CN205385603U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
- Publication number
- CN205385603U CN205385603U CN201521131627.7U CN201521131627U CN205385603U CN 205385603 U CN205385603 U CN 205385603U CN 201521131627 U CN201521131627 U CN 201521131627U CN 205385603 U CN205385603 U CN 205385603U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- prepreg
- cavity
- gear glue
- line plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000011889 copper foil Substances 0.000 claims abstract description 68
- 239000003292 glue Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 abstract 4
- 230000005574 cross-species transmission Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000003365 glass fiber Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a MEMS microphone, including third circuit board, the first line board and the the second line board from top to bottom placed, the the first line board includes: first substrate, first substrate center enclose into the cavity of the first line board, and the the second line board includes the second substrate, and the first line board and the second line board pass through prepreg and bond. The periphery that is close to the cavity in first substrate bottom surface sets up first fender and glues the copper foil, and the position that corresponds the cavity on the second substrate sets up the second and keeps off gluey copper foil, prepreg arranges in between the first line board and the the second line board, and prepreg's inward flange aligns with the outward flange that copper foil and the gluey copper foil of second fender were glued to first fender. First fender is glued copper foil and second and is kept off and glue the copper foil and avoided prepreg to spill over to the cavity in effectively, and then avoids the unstable scheduling problem of performance, reliability of its short circuit that leads to or product.
Description
Technical field
This utility model relates to wiring board production technical field, particularly to a kind of MEMS microphone.
Background technology
Wiring board generally comprises monolayer wiring board and multilayer circuit board, when producing multilayer circuit board, it is necessary to the monolayer wiring board of multilamellar is carried out pressing, and centre typically requires pressing layer of prepreg.Prepreg (prepreg) is mainly made up of resin and reinforcing material, and reinforcing material adopts glass-fiber-fabric mostly.Under the effect of uniform temperature and pressure, prepreg melts and flows, fill line and base material, and when temperature is reduced to a certain degree, prepreg solidifies, thus being bonded together by the wiring board of multilamellar.
But when producing certain class multilayer circuit board, such as, the multilayer circuit board of MEMS microphone as Figure 1-3, wiring board (1 ') has cavity (12 '), in the process of pressing prepreg (3 '), prepreg (3 ') melts and flows, and resin (32 ') and glass fibre (33 ') in prepreg (3 ') can spill in cavity (12 ').In the follow-up process carrying out heavy copper, overflow resin (32 ') and overflow on glass fibre (33 ') surface also can by heavy upper Copper Foil (16 ') so that overflowing resin (32 ') and spilling glass fibre (33 ') also has electric conductivity.When product finally assembles, spilling resin (32 ') of these conductions and spilling glass fibre (33 ') can cause short circuit or cause the performance of product, reliability unstable.
Utility model content
In view of the above problems, this utility model provides a kind of MEMS microphone, spills into wiring board internal cavities with the resin solved in existing multilayer circuit board bonding processes in prepreg and glass fibre, and is likely to affect the problem of properties of product.
For reaching above-mentioned purpose, the technical solution of the utility model is achieved in that
This utility model provides a kind of MEMS microphone, including the first line plate from top to bottom placed and the second wiring board, described first line plate includes: the first base material, described first base material surrounds the cavity of described first line plate, described second wiring board includes the second base material, described first line plate and the second wiring board are bonding by prepreg
Described first base material bottom surface arranges first gear glue Copper Foil near the periphery of described cavity, and on described second base material, the position of corresponding described cavity arranges second gear glue Copper Foil, and the outward flange of described second gear glue Copper Foil aligns with the outward flange of described first gear glue Copper Foil；
Described prepreg is placed between described first line plate and described second wiring board, the inward flange of described prepreg aligns with the outward flange of described first gear glue Copper Foil and described second gear glue Copper Foil, and the thickness sum of described first gear glue Copper Foil and described second gear glue Copper Foil is equal with the thickness of described prepreg.
Alternatively, the outer layer of described first base material is disposed with the first copper foil layer and the first solder mask, and the outer layer of described second base material is disposed with the second copper foil layer and the second solder mask.
Alternatively, in the cavity on described first line plate, MEMS chip and asic chip are set.
Alternatively, described MEMS microphone also includes: is placed in the tertiary circuit plate on described first line plate, described first line plate and described tertiary circuit plate and is bondd by solder(ing) paste or bondd by prepreg.
The beneficial effects of the utility model are: a kind of MEMS microphone that this utility model provides, at first line plate, first gear glue Copper Foil is set near the periphery of cavity, the position that second wiring board is corresponding with cavity arranges second gear glue Copper Foil, in prepreg bonding processes, first gear glue Copper Foil and second gear glue Copper Foil collectively constitute glue blocking wall, the prepreg preventing fusing is spilled in cavity, efficiently avoid the prepreg of spilling in follow-up heavy copper process by Copper Foil on heavy, and then avoid the performance of its short circuit caused or product, the problems such as reliability is unstable.
Accompanying drawing explanation
Fig. 1 is the decomposition texture profile of the multilayer circuit board of prior art；
Fig. 2 is the first package assembly profile of the multilayer circuit board of prior art；
Fig. 3 is the second package assembly profile of the multilayer circuit board of prior art；
Fig. 4 is the decomposition texture profile of the MEMS microphone of this utility model embodiment；
Fig. 5 is the first package assembly profile of the MEMS microphone of this utility model embodiment；
Fig. 6 is the second package assembly profile of the MEMS microphone of this utility model embodiment.
Wherein, 1, 1 ' is first line plate, 11, 11 ' is the first base material, 12, the cavity that 12 ' is first line plate, 13, 13 ' is the first copper foil layer, 14, 14 ' is the first solder mask, 15 is acoustic aperture, 16, 16 ' is Copper Foil, 17 is first gear glue Copper Foil, 18, 18 ' is MEMS chip, 19, 19 ' is asic chip, 2, 2 ' is the second wiring board, 21, 21 ' is the second base material, 22, 22 ' is the second copper foil layer, 23, 23 ' is the second solder mask, 24 is second gear glue Copper Foil, 3, 3 ' is prepreg, 31, the inward flange that 31 ' is prepreg, 32 ' for overflowing resin, 33 ' for overflowing glass fibre, 4, 4 ' is tertiary circuit plate.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, this utility model embodiment is described in further detail.
Fig. 1 is the decomposition texture profile of the multilayer circuit board of prior art；Fig. 2 is the first package assembly profile of the multilayer circuit board of prior art；Fig. 3 is the second package assembly profile of the multilayer circuit board of prior art.As shown in Figures 1 to 3, in prior art when having cavity 12 ' on first line plate 1 ', in the process of pressing prepreg 3 ', prepreg 3 ' melts and flows, and resin 32 ' and glass fibre 33 ' in prepreg 3 ' can spill in cavity 12 '.In the follow-up process carrying out the heavy copper of secondary, overflow resin 32 ' with overflowing and glass fibre 33 ' surface also by heavy upper Copper Foil 16 ', can also have electric conductivity so that overflowing resin 32 ' with overflowing glass fibre 33 '.When product finally assembles, the spilling resin 32 ' of these conductions with overflow glass fibre 33 ' and may contact with electronic device 15 ' etc. and to cause short circuit or the problem such as cause the performance of product, reliability unstable.
Fig. 4 is the decomposition texture profile of the MEMS microphone of this utility model embodiment；Fig. 5 is the first package assembly profile of the MEMS microphone of this utility model embodiment；Fig. 6 is the second package assembly profile of the MEMS microphone of this utility model embodiment.As shown in Figs. 4-6, the MEMS microphone of embodiment of the present utility model includes first line plate 1 and the second wiring board 2 from top to bottom placed, first line plate 1 includes: the first base material 11, first base material surrounds the cavity 12 of first line plate 1, second wiring board 2 includes the second base material 21, and first line plate 1 and the second wiring board 2 are bonding by prepreg 3.
First gear glue Copper Foil 17 is set near the periphery of cavity 12 in the first base material 1 bottom surface, on the second base material 21, the corresponding position with cavity 12 arranges second gear glue Copper Foil 24, the outward flange of second gear glue Copper Foil 24 aligns with the outward flange of first gear glue Copper Foil 13, and the thickness sum of first gear glue Copper Foil 17 and second gear glue Copper Foil 24 is equal with the thickness of prepreg 3.In an embodiment of the present invention, first gear glue Copper Foil 17 and second gear glue Copper Foil 24 collectively constitute glue blocking wall, certainly, first gear glue Copper Foil 17 can also be only set, and the thickness of first gear glue Copper Foil 17 is equal with the thickness of prepreg 3, or second gear glue Copper Foil 24 is only set, and the thickness of second gear glue Copper Foil 24 is equal with the thickness of prepreg 3.
In this utility model embodiment, in the first cavity 12 on first line plate 1, MEMS chip 18 and asic chip 19 are set.There is one layer of encapsulating compound that asic chip 19 is sealed outside asic chip 19, the effects such as waterproof, protection against the tide, shockproof, dust-proof, waterproof, heat radiation, secrecy after sealing, can be played.First line plate 1 is additionally provided with tertiary circuit plate 4, in this utility model embodiment, first line plate 1 and tertiary circuit plate 4 are bondd by solder(ing) paste, can certainly be bondd by prepreg, namely identical with the combination of first line plate 1 and the second wiring board 2.Also setting up acoustic aperture 15 on tertiary circuit plate 4, acoustic aperture 15 is just to MEMS chip 18.
In embodiment of the present utility model, the outer layer of the first base material 11 and the second base material 21 is covered with the first copper foil layer 13 and the second copper foil layer 22 when first time heavy copper.The outer layer of the first copper foil layer 13 and the second copper foil layer 22 is additionally provided with the first solder mask 14 and the second solder mask 23, for protection circuit, it is to avoid oxidation and solder shorts.In MEMS microphone bonding processes, being first placed in by prepreg 3 between first line plate 1 and the second wiring board 2, the inward flange 31 of prepreg 13 aligns with the outward flange of first gear glue Copper Foil 17 and second gear glue Copper Foil 24.Then MEMS microphone being heated, pressurize, prepreg 3 starts fusing and flows, fill line and base material.Starting cooling afterwards, when temperature is reduced to a certain degree, prepreg 3 solidifies, thus first line plate 1 and the second wiring board 2 being bonded together.When first line plate 1 cavity 12 carries out the heavy copper of secondary, the Copper Foil 16 of cavity 12 side is combined as a whole collectively constitutes conductive layer with first gear glue Copper Foil 17, second gear glue Copper Foil 24 and the first copper foil layer 13.
From the above, in first line plate 1 and the second wiring board 2 bonding processes, stop due to the glue blocking wall that first gear glue Copper Foil 17 and second gear glue Copper Foil 24 form, the prepreg 3 of fusing will not be spilled in the cavity 12 of first line plate 1, efficiently avoid the prepreg overflowed in prior art and carry out the heavy copper process of secondary is sunk Copper Foil 16 follow-up, and then avoid its short circuit caused or the problem such as the performance of product, reliability instability.
In sum, this utility model embodiment provides the benefit that: a kind of MEMS microphone that this utility model embodiment provides, at first line plate, first gear glue Copper Foil is set near the periphery of the first cavity, the position that second wiring board is corresponding with the first cavity arranges second gear glue Copper Foil, in prepreg bonding processes, first gear glue Copper Foil and second gear glue Copper Foil collectively constitute glue blocking wall, the prepreg preventing fusing is spilled in the first cavity, efficiently avoid the prepreg of spilling in follow-up heavy copper process by Copper Foil on heavy, and then avoid its short circuit caused or cause the performance of product, the problems such as reliability is unstable.
The foregoing is only preferred embodiment of the present utility model, be not intended to limit protection domain of the present utility model.All make within spirit of the present utility model and principle any amendment, equivalent replacement, improvement etc., be all contained in protection domain of the present utility model.
Claims (5)
1. a MEMS microphone, including the first line plate (1) from top to bottom placed and the second wiring board (2), described first line plate (1) includes the first base material (11), described first base material (11) surrounds the cavity (12) of described first line plate (1), described second wiring board (2) includes the second base material (21), described first line plate (1) and the second wiring board (2) are bonding by prepreg (3), it is characterized in that
In described first base material (1) bottom surface, first gear glue Copper Foil (17) is set near the periphery of described cavity (12), arranging second gear glue Copper Foil (24) in the position of described second base material (21) corresponding described cavity (12) above, the outward flange of described second gear glue Copper Foil (24) aligns with the outward flange of described first gear glue Copper Foil (13)；
Described prepreg (3) is placed between described first line plate (1) and described second wiring board (2), the inward flange (31) of described prepreg (13) aligns with the outward flange of described first gear glue Copper Foil (17) and described second gear glue Copper Foil (24), and the thickness sum of described first gear glue Copper Foil (17) and described second gear glue Copper Foil (24) is equal with the thickness of described prepreg (3).
2. MEMS microphone according to claim 1, it is characterized in that, the outer layer of described first base material (11) is disposed with the first copper foil layer (13) and the first solder mask (14), and the outer layer of described second base material (21) is disposed with the second copper foil layer (22) and the second solder mask (23).
3. MEMS microphone according to claim 1 and 2, it is characterised in that MEMS chip (18) and asic chip (19) are set in the cavity (12) on described first line plate (1).
4. MEMS microphone according to claim 3, it is characterized in that, described MEMS microphone also includes: being placed in the tertiary circuit plate (4) on described first line plate (1), described first line plate (1) and described tertiary circuit plate (4) are bondd by solder(ing) paste or bondd by prepreg.
5. MEMS microphone according to claim 4, it is characterised in that also set up acoustic aperture (15) on described tertiary circuit plate (4), described acoustic aperture (15) is just to described MEMS chip (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521131627.7U CN205385603U (en) | 2015-12-29 | 2015-12-29 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521131627.7U CN205385603U (en) | 2015-12-29 | 2015-12-29 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205385603U true CN205385603U (en) | 2016-07-13 |
Family
ID=56347257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521131627.7U Active CN205385603U (en) | 2015-12-29 | 2015-12-29 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205385603U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658956A (en) * | 2017-02-14 | 2017-05-10 | 江苏普诺威电子股份有限公司 | Waterproof and ventilating sound aperture structure and processing technology therefor |
| CN107454547A (en) * | 2017-09-08 | 2017-12-08 | 维沃移动通信有限公司 | A kind of microphone and microphone manufacturing method |
-
2015
- 2015-12-29 CN CN201521131627.7U patent/CN205385603U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658956A (en) * | 2017-02-14 | 2017-05-10 | 江苏普诺威电子股份有限公司 | Waterproof and ventilating sound aperture structure and processing technology therefor |
| CN106658956B (en) * | 2017-02-14 | 2023-03-31 | 江苏普诺威电子股份有限公司 | Waterproof and breathable sound hole structure and processing technology thereof |
| CN107454547A (en) * | 2017-09-08 | 2017-12-08 | 维沃移动通信有限公司 | A kind of microphone and microphone manufacturing method |
| CN107454547B (en) * | 2017-09-08 | 2019-11-15 | 维沃移动通信有限公司 | A kind of microphone and microphone manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI575617B (en) | An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus | |
| TW545100B (en) | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device | |
| CN109257888B (en) | Circuit board double-sided packaging method and structure and mobile terminal | |
| JP6654994B2 (en) | Circuit component manufacturing method | |
| WO2013008415A1 (en) | Wiring board and method for manufacturing three-dimensional wiring board | |
| CN103280436B (en) | Surface mounting component and preparation method thereof | |
| CN103747616B (en) | Parts installation module | |
| JP6430143B2 (en) | Resin molding apparatus, resin molding method, and molded product manufacturing method | |
| US8867225B2 (en) | Wiring board | |
| US10718497B2 (en) | Electronic product with light emitting function and method for manufacturing the same | |
| CN107071238A (en) | A kind of ultra-thin high-definition camera module and its manufacturing process | |
| JP2011243870A (en) | Coil mounting board | |
| TWI566355B (en) | Printed circuit board with electronic component and method for manufacturing same | |
| TWI570816B (en) | Package structure and method of manufacture | |
| CN104299919B (en) | Coreless package structure and method for manufacturing the same | |
| CN205385603U (en) | MEMS microphone | |
| TWI455258B (en) | Structure and method of electronic component embedded package | |
| TW201605001A (en) | Method of manufacturing electronic package module and electronic package module manufactured by the same | |
| KR20140083514A (en) | Core substrate and method for manufacturing the same, and substrate with built-in electronic component and method for manufacturing the smae | |
| CN103762200B (en) | Chip package and method for packing thereof | |
| CN103094234B (en) | The fan-out-type panel grade BGA package part and its manufacture craft of a kind of extended pin | |
| US20110104429A1 (en) | Substrate member, module, electric equipment, and manufacturing method of modules | |
| CN109195360A (en) | A kind of method for manufacturing circuit board improving rigid-flex combined board dynamic area recess | |
| TWI596718B (en) | A circuit module package structure and packaging method thereof | |
| CN207637845U (en) | A kind of simple semiconductor package, SAW filter and terminal device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |