JP3235799B2 - Epoxy resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in soldering stress resistance in surface mounting of a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, electronic components such as diodes, transistors, and integrated circuits are sealed with a thermosetting resin. In particular, in an integrated circuit, an O-cresol novolak epoxy resin having excellent heat resistance and moisture resistance is made of novolak. An epoxy resin cured with a mold phenol resin is used. However, in recent years, chips have become larger and larger with the increase in the degree of integration of integrated circuits, and small and thin QFPs, SOPs, SOJs, and TSs whose surfaces have been packaged from conventional DIP types.
OP, TQFP and PLCC have been changed.

That is, a large chip is enclosed in a small and thin package, and cracks are generated due to stress, and problems such as a decrease in moisture resistance due to the cracks have been greatly highlighted. In particular, there has been a problem in that abrupt exposure to a high temperature of 200 ° C. or more in a soldering process causes a crack in a package and a peeling of a resin and a chip to deteriorate moisture resistance. Development of a highly reliable sealing resin composition suitable for sealing these large chips has been desired. In order to solve these problems, use of an epoxy resin represented by the following formula (1) as an epoxy resin (JP-A-64-65116) has been studied.

[0004]

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[0005] The use of the epoxy resin represented by the formula (1) lowers the viscosity of the resin system. Therefore, by blending more fused silica powder, it is possible to reduce the thermal expansion and water absorption after molding the composition. Improvement of solder stress resistance was achieved. However, an increase in the modulus of elasticity due to the incorporation of a large amount of the fused silica powder is another adverse effect, and it is necessary to further improve the solder stress resistance.

[0006]

The present invention solves such a problem by using an epoxy resin represented by the formula (1) as an epoxy resin, and using a phenol resin curing agent in order to achieve a decrease in stress due to a decrease in elastic modulus. An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation in which the use of a phenol resin curing agent represented by the formula (2) significantly improves the solder stress resistance of a semiconductor package during mounting on a substrate.

[0007]

According to the present invention, there is provided an epoxy resin containing (A) an epoxy resin represented by the following formula (1) in an amount of 30 to 100% by weight based on the total epoxy resin amount:

[0008]

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(B) The phenol resin curing agent represented by the following formula (2) is added in an amount of 30 to 1 with respect to the total phenol resin curing agent.
Phenol resin curing agent containing 00% by weight,

[0010]

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An epoxy resin composition for semiconductor encapsulation comprising (C) an inorganic filler and (D) a curing accelerator as essential components. It has excellent solder stress resistance as compared with conventional epoxy resin compositions.

The biphenyl type epoxy resin represented by the structure of the formula (1) is a bifunctional epoxy resin having two epoxy groups in one molecule, and has a lower melt viscosity than conventional polyfunctional epoxy resins during transfer molding. Excellent fluidity. Accordingly, a large amount of silica powder can be added to the composition for melting, and an epoxy resin composition having low thermal expansion and low water absorption and having excellent solder stress resistance can be obtained. By adjusting the amount of the biphenyl type epoxy resin used, the solder stress resistance can be maximized. In order to achieve the effect of resistance to soldering stress, it is desirable to use the biphenyl type epoxy resin represented by the formula (1) in an amount of 30% by weight or more, preferably 50% by weight or more of the total epoxy resin amount. If it is less than 30% by weight, low thermal expansion and low water absorption cannot be obtained, and the solder stress resistance is insufficient. Further, in the formula, R _{1 to} R ₄ are preferably a methyl group, and R _{5 to} R ₈ are preferably a hydrogen atom.

When another epoxy resin is used in addition to the biphenyl type epoxy resin represented by the formula (1), the epoxy resin to be used refers to all polymers and oligomers having an epoxy group. For example, trifunctional epoxy resins such as bisphenol type epoxy resin, cresol novolak type epoxy resin, phenol novolak type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, and epoxy resin containing triazine nucleus. Say.

The curing agent represented by the molecular structure of formula (2) is obtained by a condensation reaction using orthocresol and benzaldehyde. This use can lower the elastic modulus near the soldering temperature, improve the adhesion to the lead frame and the semiconductor chip, and achieve low water absorption, as compared with the use of a conventional phenol novolak resin curing agent or the like. Therefore, it is effective in preventing a reduction in stress generated due to a thermal shock at the time of soldering and a resulting peeling failure from a semiconductor chip, a lead frame or the like. By adjusting the amount of such a phenolic resin curing agent, the solder stress resistance can be maximized. In order to bring out the effect of resistance to soldering stress, it is desirable to use the phenolic resin curing agent represented by the formula (2) in an amount of 30% by weight or more, more preferably 50% by weight or more based on the total amount of the curing agent. If the amount is less than 30% by weight, low elasticity, low water absorption, etc., and insufficient adhesion to the lead frame and semiconductor chip cannot be expected to improve solder stress resistance.

When other than the phenolic resin curing agent represented by the formula (2) is used in combination, what is used mainly refers to polymers and oligomers having mainly phenolic hydroxyl groups. For example, phenol novolak resin, cresol novolak resin, dicyclopentadiene-modified phenol resin, copolymer of dicyclopentadiene-modified phenol resin with phenol novolak and cresol novolak resin, para-xylene-modified phenol resin, triphenolmethane resin, phenol and cresol A condensate with salicylaldehyde can be used.

The inorganic filler used in the present invention includes fused silica powder, spherical silica powder, crystalline silica powder, secondary aggregated silica powder, porous silica powder, secondary aggregated silica powder or silica obtained by pulverizing porous silica powder. Examples thereof include powder, alumina, and the like, and particularly preferred are fused silica powder, spherical silica powder, and a mixture of fused silica powder and spherical silica powder. The amount of the inorganic filler is 70 to 9 with respect to the total amount of the composition in consideration of the balance between solder stress resistance and moldability.
0% by weight is preferred.

The curing accelerator used in the present invention may be any one which promotes the reaction between an epoxy group and a hydroxyl group, and those generally used for a sealing material can be widely used. Zabicycloundecene (DBU),
Triphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2-methylimidazole (2MZ)
Are used alone or in combination of two or more. The epoxy resin composition for encapsulation of the present invention contains an epoxy resin, a curing agent, an inorganic filler and a curing accelerator as essential components, but may optionally further comprise a silane coupling agent, a brominated epoxy resin, and trioxide. Various additives such as flame retardants such as antimony and hexabromobenzene, coloring agents such as carbon black and red iron oxide, release agents such as natural wax and synthetic wax, and low stress additives such as silicone oil and rubber are appropriately blended. There is no problem.

In order to produce the encapsulating epoxy resin composition of the present invention as a molding material, an epoxy resin, a curing agent,
After a curing accelerator, a filler, and other additives are sufficiently and uniformly mixed by a mixer or the like, the mixture is further melt-kneaded by a hot roll or a kneader, cooled, and ground to obtain a molding material. These molding materials can be applied to sealing, coating, insulating and the like of electronic parts or electric parts.

[0019]

The present invention will be specifically described below with reference to examples. Example 1 9.3 parts by weight of an epoxy resin represented by the formula (3) (softening point: 110 ° C., epoxy equivalent: 190 g / eq)

[0020]

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Orthocresol novolak epoxy resin (softening point 65 ° C., epoxy equivalent 200 g / eq) 2.3 parts by weight Phenolic resin curing agent represented by the formula (2) (softening point 90 ° C., hydroxyl equivalent 152 g / eq) 6.7 parts by weight Phenol novolak resin curing agent (softening point 90 ° C., hydroxyl equivalent 105 g / eq) 1.7 parts by weight Fused silica powder 78.8 parts by weight Triphenylphosphine 0.2 parts by weight Carbon black 0.5 parts by weight 0.5 part by weight of carnauba wax was mixed at room temperature with a mixer, kneaded at 70 to 100 ° C. with a biaxial roll, cooled, and pulverized to obtain a molding material. The obtained molding material is tableted, and a low pressure transfer molding machine is used to seal a 6 × 6 mm chip in a 52p package for a solder crack test at 175 ° C., 70 kg / cm ² , for 120 seconds. A 3 × 6 mm chip was sealed in a 16 pSOP package for a sex test. The sealed test element was subjected to the following solder crack test and solder moisture resistance test. Solder crack test: Sealed test element at 85 ° C, 8
48 hours and 72 hours of treatment were performed in an environment of 5% RH, and then immersed in a solder bath at 260 ° C. for 10 seconds, and external cracks were observed with a microscope. Solder moisture resistance test: Sealed test element was tested at 85 ° C for 8
After being treated for 72 hours in an environment of 5% RH, and then immersed in a solder bath at 260 ° C. for 10 seconds, a pressure cooker test (125 ° C., 100% RH) was performed to measure open circuit failure. Table 1 shows the test results.

Examples 2 to 5 Compounded according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1. A sealed molded product for a test was obtained from this molding material, and a solder crack test and a solder moisture resistance test were performed using this molded product in the same manner as in Example 1. Table 1 shows the test results.

Comparative Examples 1 to 4 Compounded according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1. A sealed molded product for a test was obtained from this molding material, and a solder crack test and a solder moisture resistance test were performed using this molded product in the same manner as in Example 1. Table 1 shows the test results.

[0024]

[Table 1]

[0025]

According to the present invention, an epoxy resin composition having solder stress resistance, which cannot be obtained by the prior art, can be obtained. When used for encapsulation, coating, insulation, etc. of electronic and electrical components, especially for highly integrated large chip ICs mounted on surface mount packages because of their excellent crack resistance and excellent moisture resistance This is suitable for products that require extremely high reliability.

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 23/31 (56) References JP-A-6-5741 (JP, A) JP-A-3-195722 (JP, A) JP-A-3 -210322 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) C08G 59/24 C08G 59/62 C08L 63/00 H01L 23/29

Claims (1)

(57) [Claims] (A) an epoxy resin containing an epoxy resin represented by the following formula (1) in an amount of 30 to 100% by weight based on the total amount of the epoxy resin: (B) a phenolic resin curing agent containing a phenolic resin curing agent represented by the following formula (2) in an amount of 30 to 100% by weight based on the total phenolic resin curing agent; An epoxy resin composition for semiconductor encapsulation comprising (C) an inorganic filler and (D) a curing accelerator as essential components.