CN102523684B - Manufacture method for printed circuit board (PCB) with step groove - Google Patents
Manufacture method for printed circuit board (PCB) with step groove Download PDFInfo
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- CN102523684B CN102523684B CN201110396258.4A CN201110396258A CN102523684B CN 102523684 B CN102523684 B CN 102523684B CN 201110396258 A CN201110396258 A CN 201110396258A CN 102523684 B CN102523684 B CN 102523684B
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Abstract
The invention relates to a manufacture method for a printed circuit board (PCB) with a step groove, which includes the following steps that: 1 a prepreg, an upper outer-layer core plate, an inner-layer core plate and a lower outer-layer core plate are provided, and a through groove is arranged correspondingly, wherein inner-layer patterns of the upper outer-layer core plate, the inner-layer core plate and the lower outer-layer core plate are manufactured; 2 the upper outer-layer core plate, the prepreg, the inner-layer core plate and the lower outer-layer core plate are stacked together according to a preset stacking sequence; 3 a gasket is filled in the through groove and comprises a body portion and a protruding edge portion, the size of the protruding edge portion is larger than that of the through groove, and the protruding edge portion is arranged on the upper surface of the upper outer-layer core plate; 4 a buffer layer is placed on the upper surface of the upper outer-layer core plate, and a through hole is arranged on the buffer layer at the position corresponding to the protruding edge portion; 5 fuse lamination is conducted under high temperature and high pressure; and 6 the buffer layer is removed, the filled gasket is taken out, and the step groove is formed. The manufacture method adopts the gasket with the protruding edge portion to conduct buffering and glue blocking during lamination, and stable control of glue flowing on the edge of the step groove can be achieved.
Description
Technical field
The present invention relates to printed circuit board and make field, relate in particular to a kind of manufacture method of pcb board of tool step trough.
Background technology
Wiring board assembling and assembling need to be produced step trough in pcb board part often, to meet the raising with wiring density of dwindling of modular assembly volume, and the realization that meets specific function.
When the larger step trough of manufactured size, can first adopt central layer and prepreg are slotted, then fill buffering resistance glue material and carry out pressing plate.But, while adopting existing filling buffering resistance glue material to make step trough, during lamination, must use and not flow or the prepreg of low fluidity, guarantee the stable control of step trough edge gummosis, in case fluid stopping glue is to plate face and bottom land, therefore, the scope of application is narrower.In addition, prepreg cost not mobile or low fluidity is high, is difficult to meet welding and the reliability requirement that electron trade improves constantly.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of manufacture method of pcb board of tool step trough, adopt the pad of flanged pin portion when lamination, cushion and hinder glue, can realize the stable control of step trough edge gummosis.
For achieving the above object, the invention provides a kind of manufacture method of pcb board of tool step trough, comprise the following steps:
Step 1: the outer central layer of upside, core material and the outer central layer of downside that prepreg are provided and have made inner figure, the correspondence position that prepreg, the outer central layer of upside and core material are formed to step trough in wish is offered respectively groove;
Step 2: the outer central layer of upside, prepreg, core material and the outer central layer of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet in the groove of the outer central layer of upside, prepreg and core material, described pad comprises the flange part of being located at the body in described groove and being positioned at body outer end, and the size of described flange part is greater than the size of described groove and is located at the upper surface of the outer central layer of described upside;
Step 4: the upper surface at the outer central layer of upside is placed resilient coating, and the thickness of described resilient coating equates with the thickness of described flange part, and on described resilient coating, the position of corresponding described flange part is provided with through hole to accommodate described flange part;
Step 5: carry out melting lamination under HTHP;
Step 6: remove resilient coating after lamination completes and take out the pad of filling, form step trough.
Wherein, in described step 1, the step trough that the size of the groove of offering on the outer central layer of upside and core material and wish form measure-alike, the size of the groove of offering on prepreg is greater than the size of the step trough of wish formation.
Wherein, described prepreg adopts FR-4 prepreg.
Wherein, described pad is silica gel piece.
Wherein, the thickness of the flange part of described pad is 0.1-0.2mm.
Wherein, in described step 4, resilient coating comprises aluminium flake and release film, and described release film is between aluminium flake and the outer central layer of upside.
Beneficial effect of the present invention: the manufacture method of the pcb board of tool step trough of the present invention, pad by adopting flanged pin portion cushions and hinders glue when lamination, can realize the stable control of step trough edge gummosis, reach the groove top of step trough and bottom land without resin residue, the sufficient effect of sidewall resin filling of step trough.And by the outer central layer of upside, thickness and the resilient coating that flange part thickness equates being set, can further improve the reliability of lamination gummosis.In addition, adopt manufacture method of the present invention, prepreg can select common FR-4 prepreg to carry out pressing plate, and cost is lower.
For further setting forth the present invention, realize technological means and the effect that predetermined object is taked, refer to following about detailed description of the present invention and accompanying drawing, believe object of the present invention, feature and feature, should be goed deep into thus and concrete understanding, yet accompanying drawing only provides reference and explanation use, is not used for the present invention to be limited.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effects apparent.
In accompanying drawing,
Fig. 1 is the flow chart of manufacture method of the pcb board of tool step trough of the present invention.
When Fig. 2 makes step trough for the manufacture method of the pcb board of employing tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
Embodiment
As shown in Figures 1 and 2, the manufacture method of the pcb board of tool step trough of the present invention, comprises the steps;
Step 1: the outer central layer 11 of upside, core material 12 and the outer central layer 13 of downside that prepreg 10 are provided and have made inner figure, the correspondence position that prepreg 10, the outer central layer 11 of upside and core material 12 are formed to step trough 16 in wish is offered respectively groove 101,111,121;
Step 2: the outer central layer 11 of upside, prepreg 10, core material 12 and the outer central layer 13 of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet 14 in the groove 101,111,121 of the outer central layer 11 of upside, prepreg 10 and core material 12, described pad 14 comprises the flange part 142 of being located at the body 141 in described groove 101,111,121 and being positioned at body 141 outer ends, the size of described flange part 142 is greater than the size of described groove 101,111,121 and is located at the upper surface of the outer central layer 11 of described upside, wherein, described pad 14 is made by the material of tool buffering effect, preferably, described pad 14 is silica gel piece;
Step 4: the upper surface at the outer central layer 11 of upside is placed resilient coating 15, the thickness of described resilient coating 15 equates with the thickness of described flange part 142, and on described resilient coating 15, the position of corresponding described flange part 142 is provided with through hole 151 to accommodate described flange part 142, preferably, resilient coating 15 comprises aluminium flake 151 and release film 152, described release film 152 is between aluminium flake 151 and the outer central layer 11 of upside, on resilient coating 15, offer through hole 151 and accommodate flange part 142, can guarantee that whole cover layer is smooth;
Step 5: carry out melting lamination under HTHP;
Step 6: remove resilient coating 15 after lamination completes and take out the pad 14 of filling, form step trough 16.
The thickness of the flange part 142 of described pad 14 is 0.1-0.2mm.
In described step 1, the step trough 16 that the size of the groove 111,121 of offering on the outer central layer 11 of upside and core material 12 and wish form measure-alike, the size of the groove 101 of offering on prepreg 10 is greater than the size of the step trough 16 of wish formation.
Because the pad 14 that adopts flanged pin portion 142 cushions when the lamination and hinders glue, this flange part 142 can seal the groove 111 of the outer central layer 11 of upside completely, prepreg for various fluidities, all can realize the stable control of step trough 16 edge gummosis, therefore, prepreg 10 can adopt the FR-4 prepreg of good fluidity, each reliability requirement of welding improving constantly to meet electron trade.
In the manufacture method of the pcb board of above-mentioned tool step trough, pad by adopting flanged pin portion cushions and hinders glue when lamination, the stable control of step trough edge gummosis be can realize, the groove top of step trough and bottom land reached without resin residue, the sufficient effect of sidewall resin filling of step trough.And by the outer central layer of upside, thickness and the resilient coating that flange part thickness equates being set, can further improve the reliability of lamination gummosis.In addition, adopt manufacture method of the present invention, prepreg can select common FR-4 prepreg to carry out pressing plate, and cost is lower.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of the accompanying claim of the present invention.
Claims (6)
1. a manufacture method for the pcb board of tool step trough, is characterized in that, comprises the following steps:
Step 1: the outer central layer of upside, core material and the outer central layer of downside that prepreg are provided and have made inner figure, the correspondence position that prepreg, the outer central layer of upside and core material are formed to step trough in wish is offered respectively groove;
Step 2: the outer central layer of upside, prepreg, core material and the outer central layer of downside are stacked together according to predetermined laminated layer sequence;
Step 3: joint sheet in the groove of the outer central layer of upside, prepreg and core material, described pad comprises the flange part of being located at the body in described groove and being positioned at body outer end, and the size of described flange part is greater than the size of described groove and is located at the upper surface of the outer central layer of described upside;
Step 4: the upper surface at the outer central layer of upside is placed resilient coating, and the thickness of described resilient coating equates with the thickness of described flange part, and on described resilient coating, the position of corresponding described flange part is provided with through hole to accommodate described flange part;
Step 5: carry out melting lamination under HTHP;
Step 6: remove resilient coating after lamination completes and take out the pad of filling, form step trough.
2. the manufacture method of the pcb board of tool step trough as claimed in claim 1, it is characterized in that, in described step 1, the step trough that the size of the groove of offering on the outer central layer of upside and core material and wish form measure-alike, the size of the groove of offering on prepreg is greater than the size of the step trough of wish formation.
3. the manufacture method of the pcb board of tool step trough as claimed in claim 1, is characterized in that, described prepreg adopts FR-4 prepreg.
4. the manufacture method of the pcb board of tool step trough as claimed in claim 1, is characterized in that, described pad is silica gel piece.
5. the manufacture method of the pcb board of tool step trough as claimed in claim 1, is characterized in that, the thickness of the flange part of described pad is 0.1-0.2mm.
6. the manufacture method of the pcb board of tool step trough as claimed in claim 1, is characterized in that, in described step 4, resilient coating comprises aluminium flake and release film, and described release film is between aluminium flake and the outer central layer of upside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110396258.4A CN102523684B (en) | 2011-12-02 | 2011-12-02 | Manufacture method for printed circuit board (PCB) with step groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110396258.4A CN102523684B (en) | 2011-12-02 | 2011-12-02 | Manufacture method for printed circuit board (PCB) with step groove |
Publications (2)
| Publication Number | Publication Date |
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| CN102523684A CN102523684A (en) | 2012-06-27 |
| CN102523684B true CN102523684B (en) | 2014-03-05 |
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| CN201110396258.4A Active CN102523684B (en) | 2011-12-02 | 2011-12-02 | Manufacture method for printed circuit board (PCB) with step groove |
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Families Citing this family (18)
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| CN102523688B (en) * | 2011-12-06 | 2013-12-25 | 东莞生益电子有限公司 | Method for manufacturing PCB (Printed Circuit Board) with stepped grooves |
| CN102769996B (en) * | 2012-08-03 | 2015-03-18 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102928563B (en) * | 2012-11-08 | 2016-04-06 | 广东生益科技股份有限公司 | Assess the method for different prepreg filling perforation |
| CN103068171B (en) * | 2012-12-24 | 2015-07-22 | 东莞生益电子有限公司 | Radio frequency printed circuit board (PCB) production process |
| CN104105344B (en) * | 2013-04-12 | 2017-05-17 | 北大方正集团有限公司 | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board |
| CN105451468A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Method of manufacturing a circuit board |
| CN104735912B (en) * | 2015-03-10 | 2018-07-06 | 广州杰赛科技股份有限公司 | A kind of production method of stepped plate |
| CN105163526B (en) * | 2015-08-21 | 2017-12-26 | 深圳崇达多层线路板有限公司 | A kind of preparation method of step trough and the printed circuit board comprising step trough |
| CN105307399B (en) * | 2015-10-23 | 2017-11-28 | 深圳市强达电路有限公司 | A kind of processing method of small size, thin pure ceramic circuit-board |
| CN105407646B (en) * | 2015-12-11 | 2018-06-12 | 深圳崇达多层线路板有限公司 | A kind of technique for improving the residual copper of stepped groove |
| CN105682364B (en) * | 2016-03-14 | 2018-07-03 | 江苏普诺威电子股份有限公司 | The processing method of stepped groove based on copper foil choked flow |
| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106252494A (en) * | 2016-08-22 | 2016-12-21 | 景旺电子科技(龙川)有限公司 | A kind of improve minute surface COB plate pressing and overflow the effective ways of glue |
| CN107231764A (en) * | 2017-06-28 | 2017-10-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the ladder wiring board for improving step platform precision |
| CN107734858A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN108811375B (en) * | 2018-06-26 | 2020-08-14 | 中国电子科技集团公司第二十九研究所 | Multilayer PCB blind groove gasket processing and filling method |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN113194638A (en) * | 2021-03-22 | 2021-07-30 | 山东英信计算机技术有限公司 | Manufacturing method and system of PCB with efficient heat dissipation and PCB |
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| CN102523684A (en) | 2012-06-27 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |