SG121911A1 - Epoxy resin laminate board as a reinforcing material for flexible printed wiring board - Google Patents

Epoxy resin laminate board as a reinforcing material for flexible printed wiring board

Info

Publication number
SG121911A1
SG121911A1 SG200406296A SG200406296A SG121911A1 SG 121911 A1 SG121911 A1 SG 121911A1 SG 200406296 A SG200406296 A SG 200406296A SG 200406296 A SG200406296 A SG 200406296A SG 121911 A1 SG121911 A1 SG 121911A1
Authority
SG
Singapore
Prior art keywords
board
epoxy resin
printed wiring
flexible printed
reinforcing material
Prior art date
Application number
SG200406296A
Inventor
Kariba Tsutomu
Shimizu Jinn
Original Assignee
Risho Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Kk filed Critical Risho Kogyo Kk
Publication of SG121911A1 publication Critical patent/SG121911A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
SG200406296A 2003-07-04 2004-06-22 Epoxy resin laminate board as a reinforcing material for flexible printed wiring board SG121911A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191870A JP4276006B2 (en) 2003-07-04 2003-07-04 Epoxy resin laminate for reinforcement of flexible printed wiring boards

Publications (1)

Publication Number Publication Date
SG121911A1 true SG121911A1 (en) 2006-05-26

Family

ID=34189315

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200406296A SG121911A1 (en) 2003-07-04 2004-06-22 Epoxy resin laminate board as a reinforcing material for flexible printed wiring board

Country Status (6)

Country Link
JP (1) JP4276006B2 (en)
KR (1) KR20050004091A (en)
CN (1) CN100471359C (en)
MY (1) MY143874A (en)
SG (1) SG121911A1 (en)
TW (1) TW200505306A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045150A (en) * 2005-07-15 2007-02-22 Kaneka Corp Fiber-resin composite, its manufacturing method and printed wiring board
JP2007059586A (en) * 2005-08-24 2007-03-08 Fujikura Ltd Wiring circuit board and manufacturing method thereof
KR20090108636A (en) * 2007-02-08 2009-10-15 스미토모 베이클리트 컴퍼니 리미티드 Laminated body, circuit board including laminated body, semiconductor package and method for manufacturing laminated body
KR20100039329A (en) * 2007-07-09 2010-04-15 스미토모 베이클리트 컴퍼니 리미티드 Resin sheet for circuit board and method for manufacturing the resin sheet
CN101437358B (en) * 2007-11-14 2010-04-14 昆山雅森电子材料科技有限公司 Protection film for printed circuit board and procedure for processing circuit board using the protection film
JP5428651B2 (en) * 2008-10-10 2014-02-26 日立化成株式会社 Metal foil-clad laminate, double-sided metal foil-clad laminate, manufacturing method thereof and printed wiring board
JP5251763B2 (en) * 2009-01-28 2013-07-31 日立化成株式会社 Double-sided metal foil-clad laminate and flexible printed wiring board
JP7168034B2 (en) 2020-08-28 2022-11-09 住友金属鉱山株式会社 Atomizing device, method for producing metal powder, and method for producing valuable metal

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227332A (en) * 1990-01-31 1991-10-08 Hitachi Chem Co Ltd Production of laminated board
JPH06120673A (en) * 1992-10-07 1994-04-28 Matsushita Electric Ind Co Ltd Multilayer printed wiring board and production thereof
JPH10222497A (en) * 1997-02-07 1998-08-21 Omron Corp Kana(japanese syllabary)/kanji (chinese character) conversion device/method
JPH1140944A (en) * 1997-07-17 1999-02-12 Sharp Corp Method and apparatus for manufacturing multilayered wiring board
JPH1168267A (en) * 1997-08-20 1999-03-09 Sony Corp Production of resin sheet and multilayer printed wiring board
JPH11163524A (en) * 1997-11-27 1999-06-18 Matsushita Electric Ind Co Ltd Multilayer wiring board and semiconductor device employing the same
JP2001007459A (en) * 1999-06-18 2001-01-12 Digital Electronics Corp Multilayer printed wiring board
JP2003080620A (en) * 2001-09-10 2003-03-19 Shin Kobe Electric Mach Co Ltd Glass fiber substrate/epoxy resin laminated sheet for backing material of flexible printed wiring board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227332A (en) * 1990-01-31 1991-10-08 Hitachi Chem Co Ltd Production of laminated board
JPH06120673A (en) * 1992-10-07 1994-04-28 Matsushita Electric Ind Co Ltd Multilayer printed wiring board and production thereof
JPH10222497A (en) * 1997-02-07 1998-08-21 Omron Corp Kana(japanese syllabary)/kanji (chinese character) conversion device/method
JPH1140944A (en) * 1997-07-17 1999-02-12 Sharp Corp Method and apparatus for manufacturing multilayered wiring board
JPH1168267A (en) * 1997-08-20 1999-03-09 Sony Corp Production of resin sheet and multilayer printed wiring board
JPH11163524A (en) * 1997-11-27 1999-06-18 Matsushita Electric Ind Co Ltd Multilayer wiring board and semiconductor device employing the same
JP2001007459A (en) * 1999-06-18 2001-01-12 Digital Electronics Corp Multilayer printed wiring board
JP2003080620A (en) * 2001-09-10 2003-03-19 Shin Kobe Electric Mach Co Ltd Glass fiber substrate/epoxy resin laminated sheet for backing material of flexible printed wiring board

Also Published As

Publication number Publication date
JP4276006B2 (en) 2009-06-10
TW200505306A (en) 2005-02-01
KR20050004091A (en) 2005-01-12
MY143874A (en) 2011-07-15
JP2005022323A (en) 2005-01-27
CN100471359C (en) 2009-03-18
CN1578585A (en) 2005-02-09

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