CN203901923U - Glue brushing assembly - Google Patents
Glue brushing assembly Download PDFInfo
- Publication number
- CN203901923U CN203901923U CN201420078067.2U CN201420078067U CN203901923U CN 203901923 U CN203901923 U CN 203901923U CN 201420078067 U CN201420078067 U CN 201420078067U CN 203901923 U CN203901923 U CN 203901923U
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- CN
- China
- Prior art keywords
- brush coating
- scraper
- mesh
- glue
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a scraper used for semiconductor encapsulation glue brushing and a glue brushing assembly with the scraper. The glue brushing assembly comprises the scraper and a printing mesh plate, wherein the scraper and the printing mesh plate are mutually matched, the scraper is provided with a main body part and a glue brushing part arranged on at least one side of the main body part, and mesh holes are formed in the printing mesh plate. At least one groove is formed in a position, corresponding to the middle position of at least one mesh hole, on the glue brushing part, and the groove penetrates through the glue brushing part in the thickness direction of the scraper.
Description
Technical field
The utility model relates to semiconductor packaging, relates in particular to a kind of brush coating assembly with scraper.
Background technology
In semiconductor package process, need to use load glue that chip is cemented on the slide holder such as printed circuit board (PCB), lead frame.For the electrical connection that realizes chip and printed circuit board (PCB), lead frame is prepared, load glue can be conducting resinl, can be also insulating cement, and it also has the function of heat radiation, conduction or insulation; Meanwhile, because the main component of load glue is resin, it can absorb and expands with heat and contract with cold the stress that causes and effectively prevent the lamination of different material interface.
At present, the technique that adhesive is accurately arranged in slide holder mainly has two kinds of a glue and brush coatings; Comparatively speaking, the speed of brush coating technique is wherein faster, forms the trend that replaces gradually gluing process.Scraper and Printing screen are the printing assemblies of most critical in brush coating technique, the operation principle of brush coating technique is mainly on Printing screen, to be pushed back and moved adhesive by scraper, make adhesive in mobile process, by escaping in the mesh on Printing screen on the slide holder that is positioned at Printing screen below, complete the process of brush coating.Blade design in existing brush coating technique is for complete entity is without engraved structure, and the design of the mesh of Printing screen is regular figure, consistent with the shape of bonding chip.But due to package dimension trend miniaturization and high density, to overflowing, glue region and the shape of glue and the thickness requirement of glue are more and more higher, the at present mesh of the scraper in brush coating technique and Printing screen design exists in encapsulation process that the glue region of overflowing is difficult to control, glue thickness is unstable and becomes between glue-line and chip to have Bubble formation, and then reduces the problem of the reliability of product.
Therefore, be necessary to provide a kind of improved brush coating assembly to address the above problem.
Utility model content
The purpose of this utility model is to provide a kind of brush coating amount that can effectively regulate in semiconductor packages to increase the brush coating assembly of the thick control flexibility of glue in brush coating process.
For realizing above-mentioned utility model object, the utility model provides a kind of brush coating assembly, for semiconductor packages, comprise the brush coating scraper and the Printing screen that cooperatively interact, described scraper has main part and is arranged on the brush coating portion of at least one side of main part, on described Printing screen, be provided with mesh, in described brush coating portion, the position corresponding with the centre position of mesh described at least one is provided with at least one groove, and described groove runs through this brush coating portion along blade thickness direction.
As further improvement of the utility model, the relative both sides of described main part are provided with described brush coating portion.
As further improvement of the utility model, described groove runs through the lateral margin of described brush coating portion away from main part, and the degree of depth of described groove is 1mm to 5mm.
As further improvement of the utility model, the width of described groove is 0.1mm to 10mm.
As further improvement of the utility model, described mesh has two pairs of madial walls that are oppositely arranged, and at least one pair of madial wall is set to nonlinear type, and this is outwards concaved with respectively depression to the both sides of madial wall.
The beneficial effects of the utility model are: the utility model is by arranging at least one runs through this brush coating portion groove along blade thickness direction in the brush coating portion at scraper, make in the brush coating process of semiconductor packages, can regulate glue amount by this groove, increase the flexibility of the thick control of glue in brush coating process, avoid adopting the existing thickness by change Printing screen and mesh size to change glue thick, make the adjusting that glue is thick convenient; Meanwhile, the groove correspondence on scraper is arranged on the centre position place of mesh, makes thick other regions that are obviously thicker than of mesh centre position glue after brush coating, thus after the process of chip pressing can be got rid of pressing by the mobility of glue the bubble between glue-line and chip; In addition, the groove design on scraper can also reduce the area of the mesh on Printing screen, solves components and parts and arranges intensive and cause mesh to arrange brush coating problem closely.
Brief description of the drawings
Fig. 1 is the local structural graph of the utility model brush coating scraper;
Fig. 2 is the part-structure schematic diagram of brush coating scraper in Fig. 1;
Fig. 3 is the Printing screen partial structurtes schematic diagram in the utility model brush coating assembly.
Detailed description of the invention
Below with reference to each embodiment shown in the drawings, the utility model is described in detail.But these embodiments do not limit the utility model, the conversion in structure, method or function that those of ordinary skill in the art makes according to these embodiments is all included in protection domain of the present utility model.
Please refer to Fig. 1 to Figure 3 shows that the utility model for the brush coating scraper 1 of semiconductor packages and thering is a preferred embodiments of the brush coating assembly of this scraper 1.The Printing screen 2 that described brush coating assembly comprises described scraper 1 and matches with described scraper 1.
Shown in Fig. 1, described scraper 1 has main part 11 and is arranged on the brush coating portion 12 of main part 11 at least one sides.In the present embodiment, for described scraper 1 is effectively utilized, be provided with described brush coating portion 12 in the relative both sides of the main part 11 of described scraper 1, thus the side brush coating portion 12 that can prevent long-time use and wearing and tearing after cause abandoning of this scraper 1, and then extend the service life of scraper 1.
In addition, preferred, the main part 11 on scraper 1 described in the utility model can be formed in one with brush coating portion 12, certainly, also can be designed to interfixed and formed by different parts, as long as can reach the object of brush coating.
Shown in Fig. 3, on described Printing screen 2, be provided with mesh 21.The position of arranging of the corresponding chip of described mesh 21 or components and parts (not shown) distributes.
In conjunction with shown in Fig. 1 to Fig. 3, described brush coating portion 12 is provided with at least one runs through this brush coating portion 12 groove 121 along scraper 1 thickness direction.Described groove 121 is arranged on the position corresponding with the centre position of mesh described at least one 21 in described brush coating portion 12.And described groove 121 runs through the lateral margin of described brush coating portion 12 away from main part 11, to facilitate passing through of glue.
In the diagram of present embodiment, described brush coating portion 12 is provided with multiple described grooves 121, and the mesh 21 on the Printing screen 2 coordinating with it with correspondence designs.The position of multiple described grooves 121 and size can design according to the size of the position of mesh 21 and corresponding mesh 21 and required glue amount thereof.In general, the degree of depth of described groove 121 can select to be designed to 1mm to 5mm, and the width of described groove 121 can select to be designed to 0.1mm to 10mm.
Shown in Fig. 3, the mobility of glue in the time of chip or components and parts installation for convenience, mesh 21 described in present embodiment is set to irregularly shaped, it is generally designed to similar dog bone shape, be specially: described mesh 21 has two pairs of madial walls 211 that are oppositely arranged, at least one pair of madial wall 211 is set to nonlinear type, and this is outwards concaved with respectively depression 2110 to the both sides of madial wall 211, this depression 2110 can be any shape, during mainly for chip or components and parts installation, glue can be flowed to these depression 2110 places; And another is designed to from lateral margin to centre position gradually to the interior projection of mesh 21 madial wall 211.
In sum, the utility model runs through this brush coating portion 12 by least one is set in the brush coating portion 12 at scraper 1 groove 121 along scraper 1 thickness direction, make in the brush coating process of semiconductor packages, can regulate glue amount by this groove 121, increase the flexibility of the thick control of glue in brush coating process, avoid adopting the existing thickness by change Printing screen 2 and mesh 21 sizes to change glue thick, make the adjusting that glue is thick convenient, and can make size and dimension change little chip attachment can to share same Printing screen; Simultaneously, groove 121 correspondences on scraper 1 are arranged on the centre position place of mesh 21, make thick other regions that are obviously thicker than of mesh 21 centre position glue after brush, thereby in the process of chip pressing, make the glue in this centre position can be to two side flow, thereby can get rid of the bubble between glue-line and chip after pressing; In addition, increase after glue amount by the groove 121 on scraper 1, can corresponding reduce the area of the mesh 21 on Printing screen 2, and then can solve components and parts and arrange intensive and cause mesh 21 to arrange brush coating problem closely.
Be to be understood that, although this description is described according to embodiment, but be not that each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should make description as a whole, technical scheme in each embodiment also can, through appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present utility model; they are not in order to limit protection domain of the present utility model, all do not depart from the equivalent embodiment that the utility model skill spirit does or change and all should be included in protection domain of the present utility model within.
Claims (5)
1. a brush coating assembly, for semiconductor packages, comprise the brush coating scraper and the Printing screen that cooperatively interact, described scraper has main part and is arranged on the brush coating portion of at least one side of main part, on described Printing screen, be provided with mesh, it is characterized in that: in described brush coating portion, the position corresponding with the centre position of mesh described at least one is provided with at least one groove, and described groove runs through this brush coating portion along blade thickness direction.
2. brush coating assembly according to claim 1, is characterized in that: the relative both sides of described main part are provided with described brush coating portion.
3. brush coating assembly according to claim 1, is characterized in that: described groove runs through the lateral margin of described brush coating portion away from main part, and the degree of depth of described groove is 1mm to 5mm.
4. according to the brush coating assembly described in any one in claims 1 to 3, it is characterized in that: the width of described groove is 0.1mm to 10mm.
5. brush coating assembly according to claim 1, is characterized in that: described mesh has two pairs of madial walls that are oppositely arranged, and at least one pair of madial wall is set to nonlinear type, and this is outwards concaved with respectively depression to the both sides of madial wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420078067.2U CN203901923U (en) | 2014-02-24 | 2014-02-24 | Glue brushing assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420078067.2U CN203901923U (en) | 2014-02-24 | 2014-02-24 | Glue brushing assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203901923U true CN203901923U (en) | 2014-10-29 |
Family
ID=51776216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420078067.2U Expired - Fee Related CN203901923U (en) | 2014-02-24 | 2014-02-24 | Glue brushing assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203901923U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105138138A (en) * | 2015-07-30 | 2015-12-09 | 山东超越数控电子有限公司 | Adhesive brushing screen plate and packaging method for reinforcing computer silicon keyboard |
| CN108556461A (en) * | 2018-03-30 | 2018-09-21 | 西安理工大学 | A kind of textured intaglio press doctor |
| JP2018187858A (en) * | 2017-05-09 | 2018-11-29 | 株式会社村田製作所 | Screen Printing Device |
-
2014
- 2014-02-24 CN CN201420078067.2U patent/CN203901923U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105138138A (en) * | 2015-07-30 | 2015-12-09 | 山东超越数控电子有限公司 | Adhesive brushing screen plate and packaging method for reinforcing computer silicon keyboard |
| JP2018187858A (en) * | 2017-05-09 | 2018-11-29 | 株式会社村田製作所 | Screen Printing Device |
| JP7043740B2 (en) | 2017-05-09 | 2022-03-30 | 株式会社村田製作所 | Screen printing device |
| CN108556461A (en) * | 2018-03-30 | 2018-09-21 | 西安理工大学 | A kind of textured intaglio press doctor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20150224 |
|
| EXPY | Termination of patent right or utility model |