TWI346127B - Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board - Google Patents

Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board

Info

Publication number
TWI346127B
TWI346127B TW095144283A TW95144283A TWI346127B TW I346127 B TWI346127 B TW I346127B TW 095144283 A TW095144283 A TW 095144283A TW 95144283 A TW95144283 A TW 95144283A TW I346127 B TWI346127 B TW I346127B
Authority
TW
Taiwan
Prior art keywords
prepreg
laminate
halogen
resin composition
epoxy resin
Prior art date
Application number
TW095144283A
Other languages
Chinese (zh)
Other versions
TW200720351A (en
Inventor
Kouichi Nogami
Yoshiaki Esaki
Takayoshi Ozeki
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of TW200720351A publication Critical patent/TW200720351A/en
Application granted granted Critical
Publication of TWI346127B publication Critical patent/TWI346127B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Reinforced Plastic Materials (AREA)
TW095144283A 2005-11-30 2006-11-29 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board TWI346127B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/021955 WO2007063580A1 (en) 2005-11-30 2005-11-30 Halogen-free epoxy resin composition, cover lay film, bonding sheet, prepreg, laminated sheet for printed wiring board

Publications (2)

Publication Number Publication Date
TW200720351A TW200720351A (en) 2007-06-01
TWI346127B true TWI346127B (en) 2011-08-01

Family

ID=38091921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144283A TWI346127B (en) 2005-11-30 2006-11-29 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board

Country Status (3)

Country Link
JP (1) JP5044414B2 (en)
TW (1) TWI346127B (en)
WO (1) WO2007063580A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511630B (en) * 2014-01-02 2015-12-01 High temperature resistance and high reflectivity for printed circuit boards covered with protective film

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136096A1 (en) * 2007-04-24 2008-11-13 Panasonic Electric Works Co., Ltd. Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate
TW200900446A (en) * 2007-06-22 2009-01-01 Advanced Int Multitech Co Ltd Flame resistant prepreg
JP2009132780A (en) * 2007-11-29 2009-06-18 Sumitomo Bakelite Co Ltd Resin composition for circuit board, insulating layer with supporting substrate, laminate, and circuit board
JP2009218305A (en) * 2008-03-10 2009-09-24 Fuji Electric Device Technology Co Ltd Insulating film forming method
CN102143987B (en) 2008-09-05 2013-08-21 横滨橡胶株式会社 Heat-cured epoxy resin composition
JP2010222569A (en) * 2009-02-24 2010-10-07 Hitachi Chem Co Ltd Resin composition, and prepreg, laminated board and wiring board using the same
JP5136573B2 (en) 2009-02-24 2013-02-06 日立化成工業株式会社 Varnish, prepreg, film with resin, metal foil-clad laminate, printed wiring board
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
JP5327087B2 (en) * 2010-02-02 2013-10-30 横浜ゴム株式会社 One-component thermosetting epoxy resin composition
WO2012007992A1 (en) * 2010-07-14 2012-01-19 京セラケミカル株式会社 Flexible wiring board, dry film for coverlay, and production method for flexible wiring board
JP5949545B2 (en) * 2011-02-16 2016-07-06 三菱レイヨン株式会社 Manufacturing method for obtaining fiber-reinforced composite material, and epoxy resin composition used therefor
CN107954627B (en) * 2017-12-04 2020-11-06 中建商品混凝土眉山新材料有限公司 Composite concrete retarder and preparation method thereof
JP6911806B2 (en) * 2018-03-29 2021-07-28 味の素株式会社 Resin composition, sheet-like laminated material, printed wiring board and semiconductor device
JP7172905B2 (en) 2019-07-30 2022-11-16 味の素株式会社 Epoxy resin composition, cured epoxy resin composition, resin sheet, printed wiring board and semiconductor device
KR20210115293A (en) * 2020-03-12 2021-09-27 주식회사 두산 Adhesive compostion, coverlay film and printed circuit board comprising the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176579A (en) * 1984-09-21 1986-04-19 Mitsui Petrochem Ind Ltd Heat-resistant adhesive composition
JPH023414A (en) * 1988-06-14 1990-01-09 Mitsubishi Petrochem Co Ltd One-package epoxy resin composition
JP2000103839A (en) * 1998-09-25 2000-04-11 Matsushita Electric Works Ltd Sealing resin composition and semiconductor device sealed therewith
JP2003002952A (en) * 2001-06-22 2003-01-08 Du Pont Mitsui Polychem Co Ltd Epoxy resin composition
JP2003213083A (en) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd Epoxy resin composition and flexible printed wiring board material using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511630B (en) * 2014-01-02 2015-12-01 High temperature resistance and high reflectivity for printed circuit boards covered with protective film

Also Published As

Publication number Publication date
TW200720351A (en) 2007-06-01
WO2007063580A1 (en) 2007-06-07
JP5044414B2 (en) 2012-10-10
JPWO2007063580A1 (en) 2009-05-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees