TW200720351A - Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board - Google Patents

Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board

Info

Publication number
TW200720351A
TW200720351A TW095144283A TW95144283A TW200720351A TW 200720351 A TW200720351 A TW 200720351A TW 095144283 A TW095144283 A TW 095144283A TW 95144283 A TW95144283 A TW 95144283A TW 200720351 A TW200720351 A TW 200720351A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
halogen
resin composition
prepreg
laminate
Prior art date
Application number
TW095144283A
Other languages
Chinese (zh)
Other versions
TWI346127B (en
Inventor
Kouichi Nogami
Yoshiaki Esaki
Takayoshi Ozeki
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200720351A publication Critical patent/TW200720351A/en
Application granted granted Critical
Publication of TWI346127B publication Critical patent/TWI346127B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

An epoxy resin composition is prepared by compounding, as essential components, the following (A) to (D) components: (A) an novolac type epoxy resin being free of a halogen, and having a phenol skeleton and a bi-phenyl skeleton, (B) diaminodiphenylsulfone, (C) an elastomer containing at least one of an acrylonitrile butadiene rubber having a carboxyl group and an acrylic rubber having a carboxyl group, and (D) a curing accelerator containing at least one of an organic phosphine and a phosphonium salt, and further compounding the following (E) and (F) components: (E) a phosphorus-based flame retardant and (F) a filler containing at least aluminum hydroxide. The epoxy resin composition is halogen-free, can securely hold flame retardance, and further provide satisfactory adhesion, electric insulation reliability and flexibility.
TW095144283A 2005-11-30 2006-11-29 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board TWI346127B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/021955 WO2007063580A1 (en) 2005-11-30 2005-11-30 Halogen-free epoxy resin composition, cover lay film, bonding sheet, prepreg, laminated sheet for printed wiring board

Publications (2)

Publication Number Publication Date
TW200720351A true TW200720351A (en) 2007-06-01
TWI346127B TWI346127B (en) 2011-08-01

Family

ID=38091921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144283A TWI346127B (en) 2005-11-30 2006-11-29 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board

Country Status (3)

Country Link
JP (1) JP5044414B2 (en)
TW (1) TWI346127B (en)
WO (1) WO2007063580A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102986310A (en) * 2010-07-14 2013-03-20 京瓷化成株式会社 Flexible wiring board, dry film for coverlay, and production method for flexible wiring board
CN110317431A (en) * 2018-03-29 2019-10-11 味之素株式会社 Resin combination, sheet stacking material, printed wiring board and semiconductor device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008136096A1 (en) * 2007-04-24 2010-07-29 パナソニック電工株式会社 Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, laminate for printed wiring board
TW200900446A (en) * 2007-06-22 2009-01-01 Advanced Int Multitech Co Ltd Flame resistant prepreg
JP2009132780A (en) * 2007-11-29 2009-06-18 Sumitomo Bakelite Co Ltd Resin composition for circuit board, insulating layer with supporting substrate, laminate, and circuit board
JP2009218305A (en) * 2008-03-10 2009-09-24 Fuji Electric Device Technology Co Ltd Insulating film forming method
JP4737345B2 (en) * 2008-09-05 2011-07-27 横浜ゴム株式会社 Thermosetting epoxy resin composition
JP5136573B2 (en) 2009-02-24 2013-02-06 日立化成工業株式会社 Varnish, prepreg, film with resin, metal foil-clad laminate, printed wiring board
JP2010222569A (en) * 2009-02-24 2010-10-07 Hitachi Chem Co Ltd Resin composition, and prepreg, laminated board and wiring board using the same
GB2472423B (en) * 2009-08-05 2012-01-11 Gurit Uk Ltd Fire-retardant composite materials
JP5327087B2 (en) * 2010-02-02 2013-10-30 横浜ゴム株式会社 One-component thermosetting epoxy resin composition
CN103380161B (en) * 2011-02-16 2016-04-20 三菱丽阳株式会社 The manufacture method obtaining fiber reinforced composite and the composition epoxy resin used thereof
TWI511630B (en) * 2014-01-02 2015-12-01 High temperature resistance and high reflectivity for printed circuit boards covered with protective film
CN107954627B (en) * 2017-12-04 2020-11-06 中建商品混凝土眉山新材料有限公司 Composite concrete retarder and preparation method thereof
JP7172905B2 (en) 2019-07-30 2022-11-16 味の素株式会社 Epoxy resin composition, cured epoxy resin composition, resin sheet, printed wiring board and semiconductor device
KR20210115293A (en) * 2020-03-12 2021-09-27 주식회사 두산 Adhesive compostion, coverlay film and printed circuit board comprising the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176579A (en) * 1984-09-21 1986-04-19 Mitsui Petrochem Ind Ltd Heat-resistant adhesive composition
JPH023414A (en) * 1988-06-14 1990-01-09 Mitsubishi Petrochem Co Ltd One-package epoxy resin composition
JP2000103839A (en) * 1998-09-25 2000-04-11 Matsushita Electric Works Ltd Sealing resin composition and semiconductor device sealed therewith
JP2003002952A (en) * 2001-06-22 2003-01-08 Du Pont Mitsui Polychem Co Ltd Epoxy resin composition
JP2003213083A (en) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd Epoxy resin composition and flexible printed wiring board material using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102986310A (en) * 2010-07-14 2013-03-20 京瓷化成株式会社 Flexible wiring board, dry film for coverlay, and production method for flexible wiring board
CN110317431A (en) * 2018-03-29 2019-10-11 味之素株式会社 Resin combination, sheet stacking material, printed wiring board and semiconductor device

Also Published As

Publication number Publication date
JPWO2007063580A1 (en) 2009-05-07
WO2007063580A1 (en) 2007-06-07
TWI346127B (en) 2011-08-01
JP5044414B2 (en) 2012-10-10

Similar Documents

Publication Publication Date Title
TW200720351A (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board
WO2008136096A1 (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg and printed wiring board laminate
KR102250655B1 (en) Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminate
TW200833802A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
TW200706626A (en) Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same
TW200704736A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
US20180201776A1 (en) Epoxy resin composition for copper clad laminate, and application of epoxy resin composition
CN101921557B (en) Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same
WO2017020462A1 (en) Epoxy resin composition for copper clad laminate, and application of epoxy resin composition
JP2013010955A (en) Flame-retardant resin composition and metal-clad laminate for flexible printed-wiring board, cover lay, adhesive sheet for flexible printed-wiring board, and flexible printed-wiring board using the resin composition
US20200079980A1 (en) Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition
CN102977829B (en) Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape
US20180022899A1 (en) Flame retardant resin composition, thermosetting resin composition, composite metal substrate and flame retardant electronic material
TW200708583A (en) Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same
TW200710159A (en) Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same
JP2009108144A (en) Flexible halogen-free epoxy resin composition, metallic foil with resin, cover-lay film, prepreg, laminate for printed wiring board, metal-clad flexible laminate
JP2008308686A (en) Epoxy adhesive, cover lay, prepreg, metal-clad laminated plate and printed wiring board
KR20140084415A (en) High speed curing halogen-free adhesive composition and coverlay film
TW200602405A (en) Thermosetting resin composition and its cured film
JP4503239B2 (en) Flame-retardant adhesive composition, flexible copper-clad laminate, coverlay and adhesive film
JP2001019930A (en) Flame-retardant adhesive composition, flexible copper- clad laminate, cover lay and adhesive film
EP1640428A4 (en) Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same
JP4884736B2 (en) Epoxy adhesive, coverlay, prepreg, metal-clad laminate, printed wiring board
JP2008239675A (en) Flame retardant resin composition, and adhesive sheet, cover lay film and copper-clad laminate using the same
JP4160234B2 (en) Metal-clad laminate for flexible printed wiring board, flexible printed wiring board, resin composition used for coverlay, and flexible printed wiring board

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees