TW200710159A - Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same - Google Patents

Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same

Info

Publication number
TW200710159A
TW200710159A TW095118128A TW95118128A TW200710159A TW 200710159 A TW200710159 A TW 200710159A TW 095118128 A TW095118128 A TW 095118128A TW 95118128 A TW95118128 A TW 95118128A TW 200710159 A TW200710159 A TW 200710159A
Authority
TW
Taiwan
Prior art keywords
composition
film
clad laminate
layer composed
cover lay
Prior art date
Application number
TW095118128A
Other languages
Chinese (zh)
Inventor
Toru Nakanishi
Kazunori Kondo
Shigehiro Hoshida
Tadashi Amano
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200710159A publication Critical patent/TW200710159A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesive Tapes (AREA)

Abstract

To provide a non-halogen adhesive composition whose cured product exhibits excellent flame retardancy and migration resistance, and an adhesive sheet, a cover lay film and a flexible copper-clad laminate obtained using the composition. The flame-retardant adhesive composition comprises (A) a non-halogen epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate salt compound, (E) a curing accelerator and (F) a nitrogen-containing organic phosphoric acid compound represented by general formula (1) (wherein R1-R4are each a hydrogen atom or an alkyl group; and X is a nitrogen-containing bivalent organic group). The adhesive sheet has a layer composed of the composition and a protective layer covering the layer composed of the composition. The cover lay film comprises an electrically insulating film and a layer composed of the composition formed on the film. The flexible copper-clad laminate comprises an electrically insulating film, a layer composed of the composition formed on the film, and a copper foil.
TW095118128A 2005-05-23 2006-05-22 Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same TW200710159A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005149920A JP2006328113A (en) 2005-05-23 2005-05-23 Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same

Publications (1)

Publication Number Publication Date
TW200710159A true TW200710159A (en) 2007-03-16

Family

ID=37550161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118128A TW200710159A (en) 2005-05-23 2006-05-22 Flame-retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper-clad laminate obtained using the same

Country Status (3)

Country Link
JP (1) JP2006328113A (en)
KR (1) KR20060121697A (en)
TW (1) TW200710159A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110607149A (en) * 2018-06-15 2019-12-24 Dic株式会社 Adhesive, laminate, battery packaging material, battery container, and battery

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815992B1 (en) 2007-08-13 2008-03-24 제일모직주식회사 Flameproof thermoplastic resin composition
JP2009126925A (en) * 2007-11-22 2009-06-11 Shin Etsu Chem Co Ltd Adhesive composition, and adhesive sheet and cover-lay film using the same
KR102216722B1 (en) * 2019-10-02 2021-02-16 한화솔루션 주식회사 Adhesive Composition for coverlay film and coverlay film for flexible printedcircuit board comprising the same
WO2021066480A1 (en) * 2019-10-02 2021-04-08 한화솔루션 주식회사 Coverlay adhesive composition and fpcb coverlay including same
KR102259563B1 (en) * 2019-10-02 2021-06-01 한화솔루션 주식회사 Adhesive Composition for coverlay film and coverlay film for flexible printedcircuit board comprising the same
KR102216726B1 (en) * 2019-10-02 2021-02-16 한화솔루션 주식회사 Adhesive Composition for coverlay film and coverlay film for flexible printedcircuit board comprising the same
CN114561083A (en) * 2022-03-10 2022-05-31 南京工业大学 Preparation method of piperazinyl phenylphosphate flame-retardant epoxy resin composite material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110607149A (en) * 2018-06-15 2019-12-24 Dic株式会社 Adhesive, laminate, battery packaging material, battery container, and battery
CN110607149B (en) * 2018-06-15 2023-01-17 Dic株式会社 Adhesive, laminate, battery packaging material, battery container, and battery

Also Published As

Publication number Publication date
JP2006328113A (en) 2006-12-07
KR20060121697A (en) 2006-11-29

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