CN108650804A - A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods - Google Patents
A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods Download PDFInfo
- Publication number
- CN108650804A CN108650804A CN201810467751.2A CN201810467751A CN108650804A CN 108650804 A CN108650804 A CN 108650804A CN 201810467751 A CN201810467751 A CN 201810467751A CN 108650804 A CN108650804 A CN 108650804A
- Authority
- CN
- China
- Prior art keywords
- control circuit
- voltage control
- substrates
- gong
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Abstract
The present invention provides a kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods, including step：Copper bar makes；FR4 plates make；PDU high-voltage control circuit plates make.The present invention efficiently solves the problems, such as to be layered gummosis present in conventional fabrication processes by changing the adjustment of pressing plate parameter and substituting PP pressings with pure glue；And the present invention solves the problems, such as that copper base is easy breaking by the adjustment to drilling parameter.Compared with prior art, The present invention reduces production technologies, improve production efficiency, it is ensured that the yield of product.
Description
Technical field
The invention belongs to printed wiring board manufacturing technology fields, and in particular to be that a kind of new-energy automobile PDU high is voltage-controlled
Circuit board manufacturing method processed.
Background technology
As new-energy automobile is quickly popularized and developed, higher want is proposed to the performance of high-tension distribution box for electric vehicle
It asks, high-tension distribution box for electric vehicle is the high-voltage electricity high current allocation unit of pure electric automobile, plug-in hybrid-power automobile
(Power Distribution Uni, PDU), is the important component of the whole-control system of electric vehicle, is mainly used for
Coordinate driving motor control system, battery management system, charging management system, the power and energy of the high pressures attachment such as braking system and
The energy distributes.
Since high-tension distribution box for electric vehicle uses centralized power distribution scheme, structure design closely, therefore to vehicle system
The requirement of system framework distribution is very high, and as the PDU high-voltage control circuit plates for carrying entire circuit design, the quality of performance is straight
Connect the performance for determining New-energy electric vehicle.And PDU high-voltage control circuit plates are special copper bases at present, if using
Conventional PCB flows make, and PCB drilling parameters can not produce copper base, are easy breaking；And routine PCB flows make PDU high pressures
Control circuit board there are problems that being layered gummosis in bonding processes, therefore can not make PDU high voltage controls using routine PCB flows
Circuit board, it is difficult to realize the promotion of automobile high-tension distribution box performance and electric vehicle performance.
Invention content
For this purpose, the purpose of the present invention is to provide a kind of new energy that can effectively promote high-tension distribution box for electric vehicle performance
Source automobile PDU high-voltage control circuit board manufacturing methods.
The purpose of the present invention is what is be achieved through the following technical solutions.
A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods, including step：Copper bar makes；FR4 plates make；
PDU high-voltage control circuit plates make.
Preferably, the copper bar, which makes, includes：
To copper base carry out sawing sheet, then bore location hole, then carry out gong plate with by copper base gong at copper bar.
Preferably, the drilling parameter when brill location hole is：Cutter diameter 2.05mm；Speed of mainshaft 25k*rpm；Feed
Speed 0.5m/min；Withdrawing speed 20m min；Drilling step number is 4 steps.
Preferably, the FR4 plates, which make, includes：
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement；
Pre-treatment processing is carried out to the FR4 substrates, then carries out pressing dry film, exposure imaging progress inner figure making；
Then internal layer etching is carried out to FR4 substrates, forms inner line figure；
Later pure glue, conveying speed 0.6 ± 0.1m/ primary by manual drying film machine pneumatics are pasted in FR4 substrate upper and lower surfaces
min；
It finally drills to FR4 substrates, and gong plate is slotted.
Preferably, the PDU high-voltage control circuits plate makes, including：
Copper bar is put into corresponding FR4 flutings, and carries out first time pressing, carries out wire drawing, gong frame, brown later
Processing；
Then it carries out pressing for second, and drill, crosses and remove tree lace, heavy copper plate electric, volcanic ash pre-treatment, manual dry film
Machine pad pasting, exposure imaging carry out outer graphics processing, do graphic plating, welding resistance, character, gong plate, turmeric, press nut, FQC,
FQA packs shipment.
A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods, including：
To copper base sawing sheet, a diameter of 2.05mm cutters, control speed of mainshaft 25k*rpm, feed velocity are then used
0.5m/min, withdrawing speed 20m min location hole is bored on copper base, later then to copper base carry out gong plate with by its gong at institute
The copper bar needed；
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement, before being carried out to the FR4 substrates
Processing press dry film, exposure imaging, makes inner figure, and carry out internal layer etching to FR4 substrates, forms internal layer circuit figure
Shape；
Pure glue is pasted in FR4 substrate upper and lower surfaces, conveying speed 0.6 ± 0.1m/min primary by manual drying film machine pneumatics,
Later to its drilling processing and gong plate, FR4 substrates fluting is formed；
Above-mentioned copper bar is correspondingly embedded in the fluting of FR4 substrates, then carries out first time pressing, then carry out wire drawing, gong
Frame, brown processing；
It carries out second to press, drill to FR4 substrates, cross and remove tree lace, heavy copper plate electric, volcanic ash pre-treatment, manual dry film
Machine pad pasting, exposure imaging carry out outer graphics processing, do graphic plating, welding resistance, character, gong plate, turmeric, press nut, FQC,
FQA packs shipment.
PDU high-voltage control circuits board manufacturing method provided by the invention, by the way that the adjustment of pressing plate parameter is changed and used
Pure glue substitutes PP pressings and efficiently solves the problems, such as to be layered gummosis present in conventional fabrication processes；And the present invention passes through to drilling
The adjustment of parameter solves the problems, such as that copper base is easy breaking.Compared with prior art, The present invention reduces production technologies, carry
High production efficiency, it is ensured that the yield of product.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
The present invention provides a kind of satisfactory new-energy automobile PDU high-voltage control circuit plates, by joining to pressing plate
The adjustment of number, drilling parameter and sheeting process, significantly improves the production technology of PDU high-voltage control circuit plates, improves
Production efficiency.
Wherein the invention mainly comprises following steps：Copper bar production process；FR4 substrate manufacture flows；And PDU high is voltage-controlled
Circuit board making main flow processed.
Copper bar production process, including sawing sheet → drilling → gong plate.
Copper bar is a kind of conducting heavy current product, is suitable for high and low voltage electrical equipment, switch contact, controller switching equipment, bus duct etc.
Electro-engineering is also widely used in the super-large currents electrolysis for production engineerings such as metal smelt, electrochemical plating, chemical industry caustic soda.
Wherein the flow includes：Sawing sheet outputs satisfactory small powder as requested using correct plate；Then it presses just
Normal drilling parameter carries out drilling processing；Gong plate process is carried out after requiring brown according to normal brown, is processed by copper coin gong board parameter.
The present invention is to copper base sawing sheet, using a diameter of 2.05mm cutters, control speed of mainshaft 25k*rpm, feed velocity
0.5m/min, withdrawing speed 20m min location hole is bored on copper base, later then to copper base carry out gong plate with by its gong at institute
The copper bar needed.
FR4 substrate manufacture flows include：Sawing sheet → inner figure → internal layer etching → pure glue → the brill of internal layer pre-treatment → patch
Hole → gong plate.
Wherein detailed process includes：According to normal parameter, outputed as requested using correct plate satisfactory small
Material；Then normal to cross internal layer pre-treatment processing, film is pressed dry, exposure etc. carries out inner figure processing；According to copper thickness adjustment etching ginseng
Number, normal parameter cross internal layer chemistry pre-treatment, and then using pure glue is pasted, manual drying film machine pneumatics is primary, and conveying speed 0.6 ±
0.1m/min, other parameters normal use；It is processed by normal drill parameter；Then normal gong board parameter gong plate, processing are pressed.
Core plate is mainly made in this step, needs to produce the core plate that thickness is 2.0mm in the present embodiment, and correspond to
It slots on core plate.
PDU high-voltage control circuit plates make main flow：One step press → wire drawing → gong frame → brown → secondary pressure
Conjunction → drilling → removing glue → heavy copper → electric plating of whole board → outer graphics → graphic plating → outer layer etches → etch QC → welding resistance →
Character → gong plate → turmeric → pressure nut → FQC → FQA → packaging.
Its detailed process is：Copper bar is put into corresponding FR4 slots；It is carried out for the first time using the pressing formula of HTG001
Pressing → using water mill wire drawing machine, which carries out wire drawing process → gong frame → using normal parameter, crosses between brown → core plate and carries out the
Second pressing → crossed by normal drill parameter processing → normal parameter except tree lace → by normal parameter sinks copper → by normal parameter plate
Electricity → volcanic ash pre-treatment, manual drying film machine pad pasting, exposure, development carry out outer graphics processing → normal parameter and do graphic plating
→ welding resistance → character → gong plate → turmeric → pressure nut → FQC → FQA → packaging shipment.
In the step, the copper bar made is correspondingly embedded in the fluting of manufactured core plate, then core plate again
Upper and lower surface respectively pastes pure glue, and pure glue thickness is 35 microns, then in the FR4 substrates of the outer side covering single side copper foil of pure glue, and is made
The one side of its smooth surface is touched with pure splicing, and wherein the FR4 glass plate thickness of the FR4 substrates of the single side copper foil is 0.508mm, and copper foil
Thickness is 1OZ.
It should be noted that：The pure glue of the present invention substitutes PP pressings and solves layering gummosis technical solution, wherein pressing lamination
Method is：Core plate will first do brown processing, increase plate face binding force, brown be after internal layer sawing sheet, internal layer D/F, internal layer erosion plate it
Copper face processing is carried out to production plate afterwards, generates layer of oxide layer in internal layer copper foil surface to promote multilayer circuit board copper in pressing
Engagement between foil and epoxy resin.Then the protective film of the pure glue surfaces of tow sides FR4 is torn, the FR4 and core of tow sides
Plate stack carries out contraposition rivet by the outer location hole at four angles.Wherein stack when pure glue surface protective film can not leak and tear, two sides FR4
There can not be displacement with core plate and fold anti-phenomenon, a release film is respectively put on the wherein two sides of working plate, release film two sides each side one again
Open silica gel.
The parameter of the pressing formula of wherein HTG001 corresponds to such as following table：
In conclusion the technical program solve before the new-energy automobile PDU high-voltage control circuits that can not produce of flow
The problem of plate, and it is up to standard smoothly to produce using the technical program product quality.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (6)
1. a kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods, which is characterized in that including step：Copper bar makes；
FR4 plates make；PDU high-voltage control circuit plates make.
2. new-energy automobile PDU high-voltage control circuit board manufacturing methods as described in claim 1, which is characterized in that the copper
Row makes：
To copper base carry out sawing sheet, then bore location hole, then carry out gong plate with by copper base gong at copper bar.
3. new-energy automobile PDU high-voltage control circuit board manufacturing methods as claimed in claim 2, which is characterized in that the brill
Drilling parameter when location hole is：Cutter diameter 2.05mm；Speed of mainshaft 25k*rpm；Feed velocity 0.5m/min；Withdrawing speed
20m\min；Drilling step number is 4 steps.
4. new-energy automobile PDU high-voltage control circuit board manufacturing methods as claimed in claim 3, which is characterized in that the FR4
Plate makes：
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement；
Pre-treatment processing is carried out to the FR4 substrates, then carries out pressing dry film, exposure imaging progress inner figure making；
Then internal layer etching is carried out to FR4 substrates, forms inner line figure；
Later pure glue, conveying speed 0.6 ± 0.1m/min primary by manual drying film machine pneumatics are pasted in FR4 substrate upper and lower surfaces；
It finally drills to FR4 substrates, and gong plate is slotted.
5. new-energy automobile PDU high-voltage control circuit board manufacturing methods as claimed in claim 4, which is characterized in that the PDU
High-voltage control circuit plate makes, including：
Copper bar is put into corresponding FR4 fluting, and carries out first time pressing, carries out wire drawing later, gong frame, at brown
Reason；
Then it carries out pressing for second, and drill, crosses and remove tree lace, heavy copper plate electric, volcanic ash pre-treatment, manual drying film machine patch
Film, exposure imaging carry out outer graphics processing, do graphic plating, welding resistance, character, gong plate, turmeric, pressure nut, FQC, FQA, packet
Take on goods.
6. a kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods, which is characterized in that including：
To copper base sawing sheet, a diameter of 2.05mm cutters, control speed of mainshaft 25k*rpm, feed velocity 0.5m/ are then used
Min, withdrawing speed 20m min location hole is bored on copper base, later then to copper base carry out gong plate with by its gong at required
Copper bar；
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement, pre-treatment is carried out to the FR4 substrates
Processing press dry film, exposure imaging, makes inner figure, and carry out internal layer etching to FR4 substrates, forms inner line figure；
Pure glue is pasted in FR4 substrate upper and lower surfaces, conveying speed 0.6 ± 0.1m/min primary by manual drying film machine pneumatics, later
To its drilling processing and gong plate, FR4 substrates fluting is formed；
Above-mentioned copper bar is correspondingly embedded in the fluting of FR4 substrates, the pressing formula of HTG-001 is then used to carry out first time pressure
It closes, then carries out wire drawing, gong frame, brown processing；Wherein, the pressing parameter of the HTG-001 pressings formula is：
It carries out second to press, drill to FR4 substrates, cross and remove tree lace, heavy copper plate electric, volcanic ash pre-treatment, manual drying film machine patch
Film, exposure imaging carry out outer graphics processing, do graphic plating, welding resistance, character, gong plate, turmeric, pressure nut, FQC, FQA, packet
Take on goods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467751.2A CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467751.2A CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108650804A true CN108650804A (en) | 2018-10-12 |
| CN108650804B CN108650804B (en) | 2022-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810467751.2A Active CN108650804B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
| CN112930024B (en) * | 2021-01-25 | 2022-05-03 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN108650804B (en) | 2022-07-19 |
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