CN104427785A - Manufacturing method of blind holes different in pore diameter, and printed circuit board - Google Patents
Manufacturing method of blind holes different in pore diameter, and printed circuit board Download PDFInfo
- Publication number
- CN104427785A CN104427785A CN201310410605.3A CN201310410605A CN104427785A CN 104427785 A CN104427785 A CN 104427785A CN 201310410605 A CN201310410605 A CN 201310410605A CN 104427785 A CN104427785 A CN 104427785A
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- CN
- China
- Prior art keywords
- blind hole
- drilling machine
- pore size
- laser drilling
- different pore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention provides a manufacturing method of blind holes different in pore diameter, and a printed circuit board. The manufacturing method of the blind holes different in pore diameter are used for manufacturing the blind holes different in pore diameter on the same layer of the printed circuit board and comprises the following steps: step 102, grouping the blind holes which are different in pore diameter and to be formed, preparing a laser drilling program according to the grouping, and inputting the laser drilling program to a laser drilling machine; step 104, browning and roughing the surface of a laminated base plate; step 106, forming the blind holes in the surface-browned and roughed base plate by using the laser drilling machine. The technical scheme provided by the invention has the advantages that the manufacturing procedures of the blind holes different in pore diameter are shortened, the manufacturing cost of the blind holes different in pore diameter is reduced and the quality of the blind holes different in pore diameter on the same layer of the printed circuit board is guaranteed, so that the quality of the printed circuit board is guaranteed and the completeness of an electronic product and the cooling performance of elements can be effectively guaranteed.
Description
Technical field
The present invention relates to printed circuit board (PCB) and manufacture field, more specifically, relate to a kind of manufacture method of different pore size blind hole and a kind of printed circuit board (PCB).
Background technology
Along with the continuous upgrading of electronic product, the cooling requirements of electronic product to signal and components and parts is more and more higher.As the printed circuit board (PCB) of electronic product components and parts carrier, in order to the thermal diffusivity of the integrality and components and parts that ensure product signal, in design, the blind hole be positioned on the same layer of printed circuit board (PCB) needs multiple aperture could meet its performance requirement.For the boring of different pore size blind hole, traditional laser drill operational method is after lamination closes outside, first opens the copper window of different size in blind hole position, and then carry out laser drill according to the demand of design.
But the laser drill flow process that prior art uses carries out the method for laser drill again after adopting and first windowing to copper face, production procedure is long, cost is high and laser drill Aligning degree is poor; Affect production cost, production efficiency and product quality.
Summary of the invention
The object of the invention is to, a kind of manufacture method of different pore size blind hole is provided, for making the blind hole of different pore size on printed circuit board (PCB) same layer, can production procedure be shortened, reduce production cost, enhance productivity, ensure end product quality.
In view of this, the invention provides a kind of manufacture method of different pore size blind hole, for making the blind hole of different pore size on printed circuit board (PCB) same layer, comprising the following steps:
Step 102, will need the blind hole grouping of the different pore size offered, and make laser drill formula, and input in laser drilling machine by described laser drill formula according to grouping;
Step 104, carries out surperficial brown and roughening treatment by the substrate after pressing;
Step 106, offers described blind hole by the described substrate after surperficial brown and roughening treatment on described laser drilling machine.
The manufacture method of the different pore size blind hole that the technical program provides, when the same layer of printed circuit board (PCB) makes the blind hole of different pore size, shorten the Making programme of different pore size blind hole, reduce the manufacturing cost of different pore size blind hole, improve the production efficiency of different pore size blind hole, ensure that the quality of different pore size blind hole, and then ensure that the quality of finished printed circuit board product.
Present invention also offers a kind of printed circuit board (PCB), the same layer of printed circuit board (PCB) is provided with the blind hole of different pore size, described blind hole adopts the manufacture method of the different pore size blind hole described in technique scheme to make.
The printed circuit board (PCB) that the technical program provides can ensure the integrality of electronic product signal and the thermal diffusivity of components and parts, be positioned at the blind hole of the different pore size on printed circuit board (PCB) same layer to offer position accurate, while the performance requirement ensureing printed circuit board (PCB), shorten printed circuit board (PCB) integral production manufacturing process, reduce manufacturing cost.
In sum, the manufacture method of different pore size blind hole provided by the invention, according to the blind hole of different pore size, different laser blind hole formulas is set, laser blind hole formula input laser drilling machine is offered the blind hole of different pore size, the method shortens the Making programme of the blind hole of different pore size, reduce the manufacturing cost of the blind hole of different pore size, ensure that and be positioned at the quality of printed circuit board (PCB) with different pore size blind hole on layer, and then ensure that the quality of printed circuit board (PCB); Printed circuit board (PCB) manufacturing process provided by the invention is simple, and production cost is low, effectively can ensure the integrality of electronic product and the thermal diffusivity of components and parts.
Accompanying drawing explanation
Fig. 1 is the flow chart of manufacture method one embodiment according to different pore size blind hole of the present invention;
Fig. 2 is the flow chart of another embodiment of manufacture method according to different pore size blind hole of the present invention;
Fig. 3 is the flow chart carrying out arranging and adjusting an embodiment according to laser drilling machine of the present invention;
Fig. 4 is the flow chart carrying out arranging and adjusting another embodiment according to laser drilling machine of the present invention;
Fig. 5 is the cutaway view offering one group of blind hole according to the manufacture method of different pore size blind hole of the present invention;
Fig. 6 is the cutaway view of the printed circuit board (PCB) made according to the manufacture method of different pore size blind hole of the present invention.
Wherein, the corresponding relation in Fig. 1 to Fig. 5 between Reference numeral and component names is:
1 printed circuit board (PCB), 11 blind holes.
Embodiment
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from mode described here to implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
As shown in Figure 1, the invention provides a kind of manufacture method of different pore size blind hole, for making the blind hole 11 of different pore size on printed circuit board (PCB) 1 same layer, comprise the following steps: step 102, divide into groups needing the blind hole 11 of the different pore size offered, make laser drill formula according to grouping, and laser drill formula is inputed in laser drilling machine; Step 104, carries out surperficial brown and roughening treatment by the substrate after pressing; Step 106, offers blind hole 11 by the substrate after surperficial brown and roughening treatment on laser drilling machine.
The manufacture method of the different pore size blind hole that the technical program provides, when the same layer of printed circuit board (PCB) 1 makes the blind hole of different pore size, shorten the Making programme of the blind hole of different pore size, reduce the manufacturing cost of the blind hole of different pore size, improve the production efficiency of different pore size blind hole, ensure that the quality of different pore size blind hole, and then ensure that the quality of finished printed circuit board product.
As shown in Figure 2, in the above-described embodiments, preferably, also comprise after the step 106:
Step 108, plasma cleaning, removes resin residual in blind hole 11;
Step 110, cleaning, removes the oxide of copper face.
After using laser drilling machine to be machined with all blind holes 11 on layer by printed circuit board (PCB) 1, resin residual in plasma cleaning blind hole 11, ensure the cleanliness factor of blind hole 11, after blind hole 11 is cleaned up, by whole printed circuit board (PCB) 1 base-plate cleaning with blind hole 11, remove the oxide on copper face, ensure the cleanliness factor of printed circuit board base board, for follow-up work is given security.
In above-mentioned any one embodiment, preferably, in a step 102, blind hole 11 is grouped into and the blind hole 11 being positioned at same apertures on printed circuit board (PCB) 1 same layer is set as one group.
Same apertures on printed circuit board (PCB) 1 same layer is set to one group, is convenient to statistics, when using laser to offer blind hole, being convenient to the processing of blind hole, saving the process time of blind hole, making the quality and quantity of the blind hole of machine-shaping be guaranteed simultaneously.
Preferably, at step 104, by liquid medicine, brown and roughening treatment are carried out in the surface of substrate.Use liquid medicine to make the surface needing laser to offer blind hole 11 be brown and coarse, ensure that the quality of the blind hole offered; Ensure that this surface has stronger extinction effect in brown, coarsely ensure that this surface can not be reflective, both combinations ensure that offers the position of blind hole and the precision in aperture.
In the above-described embodiments, preferably, in step 106, before laser drilling machine is offered blind hole 11, laser drilling machine is arranged and adjusts.
Before using laser drilling machine batch machining blind hole 11, laser drilling machine arranged and adjusts, ensure that the positional precision of blind hole, and then ensure that the quality of finished printed circuit board product.
As shown in Figure 3, in the above-described embodiments, preferably, laser drilling machine to be arranged and adjustment comprises the following steps: step 202, laser drilling machine is derived laser drill formula; Step 204, the size according to often organizing blind hole 11 aperture carries out laser energy test on laser drilling machine; Step 206, adjusts according to position, the hole precision of laser drill formula to laser drilling machine.
In step 202., the laser drill formula inputed in step 102 in laser drilling machine is recalled, offer blind hole 11 for laser and prepare;
In step 204, the embodiment of laser energy test is: laser energy test is carried out in the aperture offering blind hole 11 as required, the energy of laser is just satisfied the demand and is offered the aperture of blind hole 11, after test, data to be recorded in laser drilling machine and to preserve, like this, the precision in this blind hole 11 aperture can be ensured, and then ensure the quality of finished printed circuit board product;
In step 206, to the embodiment that position, the hole precision of laser drilling machine adjusts be: after using laser drilling machine to offer blind hole 11 according to laser drill formula on model, start the Precision adjustment device of laser drilling machine, the position of the blind hole 11 that laser drill machine testing model is offered also contrasts with the position in laser drill formula, if consistent, carry out the processing of blind hole 11; If inconsistent, adjustment laser drilling machine is consistent to both, accurate to ensure the position that blind hole 11 is offered.
It should be noted that, in the present embodiment, when generally offering the blind hole 11 of different pore size on the same layer of different printing circuit board 1, all need to adjust position, the hole precision of laser drilling machine; On laser drilling machine during Continuous maching, the hole position precision of certain interval of time to laser drilling machine is needed to adjust, accurate to guarantee the blind hole eleven-punch manufactured, in the present embodiment, can adjust position, the hole precision of laser drilling machine after general processing 5 to 6 is little.Certainly, according to different processing needs, the regulation time of position, the hole precision to laser drilling machine can also be revised.
As shown in Figure 4, in the above-described embodiments, preferably, also comprise between step 202 and step 204:
Tool code parameter modification in laser formula, when in the tool code parameter in laser drill formula and laser drilling machine, tool code parameter is inconsistent, is consistent with tool code parameter in laser drilling machine by step 203.
Before laser drilling machine uses, the parameter testing of the laser drill on the printed circuit board (PCB) 1 of different pore size need be completed, the blind hole 11 by different pore size needs the tool code record used, and is then kept on laser drilling machine.When using laser drilling machine to offer blind hole 11, the cutter sequence code in formula is changed into the parameter codes in aperture corresponding to laser drilling machine.As: the code in former formula, to be " M101 " be represents the aperture of 100 μm, laser drilling machine represents the aperture code of 100 μm for " M102 ", then need to change " M101 " in formula into " M102 "; If the code in former formula is consistent with the code of representation parameter on laser drilling machine, then do not need to modify to formula.
In the above-described embodiments, preferably, in step 106, after laser drilling machine being arranged and adjusting, non-for the substrate one side offering blind hole 11 is placed on laser drilling machine, restarts different pore size also offered by laser drilling machine blind hole 11 according to the laser drill formula be input in laser drilling machine.
Further, preferably, in step 106, when laser drilling machine is offered blind hole 11, laser drilling machine, according to laser drill formula, first completes wherein after one group of blind hole 11, then completes the blind hole 11 of other groups successively.
When using laser drilling machine to offer blind hole 11, the non-surface offering blind hole 11 of substrate is placed on laser drilling machine, successively blind hole 11 is machined by group by laser drill formula, such processing, be convenient to laser drilling machine and offer blind hole, improve the operating efficiency of laser drilling machine, reduce the operating time of offering blind hole, ensure that quantity that blind hole offers, position simultaneously, and then ensure finished printed circuit board product quality.
As shown in Figure 5 and Figure 6, in above-mentioned any embodiment, preferably, substrate be by Copper Foil, prepreg and oxidation processes after the multi-layer sheet that is pressed into of internal layer circuit plate.
The multi-layer sheet that in the present embodiment, what substrate adopted is Copper Foil, internal layer circuit plate after prepreg and oxidation processes is pressed into certainly, also can be other forms of substrate, such as, and lamina or double sided board.
As shown in Figure 5 and Figure 6, present invention also offers a kind of printed circuit board (PCB) 1, the same layer of printed circuit board (PCB) 1 is provided with the blind hole 11 of different pore size, blind hole 11 adopts the manufacture method of the different pore size blind hole described in above-mentioned any embodiment to make.
Printed circuit board (PCB) shown in Fig. 5 has the blind hole of two groups of different pore sizes in the printed circuit board (PCB) shown in the blind hole in one group of aperture, Fig. 6 for only having; certainly; adopt the manufacture method of different pore size blind hole of the present invention can also make the blind hole of more groups of different pore sizes; do not repeat them here, but its application all should within protection scope of the present invention.
The printed circuit board (PCB) 1 that the present embodiment provides can ensure the integrality of electronic product signal and the thermal diffusivity of components and parts, be positioned at the blind hole of the different pore size on printed circuit board (PCB) 1 same layer to offer position accurate, while the performance requirement ensureing printed circuit board (PCB), shorten printed circuit board (PCB) integral production manufacturing process, reduce manufacturing cost.
In sum, the manufacture method of different pore size blind hole provided by the invention, according to the blind hole of different pore size, different laser blind hole formulas is set, laser blind hole formula input laser drilling machine is offered the blind hole of different pore size, the method shortens the Making programme of the blind hole of different pore size, reduce the manufacturing cost of the blind hole of different pore size, ensure that and be positioned at the quality of printed circuit board (PCB) with different pore size blind hole on layer, and then ensure that the quality of printed circuit board (PCB); Printed circuit board (PCB) manufacturing process provided by the invention is simple, and production cost is low, effectively can ensure the integrality of electronic product and the thermal diffusivity of components and parts.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a manufacture method for different pore size blind hole, for making the blind hole of different pore size on printed circuit board (PCB) same layer, is characterized in that, comprise the following steps:
Step 102, will need the blind hole grouping of the different pore size offered, and make laser drill formula, and input in laser drilling machine by described laser drill formula according to grouping;
Step 104, carries out surperficial brown and roughening treatment by the substrate after pressing;
Step 106, offers described blind hole by the described substrate after surperficial brown and roughening treatment on described laser drilling machine.
2. the manufacture method of different pore size blind hole according to claim 1, is characterized in that, in described step 102, described blind hole is grouped into and the blind hole being positioned at same apertures on described printed circuit board (PCB) same layer is set as one group.
3. the manufacture method of different pore size blind hole according to claim 2, is characterized in that, in step 106, before described blind hole offered by described laser drilling machine, arranges described laser drilling machine and adjusts.
4. the manufacture method of different pore size blind hole according to claim 3, is characterized in that, arranges and adjustment comprises the following steps to described laser drilling machine:
Step 202, described laser drilling machine is derived described laser drill formula;
Step 204, the size according to often organizing described blind hole aperture carries out laser energy test on described laser drilling machine;
Step 206, adjusts according to position, the hole precision of described laser drill formula to described laser drilling machine.
5. the manufacture method of different pore size blind hole according to claim 4, is characterized in that, also comprises between described step 202 and described step 204:
Described tool code parameter modification in described laser formula, when in the tool code parameter in described laser drill formula and described laser drilling machine, tool code parameter is inconsistent, is consistent with tool code parameter in described laser drilling machine by step 203.
6. the manufacture method of different pore size blind hole according to claim 5, it is characterized in that, in described step 106, after described laser drilling machine is arranged and is adjusted, non-for the described substrate one side offering described blind hole is placed on described laser drilling machine, restarts different pore size also offered by described laser drilling machine described blind hole according to the described laser drill formula be input in described laser drilling machine.
7. the manufacture method of different pore size blind hole according to claim 6, it is characterized in that, in described step 106, when blind hole offered by described laser drilling machine, described laser drilling machine is according to described laser drill formula, first complete wherein after blind hole described in a group, then complete the described blind hole of other groups successively.
8. the manufacture method of different pore size blind hole according to any one of claim 1 to 7, is characterized in that, described substrate be by Copper Foil, prepreg and oxidation processes after the multi-layer sheet that is pressed into of internal layer circuit plate.
9. the manufacture method of different pore size blind hole according to claim 8, is characterized in that, also comprises after described step 106:
Step 108, plasma cleaning, removes resin residual in blind hole;
Step 110, cleaning, removes the oxide of copper face.
10. a printed circuit board (PCB), the same layer of described printed circuit board (PCB) is provided with the blind hole of different pore size, it is characterized in that, described blind hole adopts the manufacture method of different pore size blind hole as claimed in any one of claims 1-9 wherein to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310410605.3A CN104427785B (en) | 2013-09-11 | 2013-09-11 | The preparation method and printed circuit board (PCB) of different pore size blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310410605.3A CN104427785B (en) | 2013-09-11 | 2013-09-11 | The preparation method and printed circuit board (PCB) of different pore size blind hole |
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| Publication Number | Publication Date |
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| CN104427785A true CN104427785A (en) | 2015-03-18 |
| CN104427785B CN104427785B (en) | 2017-10-03 |
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| CN201310410605.3A Active CN104427785B (en) | 2013-09-11 | 2013-09-11 | The preparation method and printed circuit board (PCB) of different pore size blind hole |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107971753A (en) * | 2017-07-28 | 2018-05-01 | 南昌正业科技有限公司 | A kind of automation control method, system and storage device |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN113747683A (en) * | 2020-05-29 | 2021-12-03 | 深南电路股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN113766738A (en) * | 2020-06-02 | 2021-12-07 | 深南电路股份有限公司 | Drilling method and drilling device for circuit board and computer readable storage device |
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| JP2001237511A (en) * | 2000-02-23 | 2001-08-31 | Hitachi Cable Ltd | Substrate with plating bump and its manufacturing method |
| CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路（惠州）有限公司 | Method for drilling internal layer thick copper plate |
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2013
- 2013-09-11 CN CN201310410605.3A patent/CN104427785B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237511A (en) * | 2000-02-23 | 2001-08-31 | Hitachi Cable Ltd | Substrate with plating bump and its manufacturing method |
| CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路（惠州）有限公司 | Method for drilling internal layer thick copper plate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107971753A (en) * | 2017-07-28 | 2018-05-01 | 南昌正业科技有限公司 | A kind of automation control method, system and storage device |
| CN113747683A (en) * | 2020-05-29 | 2021-12-03 | 深南电路股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN113766738A (en) * | 2020-06-02 | 2021-12-07 | 深南电路股份有限公司 | Drilling method and drilling device for circuit board and computer readable storage device |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN113369719B (en) * | 2021-05-14 | 2023-01-31 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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