CN206977782U - A kind of printed wiring board containing blind hole of high density interconnection - Google Patents
A kind of printed wiring board containing blind hole of high density interconnection Download PDFInfo
- Publication number
- CN206977782U CN206977782U CN201720661308.XU CN201720661308U CN206977782U CN 206977782 U CN206977782 U CN 206977782U CN 201720661308 U CN201720661308 U CN 201720661308U CN 206977782 U CN206977782 U CN 206977782U
- Authority
- CN
- China
- Prior art keywords
- heat
- bottom plate
- wiring board
- conductive sole
- polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920000728 polyester Polymers 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 125000006850 spacer group Chemical group 0.000 claims abstract description 12
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 10
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000011120 plywood Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000010354 integration Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of printed wiring board containing blind hole of high density interconnection, including polyester bottom plate, the polyester plate upper surface is closely fitted with thermoplastic printing layer, the polyester bottom plate left side wall and rear uniform surface is body formed card article, the preceding surface of the polyester bottom plate and right side wall are provided with neck, the polyester bottom plate lower surface is closely fitted with heat conduction glued board, and the heat conduction glued board lower surface gluing has conductive sole plate, and the conductive sole plate lower surface is integrally formed with heat-dissipation spacer；The splicing of polylith polyester bottom plate is realized by the cooperation of neck and card article, so as to form the wiring board of an entirety, and carry out thermoplastic integration by heating thermoplastic printing layer after splicing, avoid splicing gap influence wiring, and the conductive sole plate of bottom, heat-dissipation spacer, circulation heat conducting pipe form a heat abstractor for no reason at all, by wiring board work caused by heat carry out loss cooling.
Description
Technical field
Printed wiring board technical field is the utility model is related to, specially a kind of printed wiring containing blind hole of high density interconnection
Plate.
Background technology
High density printed wiring board is substrate common in electronic product, needs integrated substantial amounts of electronics member at an upper portion thereof
Part, and electronic component can produce substantial amounts of heat in use, while wiring board needs to carry out the limit of size in use
It is fixed, so as to need to be cut, cause the main body of wiring board may destroy, be this it is proposed that a kind of containing for high density interconnection is blind
Hole printed wiring board.
Utility model content
The purpose of this utility model is to provide a kind of printed wiring board containing blind hole of high density interconnection, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides following technical scheme：A kind of high density interconnection is printed containing blind hole
Wiring board, including polyester bottom plate, the polyester plate upper surface are closely fitted with thermoplastic printing layer, the polyester bottom plate left side wall
With rear uniform surface is body formed a card article, the preceding surface of the polyester bottom plate and right side wall are provided with neck, under the polyester bottom plate
Surface is closely fitted with heat conduction glued board, and the heat conduction glued board lower surface gluing has conductive sole plate, the conductive sole plate following table
Integrally formed with heat-dissipation spacer, the conductive sole plate in the interval of the heat-dissipation spacer is described to dissipate integrally formed with heat conduction deck in face
Hot dividing plate intersection is provided with radiating block, and the radiating block is integrally formed in the lower surface of conductive sole plate, the heat conduction deck following table
Face is installed with circulation heat conducting pipe.
Preferably, the circulation heat conducting pipe is snakelike arrangement, and symmetrical along the diagonal of conductive sole plate.
Preferably, central tube is provided with the middle part of the circulation heat conducting pipe, the central tube is fitted with three around pipe, described around pipe
It is bonded the inwall of circulation heat conducting pipe.
Preferably, the central tube in pipe pipe with being filled with endothermic ring flow liquid.
Compared with prior art, the beneficial effects of the utility model are：Realize that polylith gathers by the cooperation of neck and card article
The splicing of ester bottom plate, so as to form the wiring board of an entirety, and carried out after splicing by heating thermoplastic printing layer
Thermoplastic is integrated, and avoids splicing gap influence wiring, and the conductive sole plate of bottom, heat-dissipation spacer, circulation heat conducting pipe form a nothing
Edge heat abstractor, by wiring board work caused by heat carry out loss cooling.
Brief description of the drawings
Fig. 1 is the utility model main structure diagram；
Fig. 2 is the utility model right side structural representation；
Fig. 3 is the utility model conductive sole plate present invention looks up structural representation；
Fig. 4 is that the utility model circulating pipe cuts open figure.
In figure：1st, polyester bottom plate, 2, thermoplastic printing layer, 3, card article, 4, neck, 5, heat conduction glued board, 6, conductive sole plate, 7,
Circulation heat conducting pipe, 71, around pipe, 72, central tube, 8, heat-dissipation spacer, 9, radiating block, 10, heat conduction deck.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-4 are referred to, the utility model provides a kind of technical scheme：A kind of printed wiring containing blind hole of high density interconnection
Plate, including polyester bottom plate 1, it is the installation foundation of whole device, the upper surface of polyester bottom plate 1 is closely fitted with thermoplastic printing layer
2, integrated by heating, polyester bottom plate 1 is spliced into caused gap is made up, the left side wall of polyester bottom plate 1
With rear uniform surface is body formed card article 3, the 1 preceding surface of polyester bottom plate and right side wall are provided with neck 4, pass through the He of card article 3
The cooperation of neck 4 realizes that the splicing of polyester bottom plate 1 is integrated, and the lower surface of polyester bottom plate 1 is closely fitted with heat conduction glued board 5,
Heat caused by electronic component on device is conducted, and polyester bottom plate 1 and conductive sole plate 6 are combined, it is described to lead
The lower surface gluing of hot glue plywood 5 has conductive sole plate 6, and heat caused by device is conducted, the lower surface one of conductive sole plate 6
It is body formed to have heat-dissipation spacer 8, the heat of circulation heat conducting pipe 7 and conductive sole plate 6 is radiated, the interval of the heat-dissipation spacer 8
In conductive sole plate 6 integrally formed with heat conduction deck 10, the heat of conductive sole plate 6 is conducted to circulation heat conducting pipe 7, the radiating
The intersection of dividing plate 8 is provided with radiating block 9, increases the radiating efficiency of device, and the radiating block 9 is integrally formed under conductive sole plate 6
Surface, the lower surface of heat conduction deck 10 are installed with circulation heat conducting pipe 7, pass through heat conduction of the inside inside pipe 71 and central tube 72
The circulation of circulation liquid carries out heat circulation conduction.
Specifically, the circulation heat conducting pipe 7 is snakelike arrangement, and symmetrical along the diagonal of conductive sole plate 6 so that
Whole device is adapted to more setting angles.
Specifically, the middle part of circulation heat conducting pipe 7 is provided with central tube 72, and the central tube 72 is fitted with three around pipe
71, the inwall that circulation heat conducting pipe 7 is bonded around pipe 71, inner wrap circulation structure is formed, reaches the purpose of circulation.
Specifically, the central tube 72 with managed around pipe 71 in be filled with endothermic ring flow liquid, increase caloric receptivity and provide hot
Measure the carrier of circulation.
Operation principle：According to size requirements, by the cooperation of neck 4 and card article 3, polyester bottom plate 1 is spliced, spliced
After end, thermoplastic printing layer 2 is heated, after plasticity, carries out printed wiring board, in use, electronic component
Caused heat, there are polyester bottom plate 1 and heat conduction glued board 5 to transfer heat to conductive sole plate 6, then heat is by heat conduction deck 10
Circulation heat conducting pipe 7 is passed to, and the circulation conductive fluid around pipe 71 and central tube 72 and its inside inside circulation heat conducting pipe 7 is carried out
Heat circulation radiating, while a heat part for conductive sole plate 6 has heat-dissipation spacer 8 and radiating block 9 to be radiated.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of printed wiring board containing blind hole of high density interconnection, including polyester bottom plate (1), polyester bottom plate (1) upper surface
It is closely fitted with thermoplastic printing layer (2), polyester bottom plate (1) left side wall and rear uniform surface is body formed a card article (3) is described
The preceding surface of polyester bottom plate (1) and right side wall are provided with neck (4), and polyester bottom plate (1) lower surface is closely fitted with heat-conducting glue
Plywood (5), heat conduction glued board (5) lower surface gluing have a conductive sole plate (6), conductive sole plate (6) the lower surface one into
Type has a heat-dissipation spacer (8), and the conductive sole plate (6) in the interval of the heat-dissipation spacer (8) is integrally formed with heat conduction deck (10), institute
To state heat-dissipation spacer (8) intersection and be provided with radiating block (9), the radiating block (9) is integrally formed in the lower surface of conductive sole plate (6),
Heat conduction deck (10) lower surface is installed with circulation heat conducting pipe (7).
A kind of 2. printed wiring board containing blind hole of high density interconnection according to claim 1, it is characterised in that：The circulation
Heat conducting pipe (7) is snakelike arrangement, and symmetrical along the diagonal of conductive sole plate (6).
A kind of 3. printed wiring board containing blind hole of high density interconnection according to claim 1, it is characterised in that：The circulation
Central tube (72) is provided with the middle part of heat conducting pipe (7), the central tube (72) is fitted with three around pipe (71), described to be bonded around pipe (71)
The inwall of circulation heat conducting pipe (7).
A kind of 4. printed wiring board containing blind hole of high density interconnection according to claim 3, it is characterised in that：The center
Pipe (72) in pipe (71) pipe with being filled with endothermic ring flow liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661308.XU CN206977782U (en) | 2017-06-08 | 2017-06-08 | A kind of printed wiring board containing blind hole of high density interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661308.XU CN206977782U (en) | 2017-06-08 | 2017-06-08 | A kind of printed wiring board containing blind hole of high density interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206977782U true CN206977782U (en) | 2018-02-06 |
Family
ID=61407375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720661308.XU Expired - Fee Related CN206977782U (en) | 2017-06-08 | 2017-06-08 | A kind of printed wiring board containing blind hole of high density interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206977782U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918479A (en) * | 2020-09-17 | 2020-11-10 | 广州深卓信息科技有限公司 | PCB circuit board structure and detection sorting equipment thereof |
-
2017
- 2017-06-08 CN CN201720661308.XU patent/CN206977782U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918479A (en) * | 2020-09-17 | 2020-11-10 | 广州深卓信息科技有限公司 | PCB circuit board structure and detection sorting equipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180206 Termination date: 20200608 |