CN105430941A - Technology for improving thick copper board stitching white edge - Google Patents
Technology for improving thick copper board stitching white edge Download PDFInfo
- Publication number
- CN105430941A CN105430941A CN201510731024.9A CN201510731024A CN105430941A CN 105430941 A CN105430941 A CN 105430941A CN 201510731024 A CN201510731024 A CN 201510731024A CN 105430941 A CN105430941 A CN 105430941A
- Authority
- CN
- China
- Prior art keywords
- board
- copper coin
- pressing
- thick copper
- white edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention discloses the technology for improving a thick copper board stitching white edge. The technology comprises steps that S1, rough shape cutting, a copper foil, a copper board and prepregs are cut according to required dimensions; S2, inner core board brownification is carried out; S3, board pre-lamination, the to-be-laminated copper foil, the to-be-laminated copper board and the to-be-laminated prepregs are laminated according to a pre-determined order, and the two prepregs close to the thick copper board are pure glue prepregs; S4, board lamination, a printed circuit board semi-finished product after board pre-lamination is placed on the copper foil on a steel board, and the copper foil and the steel board are symmetrically laid above the printed circuit board semi-finished product; and S5, stitching is carried out. According to the technology, traditional prepregs at two sides of a thick copper board in the printed circuit board are replaced by the pure glue prepregs, so excellent bonding performance, heat resistance performance and low fluidity are realized, a problem that stitching white edges are generated at copper-less zones after stitching can be solved, thickness of the printed circuit board after stitching can be consistent with thickness of a printed circuit board in the prior art, and performance of the circuit boards is not influenced.
Description
Technical field
The invention belongs to printed circuit board and make field, relate in particular to a kind of technique improving thick copper coin pressing white edge.
Background technology
Along with the develop rapidly in electronic information epoch, design manufacturer strengthens day by day for the demand of the printed circuit board (PCB) such as server power supply plate of high-power, big current, and these power panels need the characteristic such as high-fire resistance, high-cooling property, so more favor is designed to thick copper coin.Because of the characteristic of its copper thick (>=3OZ), especially there is many processing difficulties in bonding processes in the processing process of PCB in thick copper coin.
Pressing utilizes HTHP that prepreg is heated thawing, and make it flow, change cured sheets into again, thus the plate after the etching of one or more internal layer and Copper Foil are bonded into one piece of multiple-plate processing procedure, for the pressing of thick copper coin, a main problem is, thick copper coin due to thickness larger, in bonding processes, easily occur that resin filling is not enough, gummosis amount is large, thus cause occurring the exception without copper district pressing white edge.
Summary of the invention
For this reason, technical problem to be solved by this invention is easily to occur to the pressing of thick copper coin the exception that resin filling is not enough, remove to occur pressing white edge without copper to this in prior art, thus proposes a kind of technique improving thick copper coin pressing white edge.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of technique improving thick copper coin pressing white edge, it comprises the steps:
S1, sawing sheet, cut internal layer Copper Foil, copper coin and prepreg according to required size;
S2, core material brown, form oxide layer on core material surface;
S3, pre-lamination, internal layer Copper Foil, copper coin and prepreg to be laminated are stacked according to predefined procedure, the two panels prepreg pressing close to thick copper coin is pure glue prepreg;
S4, lamination, be placed in by the printed circuit boards half-finished product after pre-lamination on the Copper Foil be layed on steel plate, above described printed circuit boards half-finished product, also symmetrical laying has Copper Foil and steel plate;
S5, pressing.
As preferably, in described step S4, in described step S4, be equipped with cushion pad and aluminium flake between described Copper Foil and steel plate, described Copper Foil pressed close to by aluminium flake.。
As preferably, in described step S5, the technological parameter of pressing is: pressing pressure 400PSI, press maximum temperature 220 DEG C, pressing time 170min.
As preferably, described cushion pad is PACOPLUS stripping film, and its thickness is 1.6mm.
As preferably, the thickness of described copper coin is not less than 3OZ.
As preferably, the prepreg of described internal layer Copper Foil both sides is 1080RC71% prepreg, and its thickness is 90 μm.
As preferably, described pure glue prepreg thickness is 150 μm.
As preferably, described aluminium flake thickness is 0.15mm.
As preferably, the hardness of described steel plate is 47H, and thermal coefficient of expansion is 16.5.
Technique scheme of the present invention has the following advantages compared to existing technology: the technique of improvement of the present invention thick copper coin pressing white edge, traditional prepreg of copper coin both sides thick in printed circuit board is replaced with pure glue prepreg, it has good adhesive property, heat resistance, there is lazy flow simultaneously, pressing Hou Wutong district can be effectively avoided to produce pressing white edge, and after pressing printed circuit plate thickness can with printed circuit board consistency of thickness of the prior art, do not affect circuit board performance.In lamination process, each symmetrical laying cushion pad in the upper and lower both sides of printed circuit boards half-finished product after pre-lamination and aluminium flake, the pressure that when having cushioned hot pressing, circuit board semi-finished product are subject to; In bonding processes, improve maximal pressure force value, delayed upper high-voltage time section, prepreg resin has more fully been filled in line gap, further improves the defect of pressing white edge.
Embodiment
In order to make content of the present invention be more likely to be clearly understood, the present invention is further detailed explanation according to a particular embodiment of the invention below.
Embodiment
The present embodiment provides a kind of technique improving thick copper coin pressing white edge, and it comprises the steps:
S1, sawing sheet, cut internal layer Copper Foil, thick copper coin and prepreg according to required size, and after cutting, remove the prepreg powder on prepreg surface, the thickness of described thick copper coin is not less than 3OZ;
S2, core material brown, form oxide layer with conventional brown technique on core material surface;
S3, pre-lamination, stack internal layer Copper Foil to be laminated, thick copper coin and prepreg according to predefined procedure, the two panels prepreg pressing close to thick copper coin to be thickness the be pure glue prepreg of 150 μm, and Copper Foil both sides are 1080RC71% prepreg, and thickness is 90 μm;
S4, lamination, printed circuit boards half-finished product after pre-lamination is placed on the Copper Foil be layed on steel plate, described steel plate hardness is 47H, thermal coefficient of expansion is 16.5, and above described printed circuit boards half-finished product, also symmetrical laying has Copper Foil and steel plate, is also equipped with cushion pad and aluminium flake between described Copper Foil and steel plate, wherein described Copper Foil pressed close to by aluminium flake, the thickness of aluminium flake is 0.15mm, and described cushion pad is PACOPLUS stripping film, and thickness is 1.6mm; Polishing or brushing is adopted to clean after steel plate uses at every turn; Cushion pad and aluminium flake, the pressure that when having cushioned hot pressing, circuit board semi-finished product are subject to;
S5, pressing, adopt pressing machine, pressing 170min under pressure is 400PSI, press maximum temperature 220 DEG C of conditions.
Traditional prepreg of copper coin both sides thick in printed circuit board is replaced with pure glue prepreg, it has good adhesive property, heat resistance, there is lazy flow simultaneously, pressing Hou Wutong district can be effectively avoided to produce pressing white edge, and after pressing printed circuit plate thickness can with printed circuit board consistency of thickness of the prior art, do not affect circuit board performance.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (9)
1. improve a technique for thick copper coin pressing white edge, it is characterized in that, comprise the steps:
S1, sawing sheet, cut internal layer Copper Foil, copper coin and prepreg according to required size;
S2, core material brown, form oxide layer on core material surface;
S3, pre-lamination, internal layer Copper Foil, copper coin and prepreg to be laminated are stacked according to predefined procedure, the two panels prepreg pressing close to thick copper coin is pure glue prepreg;
S4, lamination, be placed in by the printed circuit boards half-finished product after pre-lamination on the Copper Foil be layed on steel plate, above described printed circuit boards half-finished product, also symmetrical laying has Copper Foil and steel plate;
S5, pressing.
2. the technique of improvement according to claim 1 thick copper coin pressing white edge, is characterized in that, in described step S4, be equipped with cushion pad and aluminium flake between described Copper Foil and steel plate, described Copper Foil pressed close to by aluminium flake.
3. the technique of improvement according to claim 1 and 2 thick copper coin pressing white edge, is characterized in that, in described step S5, the technological parameter of pressing is: pressing pressure 400PSI, press maximum temperature 220 DEG C, pressing time 170min.
4. the technique of improvement according to claim 3 thick copper coin pressing white edge, is characterized in that, described cushion pad is PACOPLUS stripping film, and its thickness is 1.6mm.
5. the technique of improvement according to claim 4 thick copper coin pressing white edge, is characterized in that, the thickness of described copper coin is not less than 3OZ.
6. the technique of improvement according to claim 5 thick copper coin pressing white edge, is characterized in that, the prepreg of described internal layer Copper Foil both sides is 1080RC71% prepreg, and its thickness is 90 μm.
7. the technique of improvement according to claim 6 thick copper coin pressing white edge, is characterized in that, described pure glue prepreg thickness is 150 μm.
8. the technique of improvement according to claim 7 thick copper coin pressing white edge, is characterized in that, described aluminium flake thickness is 0.15mm.
9. the technique of improvement according to claim 8 thick copper coin pressing white edge, is characterized in that, the hardness of described steel plate is 47H, and thermal coefficient of expansion is 16.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731024.9A CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731024.9A CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430941A true CN105430941A (en) | 2016-03-23 |
| CN105430941B CN105430941B (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510731024.9A Active CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
| CN106982515A (en) * | 2017-05-26 | 2017-07-25 | 东莞翔国光电科技有限公司 | A kind of thick copper coin process for pressing of 12oz |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN107770975A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of anti-corrugation compression methods of PCB |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN113518508A (en) * | 2021-03-17 | 2021-10-19 | 东莞联桥电子有限公司 | Improved multilayer circuit board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168727A (en) * | 2014-08-22 | 2014-11-26 | 广州杰赛科技股份有限公司 | Method for manufacturing multilayer PCB in plate pressing mode |
| CN104486914A (en) * | 2014-11-14 | 2015-04-01 | 皆利士多层线路版(中山)有限公司 | Inner and outer layer copper thickness-differentiated thick copper circuit board and preparation method thereof |
-
2015
- 2015-11-02 CN CN201510731024.9A patent/CN105430941B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168727A (en) * | 2014-08-22 | 2014-11-26 | 广州杰赛科技股份有限公司 | Method for manufacturing multilayer PCB in plate pressing mode |
| CN104486914A (en) * | 2014-11-14 | 2015-04-01 | 皆利士多层线路版(中山)有限公司 | Inner and outer layer copper thickness-differentiated thick copper circuit board and preparation method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
| CN106686912A (en) * | 2016-12-21 | 2017-05-17 | 皆利士多层线路版(中山)有限公司 | Thick-bottom copper multilayered circuit board and preparation method therefor |
| CN106982515A (en) * | 2017-05-26 | 2017-07-25 | 东莞翔国光电科技有限公司 | A kind of thick copper coin process for pressing of 12oz |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN107770975A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of anti-corrugation compression methods of PCB |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN108650804B (en) * | 2018-05-14 | 2022-07-19 | 深圳市深联电路有限公司 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN113518508A (en) * | 2021-03-17 | 2021-10-19 | 东莞联桥电子有限公司 | Improved multilayer circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430941B (en) | 2018-04-24 |
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