JP2000103839A - Sealing resin composition and semiconductor device sealed therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composition which can form a sealing resin capable of giving a cured product resistant to cracking or peeling by mixing a glycidyl- containing epoxy resin with a phenol aralkyl resin curing agent, a cure assistant, and a filler. SOLUTION: There are used an epoxy resin of formula I (wherein Gr is glycidyl; and n is 0-5) and a curing agent of formula II. Alternatively, the epoxy resin may be one having at least two epoxy groups, and the curing agent used is one having at least two phenolic hydroxy groups. It is desirable that the epoxy resin of formula I is used in an amount of 20-100 wt.% based on the amount of the entire epoxy resin. It is desirable that the curing agent of formula II is used in an amount of 20-100 wt.% based on the amount of the entire curing agent. Usually, the entire epoxy resin/entire curing agent is 0.5-1.5 by equivalent. The cure assistant is desirably an organophosphorus compound. The filler is desirably fused silica.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing resin composition used for sealing electric and electronic parts of diodes, transistors, integrated circuits (ICs, LSIs, VLSIs, etc.) and semiconductor devices on which these are mounted. And a semiconductor device using the same.

2. Description of the Related Art Conventionally, as a method for sealing electric and electronic parts and semiconductor devices, for example, a sealing method using a resin composition containing an epoxy resin or a silicon resin, glass,
The hermetic sealing method using metals, ceramics, etc. has been adopted, but in recent years, a resin composition containing an epoxy resin has been used as a method that can be mass-produced with improved sealing reliability and is more cost-effective. The low pressure transfer molding using is adopted and occupies the mainstream. As an epoxy resin of such a resin composition, o
A cresol novolak type epoxy resin is generally used, and a phenol novolak resin is generally used as a curing agent. Recently, with the increase in density and lamination of electronic components and semiconductor devices, the thickness of sealing resin (mold resin) has been reduced.

However, the above-mentioned conventional resin composition cannot satisfy this reduction in thickness satisfactorily. For example, in a device for surface mounting, the device itself is exposed to high temperatures during mounting,
The occurrence of package cracks and the like is inevitable. That is, the moisture absorbed during storage after the encapsulation molding is exposed to a high temperature and rapidly evaporates and expands, so that the encapsulation resin cannot withstand the expansion and cracks occur in the package (encapsulation resin). is happening. In order to solve such problems, studies have been made on improving the heat resistance and adhesion of the sealing resin composition, and, for example, a sealing resin composition containing an epoxy resin having a heat-resistant skeleton. However, it has not been able to prevent the occurrence of cracks at a high temperature after moisture absorption. The present invention has been made in view of the above points, and an object of the present invention is to provide a sealing resin composition capable of forming a sealing resin in which cracks and peeling hardly occur. Further, the present invention is a semiconductor device sealed using the sealing resin composition,
It is an object of the present invention to provide a semiconductor device in which cracks and peeling do not easily occur in a sealing resin.

The encapsulating resin composition according to claim 1 of the present invention is a semiconductor encapsulating resin composition containing an epoxy resin, a curing agent, a curing aid, and a filler. And an epoxy resin having the following structural formula (1) and a curing agent having the following structural formula (2).

Embedded image In addition, the sealing resin composition according to claim 2 of the present invention, in addition to the structure of claim 1, has a filler in an amount of 80 to 95 with respect to the total amount.
% By weight. Further, the sealing resin composition according to claim 3 of the present invention is characterized by claim 1.
Or, in addition to the constitution 2, the epoxy resin of the above (1) is contained in an amount of 20 to 100% by weight based on the total epoxy resin. Further, the sealing resin composition according to claim 4 of the present invention, in addition to any one of claims 1 to 3, further comprises the curing agent of (2) in an amount of 20 to 100% by weight based on the total curing agent. It is characterized by comprising. The sealing resin composition according to a fifth aspect of the present invention is characterized in that, in addition to any one of the first to fourth aspects, an organic phosphorus compound is used as a curing aid. . A semiconductor device according to a sixth aspect of the present invention is characterized by being sealed with the sealing resin composition according to any one of the first to fifth aspects.

Embodiments of the present invention will be described below. As the epoxy resin, one having the above structural formula (1) (Gr in the formula is a glycidyl group),
Those having two or more epoxy groups in the molecule can be used. Examples of the epoxy resin other than (1) include a cresol novolak epoxy resin, a dicyclopentadiene epoxy resin, a triphenylmethane epoxy resin, a bromo-containing epoxy resin, and an epoxy resin having a naphthalene ring. Further, the epoxy resin of (1) is used in an amount of 20 to the total amount of the epoxy resin.
-100% by weight (100% by weight is the total epoxy resin when the epoxy resin of (1) is used). If the amount of the epoxy resin (1) is less than 20% by weight based on the total epoxy resin, the moisture absorption of the encapsulating resin composition of the present invention cannot be reduced, and the encapsulating resin ( (Package) may be cracked or peeled off. The epoxy resin (1) has n = 0, n = 1, n = 2, n = 3, n
= 4 and n = 5.
As the curing agent, a phenol aralkyl resin having the structural formula (2) and a compound having two or more phenolic hydroxyl groups in one molecule can be used.
As a curing agent other than (2), a phenol novolak resin or a naphthol resin can be used. The curing agent (2) is used in an amount of 20 to 1 based on the total amount of the curing agent.
It is preferable to add 00% by weight (100% by weight is the total curing agent when the phenol aralkyl resin (2) is used). If the amount of the curing agent (2) is less than 20% by weight based on the total amount of the curing agent, the moisture absorption of the encapsulating resin composition of the present invention cannot be reduced, and the reflow resistance decreases. That is, cracks and peeling may occur in the sealing resin (package) during reflow. The curing agent (2) has m = 0, m = 1, m = 2, and m = 2.
3, m = 4, and m = 5. Curing aid is used to accelerate the curing reaction between the epoxy resin and the curing agent, for example,
Organic phosphorus compounds such as triphenylphosphine and tributylphosphine, and 1,8-diaza-bicyclo (5,4,
0) Tertiary amines such as undecene-7, triethylenediamine, benzyldimethylamine and the like, imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole Can be used,
It is preferable to use an organic phosphorus compound having a high curing promoting effect. It is preferable that the curing aid is added in an amount of 0.1 to 5.0% by weight based on all resin components (epoxy resin and curing agent). If the amount of the curing aid is less than 0.1% by weight based on the total amount of the resin components, the effect of promoting the curing cannot be enhanced, and the amount of the curing aid is reduced to the amount of all the resin components. On the other hand, if it exceeds 5.0% by weight, the effect of accelerating the curing cannot be greatly increased, and only the amount of the curing aid is increased, which may be economically disadvantageous. As the filler, an inorganic filler can be mainly used, and fused silica, crystalline silica, alumina, silicon nitride and the like can be used alone or in combination, but the fused silica is used because of availability. Is preferred. It is preferable that the filler is blended in an amount of 80 to 95% by weight, particularly preferably 83 to 91% by weight, based on the total amount of the sealing resin composition of the present invention. If the compounding amount of the filler is less than 80% by weight based on the total amount of the sealing resin composition, the amount of moisture absorbed by the sealing resin may increase to cause a decrease in reflow resistance. If the compounding amount exceeds 95% by weight based on the total amount of the sealing resin composition, the viscosity of the sealing resin composition increases, which may cause troubles such as voids and wire flow during molding. In addition to the above materials, a coupling agent such as γ-glycidoxypropyl trimexisilane as a surface treatment agent for the filler, a flame retardant such as antimony trioxide, a release agent such as carnauba wax, and a coloring agent such as carbon black (Pigment), a flexible agent (low stress agent) such as silicone gel, silicone rubber or silicone oil, and the like can be arbitrarily compounded. In preparing the encapsulating resin composition of the present invention, first, the epoxy resin, curing agent, filler, curing aid and other materials are mixed in a predetermined amount, and then uniformly mixed with a mixer or a blender. After mixing, kneading is performed while heating with a kneader or a roll. The mixing ratio of the total curing agent to the total epoxy resin is as follows: total epoxy resin / curing agent = 0.5 to 1.5 (equivalent ratio), preferably 0.8 to 1.5.
Set to 1.3. If the compounding ratio is less than 0.5, the compounding amount of the curing agent may be too large to be economically disadvantageous, and if the compounding ratio exceeds 1.5, the compounding amount of the curing agent may be reduced. If the amount is too small, curing may be insufficient. After kneading, if necessary, the mixture may be cooled and solidified, pulverized to form a powder. In manufacturing the semiconductor device of the present invention, an electric / electronic component is mounted on a substrate or the like, and then sealed with a sealing resin formed from the above sealing resin composition. For this sealing, transfer molding (transfer molding) can be adopted. After disposing a substrate or the like on which electric and electronic components are mounted in the mold cavity,
The cavity is filled with the sealing resin composition described above, and is heated and cured to form a sealing resin. The mold temperature when this transfer molding is adopted is 1
The molding time can be set to 30 to 120 seconds at 70 to 180 ° C., and the setting is appropriately changed depending on the type of the material of the sealing resin composition and the type of the semiconductor device.

The present invention will be described below in detail with reference to examples. (Examples 1 to 9 and Comparative Examples 1 to 3) As shown in Table 1, epoxy resins, curing agents, curing assistants, mold release agents, flame retardants, pigments, and fillers were mixed in predetermined amounts in a mixer or blender. After being uniformly mixed by a method such as described above, the mixture was kneaded while heating with a kneader or a roll to prepare a sealing resin composition. The following materials were used as the materials shown in Table 1. Epoxy resin A: An epoxy resin having the structural formula (1) above, NC3000P (epoxy equivalent: 274) manufactured by Nippon Kayaku Co., Ltd. Epoxy resin B: o-cresol novolac type epoxy resin (epoxy equivalent manufactured by Sumitomo Chemical Co., Ltd.) : 195) Epoxy resin C: Brominated epoxy resin (epoxy equivalent: 400) Curing agent A: A phenol aralkyl resin having the structural formula of the above (2), HE100 manufactured by Sumikin Kako (hydroxyl equivalent:
169) Curing agent B: Phenol novolak resin manufactured by Arakawa Chemical (hydroxyl equivalent: 105) Curing aid A: Triphenylphosphine Curing aid B: DBU (diazabicycloundecene) Curing aid C: 2PZ (2-phenyl) Release agent: carbana wax Flame retardant: antimony trioxide Pigment: carbon black Filler: fused silica treated with γ-glycidoxypropyltrimethoxysilane (coupling agent) Example 1 To 9, and the sealing resin compositions of Comparative Examples 1 to 3 were molded by a transfer molding machine to prepare test pieces having a diameter of 50 mm and a thickness of 3.0 mm. The change in weight of the test piece after being left under the conditions of 85 ° C., 85% RH and 72 hours was defined as the moisture absorption rate. (Reflow resistance test) Examples 1 to 9, Comparative Examples 1 to 3
60FPTE formed by using the sealing resin composition of the present invention
G (outer size: 15 × 19 × 2.4 mm thick) in a package (10 pieces in total), left under conditions of 85 ° C., 85% RH and 72 hours to absorb moisture, and then subjected to IR reflow treatment (EIAJ) Standard), and thereafter, the presence or absence of cracks in the package was observed with a stereoscopic microscope. (Humidity Reliability Test) The package after the reflow resistance test was subjected to PCT: 133 ° C./100% RH for 5 hours.
The number of open failures after the treatment for 00 hours was measured.
Table 1 shows the results of these measurements and tests.

[Table 1] As is clear from Table 1, in Examples 1 to 9, the moisture absorption rate was low and the reflow resistance and the humidity resistance were improved even with the same amount of the resin component.

As described above, the sealing resin composition according to claim 1 of the present invention comprises an epoxy resin, a curing agent, a curing assistant,
What is claimed is: 1. A resin composition for semiconductor encapsulation containing a filler, comprising: an epoxy resin having the structural formula (1);
Since the curing agents having the structural formulas (1) and (2) are used, the moisture absorption of the sealing resin can be suppressed low, and the sealing resin in which cracks and peeling are less likely to occur can be formed. Further, the sealing resin composition according to claim 2 of the present invention,
Since the filler contained 80 to 95% by weight based on the total amount,
It is possible to prevent the amount of moisture absorption of the sealing resin from increasing and to prevent the viscosity from increasing, thereby reducing reflow resistance and trouble during molding. In addition, since the sealing resin composition according to claim 3 of the present invention contains the epoxy resin of the above (1) in an amount of 20 to 100% by weight based on the total epoxy resin, the moisture absorption of the sealing resin is reliably reduced. It is possible to reliably form a sealing resin that can suppress cracks and peeling. Further, the sealing resin composition according to claim 4 of the present invention is characterized in that the curing agent of the above (2) is used in an amount of 20 to the total curing agent.
Since it is contained in an amount of about 100% by weight, the moisture absorption of the sealing resin can be reliably suppressed to a low level, and the sealing resin in which cracks and peeling do not easily occur can be reliably formed.
Moreover, since the sealing resin composition according to claim 5 of the present invention uses an organic phosphorus compound as a curing aid, it is possible to enhance the curing promotion effect of the curing aid and promote curing. Things. Since the semiconductor device according to claim 6 of the present invention is sealed with the sealing resin composition according to any one of claims 1 to 5, the moisture absorption of the sealing resin can be suppressed low, Cracks and peeling are less likely to occur in the resin.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/31 (72) Inventor Masayuki Kigaku 1048 Odakadoma, Kadoma City, Osaka Matsushita Electric Works F-term (Reference) 4J002 CD061 EJ026 EN068 EU118 EU208 EW008 EW138 FD017 FD146 FD158 GQ05 4J036 AF06 DB05 DC10 DC40 DD07 FA01 JA07 4M109 AA01 BA01 BA03 CA21 EA03 EB02 EB04 EC01 EC03 EC05 EC09

Claims (6)

[Claims] 1. A semiconductor encapsulating resin composition containing an epoxy resin, a curing agent, a curing assistant, and a filler, wherein the epoxy resin has the following structural formula (1) and the following structure (2): What is claimed is: 1. A sealing resin composition comprising a curing agent having the formula: Embedded image 2. 80 to 95% by weight of the filler relative to the total amount
The encapsulating resin composition according to claim 1, further comprising: 3. The sealing resin composition according to claim 1, wherein the epoxy resin of (1) is contained in an amount of 20 to 100% by weight based on the total epoxy resin. 4. The encapsulating resin composition according to claim 1, comprising 20 to 100% by weight of the curing agent (2) based on the total curing agent. . 5. The encapsulating resin composition according to claim 1, wherein an organic phosphorus compound is used as a curing assistant. 6. A semiconductor device which is encapsulated with the encapsulating resin composition according to claim 1. Description: