AU2003242007A1 - Resin composition for printed wiring board, prepreg, and laminate obtained with the same - Google Patents

Resin composition for printed wiring board, prepreg, and laminate obtained with the same

Info

Publication number
AU2003242007A1
AU2003242007A1 AU2003242007A AU2003242007A AU2003242007A1 AU 2003242007 A1 AU2003242007 A1 AU 2003242007A1 AU 2003242007 A AU2003242007 A AU 2003242007A AU 2003242007 A AU2003242007 A AU 2003242007A AU 2003242007 A1 AU2003242007 A1 AU 2003242007A1
Authority
AU
Australia
Prior art keywords
prepreg
resin composition
same
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003242007A
Inventor
Akinori Hibino
Katsuhiko Ito
Hidetsugu Motobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of AU2003242007A1 publication Critical patent/AU2003242007A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2631—Coating or impregnation provides heat or fire protection
    • Y10T442/2713—Halogen containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
AU2003242007A 2003-06-03 2003-06-03 Resin composition for printed wiring board, prepreg, and laminate obtained with the same Abandoned AU2003242007A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/007052 WO2004108791A1 (en) 2003-06-03 2003-06-03 Resin composition for printed wiring board, prepreg, and laminate obtained with the same

Publications (1)

Publication Number Publication Date
AU2003242007A1 true AU2003242007A1 (en) 2005-01-04

Family

ID=33495915

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003242007A Abandoned AU2003242007A1 (en) 2003-06-03 2003-06-03 Resin composition for printed wiring board, prepreg, and laminate obtained with the same

Country Status (7)

Country Link
US (1) US8470938B2 (en)
EP (1) EP1637554B1 (en)
JP (1) JP4915549B2 (en)
CN (1) CN100424110C (en)
AU (1) AU2003242007A1 (en)
TW (1) TWI266790B (en)
WO (1) WO2004108791A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070293614A1 (en) * 2006-06-15 2007-12-20 Zhou Wenjing J Powder coating composition for pipe coating
KR100877342B1 (en) * 2007-09-13 2009-01-07 삼성전기주식회사 Flame retardant resin composition for printed circuit board, printed circuit board using the same and manufacturing method thereof
KR101091305B1 (en) 2009-10-09 2011-12-07 유니플러스 일렉트로닉스 컴퍼니 리미티드 Method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers
EP2374828B1 (en) * 2010-04-08 2016-07-20 Nan-Ya Plastics Corporation Preparation of a low dielectric brominated resin with a symmetric or saturated heterocyclic aliphatic molecular structure and composition comprising said resin
CN101892027B (en) * 2010-07-08 2013-05-01 广东生益科技股份有限公司 Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same
CN102514304B (en) * 2011-11-14 2014-08-27 上海南亚覆铜箔板有限公司 Common Tg lead-free copper clad laminate and preparation method thereof
JP6274112B2 (en) * 2012-12-12 2018-02-07 株式会社ニコン Composition, laminate, method for producing laminate, transistor and method for producing transistor
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
CN104582278B (en) * 2014-09-04 2017-08-29 陈鹏 A kind of circuit board and preparation method thereof
JPWO2017057689A1 (en) * 2015-09-30 2018-09-06 新日鉄住金化学株式会社 Curable epoxy resin composition and fiber reinforced composite material using the same
CN110328914A (en) * 2019-06-17 2019-10-15 吉安市宏瑞兴科技有限公司 A kind of copper-clad plate and preparation method thereof suitable for PCB processing procedure with good flame-retardance
CN110358252B (en) * 2019-06-26 2021-07-13 建滔电子材料（江阴）有限公司 Glue solution for producing lead-free high-reliability FR-4 copper-clad plate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0748586B2 (en) 1992-04-24 1995-05-24 東芝ケミカル株式会社 Method for manufacturing multilayer printed wiring board
JPH0768380B2 (en) 1992-04-24 1995-07-26 東芝ケミカル株式会社 Prepreg for printed wiring board
JPH0812858A (en) 1994-06-28 1996-01-16 Matsushita Electric Works Ltd Epoxy resin composition, prepreg using the epoxy resin composition, and laminate board using the prepreg
JP2000154232A (en) 1998-11-20 2000-06-06 Sumitomo Bakelite Co Ltd Heat-resistant resin composition, and prepreg and laminate using same
WO2000037579A1 (en) * 1998-12-22 2000-06-29 Hitachi Chemical Company, Ltd. Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same
GB2362037A (en) * 2000-05-03 2001-11-07 Bancha Ongkosit Printed circuit board manufacture

Also Published As

Publication number Publication date
CN1771274A (en) 2006-05-10
TWI266790B (en) 2006-11-21
JP4915549B2 (en) 2012-04-11
EP1637554B1 (en) 2015-07-29
EP1637554A4 (en) 2011-08-24
TW200500413A (en) 2005-01-01
CN100424110C (en) 2008-10-08
WO2004108791A1 (en) 2004-12-16
US8470938B2 (en) 2013-06-25
US20060159928A1 (en) 2006-07-20
EP1637554A1 (en) 2006-03-22
JPWO2004108791A1 (en) 2006-07-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase