CN106550558A - A kind of pressing preparation method of embedding ceramic pcb board - Google Patents
A kind of pressing preparation method of embedding ceramic pcb board Download PDFInfo
- Publication number
- CN106550558A CN106550558A CN201611111230.0A CN201611111230A CN106550558A CN 106550558 A CN106550558 A CN 106550558A CN 201611111230 A CN201611111230 A CN 201611111230A CN 106550558 A CN106550558 A CN 106550558A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- gong
- groove
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention provides a kind of pressing preparation method of embedding ceramic pcb board, including：Make central layer；Make outer layer copper-clad plate；PP and the outer layer copper-clad plate made are sequentially placed in the upper and lower surface of central layer, and correspondence is pressed.The present invention is by the corresponding gong groove and correspondence gong inside groove in central layer at pad locations in outer layer copper-clad plate, and potsherd is correspondingly embedded in the inside groove of central layer, and the two ends correspondence of potsherd is embedded into through after PP in the groove of outer layer copper-clad plate, as potsherd is located at below pad, and its small volume, therefore, it is possible to the heat that the LED welded on pad modules are produced timely is exhaled.Compared with prior art, the present invention substantially increases the heat-sinking capability of product, reduces the manufacturing cost of product, effectively raises the manufacturing process ability of embedding ceramic pcb board pressing.
Description
Technical field
The invention belongs to printed wiring board manufacture technology field, and in particular to be a kind of pressing system of embedding ceramic pcb board
Make method.
Background technology
With the fast development of LED illumination industry, printed circuit board scale and the technology of LED module are constantly updated.But
The luminous efficiency of LED is only 20%-30% at present, and its complementary energy is converted into mostly thermal waste and falls, and in order to ensure that LED's is normal
The heat that these produce is distributed by work and the service life of prolongation LED, needs in time.Therefore, in LED fast developments
Meanwhile, LED heat dissipation technologys are also evolving.
LED printed circuit boards radiating at present mainly adopts metal substrate, ceramic substrate, high heat conduction plastic material or embedding ceramics
PCB etc..Wherein pressed together with insulating resin between metal substrate and Copper Foil, the capacity of heat transmission cannot meet LED
The requirement of product, and the ceramic board size in ceramics PCB and embedding ceramic PCB can not do too big, generally all in 250mm × 250mm
Within, otherwise cost of manufacture will be multiplied, and also plate such as sticks up at the quality risk, and ceramic wafer also needs to carry out thickness in addition
Cost control, if it exceeds 1.0mm, its cost will be multiplied.
The content of the invention
For this purpose, it is an object of the invention to provide a kind of low manufacture cost, production efficiency is high, good heat dissipation effect embedding ceramics
The pressing preparation method of pcb board.
The purpose of the present invention is achieved through the following technical solutions.
A kind of pressing preparation method of embedding ceramic pcb board, including：
Make central layer；
Make outer layer copper-clad plate；
PP and the outer layer copper-clad plate made are sequentially placed in the upper and lower surface of central layer, and correspondence is pressed.
Preferably, make central layer to specifically include：Sawing sheet, drilling, inner figure making, gong central layer groove.
Preferably, the gong central layer groove includes：Slotted eye of the specified location gong through whole central layer on central layer, and in the groove
Potsherd, and the thickness of the potsherd are correspondingly embedded in hole more than the thickness of central layer.
Preferably, make outer layer copper-clad plate to specifically include：Sawing sheet, drilling, inner figure making, gong outer layer copper-clad plate groove,
Wherein institute's gong outer layer copper-clad plate groove is identical with the corresponding size of the central layer groove location, and potsherd projection correspondence is located at
In the outer layer copper-clad plate groove that gong goes out.
Preferably, institute's gong outer layer copper-clad plate groove gong run through outer layer copper-clad plate, and with outer layer copper-clad plate on pad locations pair
Should.
Preferably, in the outer layer copper-clad plate groove that potsherd projection correspondence goes out positioned at gong, and with outer layer copper-clad plate
Medial plane flush.
The present invention is by corresponding to the gong groove and correspondence gong inside groove in central layer at pad locations in outer layer copper-clad plate, and incites somebody to action
Potsherd is correspondingly embedded in the inside groove of central layer, and makes the corresponding groove for being embedded into outer layer copper-clad plate through after PP in two ends of potsherd
In, as potsherd is located at below pad, and its small volume, the heat that the LED modules therefore, it is possible to will weld on pad are produced
Amount is timely exhaled.Compared with prior art, the present invention substantially increases the heat-sinking capability of product, reduces the system of product
This is caused, the manufacturing process ability of embedding ceramic pcb board pressing is effectively raised.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that specific embodiment described herein is not used to only to explain the present invention
Limit the present invention.
The invention provides a kind of pressing preparation method of embedding ceramic pcb board, which includes a kind of embodiment, and which specifically includes
Following steps：
Make central layer：Sawing sheet, drilling, inner figure making, gong central layer groove.Wherein described gong central layer groove includes：Refer on central layer
Positioning puts slotted eye of the gong through whole central layer, and potsherd is correspondingly embedded in the slotted eye, and the thickness of the potsherd is more than
The thickness of central layer.
Make outer layer copper-clad plate：Sawing sheet, drilling, inner figure making, gong outer layer copper-clad plate groove, wherein institute's gong outer layer cover copper
Board slot is identical with the corresponding size of the central layer groove location, and the outer layer copper-clad plate that potsherd projection correspondence goes out positioned at gong
In groove.
The potsherd for making appointed thickness is correspondingly embedded in the groove of central layer
Pressing：PP and the outer layer copper-clad plate made are sequentially placed in the upper and lower surface of central layer, and correspondence is pressed.Wherein PP
Upper correspondence opens a window, and opened a window size is in the same size with the hole of gong groove, so as to potsherd can be passed through and be correspondingly embedded in outer layer cover
In copper coin.
It should be noted that in the corresponding outer layer copper-clad plate groove gone out positioned at gong of potsherd projection, and copper is covered with outer layer
The medial plane of plate is flushed.And the line pad position being correspondingly formed in outer layer copper-clad plate and embedded potsherd position pair
Should, when correspondence welding LED module on pad, can be radiated by potsherd.
In addition, present invention also offers another embodiment, which specifically includes following steps：
Sawing sheet：Choosing one block of FR4 glass mat and two pieces of copper-clad plates carries out sawing sheet according to preliminary dimension size, by large scale
Supplied materials cut into production required for size.
Drilling：Brill location hole is carried out to the FR4 glass mats after sawing sheet and copper-clad plate, to follow-up Making programme and client
Assembling provided auxiliary.
Inner figure：Internal layer drawing making is carried out to copper-clad plate, by the inner figure made correspondence through nog plate, patch
Develop on the internal layer copper face of copper-clad plate after film, exposure.
Internal layer is etched：Retain the circuit pack of needs after imaging, remove the redundance beyond circuit.
Gong groove：Carry out gong inside groove to FR4 glass mats and copper-clad plate respectively, the interior groove location size of wherein institute's gong is right
Should, the inside groove shape of institute's gong can be circle, rectangle or other shapes.
Brown：Brown process is carried out to copper-clad plate, to increase the roughness of copper-clad plate inner plating copper face.
Pressing：Correspondence is made on PP, and the PP be first provided with window corresponding with gong groove location, then will make
Potsherd is correspondingly embedded in the groove of FR4 glass mats, and PP correspondences are attached to the upper and lower surface of FR4 glass mats afterwards,
And enable potsherd to be each passed through the windowing of upper and lower PP, then on upper and lower two PP, the interior copper face of correspondence and copper-clad plate is pasted
Close, and potsherd is correspondingly embedded in the inside groove that copper-clad plate institute gong goes out, then pressed by press.Wherein potsherd
Thickness is equal to the thickness sum of FR4 glass mats and two pieces of copper-clad plates.
In the present embodiment, PP refers to prepreg, is placed between two layers of copper, plays and completely cuts off and cause the bonding of two layers of copper
Effect.
Practice shooting mark hole, gong housing, nog plate, except gummosis, drilling, de-smear, sink copper, electric plating of whole board.
Outer graphics：Outer graphics making is carried out to the outer layer copper face of above-mentioned copper-clad plate, wherein setting on the outer graphics
Be equipped with for welding the pad locations of LED module or chip or the larger module of other caloric values, and the pad locations with it is embedded
Potsherd position correspondence.
Outer layer is etched：Retain the circuit pack of needs after imaging, remove the redundance beyond circuit.
Welding resistance, character, test, gong plate, board-washing, silk-screen, OSP, FQC, FQA, packaging, shipment are carried out afterwards.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (7)
1. a kind of pressing preparation method of embedding ceramic pcb board, it is characterised in that include：
Make central layer；
Make outer layer copper-clad plate；
PP and the outer layer copper-clad plate made are sequentially placed in the upper and lower surface of central layer, and correspondence is pressed.
2. the pressing preparation method of embedding ceramic pcb board as claimed in claim 1, it is characterised in that make central layer and specifically include：
Sawing sheet, drilling, inner figure making, gong central layer groove.
3. the pressing preparation method of embedding ceramic pcb board as claimed in claim 2, it is characterised in that the gong central layer groove includes：
Slotted eye of the specified location gong through whole central layer on central layer, and potsherd, and the potsherd are correspondingly embedded in the slotted eye
Thickness more than central layer thickness.
4. the pressing preparation method of embedding ceramic pcb board as claimed in claim 3, it is characterised in that make outer layer copper-clad plate tool
Body includes：Sawing sheet, drilling, inner figure making, wherein gong outer layer copper-clad plate groove, institute's gong outer layer copper-clad plate groove and the central layer groove
Position correspondence size is identical, and potsherd projection correspondence is located in the groove that outer layer copper-clad plate gong goes out.
5. the pressing preparation method of embedding ceramic pcb board as claimed in claim 4, it is characterised in that institute's gong central layer groove and outer layer
Copper-clad plate groove needs gong to wear, and corresponding with the pad locations on outer layer copper-clad plate circuit.
6. the pressing preparation method of embedding ceramic pcb board as claimed in claim 5, it is characterised in that the potsherd protuberance
Divide in the outer layer copper-clad plate groove that correspondence goes out positioned at gong, and flush with the medial plane of outer layer copper-clad plate.
7. a kind of pressing preparation method of embedding ceramic pcb board, it is characterised in that include：
Sawing sheet：Choosing one block of FR4 glass mat and two pieces of copper-clad plates carries out sawing sheet according to preliminary dimension size, by large scale
Supplied materials cut into production required for size；
Drilling：Brill location hole is carried out to the FR4 glass mats after sawing sheet and copper-clad plate；
Inner figure：The inner figure made is developed on the internal layer copper face of copper-clad plate, and carries out internal layer and etch to form line
Road；
Gong groove：Carry out gong inside groove to FR4 glass mats and copper-clad plate respectively, the interior groove location size of wherein institute's gong is corresponded to；
Pressing：Correspondence on PP, and the PP is made first and is provided with window corresponding with gong groove location, then by the ceramics made
Piece is correspondingly embedded in the groove of FR4 glass mats, PP correspondences is attached to the upper and lower surface of FR4 glass mats afterwards, and is made
The windowing that potsherd can be each passed through upper and lower PP is obtained, then correspondence is fitted with the interior copper face of copper-clad plate on upper and lower two PP, and
Potsherd is correspondingly embedded in the inside groove that copper-clad plate institute gong goes out, then pressed by press；
Wherein the thickness of potsherd is equal to the thickness sum that FR4 glass mats add two PP and two outer layer copper-clad plates；
Outer graphics：Outer graphics making is carried out to the outer layer copper face of above-mentioned copper-clad plate, wherein being provided with the outer graphics
For welding the pad locations of LED module or chip or the larger module of other caloric values, and the pad locations and embedded pottery
Ceramics position correspondence；
Outer layer is etched：Retain the circuit pack of needs after imaging, remove the redundance beyond circuit；
Welding resistance, character, test, gong plate, board-washing, silk-screen, OSP, FQC, FQA, packaging, shipment are carried out afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611111230.0A CN106550558A (en) | 2016-12-06 | 2016-12-06 | A kind of pressing preparation method of embedding ceramic pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611111230.0A CN106550558A (en) | 2016-12-06 | 2016-12-06 | A kind of pressing preparation method of embedding ceramic pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550558A true CN106550558A (en) | 2017-03-29 |
Family
ID=58397024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611111230.0A Pending CN106550558A (en) | 2016-12-06 | 2016-12-06 | A kind of pressing preparation method of embedding ceramic pcb board |
Country Status (1)
| Country | Link |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852034A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The processing method of the high-accuracy auto lamp printed board of high heat conduction embedded ceramic piece |
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN107222983A (en) * | 2017-06-09 | 2017-09-29 | 深圳市景旺电子股份有限公司 | The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module |
| CN107708315A (en) * | 2017-10-31 | 2018-02-16 | 江苏贺鸿电子有限公司 | A kind of ceramic embedded radiating circuit plate and preparation method thereof |
| CN107911935A (en) * | 2017-10-31 | 2018-04-13 | 东莞翔国光电科技有限公司 | A kind of pcb board processing method with reinforcing rib |
| CN107911937A (en) * | 2017-11-10 | 2018-04-13 | 生益电子股份有限公司 | The production method and PCB of a kind of PCB |
| CN108419372A (en) * | 2018-05-14 | 2018-08-17 | 深圳市深联电路有限公司 | A kind of new-energy automobile power battery test system current-carrying board manufacturing method |
| CN108419373A (en) * | 2018-05-14 | 2018-08-17 | 深圳市深联电路有限公司 | A kind of copper-based board manufacturing method for New-energy electric vehicle BMS protections |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN108990254A (en) * | 2017-06-01 | 2018-12-11 | 瑷司柏电子股份有限公司 | Built-in longitudinal direction heat dissipation ceramic printed circuit board and the circuit unit for having the circuit board |
| CN109699115A (en) * | 2017-10-23 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module |
| CN111315142A (en) * | 2020-03-24 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Processing technology of MPI foam cotton mixed pressing plate |
| CN113630986A (en) * | 2021-07-14 | 2021-11-09 | 广东世运电路科技股份有限公司 | Ceramic-embedded PCB and manufacturing method and application thereof |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106879167A (en) * | 2017-04-06 | 2017-06-20 | 昆山苏杭电路板有限公司 | Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof |
| CN106879167B (en) * | 2017-04-06 | 2023-11-28 | 昆山苏杭电路板有限公司 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
| CN106852034A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The processing method of the high-accuracy auto lamp printed board of high heat conduction embedded ceramic piece |
| CN108990254A (en) * | 2017-06-01 | 2018-12-11 | 瑷司柏电子股份有限公司 | Built-in longitudinal direction heat dissipation ceramic printed circuit board and the circuit unit for having the circuit board |
| CN108990254B (en) * | 2017-06-01 | 2021-04-16 | 瑷司柏电子股份有限公司 | Printed circuit board with built-in longitudinal heat dissipation ceramic block and circuit assembly with same |
| CN107222983A (en) * | 2017-06-09 | 2017-09-29 | 深圳市景旺电子股份有限公司 | The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module |
| CN107222983B (en) * | 2017-06-09 | 2019-05-03 | 深圳市景旺电子股份有限公司 | A kind of pcb board and production method of embedded AlN ceramic insulating radiation module |
| CN109699115A (en) * | 2017-10-23 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module |
| CN107911935B (en) * | 2017-10-31 | 2020-05-15 | 广东和润新材料股份有限公司 | Method for processing PCB with reinforcing ribs |
| CN107911935A (en) * | 2017-10-31 | 2018-04-13 | 东莞翔国光电科技有限公司 | A kind of pcb board processing method with reinforcing rib |
| CN107708315A (en) * | 2017-10-31 | 2018-02-16 | 江苏贺鸿电子有限公司 | A kind of ceramic embedded radiating circuit plate and preparation method thereof |
| CN107911937A (en) * | 2017-11-10 | 2018-04-13 | 生益电子股份有限公司 | The production method and PCB of a kind of PCB |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN108419373A (en) * | 2018-05-14 | 2018-08-17 | 深圳市深联电路有限公司 | A kind of copper-based board manufacturing method for New-energy electric vehicle BMS protections |
| CN108419372A (en) * | 2018-05-14 | 2018-08-17 | 深圳市深联电路有限公司 | A kind of new-energy automobile power battery test system current-carrying board manufacturing method |
| CN108419373B (en) * | 2018-05-14 | 2020-08-28 | 深圳市深联电路有限公司 | Copper substrate manufacturing method for BMS protection of new energy electric vehicle |
| CN111315142A (en) * | 2020-03-24 | 2020-06-19 | 四川英创力电子科技股份有限公司 | Processing technology of MPI foam cotton mixed pressing plate |
| CN113630986A (en) * | 2021-07-14 | 2021-11-09 | 广东世运电路科技股份有限公司 | Ceramic-embedded PCB and manufacturing method and application thereof |
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