CN112752442B - Press fit method for improving impedance precision of printed circuit board - Google Patents
Press fit method for improving impedance precision of printed circuit board Download PDFInfo
- Publication number
- CN112752442B CN112752442B CN202011257772.5A CN202011257772A CN112752442B CN 112752442 B CN112752442 B CN 112752442B CN 202011257772 A CN202011257772 A CN 202011257772A CN 112752442 B CN112752442 B CN 112752442B
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- CN
- China
- Prior art keywords
- prepreg
- gasket
- thickness
- connecting portion
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 238000003475 lamination Methods 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 238000003801 milling Methods 0.000 claims abstract description 4
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 238000003672 processing method Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 230000008093 supporting effect Effects 0.000 abstract description 4
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001447 compensatory effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
Abstract
The invention belongs to the technical field of manufacturing of printed circuit boards, and provides a pressing method for improving impedance precision of a printed circuit board, which comprises the following steps: s1, designing an engineering file, manufacturing a large epoxy resin plate into an epoxy resin gasket, and milling the edges and the center of a prepreg into the shape of the gasket; s2, after the PCB is processed to a total pressing process, placing the prepreg during lamination, inserting a gasket with a proper thickness into a gasket groove of the prepreg, and then continuously finishing lamination and pressing; s3, finally obtaining the product with the thickness of the prepreg medium layer consistent with that of the gasket. According to the invention, the epoxy resin gasket which is not easy to deform and has low cost is added into the prepreg, so that the thickness supporting effect can be realized, and the thickness of the laminated medium layer is stable and controllable; and the thickness of the dielectric layer of the prepreg is stable, so that the influence of impedance change can be reduced, the impedance control precision of the PCB can be greatly improved, and the impedance precision can be generally improved to be within 5% from 10% when the control is poorer.
Description
Technical Field
The invention belongs to the technical field of manufacturing of printed circuit boards, and particularly relates to a pressing method for improving impedance accuracy of a printed circuit board.
Background
The impedance of the PCB is important to the performance of signal transmission. The impedance is mainly related to the line width and spacing between the current levels of the PCB, the copper thickness of the line layer, the dielectric layer thickness, and the dielectric constant. Wherein the dielectric constant is determined by the dielectric material itself and is relatively stable. The width and the interval of the circuit and the copper thickness of the circuit layer can be rapidly measured in the processing process, and the target processing range can be finally reached by correcting the processing parameters. The control of the thickness of the dielectric layer of the inner layer of the PCB is relatively weak, and the thickness of the dielectric layer of the traditional processing mode is greatly changed, so that the control of impedance is quite unfavorable.
The conventional PCB lamination process, as shown in fig. 1 below, is formed by superposing a core dielectric layer 1 and a prepreg dielectric layer 2, symmetrically arranging circuits 3 on two sides of the core dielectric layer, and performing high-temperature high-pressure treatment in a sandwich-like structure. Wherein the medium of the core plate is from the copper-clad plate, and the thickness change of the medium is small. However, the dielectric thickness of the prepreg is affected by the residual copper content of the adjacent circuit, and when the residual copper content is large, the glue of the prepreg is less in the part of the circuit, the dielectric is thicker, and when the residual copper content is small, the opposite is true. Therefore, the thickness of the dielectric layer of the prepreg with the residual copper content influences the change of the impedance value. For this problem, the conventional processing method can only perform some compensatory processing by adjusting the width and the spacing of the lines, and is difficult to control accurately, and is the variable with the largest impedance control process.
Disclosure of Invention
In view of the above, the present invention provides a method for controlling the thickness stability of a prepreg dielectric layer, thereby realizing high-precision impedance control.
The technical scheme of the invention is as follows:
a pressing method for improving impedance precision of a printed circuit board is characterized by comprising the following steps:
s1, designing an engineering file, manufacturing a large epoxy resin plate into an epoxy resin gasket, and milling the edges and the center of a prepreg into the shape of the gasket;
s2, after the PCB is processed to a total pressing process, placing the prepreg during lamination, inserting a gasket with a proper thickness into a gasket groove of the prepreg, and then continuously finishing lamination and pressing;
s3, finally obtaining a product with the thickness of the prepreg medium layer consistent with that of the gasket, wherein the impedance precision is controlled.
Further, in the step S2, after the pressing, the gasket may be left in the board, so that the normal processing of the subsequent process is not affected.
Further, in the step S1, a design of a prepreg laminated gasket is included, where the gasket includes at least one of an inverted T-shaped gasket, a cross-shaped gasket, and an L-shaped gasket. But are not limited thereto, and may be other shapes of the prior art.
Further, the thickness of the gasket is 0.1-0.2mm.
Further, the inverted T-shaped bench gasket comprises a base and a first connecting portion perpendicular to the base, wherein the length of the base is 45mm, the width of the base is 15mm, and the length of the first connecting portion is 35mm, and the width of the first connecting portion is 5mm.
Further, the cross-shaped gasket comprises a second connecting portion which is perpendicularly crossed, and the length of the second connecting portion is 50mm, and the width of the second connecting portion is 5mm.
Further, the L-shaped gasket comprises a third connecting portion which is vertically arranged, and the length of the third connecting portion is 25mm, and the width of the third connecting portion is 15mm.
Further, in the step S1, the prepreg processing method includes: and carrying out contour machining on the prepreg used for pressing, hollowing out the shape of the prepreg, and subsequently placing the gasket.
Further, 4 PCB unit groups are symmetrically arranged on the prepreg, and at least one PCB unit is placed in one unit group; the pads are placed in the area between the groups of PCB units.
Further, the L-shaped gaskets are symmetrically arranged at four corners of the prepreg, the inverted T-shaped gaskets are symmetrically arranged at the edges of the prepreg, and the cross-shaped gaskets are arranged in the central area of the prepreg.
In particular, the person skilled in the art can adjust the number of the unit groups and the number of the gaskets according to the specific size of the PCB, the positions of the gaskets are not invariable, and the gaskets can be properly adjusted, so that the principle is that the gaskets are reasonably placed at the center and around the board, and the uniformity of pressing is ensured.
Further, in step S2, when the pre-lamination board is laminated, the prepreg is laid, and a spacer with the same thickness is placed in the hollow groove of the prepreg. The gasket is inserted for pressing, so that the supporting effect can be well achieved, and the thickness of the dielectric layer of the prepreg can be stably controlled.
The invention has the beneficial effects that:
1. through adding the epoxy resin gasket which is difficult to deform and has low cost in the prepreg, the thickness supporting effect can be achieved, and the thickness of the laminated medium layer is stable and controllable.
2. The thickness of the dielectric layer of the prepreg is stable, so that the influence of impedance change can be reduced, the impedance control precision of the PCB can be greatly improved, and the impedance precision can be generally improved to be within 5% from 10% when the control is poorer.
3. The design adjustability of the separation type gasket is strong, the press fit of PCBs with various sizes can be met, and the line gummosis and vacuumizing cannot be affected.
Drawings
Fig. 1 is a schematic structural view of a conventional PCB laminate in the prior art;
FIG. 2 is a schematic view of a gasket according to the present invention;
FIG. 3 is a schematic view of a gasket according to the present invention;
FIG. 4 is a schematic view of a gasket according to the present invention;
FIG. 5 is a schematic view of the structure of the appearance process of the prepreg according to the present invention;
fig. 6 is a schematic view of a structure of a prepreg of the present invention with a spacer disposed therein.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but it should not be construed that the scope of the present invention is limited to the following examples. The raw materials used are commercially available from public sources unless otherwise specified.
Example 1
A pressing method for improving impedance precision of a printed circuit board is characterized by comprising the following steps:
s1, designing an engineering file, manufacturing a large epoxy resin plate into an epoxy resin gasket, and milling the edges and the center of a prepreg into the shape of a gasket 4;
s2, after the PCB is processed to a total pressing process, placing the prepreg during lamination, inserting a gasket with a proper thickness into a gasket groove of the prepreg, and then continuously finishing lamination and pressing;
s3, finally obtaining a product with the thickness of the prepreg medium layer consistent with that of the gasket, wherein the impedance precision is controlled.
Further, in the step S2, after the pressing, the gasket may be left in the board, so that the normal processing of the subsequent process is not affected.
Further, in the step S1, a prepreg pressing gasket design is included, where the gasket includes at least one of an inverted T-shaped gasket 41, a cross-shaped gasket 42, and an L-shaped gasket 43. But are not limited thereto, and may be other shapes of the prior art.
Further, the thickness of the gasket is 0.1-0.2mm.
Further, the inverted-T-shaped pad includes a base 411 and a first connection portion 412 perpendicular to the base, where the length of the base is 45mm and the width of the base is 15mm, and the length of the first connection portion is 35mm and the width of the first connection portion is 5mm.
Further, the cross-shaped gasket includes a second connecting portion 421 perpendicularly intersecting with each other, and the second connecting portion has a length of 50mm and a width of 5mm.
Further, the L-shaped spacer includes a third connection portion 431 vertically disposed, and the third connection portion has a length of 25mm and a width of 15mm.
Further, in the step S1, the prepreg processing method includes: and (3) carrying out contour machining on the prepreg used for pressing, hollowing out the prepreg by the shape 5 of the gasket, and subsequently placing the gasket.
Further, 4 PCB unit groups 21 are symmetrically arranged on the prepreg, and at least one PCB unit is placed in one unit group; the pads are placed in the area between the groups of PCB units.
Further, the L-shaped gaskets are symmetrically arranged at four corners of the prepreg, the inverted T-shaped gaskets are symmetrically arranged at the edges of the prepreg, and the cross-shaped gaskets are arranged in the central area of the prepreg.
In particular, the person skilled in the art can adjust the number of the unit groups and the number of the gaskets according to the specific size of the PCB, the positions of the gaskets are not invariable, and the gaskets can be properly adjusted, so that the principle is that the gaskets are reasonably placed at the center and around the board, and the uniformity of pressing is ensured.
Further, in step S2, when the pre-lamination board is laminated, the prepreg is laid, and a spacer with the same thickness is placed in the hollow groove of the prepreg. The gasket is inserted for pressing, so that the supporting effect can be well achieved, and the thickness of the dielectric layer of the prepreg can be stably controlled.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. It should be noted that technical features not described in detail in the present invention may be implemented by any prior art in the field.
Claims (6)
1. A pressing method for improving impedance precision of a printed circuit board is characterized by comprising the following steps:
s1, designing an engineering file, manufacturing a large epoxy resin plate into an epoxy resin gasket, and milling the edges and the center of a prepreg into the shape of the gasket;
s2, after the PCB is processed to a total pressing process, placing the prepreg during lamination, inserting a gasket with a proper thickness into a gasket groove of the prepreg, and then continuously finishing lamination and pressing;
s3, finally obtaining a product with the thickness of the prepreg medium layer consistent with that of the gasket; in the step S1, a prepreg laminated gasket design is included, wherein the gasket comprises an inverted T-shaped gasket, a cross-shaped gasket and an L-shaped gasket;
in the step S1, the prepreg processing method includes: carrying out contour machining on the prepreg used for pressing, hollowing out the shape of the gasket by the prepreg, and subsequently placing the gasket;
4 PCB unit groups are symmetrically arranged on the prepreg, and at least one PCB unit is placed on one PCB unit group; the gasket is arranged in the area between the PCB unit groups;
the L-shaped gaskets are symmetrically arranged at four corners of the prepreg, the inverted T-shaped gaskets are symmetrically arranged at the edges of the prepreg, and the cross-shaped gaskets are arranged in the central area of the prepreg;
in the step S2, when the pre-lamination board is laminated, the prepreg is laid, and a gasket with the same thickness is placed in the hollow groove of the prepreg.
2. The pressing method for improving impedance accuracy of a printed circuit board according to claim 1, wherein in the step S2, after the pressing is completed, the spacer remains in the board without affecting normal processing in the subsequent process.
3. The bonding method for improving impedance accuracy of printed circuit board according to claim 1, wherein the thickness of the spacer is 0.1-0.2mm.
4. The press-fit method for improving impedance accuracy of a printed circuit board according to claim 3, wherein the inverted-T-shaped gasket comprises a base and a first connecting portion perpendicular to the base, the length of the base is 45mm, the width of the base is 15mm, and the length of the first connecting portion is 35mm, and the width of the first connecting portion is 5mm.
5. The bonding method for improving impedance accuracy of a printed circuit board according to claim 3, wherein the cross-shaped gasket comprises a second connecting portion which is arranged in a vertically crossed mode, and the length of the second connecting portion is 50mm, and the width of the second connecting portion is 5mm.
6. The press-fit method for improving impedance accuracy of a printed circuit board according to claim 3, wherein the L-shaped spacer comprises a third connecting portion which is vertically arranged, and the length of the third connecting portion is 25mm and the width of the third connecting portion is 15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011257772.5A CN112752442B (en) | 2020-11-12 | 2020-11-12 | Press fit method for improving impedance precision of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011257772.5A CN112752442B (en) | 2020-11-12 | 2020-11-12 | Press fit method for improving impedance precision of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112752442A CN112752442A (en) | 2021-05-04 |
| CN112752442B true CN112752442B (en) | 2023-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011257772.5A Active CN112752442B (en) | 2020-11-12 | 2020-11-12 | Press fit method for improving impedance precision of printed circuit board |
Country Status (1)
| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106486A (en) * | 1998-07-28 | 2000-04-11 | Matsushita Electric Works Ltd | Manufacture of multilayer wiring board |
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN104254206A (en) * | 2013-06-28 | 2014-12-31 | 深南电路有限公司 | Machining method of circuit board with step grooves |
| JP2015204309A (en) * | 2014-04-10 | 2015-11-16 | 凸版印刷株式会社 | Printed wiring board and method of manufacturing the same |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| CN110381664A (en) * | 2019-07-26 | 2019-10-25 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB containing cavity |
| CN111867281A (en) * | 2020-08-31 | 2020-10-30 | 生益电子股份有限公司 | Manufacturing method of PCB with efficient heat dissipation |
-
2020
- 2020-11-12 CN CN202011257772.5A patent/CN112752442B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106486A (en) * | 1998-07-28 | 2000-04-11 | Matsushita Electric Works Ltd | Manufacture of multilayer wiring board |
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN104254206A (en) * | 2013-06-28 | 2014-12-31 | 深南电路有限公司 | Machining method of circuit board with step grooves |
| JP2015204309A (en) * | 2014-04-10 | 2015-11-16 | 凸版印刷株式会社 | Printed wiring board and method of manufacturing the same |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| CN110381664A (en) * | 2019-07-26 | 2019-10-25 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB containing cavity |
| CN111867281A (en) * | 2020-08-31 | 2020-10-30 | 生益电子股份有限公司 | Manufacturing method of PCB with efficient heat dissipation |
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| CN112752442A (en) | 2021-05-04 |
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