CN106879167A - Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof - Google Patents
Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof Download PDFInfo
- Publication number
- CN106879167A CN106879167A CN201710222032.XA CN201710222032A CN106879167A CN 106879167 A CN106879167 A CN 106879167A CN 201710222032 A CN201710222032 A CN 201710222032A CN 106879167 A CN106879167 A CN 106879167A
- Authority
- CN
- China
- Prior art keywords
- double
- macropore
- aluminium
- ceramic block
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 63
- 239000004411 aluminium Substances 0.000 title claims abstract description 62
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000010410 layer Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000011229 interlayer Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- -1 that is Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
Abstract
Double-face aluminium substrate the invention discloses the embedded super-high heat-conductive ceramic block of high precision and preparation method thereof, needing the hole position subdrilling macropore of conducting, then high heat-conducting ceramic block is filled in macropore, Copper Foil is pressed on aluminium base finally by the mode of pressing and forms double-face aluminium substrate, spiled on last ceramic block again and metal conduction layer is electroplated on aperture inwall, form the double-face aluminium substrate of interlayer interconnection.The present invention thoroughly solves conventional resins and fills brought all defect, and the thermal conductivity factor of aluminium oxide ceramics block is 29.3W/ (M.K), it is 150 times or so of the thermal conductivity factor of epoxy resin, greatly improve the heat sinking function of aluminium base, can realize that interlayer is interconnected, and solves the problems, such as that aluminium base can not be interconnected well, greatly expands the use scope of aluminium base again simultaneously, market prospects are considerable, especially have vast potential for future development in LED field.
Description
Technical field
The two-sided of super-high heat-conductive ceramic block is embedded the present invention relates to a kind of double-face aluminium substrate, more particularly to a kind of high precision
Aluminium base and preparation method thereof.
Background technology
The appearance of LED, greatly reduces the loss of electric energy, and on the premise of equivalent brightness, consumption of the LED to electric energy will
Decline 300%.In recent years due to the reduction of LED costs, LED lamp progressively instead of tengsten lamp, the utilization prospect of LED and
Market is considerable.Aluminium base high-cooling property can solve the heat dissipation problem of LED, so aluminium base is also increasingly subject to
The concern in market.But because aluminium is conductive, it is impossible to realize the performance of interlayer interconnection so that office is also received in the utilization of aluminium base very much
Limit.
Existing double-face aluminium substrate fills macropore when making using conventional resins, to realize that interlayer is interconnected, but exists all
Many shortcomings：First, conventional resins filling macropore is also easy to produce bubble, and easily produces slight crack at high temperature, realizes that interlayer is interconnected
When yield it is very low；Secondly, the low only 0.2W/ (M.K) of thermal conductivity factor of traditional epoxy resin increasingly can not meet aluminium base
It is poor that coefficient of heat transfer and interlayer coefficient of heat transfer at cooling requirements, and the aluminium base coefficient of heat transfer hole position so produced are present
It is different, can not meet the quality of product requirement.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of double-side aluminum of the embedded super-high heat-conductive ceramic block of high precision
Plate and preparation method thereof, can solve the good heat dispersion of hole position, can realize that interlayer is interconnected again, greatly expand making for aluminium base
Use scope.
The technical scheme that is used to solve its technical problem of the present invention is：A kind of embedded super-high heat-conductive pottery of high precision
The double-face aluminium substrate of porcelain block, including the first copper foil layer, aluminium base and the second copper foil layer for stacking gradually, the aluminium base need to connect
Macropore of the radius more than hole position to be drilled is drilled with logical hole position, the ceramics filled with high thermal conductivity in the macropore；The pottery
Aperture is drilled with porcelain and corresponding first and second logical copper foil layer, metal conduction layer is electroplate with the medial surface of the aperture.
As a further improvement on the present invention, the ceramics of filling are aluminium oxide ceramics block and aluminium oxide ceramics in the macropore
PP。
As a further improvement on the present invention, the aperture is located at the center of the macropore.
As a further improvement on the present invention, the metal conduction layer is layers of copper.
As a further improvement on the present invention, the aluminium base needs to be drilled with the hole position of connection radius more than hole position to be drilled
The macropore of more than 0.3mm.
The present invention also provides a kind of system of the double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision as described above
Make method, comprise the following steps：
Step 1, will need to bore macropore of the radius more than hole position to be drilled in the hole position of connection on aluminium base；
Step 2, will fill the ceramics of high thermal conductivity in the macropore；
Step 3, the first copper foil layer aluminium base and the second copper foil layer are stacked gradually and pressed together；
Step 4, bores the aperture for interlayer interconnection on described ceramic and corresponding first and second copper foil layer, that is, turn on
Hole；
Step 5, the metal conduction layer in plating on the medial surface of the aperture.
As a further improvement on the present invention, the step 1, will need brill radius in the hole position of connection to be more than on aluminium base
The macropore of more than hole position 0.3mm to be drilled.
As a further improvement on the present invention, in the step 2, the ceramics are aluminium oxide ceramics block and aluminium oxide ceramics
PP。
As a further improvement on the present invention, in the step 3, the center of the aperture is heavy with the center of the macropore
Close.
The beneficial effects of the invention are as follows：The double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of the high precision and its making side
Method using aluminium oxide ceramics block and using aluminium oxide ceramics PP coordinate fill can thoroughly solve conventional resins filling brought
All defect, and aluminium oxide ceramics block thermal conductivity factor be 29.3W/ (M.K), be 150 times of the thermal conductivity factor of epoxy resin
Left and right, greatly improves the heat sinking function of aluminium base, while can realize that interlayer is interconnected again, aluminium base is solved well can not
The problem of interconnection, greatly expands the use scope of aluminium base, and market prospects are considerable, especially have wide development in LED field
Prospect.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
With reference to accompanying drawing, make the following instructions：
1 --- the first copper foil layer 2 --- aluminium base
3 --- the second copper foil layer 21 --- macropores
22 --- ceramics 23 --- apertures
24 --- interlayer conduction layer
Specific embodiment
With reference to accompanying drawing, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., in every case
The simple equivalence changes made with scope of the present invention patent and description and modification, are all still belonged to patent of the present invention and contained
Within the scope of lid.
It is a kind of double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision of the present invention refering to Fig. 1, including
The first copper foil layer 1, the copper foil layer 3 of aluminium base 2 and second for stacking gradually.It is big radius to be drilled with the hole position of the needs connection of aluminium base 2
In the ceramics 22 filled with high thermal conductivity in the macropore 21 of hole position to be drilled, macropore 21.Ceramics 22 and it is corresponding first and second lead to
Aperture 23 is drilled with copper foil layer 1,3, metal conduction layer 24 is electroplate with the medial surface of aperture 23.
Wherein, the aluminium base needs to be drilled with macropore 21 of the radius more than more than hole position 0.3mm to be drilled in the hole position of connection；
The ceramics of filling are aluminium oxide ceramics block and aluminium oxide ceramics PP in the macropore；The aperture is located at the center of the macropore；
The metal conduction layer is layers of copper.
A kind of preparation method of the double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision as described above, including with
Lower step：
Step 1, will need to bore macropore 21 of the radius more than hole position to be drilled in the hole position of connection on aluminium base 2；
Step 2, will fill the ceramics 22 of high thermal conductivity in the macropore；
Step 3, the first copper foil layer 1, the copper foil layer 3 of aluminium base 2 and second are stacked gradually and pressed together；
Step 4, bores the aperture 23 for interlayer interconnection on described ceramic and corresponding first and second copper foil layer, that is, lead
Through hole；
Step 5, the metal conduction layer 24 in plating on the medial surface of the aperture.
Wherein, in the step 1, will be needed on aluminium base 2 connection hole position on bore radius more than hole position 0.3mm to be drilled with
On macropore 21；In the step 2, the ceramics are aluminium oxide ceramics block and aluminium oxide ceramics PP；It is described in the step 3
The center superposition of the center of aperture and the macropore.
Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision of the present invention and preparation method thereof, using oxygen
Change aluminium ceramic block and using aluminium oxide ceramics PP coordinate fill can thoroughly solve conventional resins filling brought it is all lack
Fall into, and the thermal conductivity factor of aluminium oxide ceramics block is 29.3W/ (M.K), is 150 times or so of the thermal conductivity factor of epoxy resin, significantly
The heat sinking function for improving aluminium base, while can realize that interlayer is interconnected again, solve that aluminium base can not interconnect well asks
Topic, greatly expands the use scope of aluminium base, and market prospects are considerable, especially have vast potential for future development in LED field.
Double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of high precision of the present invention and preparation method thereof is on the one hand
The blank of LED high-density interconnection technology is filled up so that LED core technologies are broken through, while lifting the core of whole industry
Heart competitiveness；On the one hand promote the sustained and coordinated development of local economy society, drive this real estate sector to provide substantial amounts of job；One
Aspect will promote the lifting of the performance index of product technologies, meet the requirement of current a new generation's LED technology and LED market orientation demands.
As can be seen here, the present invention solves the technical problem that aluminium base is unable to interlayer interconnection well, overcomes traditional tree
The defect of fat, improves product quality, expands range of application, and with good development prospect.
Claims (9)
1. the double-face aluminium substrate of the embedded super-high heat-conductive ceramic block of a kind of high precision, including stack gradually the first copper foil layer (1),
Aluminium base (2) and the second copper foil layer (3), it is characterised in that：The aluminium base needs to be drilled with the hole position of connection radius more than treating
The macropore (21) of drilling position, the ceramics (22) filled with high thermal conductivity in the macropore；Described ceramic and corresponding first,
Aperture (23) is drilled with two-way copper foil layer, metal conduction layer (24) is electroplate with the medial surface of the aperture.
2. high precision according to claim 1 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, it is characterised in that：Institute
The ceramics for stating filling in macropore are aluminium oxide ceramics block and aluminium oxide ceramics PP.
3. high precision according to claim 1 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, it is characterised in that：Institute
Aperture is stated positioned at the center of the macropore.
4. high precision according to claim 1 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, it is characterised in that：Institute
It is layers of copper to state metal conduction layer.
5. high precision according to claim 1 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, it is characterised in that：Institute
Stating aluminium base needs to be drilled with macropore (21) of the radius more than more than hole position 0.3mm to be drilled in the hole position of connection.
6. a kind of high precision as any one of claim 1-5 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block
Preparation method, it is characterised in that comprise the following steps：
Step 1, will need to bore macropore (21) of the radius more than hole position to be drilled in the hole position of connection on aluminium base (2)；
Step 2, will fill the ceramics (22) of high thermal conductivity in the macropore；
Step 3, the first copper foil layer (1), aluminium base (2) and the second copper foil layer (3) are stacked gradually and pressed together；
Step 4, bores the aperture (23) for interlayer interconnection on described ceramic and corresponding first and second copper foil layer, that is, turn on
Hole；
Step 5, metal conduction layer (24) in plating on the medial surface of the aperture.
7. the preparation method that high precision according to claim 6 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, its
It is characterised by：The step 1, will need to be bored in the hole position of connection radius more than more than hole position 0.3mm to be drilled on aluminium base (2)
Macropore (21).
8. the preparation method that high precision according to claim 6 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, its
It is characterised by：In the step 2, the ceramics are aluminium oxide ceramics block and aluminium oxide ceramics PP.
9. the preparation method that high precision according to claim 6 embeds the double-face aluminium substrate of super-high heat-conductive ceramic block, its
It is characterised by：In the step 3, the center superposition of the center of the aperture and the macropore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710222032.XA CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710222032.XA CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106879167A true CN106879167A (en) | 2017-06-20 |
| CN106879167B CN106879167B (en) | 2023-11-28 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710222032.XA Active CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106879167B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107911937A (en) * | 2017-11-10 | 2018-04-13 | 生益电子股份有限公司 | The production method and PCB of a kind of PCB |
| CN109699115A (en) * | 2017-10-23 | 2019-04-30 | 苏州旭创科技有限公司 | Optical module |
| CN113015339A (en) * | 2021-03-01 | 2021-06-22 | 鹤山市世拓电子科技有限公司 | Manufacturing method of embedded ceramic circuit board and embedded ceramic circuit board |
| CN113286435A (en) * | 2021-05-25 | 2021-08-20 | 胜宏科技（惠州）股份有限公司 | Method for plating copper in aluminum plate hole |
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| CN113286435A (en) * | 2021-05-25 | 2021-08-20 | 胜宏科技（惠州）股份有限公司 | Method for plating copper in aluminum plate hole |
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|---|---|
| CN106879167B (en) | 2023-11-28 |
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