CN105578802A - Lamination method for multi-layer flexible board and multi-layer flexible board - Google Patents
Lamination method for multi-layer flexible board and multi-layer flexible board Download PDFInfo
- Publication number
- CN105578802A CN105578802A CN201510995571.8A CN201510995571A CN105578802A CN 105578802 A CN105578802 A CN 105578802A CN 201510995571 A CN201510995571 A CN 201510995571A CN 105578802 A CN105578802 A CN 105578802A
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- Prior art keywords
- layer flexible
- flexible sheet
- pressing
- flexible board
- compression method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a lamination method for a multi-layer flexible board and the multi-layer flexible board. The method disclosed by the invention is wide in application range, and can well solve the problem of wrinkling of copper foil for lamination of the multi-layer board with the copper foil outside; meanwhile, the flexible circuit board can be relatively well coated and combined through combination of an aluminum sheet and a PE film; the reliability is relatively well guaranteed; and the product yield is improved.
Description
Technical field
The present invention relates to flexible board field, particularly relate to a kind of compression method and multi-layer flexible sheet of multi-layer flexible sheet.
Background technology
Flexible board, its material is softer, there is harmomegathus and be difficult to problems such as controlling, central layer is easily out of shape, Copper Foil is wrinkling in bonding processes.This problem is the Major Difficulties of Copper Foil in the pressing of outer field layer flexible plate structure at present.What adopt during the pressing of conventional multilayer flexible board is that silicagel pad cushions, although silicagel pad is high temperature resistant, shock-absorbing capacity is good, and when being applied to flexible board pressing, especially Copper Foil is when outer field flexible board pressing, still easily can occur the problem that Copper Foil is wrinkling.Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of compression method and multi-layer flexible sheet of multi-layer flexible sheet, be intended to solve existing multi-layer flexible sheet easy wrinkling, yielding problem when pressing.
Technical scheme of the present invention is as follows:
A compression method for multi-layer flexible sheet, wherein, comprises step:
S1: by flexible board successively sawing sheet, boring, then produce figure;
S2: have the pure glue contraposition laminating of the one side of figure to get on a flexible board, then cold pressing;
S3: after colding pressing, produces the flexible board of figure by other one and the pure glue of above-mentioned flexible board is fitted in the face of position;
S4: flexible board and flexible board are fitted according to step S2 and step S3, make the multi-layer flexible sheet of the required number of plies, again pure glue laminating is colded pressing on the back side of Copper Foil again, then Copper Foil and the above-mentioned multi-layer flexible sheet contraposition posted are superimposed together, form multi-layer flexible sheet to be laminated;
S5: stack according to the order of brown paper, steel plate, release film, PE film, release film, aluminium flake, multi-layer flexible sheet to be laminated, aluminium flake, release film, PE film, release film, steel plate, brown paper;
S6: make the structure stacked enter press, carry out hot pressing, finally form multi-layer flexible sheet.
Described multi-layer flexible sheet compression method, wherein, described multi-layer flexible sheet is that the number of plies is more than or equal to 3.
Described multi-layer flexible sheet compression method, wherein, in described step S2, the temperature of colding pressing is 80-100 DEG C.
Described multi-layer flexible sheet compression method, wherein, in described step S2, the time of colding pressing is 15-20s.
Described multi-layer flexible sheet compression method, wherein, in described step S6, the temperature of hot pressing is 170-190 DEG C.
Described multi-layer flexible sheet compression method, wherein, in described step S6, the time of hot pressing is 150-300s.
A kind of multi-layer flexible sheet, wherein, adopts the compression method pressing as above described in any one to form.
Beneficial effect: method of the present invention is applied widely, concerning Copper Foil multi-layer sheet pressing outside, can the wrinkling problem of extraordinary solution Copper Foil.Aluminium flake and PE film combine and flexible circuit board can be made better to be covered shape and combination simultaneously, make reliability more guaranteed, improve product yield.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of multi-layer flexible sheet compression method of the present invention preferred embodiment.
Fig. 2 is the schematic diagram of laminate structure in method of the present invention.
Embodiment
The invention provides a kind of compression method and multi-layer flexible sheet of multi-layer flexible sheet, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of the compression method preferred embodiment of a kind of multi-layer flexible sheet of the present invention, and as shown in the figure, it comprises step:
S1: by flexible board successively sawing sheet, boring, then produce figure;
S2: at a flexible board 10(composition graphs 2) on have the one side of figure pure glue 11 contraposition laminating to get on, then to cold pressing;
S3: after colding pressing, the pure glue 11 of the flexible board 10 and above-mentioned flexible board 10 of other one being produced figure is fitted in the face of position;
S4: flexible board 10 and flexible board 10 are fitted according to step S2 and step S3, make the multi-layer flexible sheet of the required number of plies, cold pressing again in the back side purer glue 11 being fitted in Copper Foil 12, then Copper Foil 12 and the above-mentioned multi-layer flexible sheet contraposition posted are superimposed together, form multi-layer flexible sheet to be laminated;
S5: stack according to the order of brown paper 17, steel plate 16, release film 14, PE film 15, release film 14, aluminium flake 13, multi-layer flexible sheet to be laminated, aluminium flake 13, release film 14, PE film 15, release film 14, steel plate 16, brown paper 17;
S6: make the structure stacked enter press, carry out hot pressing, finally form multi-layer flexible sheet.
Method of the present invention is applicable to all multi-layer flexible sheet pressings.Namely method of the present invention saves the fabrication cycle of multi-layer flexible sheet, saves pressing time, but also flexible board pressing is obtained well cover shape, and reliability is guaranteed.
Described pure glue 11 is used to insulating medium layer flexible board 10 and flexible board 10 being carried out the acrylic acid material combined, and it has excellent high and low temperature resistance, electric insulating quality, dimensional stability, and firm time is short.Though acrylic compounds thermal endurance, dielectricity and flexible are satisfactory, its water absorption is high, cost is high, so the present invention also can adopt modified epoxy as pure glue, it has fabulous dielectric property, and cost is low.
The lamination materials such as release film 14 wherein, PE film 15, brown paper 17, its shock-absorbing capacity is excellent, can ensure product quality.
Wherein aluminium flake 13 can resistance to 150-200 DEG C high temperature, has good shock-absorbing capacity.Described aluminium flake 13 can use the anti-welding consent of PCB rigid plate to use, and thickness is more than or equal to the consent aluminium flake of 0.2mm, and the distortion of this aluminium flake is little, high temperature resistant.
Brown paper 17 be PCB pressing use can the brown paper of high temperature resistant, good thermal conduction.
Release film 14 wherein, high temperature resistant and not yielding, evenness is good, covers shape effective.
Wherein PE film 15, has and well cushions and cover shape effect.
The steel plate of the 1.2-2.0mm thickness (1.8mm is thick) that steel plate 16 is PCB pressing.Described steel plate 16 its be the steel plate of high rigidity steel plate, such as ASISI440C.
Flexible board 10 is wherein a kind of polyimides material, the wiring board of high temperature resistant, excellent performance of destroying or force to yield.
In described step S1, the first-selected number of plies selecting to determine to need the multi-layer flexible sheet made, method of the present invention is applicable to the multi-layer flexible sheet of all numbers of plies.Then by flexible board by normal flow successively sawing sheet, hole, produce figure;
In described step S2, in the flexible board after making figure, select a flexible board 10, had the pure glue 11 contraposition laminating of the one side of figure to get on, then cold pressing;
In the present invention, the temperature of colding pressing is: 80-100 DEG C, and the time of colding pressing is: 15-20s.Preferably, the temperature of colding pressing is 90 DEG C, the time of colding pressing is 18s, the control of heating rate, the control of cooldown rate should be noted before and after cold pressure procedure, cooldown rate controls at 1.3 DEG C/min ~ 1.7 DEG C/min(as 1.5 DEG C/min), tapping temperature also should not be too high, is generally no more than 70 DEG C, as 65 DEG C.The benefit done like this makes to be not easy to occur wrinkle when pressing between flexible board and flexible board, and dimensional stability is better.And adopt pure glue laminating, can avoid using the PP with glass fibre, thus avoid the flexility affecting product, improve product stability.
In described step S3, after an above-mentioned flexible board 10 of having colded pressing, select an other flexible board 10, its pure glue 11 one side contraposition with a flexible board 10 is above fitted;
In described step S4, (condition of colding pressing is identical with aforementioned condition of colding pressing) is colded pressing at the back side pure glue 11 being fitted in Copper Foil 12 more herein, then the pure glue 11 of above-mentioned Copper Foil 12 one side is superimposed together with the contraposition of above-mentioned flexible board 10, forms multi-layer flexible sheet to be laminated; First hold Copper Foil 12 successfully size, Copper Foil 12 large 50-100mm, such as 60mm more monolateral than flexible board 10, be fitted on Copper Foil 12 by pure glue 11, cold pressing, this process is gum, then the Copper Foil 12 having carried on the back glue is superimposed together with flexible board 10 contraposition, forms multi-layer flexible sheet to be laminated;
For the situation being greater than 2 flexible board pressings, then except outermost layer flexible board, all the other flexible boards all carry out pure glue contraposition and fit-cold pressing, and namely adopt pure glue laminating between flexible board and flexible board.
In described step S5, stack according to the order of brown paper 17, steel plate 16, release film 14, PE film 15, release film 14, aluminium flake 13, multi-layer flexible sheet to be laminated, aluminium flake 13, release film 14, PE film 15, release film 14, steel plate 16, brown paper 17.The brown paper on every one side its structure of 5 new brown paper+5 old brown paper can be adopted to stack.Described brown paper 17 can be mixed with highly basic (as NaOH) by pine to boil altogether, after treating the effusion of its volatile matter and removing acids, carries out immediately washing and precipitating, after becoming paper pulp, the more coarse cheap paper wood suppressed.
In described step S6, make the structure stacked enter press, the temperature of hot pressing is 170-190 DEG C.The time of hot pressing is 150-300s, finally forms multi-layer flexible sheet.Preferably, the temperature of hot pressing is 180 DEG C, and the time of hot pressing is 200s, and described press is vacuum hotpressing machine.Above-mentioned hot pressing condition, can guarantee the impact not being subject to extraneous factor in bonding processes, and dimensional stability is better, and pressing reliability is high.When carrying out hot pressing, its pressure can be divided into four-stage: first pressing, second segment pressure, the 3rd section of pressure, the 4th section of pressure, and every layer of heat transfer of combining closely is instigated in first pressing, drives volatile matter and residual gas; Second segment pressure makes the fluid of melting (cull etc.) fill and drive bubble in glue smoothly, the wrinkle simultaneously preventing hypertonia from causing and stress; 3rd section of pressure produces polymerization reaction, and material should be changed; 4th section of pressure still keeps suitable pressure at temperature-fall period, reduces because cooling incident internal stress.In the present invention, the scope of first pressing is that 100 ~ 150psi(is as kept 120psi at front 20s), the scope of second segment pressure is that 200 ~ 300psi(such as 20th ~ 50s keeps 250psi), the scope of the 3rd section of pressure is that 350 ~ 450psi(is as kept 400psi at 50s ~ 150s), the scope of the 4th section of pressure is that 150 ~ 200psi(is as kept 180psi at 150s ~ 100s).
The present invention also provides a kind of multi-layer flexible sheet, and it adopts compression method pressing as above to form.
In the present invention, because aluminium flake has fabulous high temperature resistant and deformation resistant ability, PE film is due to quality softness, when hot pressing, shape can well be covered on the line pattern of flexible board, so both combinations, can obtain fabulous covering shape effect, improve Copper Foil in the wrinkling problem of the easy Copper Foil of outer field multi-layer flexible sheet pressing.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (7)
1. a compression method for multi-layer flexible sheet, is characterized in that, comprises step:
S1: by flexible board successively sawing sheet, boring, then produce figure;
S2: have the pure glue contraposition laminating of the one side of figure to get on a flexible board, then cold pressing;
S3: after colding pressing, produces the flexible board of figure by other one and the pure glue of above-mentioned flexible board is fitted in the face of position;
S4: flexible board and flexible board are fitted according to step S2 and step S3, make the multi-layer flexible sheet of the required number of plies, again pure glue laminating is colded pressing on the back side of Copper Foil again, then Copper Foil and the above-mentioned multi-layer flexible sheet contraposition posted are superimposed together, form multi-layer flexible sheet to be laminated;
S5: stack according to the order of brown paper, steel plate, release film, PE film, release film, aluminium flake, multi-layer flexible sheet to be laminated, aluminium flake, release film, PE film, release film, steel plate, brown paper;
S6: make the structure stacked enter press, carry out hot pressing, finally form multi-layer flexible sheet.
2. multi-layer flexible sheet compression method according to claim 1, is characterized in that, described multi-layer flexible sheet is that the number of plies is more than or equal to 3.
3. multi-layer flexible sheet compression method according to claim 1, is characterized in that, in described step S2, the temperature of colding pressing is 80-100 DEG C.
4. multi-layer flexible sheet compression method according to claim 1, is characterized in that, in described step S2, the time of colding pressing is 15-20s.
5. multi-layer flexible sheet compression method according to claim 1, is characterized in that, in described step S6, the temperature of hot pressing is 170-190 DEG C.
6. multi-layer flexible sheet compression method according to claim 1, is characterized in that, in described step S6, the time of hot pressing is 150-300s.
7. a multi-layer flexible sheet, is characterized in that, adopts the compression method pressing as described in any one of claim 1 ~ 6 to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510995571.8A CN105578802A (en) | 2015-12-28 | 2015-12-28 | Lamination method for multi-layer flexible board and multi-layer flexible board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510995571.8A CN105578802A (en) | 2015-12-28 | 2015-12-28 | Lamination method for multi-layer flexible board and multi-layer flexible board |
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| CN105578802A true CN105578802A (en) | 2016-05-11 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN106304660A (en) * | 2016-08-30 | 2017-01-04 | 惠州新联兴实业有限公司 | Outer layer thin copper foil circuit board pressing method |
| CN106535509A (en) * | 2016-11-16 | 2017-03-22 | 天津普林电路股份有限公司 | Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose |
| CN107135617A (en) * | 2017-06-07 | 2017-09-05 | 盐城博超机电设备有限公司 | Steel plate lamination method for suppressing wiring board |
| CN107864566A (en) * | 2017-10-24 | 2018-03-30 | 深圳市昶东鑫线路板有限公司 | A kind of heavy copper circuit board preparation method |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN112616251A (en) * | 2020-12-08 | 2021-04-06 | 深圳市祺利电子有限公司 | Manufacturing method of circuit board mounting hole |
| CN112770543A (en) * | 2020-12-10 | 2021-05-07 | 安捷利（番禺）电子实业有限公司 | Preparation method of FPC board |
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| CN114286542A (en) * | 2021-12-06 | 2022-04-05 | 龙南骏亚柔性智能科技有限公司 | Laminating method of OLED circuit board |
| CN114628067A (en) * | 2022-03-24 | 2022-06-14 | 苏州思源科安信息技术有限公司 | Flexible FPC flat cable based on multilayer separation type and application equipment thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201403253Y (en) * | 2009-04-17 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board compression structure with PET single-sided parting film |
| CN204031627U (en) * | 2014-08-30 | 2014-12-17 | 江西景旺精密电路有限公司 | A kind of laminater of rigid-flex combined board |
| CN204305455U (en) * | 2014-12-16 | 2015-04-29 | 珠海海迅软性多层板有限公司 | A kind of novel multi-layer FPC |
| CN204616215U (en) * | 2015-05-18 | 2015-09-02 | 惠州市金百泽电路科技有限公司 | A kind of laminate structure promoting rigid-flex combined board pressing shock absorbent quality |
-
2015
- 2015-12-28 CN CN201510995571.8A patent/CN105578802A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201403253Y (en) * | 2009-04-17 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board compression structure with PET single-sided parting film |
| CN204031627U (en) * | 2014-08-30 | 2014-12-17 | 江西景旺精密电路有限公司 | A kind of laminater of rigid-flex combined board |
| CN204305455U (en) * | 2014-12-16 | 2015-04-29 | 珠海海迅软性多层板有限公司 | A kind of novel multi-layer FPC |
| CN204616215U (en) * | 2015-05-18 | 2015-09-02 | 惠州市金百泽电路科技有限公司 | A kind of laminate structure promoting rigid-flex combined board pressing shock absorbent quality |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN106304660A (en) * | 2016-08-30 | 2017-01-04 | 惠州新联兴实业有限公司 | Outer layer thin copper foil circuit board pressing method |
| CN106535509A (en) * | 2016-11-16 | 2017-03-22 | 天津普林电路股份有限公司 | Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose |
| CN106535509B (en) * | 2016-11-16 | 2019-02-26 | 天津普林电路股份有限公司 | A kind of space flight and aviation does not flow PP pressing structure and its method with circuit board single side |
| CN107135617A (en) * | 2017-06-07 | 2017-09-05 | 盐城博超机电设备有限公司 | Steel plate lamination method for suppressing wiring board |
| CN107864566A (en) * | 2017-10-24 | 2018-03-30 | 深圳市昶东鑫线路板有限公司 | A kind of heavy copper circuit board preparation method |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN111132531B (en) * | 2018-11-01 | 2022-03-04 | 无锡蓝沛新材料科技股份有限公司 | Wave-absorbing material and laminating process thereof |
| CN112616251A (en) * | 2020-12-08 | 2021-04-06 | 深圳市祺利电子有限公司 | Manufacturing method of circuit board mounting hole |
| CN112770543A (en) * | 2020-12-10 | 2021-05-07 | 安捷利（番禺）电子实业有限公司 | Preparation method of FPC board |
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| CN114286542A (en) * | 2021-12-06 | 2022-04-05 | 龙南骏亚柔性智能科技有限公司 | Laminating method of OLED circuit board |
| CN114628067A (en) * | 2022-03-24 | 2022-06-14 | 苏州思源科安信息技术有限公司 | Flexible FPC flat cable based on multilayer separation type and application equipment thereof |
| CN114628067B (en) * | 2022-03-24 | 2023-11-24 | 苏州思源科安信息技术有限公司 | Flexible FPC winding displacement based on multilayer separation formula and application equipment thereof |
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Application publication date: 20160511 |