TW200505306A - Epoxy resin laminate board as a reinforcing material for flexible printed wiring board - Google Patents

Epoxy resin laminate board as a reinforcing material for flexible printed wiring board

Info

Publication number
TW200505306A
TW200505306A TW093118932A TW93118932A TW200505306A TW 200505306 A TW200505306 A TW 200505306A TW 093118932 A TW093118932 A TW 093118932A TW 93118932 A TW93118932 A TW 93118932A TW 200505306 A TW200505306 A TW 200505306A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
board
wiring board
reinforcing material
printed wiring
Prior art date
Application number
TW093118932A
Other languages
Chinese (zh)
Inventor
Tsutomu Kariba
Jinn Shimizu
Original Assignee
Risho Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Kk filed Critical Risho Kogyo Kk
Publication of TW200505306A publication Critical patent/TW200505306A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Abstract

A glass fiber substrate/epoxy resin laminate board as a reinforcing material for a flexible printed wiring board is provided which can suppress a fall of powder from blanked surfaces during blanking, and which is superior in the peelability at portions where no bonding is necessary during hot pressing with the flexible wiring board. The laminate board is formed by superposing electrically insulating films on both sides of an epoxy resin prepreg formed by impregnating a glass fiber substrate with an epoxy resin and hot pressing them together.
TW093118932A 2003-07-04 2004-06-29 Epoxy resin laminate board as a reinforcing material for flexible printed wiring board TW200505306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191870A JP4276006B2 (en) 2003-07-04 2003-07-04 Epoxy resin laminate for reinforcement of flexible printed wiring boards

Publications (1)

Publication Number Publication Date
TW200505306A true TW200505306A (en) 2005-02-01

Family

ID=34189315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118932A TW200505306A (en) 2003-07-04 2004-06-29 Epoxy resin laminate board as a reinforcing material for flexible printed wiring board

Country Status (6)

Country Link
JP (1) JP4276006B2 (en)
KR (1) KR20050004091A (en)
CN (1) CN100471359C (en)
MY (1) MY143874A (en)
SG (1) SG121911A1 (en)
TW (1) TW200505306A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045150A (en) * 2005-07-15 2007-02-22 Kaneka Corp Fiber-resin composite, its manufacturing method and printed wiring board
JP2007059586A (en) * 2005-08-24 2007-03-08 Fujikura Ltd Wiring circuit board and manufacturing method thereof
MY151594A (en) * 2007-02-08 2014-06-13 Sumitomo Bakelite Co Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body
KR20100039329A (en) * 2007-07-09 2010-04-15 스미토모 베이클리트 컴퍼니 리미티드 Resin sheet for circuit board and method for manufacturing the resin sheet
CN101437358B (en) * 2007-11-14 2010-04-14 昆山雅森电子材料科技有限公司 Protection film for printed circuit board and procedure for processing circuit board using the protection film
JP5428651B2 (en) * 2008-10-10 2014-02-26 日立化成株式会社 Metal foil-clad laminate, double-sided metal foil-clad laminate, manufacturing method thereof and printed wiring board
JP5251763B2 (en) * 2009-01-28 2013-07-31 日立化成株式会社 Double-sided metal foil-clad laminate and flexible printed wiring board
JP7168034B2 (en) 2020-08-28 2022-11-09 住友金属鉱山株式会社 Atomizing device, method for producing metal powder, and method for producing valuable metal

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227332A (en) * 1990-01-31 1991-10-08 Hitachi Chem Co Ltd Production of laminated board
JPH06120673A (en) * 1992-10-07 1994-04-28 Matsushita Electric Ind Co Ltd Multilayer printed wiring board and production thereof
JPH10222497A (en) * 1997-02-07 1998-08-21 Omron Corp Kana(japanese syllabary)/kanji (chinese character) conversion device/method
JPH1140944A (en) * 1997-07-17 1999-02-12 Sharp Corp Method and apparatus for manufacturing multilayered wiring board
JP3568091B2 (en) * 1997-08-20 2004-09-22 ソニー株式会社 Laminated sheet, printed wiring board and method of manufacturing the same
JPH11163524A (en) * 1997-11-27 1999-06-18 Matsushita Electric Ind Co Ltd Multilayer wiring board and semiconductor device employing the same
JP3531858B2 (en) * 1999-06-18 2004-05-31 株式会社デジタル Multilayer printed circuit board
JP2003080620A (en) * 2001-09-10 2003-03-19 Shin Kobe Electric Mach Co Ltd Glass fiber substrate/epoxy resin laminated sheet for backing material of flexible printed wiring board

Also Published As

Publication number Publication date
JP4276006B2 (en) 2009-06-10
JP2005022323A (en) 2005-01-27
MY143874A (en) 2011-07-15
CN100471359C (en) 2009-03-18
CN1578585A (en) 2005-02-09
SG121911A1 (en) 2006-05-26
KR20050004091A (en) 2005-01-12

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