CN104254206A - Machining method of circuit board with step grooves - Google Patents
Machining method of circuit board with step grooves Download PDFInfo
- Publication number
- CN104254206A CN104254206A CN201310269548.1A CN201310269548A CN104254206A CN 104254206 A CN104254206 A CN 104254206A CN 201310269548 A CN201310269548 A CN 201310269548A CN 104254206 A CN104254206 A CN 104254206A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cushion block
- step groove
- printed circuit
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention is applicable to the field of printed circuit board machining, provides a machining method of a circuit board with step grooves, and aims to solve the problem that liquid adhesives easily exist at the bottoms of the step grooves in the prior art. The method includes: providing a first board layer, a second board layer, and an adhering layer disposed between the first board layer and the second board layer, and reserving through grooves in the corresponding positions, for pre-forming the step grooves, of the adhering layer and the first board layer or the second board layer; laminating the adhering layer and the first board layer or the second board layer with the through grooves according to a preset laminating sequence to form blind grooves; providing elastic cushion blocks; placing the cushion blocks in the blind grooves and allowing the cushion blocks to contact with the bottoms of the blind grooves; laminating; taking out the cushion blocks in the blind grooves. The invention further provides a circuit board formed by the method. By the elastic cushion blocks disposed in the blind grooves, adhesives can be blocked.
Description
Technical field
The invention belongs to the manufacture field of printed circuit board (PCB), particularly relate to a kind of processing method with step groove printed circuit board (PCB).
Background technology
At present, according to paster needs, often on printed circuit board (PCB) (Printed Circuit Board, PCB), design step groove, and have strict demand to the quality of this step groove.But the common processing method of step groove is: first provide the central layer and prepreg (Prepreg, PP) that need to offer step groove, and offer corresponding step groove on central layer and PP; Then according to level requirement order lamination and formed step groove in place pad with equalizing pressure; Finally carry out lamination.The cushion block size adopted cannot accomplish to mate completely with step groove, and this will occur problems in the course of processing, such as, if pad thickness is greater than the degree of depth of step groove, so there will be filler deficiency near step groove; If pad thickness is less than the degree of depth of step groove, so step groove bottom land can leave gummosis, the gummosis that remains will affect the reliability of follow-up step groove bottom land coating, and very easily there is layering bubble phenomenon after Reflow Soldering.
Summary of the invention
The object of the present invention is to provide a kind of processing method with step groove printed circuit board (PCB), easily there is the problem of gummosis in the bottom land being intended to solve step groove in prior art.
The embodiment of the present invention is achieved in that a kind of processing method with step groove printed circuit board (PCB) comprises the following steps:
The adhesive linkage first sheet metal layer and the second sheet metal layer being provided and being located between described first sheet metal layer and described second sheet metal layer, the correspondence position of the pre-formed step groove of described adhesive linkage and described first sheet metal layer or described second sheet metal layer offers groove respectively;
To the described adhesive linkage of described groove, described first sheet metal layer offering described groove or described second sheet metal layer be offered according to predetermined laminated layer sequence lamination to form blind slot;
There is provided and there is flexible cushion block;
Described cushion block to be positioned in described blind slot and to make described cushion block contact the bottom land of described blind slot;
Carry out lamination at high temperature under high pressure; And
Take out the described cushion block in described blind slot.
Further, the material of described cushion block is silica gel.
Further, described cushion block comprises pad and is coated on the elastic layer of described gasket surface, and described elastic layer contacts with the bottom land of described blind slot.
Further, the material of described pad is polytetrafluoroethylene, epoxy resin, polyethylene terephthalate or polyimides.
Further, described elastic layer is made up of soft elastic material.
Further, the material of described elastic layer is silicon rubber or polyurethane.
Further, the size of described groove that described first sheet metal layer or described second sheet metal layer are offered and the measure-alike of preformed described step groove, the size of the described groove that described adhesive linkage is offered is slightly smaller than the size of preformed described step groove.
Further, the size of described cushion block and the size of described blind slot match, and the thickness of described cushion block is a bit larger tham the degree of depth of described blind slot.
Further, gap is left between described cushion block and described blind slot inwall.
The embodiment of the present invention is achieved in that and additionally provides a kind of printed circuit board (PCB) adopting the above-mentioned processing method with step groove printed circuit board (PCB) to be formed.
The processing method with step groove printed circuit board (PCB) provided by the invention utilizes to be had flexible cushion block and to be positioned in blind slot and to contact with bottom land, in lamination process, this cushion block generation strain also fits tightly with bottom land, thus prevents bottom land from polluting from gummosis and play good resistance glue effect.
Accompanying drawing explanation
Fig. 1 is the flow chart with the processing method of step groove printed circuit board (PCB) that the embodiment of the present invention provides.
Fig. 2 is schematic diagram prepreg and central layer being arranged to groove that the embodiment of the present invention provides.
Fig. 3 is the lamination schematic diagram that the embodiment of the present invention provides.
Fig. 4 is the schematic diagram be positioned over by cushion block in groove that first embodiment of the invention provides.
Fig. 5 is the schematic diagram be positioned over by cushion block in groove that second embodiment of the invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of processing method with step groove printed circuit board (PCB) provided in the specific embodiment of the invention comprises the following steps:
The adhesive linkage first sheet metal layer and the second sheet metal layer being provided and being located between described first sheet metal layer and described second sheet metal layer, and offer groove respectively in the correspondence position of the pre-formed step groove of described adhesive linkage and described first sheet metal layer or described second sheet metal layer;
To the described tack coat of described groove, described first sheet metal layer offering described groove or described second sheet metal layer be offered according to predetermined laminated layer sequence lamination to form blind slot;
There is provided and there is flexible cushion block;
Described cushion block to be positioned in described blind slot and to make described cushion block contact the bottom land of described blind slot;
Carry out lamination at high temperature under high pressure; And
Take out the described cushion block in described blind slot.
The processing method with step groove printed circuit board (PCB) of the present invention utilizes to be had flexible cushion block and to be positioned in blind slot and to contact with the bottom land of blind slot; in lamination process; this cushion block generation deformation also fits tightly with the bottom land of blind slot, thus the effect playing the bottom land of protection blind slot is polluted by gummosis to prevent bottom land.And, utilize this to have flexible cushion block and can play well resistance glue effect.
Please refer to Fig. 1 to Fig. 4, in the present embodiment, described first sheet metal layer comprises two pieces of central layers and is located at the prepreg between described two pieces of central layers, described second sheet metal layer comprises one deck central layer, describedly be arranged at adhesive linkage between the first sheet metal layer and the second sheet metal layer for prepreg, described groove is opened in described second sheet metal layer, next describes this processing method in detail.This processing method with step groove printed circuit board (PCB) comprises the following steps: provide central layer 10a, 10b and 10c and be located at prepreg 20a, the 20b between central layer, offers groove 12,22 respectively at the correspondence position of the pre-formed step groove of described central layer 10a and described prepreg 20a; By offer groove 12 described central layer 10a, the described prepreg 20a offering groove 22 and other central layers 10b, 10c and prepreg 20b according to predetermined laminated layer sequence lamination to form blind slot 30; There is provided and there is flexible cushion block 40; Described cushion block 40 to be positioned in described blind slot 30 and to make described cushion block 40 contact the bottom land of described blind slot 30; Carry out lamination at high temperature under high pressure; And the described cushion block 40 taken out in described blind slot 30.After cushion block 40 is put into blind slot 30, send in hot press and carry out lamination.Cushion block 40 is taken out to form step groove after lamination from blind slot 30.The processing method with step groove printed circuit board (PCB) of the present invention utilizes to be had flexible cushion block 40 and to be positioned in blind slot 30 and to contact with the bottom land of blind slot 30; in HTHP lamination process; there is deformation and fit tightly with the bottom land of blind slot 30 in this cushion block 40; to stop gummosis to enter bottom land, thus the effect playing the bottom land of protection blind slot 30 is polluted by gummosis to prevent bottom land.
Wherein, the shape of step groove 30 can be circle, rectangle or other arbitrary shapes.Prepreg 20a, 20b of thering is provided can be FR-4 prepreg, the shape of the groove 22 that prepreg 20a offers is identical with the shape of the groove offered on central layer 10a, and it is less than the size of the groove offered on central layer 10a, can prevent further in lamination process, prepreg gummosis be to the bottom of step groove.Preferably, the size of the described groove 12 that described central layer 10a offers and the measure-alike of preformed described step groove, the size of the described groove 22 that described prepreg 20a offers is less than the size of preformed described step groove, to prevent in lamination process, prepreg gummosis is to the bottom land of blind slot 30.
The present invention utilizes this cushion block 40 to be positioned in blind slot 30, to balance the pressure of multilayer board, avoids the buckle in compression of local location, and ensures that flow adhesive is stable, controlled.
Please refer to Fig. 4, the material of described cushion block 40 is silica gel.Namely adopt the cushion block 40 be made up of silica gel to be positioned in blind slot 30, to ensure that this cushion block 40 strain occurs and fits tightly with bottom land in lamination process, thus play at the bottom of protector and pollute from gummosis.
Please refer to Fig. 5, described cushion block 40 comprises pad 41 and is coated on the elastic layer 42 on described pad 41 surface, and described elastic layer 42 contacts with the bottom land of described blind slot 30.The elastic layer that namely pad 41 surface only need be made to be formed contacts with the bottom land of blind slot 30, this elastic layer 42 can be formed at pad 41 wherein one surface and contact with the bottom land of blind slot 30, or be formed at two apparent surfaces of pad 41 and the elastic layer 42 being formed at a wherein surface contacts with the bottom land of blind slot 30, or be formed at all surface of pad 41 and the elastic layer 42 being formed at a wherein surface contacts with the bottom land of blind slot 30.The cushion block 40 with elastic layer 42 is utilized to be positioned in blind slot 30 and elastic layer 42 contacts with the bottom land of blind slot 30; in lamination process; there is strain and fit tightly with the bottom land of blind slot 30 in this elastic layer 42, thus the effect playing the bottom land of protection blind slot 30 is polluted by gummosis to prevent bottom land.Preferably, the material of described pad 41 is polytetrafluoroethylene (Polytetrafluoroethylene, PTFE), epoxy resin, polyethylene terephthalate (Polyethylene terephthalate, PET) or polyimides (Polyimide, PI).
Described elastic layer 42 is made up of soft elastic material.This soft elastic material can resistance to lamination time high temperature, and do not flow in lamination process and do not react with prepreg.In lamination process, there is deformation in this elastic layer 42, pollutes by gummosis to prevent the bottom land of blind slot 30.Preferably, the material of described elastic layer 42 can be silicon rubber or polyurethane, and silicon rubber can select room temperature vulcanized silicone rubber (RTV) or high-temperature silicon disulfide rubber (HTV).By arranging elastic layer 42 to strengthen the deformation of cushion block 40 in lamination process on cushion block 40, and play at the bottom of protector from the effect that gummosis pollutes.
The size of described groove 12 that described first sheet metal layer or described second sheet metal layer are offered and the measure-alike of preformed described step groove, the size of the described groove 22 that described adhesive linkage is offered is slightly smaller than the size of preformed described step groove.In a certain embodiment, described adhesive linkage is prepreg, the size of the groove 30 that described prepreg is offered is slightly smaller than the size of pre-formed step groove, to ensure cushion block 40 closely to put into blind slot 30, thus ensure that in lamination process, gummosis flows into the gap between cushion block 40 and blind slot 30 sidewall.
The size of the described cushion block 40 provided and the size of described groove 12,22 match, and the thickness of described cushion block 40 is a bit larger tham the degree of depth of described blind slot 30.Thickness due to cushion block 40 is a bit larger tham the degree of depth of blind slot 30 effectively to play the effect of resistance glue.When the thickness of cushion block 40 is suitable and thickness that is elastic layer 42 is in an OK range, good resistance glue effect can be played.
After cushion block 40 is put into blind slot 30, between described cushion block 40 and described groove 12,22 inwall, leave gap.To ensure in lamination process, when deformation occurs cushion block 40, the deformation part of cushion block 40 will fill this gap, to prevent cushion block 40 to be expressed to blind slot 30 side, effectively can reduce to have the gap that step groove printed circuit board (PCB) produces when lamination abnormal.
The processing method employing that the present invention has step groove printed circuit board (PCB) has flexible cushion block 40, can play resistance glue effect well and avoid bottom land to pollute from gummosis; Due to cushion block 40, there is buffering effect or elastic layer 42 deformation can occur, the filler that causes because cushion block 40 thickness is partially thick can be avoided not enough; During lamination; there is deformation and fit tightly with at the bottom of protector with bottom land in cushion block 40 itself or elastic layer 42; avoid and remove gummosis and the printed circuit dash-board injury that causes, improve working (machining) efficiency, and the problem due to the coating reliability deficiency caused at the bottom of gummosis pollution groove can be avoided.
The printed circuit board (PCB) adopting the above-mentioned processing method with step groove printed circuit board (PCB) to be formed is additionally provided in the specific embodiment of the invention.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. there is a processing method for step groove printed circuit board (PCB), it is characterized in that, comprise the following steps:
The adhesive linkage first sheet metal layer and the second sheet metal layer being provided and being located between described first sheet metal layer and described second sheet metal layer, and offer groove respectively in the correspondence position of the pre-formed step groove of described adhesive linkage and described first sheet metal layer or described second sheet metal layer;
To the described tack coat of described groove, described first sheet metal layer offering described groove or described second sheet metal layer be offered according to predetermined laminated layer sequence lamination to form blind slot;
There is provided and there is flexible cushion block;
Described cushion block to be positioned in described blind slot and to make described cushion block contact the bottom land of described blind slot;
Carry out lamination at high temperature under high pressure; And
Take out the described cushion block in described blind slot.
2. have the processing method of step groove printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the material of described cushion block is silica gel.
3. have the processing method of step groove printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described cushion block comprises pad and is coated on the elastic layer of described gasket surface, and described elastic layer contacts with the bottom land of described blind slot.
4. have the processing method of step groove printed circuit board (PCB) as claimed in claim 3, it is characterized in that, the material of described pad is polytetrafluoroethylene, epoxy resin, polyethylene terephthalate person's polyimides.
5. have the processing method of step groove printed circuit board (PCB) as claimed in claim 3, it is characterized in that, described elastic layer is made up of soft elastic material.
6. the processing method with step groove printed circuit board (PCB) as described in claim 3 or 5, is characterized in that, the material of described elastic layer is silicon rubber or polyurethane.
7. there is the processing method of step groove printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the size of described groove that described first sheet metal layer or described second sheet metal layer are offered and the measure-alike of preformed described step groove, the size of the described groove that described adhesive linkage is offered is slightly smaller than the size of preformed described step groove.
8. have the processing method of step groove printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the size of described cushion block and the size of described blind slot match, and the thickness of described cushion block is greater than the degree of depth of described blind slot.
9. there is the processing method of step groove printed circuit board (PCB) as claimed in claim 8, it is characterized in that, between described cushion block and described blind slot inwall, leave gap.
10. the printed circuit board (PCB) adopting the processing method with step groove printed circuit board (PCB) as described in claim 1 to 9 any one to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310269548.1A CN104254206B (en) | 2013-06-28 | 2013-06-28 | Processing method with step groove printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310269548.1A CN104254206B (en) | 2013-06-28 | 2013-06-28 | Processing method with step groove printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104254206A true CN104254206A (en) | 2014-12-31 |
| CN104254206B CN104254206B (en) | 2017-08-04 |
Family
ID=52188615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310269548.1A Active CN104254206B (en) | 2013-06-28 | 2013-06-28 | Processing method with step groove printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104254206B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338727A (en) * | 2015-10-22 | 2016-02-17 | 北大方正集团有限公司 | Preparation method for step trough of step circuit board, and step circuit board |
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN106793566A (en) * | 2017-03-06 | 2017-05-31 | 维沃移动通信有限公司 | The preparation method and mobile terminal of a kind of printed circuit board plate |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN112752442A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Pressing method for improving impedance precision of printed circuit board |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
-
2013
- 2013-06-28 CN CN201310269548.1A patent/CN104254206B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338727A (en) * | 2015-10-22 | 2016-02-17 | 北大方正集团有限公司 | Preparation method for step trough of step circuit board, and step circuit board |
| CN105338727B (en) * | 2015-10-22 | 2018-05-25 | 北大方正集团有限公司 | The preparation method and stepped circuit board of the stepped groove of stepped circuit board |
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN105682364B (en) * | 2016-03-14 | 2018-07-03 | 江苏普诺威电子股份有限公司 | The processing method of stepped groove based on copper foil choked flow |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN108271315B (en) * | 2017-01-04 | 2019-12-31 | 北大方正集团有限公司 | Stepped circuit board and manufacturing method thereof |
| CN106793566A (en) * | 2017-03-06 | 2017-05-31 | 维沃移动通信有限公司 | The preparation method and mobile terminal of a kind of printed circuit board plate |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN112752442A (en) * | 2020-11-12 | 2021-05-04 | 惠州市金百泽电路科技有限公司 | Pressing method for improving impedance precision of printed circuit board |
| CN112752442B (en) * | 2020-11-12 | 2023-11-24 | 惠州市金百泽电路科技有限公司 | Press fit method for improving impedance precision of printed circuit board |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104254206B (en) | 2017-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104254206A (en) | Machining method of circuit board with step grooves | |
| CN102523684B (en) | Manufacture method for printed circuit board (PCB) with step groove | |
| CN102769996B (en) | Machining method of printed circuit board (PCB) of step blind slot | |
| CN104080281B (en) | Laminating method of printed circuit board | |
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN105430941A (en) | Technology for improving thick copper board stitching white edge | |
| CN103249265B (en) | A kind of blind hole filling perforation method | |
| CN109982521B (en) | Preparation method of 16-layer arbitrary interconnection circuit board | |
| CN201750634U (en) | Improved pressing in carrier structure provided with rigid-flexible circuit board | |
| CN206332909U (en) | A kind of combined type folds structure mould release membrance | |
| US20180110118A1 (en) | Length- and width-deformable printed circuit board and method for manufacturing the same | |
| CN204392684U (en) | Circuit board | |
| CN101351079A (en) | Method for processing step ladder PCB plate | |
| SG11201810482XA (en) | Method for manufacturing multilayer wiring board | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| CN208290638U (en) | A kind of PTFE copper-clad plate | |
| CN203407071U (en) | Circuit board with crimping blind hole | |
| TW200505306A (en) | Epoxy resin laminate board as a reinforcing material for flexible printed wiring board | |
| KR20130104246A (en) | Method for manufacruting copper clad laminated board | |
| CN114340166A (en) | Lamination flow glue hole filling process and PCB | |
| CN208387021U (en) | A kind of copper-clad plate blind slot film processing accessory part | |
| JP2005178302A (en) | Cushioning sheet for heat press | |
| CN204697383U (en) | Multilayer circuit board | |
| CN219769314U (en) | PBT composite film | |
| JP5251212B2 (en) | 3D printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant before: Shenzhen Shennan Circuits Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |