CN110112280B - Manufacturing process of thermoelectric separation circuit board - Google Patents
Manufacturing process of thermoelectric separation circuit board Download PDFInfo
- Publication number
- CN110112280B CN110112280B CN201910424714.8A CN201910424714A CN110112280B CN 110112280 B CN110112280 B CN 110112280B CN 201910424714 A CN201910424714 A CN 201910424714A CN 110112280 B CN110112280 B CN 110112280B
- Authority
- CN
- China
- Prior art keywords
- boss
- dry film
- copper substrate
- copper
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Abstract
The invention provides a manufacturing process of a thermoelectric separation circuit board, which can avoid the influence of glue overflow generated in the manufacturing process of the thermoelectric separation circuit board on the heat dissipation effect of the thermoelectric separation circuit board, and comprises the following steps: cutting a copper substrate, covering a dry film on the copper substrate, forming a boss corresponding to the LED heat conduction bonding pad on the copper substrate through exposure, development and etching, and removing the dry film on the boss; coating resin on the copper substrate, curing the resin, and grinding the resin layer on the boss to expose the boss; then covering the dry film, and removing the dry film in other areas except the lug boss through exposure and development; plating a layer of copper foil on a copper substrate, and grinding the surface of the copper foil to ensure that the height of the surface of the copper foil is consistent; and then, a dry film is pasted on the copper foil, exposure and development are carried out, then the copper foil on the dry film of the boss is removed through etching, an outer layer circuit is manufactured, and then the dry film on the boss is removed to expose the boss.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing process of a thermoelectric separation circuit board.
Background
Light-Emitting diodes (LEDs) are used as a new generation of solid-state Light source, have the advantages of long service life, high efficiency, energy saving, environmental protection, and the like, and are widely applied to lighting sources.
The core part of the LED is a PN junction, injected electrons and holes directly convert electric energy into light energy when the PN junction is compounded, but not all the converted light energy can be emitted outside the LED, and the light energy can be converted into heat energy by an absorption sheet in the PN junction and the epoxy resin/silica gel, and the heat energy has a great side effect on a lamp.
With the wide use of LEDs, the conventional heat dissipation medium and metal matrix structure of a high-power LED cannot meet the heat dissipation requirement. A thermoelectric separated circuit board is used in the environment and has an independent thermal channel bonding pad which is completely insulated from a chip, a gold wire, a bracket, an electric pin and the like of an LED, and a heat dissipation bonding pad can be connected into a whole on the whole PCB to use the limited heat dissipation area to the limit.
Among the prior art, thermoelectric separation circuit board is through high temperature lamination, with base plate, PP and the lamination pressfitting of copper foil, however at the in-process of lamination, the volume of overflowing glue is difficult to control, has the resin glue in the PP to spill over to the hot aisle pad on, remains the heat conduction that the resin glue on the hot aisle pad can influence for the unable radiating effect of thermoelectric separation circuit board guarantees.
Disclosure of Invention
In view of the above problems, the present invention provides a manufacturing process of a thermoelectric separation circuit board, which can prevent glue overflow generated during the manufacturing process of the thermoelectric separation circuit board from affecting the heat dissipation effect of the thermoelectric separation circuit board.
The technical scheme is as follows: a manufacturing process of a thermoelectric separation circuit board is characterized by comprising the following steps: cutting a copper substrate, covering a dry film on the copper substrate, forming a boss corresponding to the LED heat conduction bonding pad on the copper substrate through exposure, development and etching, and removing the dry film on the boss;
coating resin on the copper substrate, curing the resin, and grinding the resin layer on the boss to expose the boss;
then covering the dry film on the copper substrate, and removing the dry film in other areas except the lug boss through exposure and development;
plating a layer of copper foil on a copper substrate, and grinding the surface of the copper foil to ensure that the height of the surface of the copper foil is consistent;
and then, a dry film is pasted on the copper foil, exposure and development are carried out, then the copper foil on the dry film of the boss is removed through etching, an outer layer circuit is manufactured, and then the dry film on the boss is removed to expose the boss.
Further, covering a dry film on the copper substrate, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, forming a boss corresponding to the pattern on the copper substrate, arranging the boss corresponding to the LED heat conduction bonding pad, and removing the dry film on the boss;
further, after the outer layer circuit is manufactured and the copper foil on the dry film of the boss is removed by etching, the method also comprises the following steps: AOI optical detection → solder mask → surface treatment → molding → finished product packaging.
Furthermore, when the outer layer circuit is manufactured by etching, the copper foil where the outer layer circuit is located is separated from the boss of the copper substrate.
Furthermore, after the copper substrate is cut, an alignment tool hole is drilled in the copper substrate, and when the copper foil on the dry film of the boss is removed through etching, alignment is carried out through the alignment tool hole.
Further, the copper substrate was subjected to sand blasting before the resin coating.
Further, a copper foil is plated on the copper substrate by adopting an electroplating method.
According to the manufacturing process of the thermoelectric separation circuit board, the phenomenon that glue overflowing generated in the manufacturing process of the thermoelectric separation circuit board affects the heat dissipation effect of the thermoelectric separation circuit board can be avoided, the processing yield of the thermoelectric separation circuit board is improved, the production cost is reduced, the production efficiency is greatly improved, the combination effect of the resin and the copper substrate is better than that of the traditional laminating process, and the product performance of the thermoelectric separation circuit board is improved.
Drawings
FIG. 1 is a schematic structural diagram of a thermoelectric separation circuit board manufactured by the manufacturing process of the thermoelectric separation circuit board of the present invention;
FIG. 2 is a schematic flow chart of a manufacturing process of the thermoelectric separation circuit board of the present invention;
description of reference numerals: 1: a copper substrate; 2: a boss; 3: a resin layer; 4: copper foil; 5: printing ink; 6: an organic solderability preservative film; 7: and (3) drying the film.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, the thermoelectric separation circuit board manufactured by the processing method of the thermoelectric separation circuit board of the invention comprises a copper substrate 1, a boss 2 on the copper substrate, a resin layer 3 on two sides of the boss 2, and a copper foil 4 on the resin layer 3, wherein the copper foil is coated with ink 5 for solder resistance, the boss 2 is subjected to OSP surface treatment, and a layer of organic solder mask 6 is chemically grown on the clean bare copper surface of the boss 2.
The manufacturing process of the thermoelectric separation circuit board comprises the following steps: cutting a copper substrate, drilling an alignment tool hole on the copper substrate, then covering a dry film on the copper substrate, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, forming a boss corresponding to the pattern on the copper substrate, arranging the boss corresponding to the LED heat conduction bonding pad, and removing the dry film on the boss;
carrying out sand blasting treatment on the copper substrate, then coating resin on the copper substrate, curing the resin, and grinding the resin layer on the boss to expose the boss;
then, covering a dry film 7 on the copper substrate, and removing the dry film in other areas except the boss through exposure and development;
plating a layer of copper foil 4 on the copper substrate, in the embodiment, plating the copper foil on the copper substrate by adopting an electroplating method, and grinding the surface of the copper foil to ensure that the height of the surface of the copper foil is consistent;
then, a dry film is pasted on the copper foil, exposure and development are carried out, then the copper foil on the dry film of the boss is removed through etching, when the copper foil on the dry film of the boss is removed through etching, alignment is carried out through an alignment tool hole, an outer layer circuit is manufactured, meanwhile, the copper foil where the outer layer circuit is located is separated from the boss of the copper substrate and insulated from the boss, and then the dry film on the boss is removed to enable the boss to be exposed;
the steps of pasting a dry film, exposing, developing and etching are that the dry film is pasted on a processed copper substrate in a hot pressing mode, so that the subsequent exposure production is facilitated, a negative film is aligned with the copper substrate pressed with the dry film, the negative film graph is transferred to a photosensitive dry film by utilizing the irradiation of ultraviolet light on an exposure machine, the unexposed dry film is dissolved and washed away by utilizing the alkalescence of developing solution (sodium carbonate), the exposed part is reserved, the copper surface can be exposed after the unexposed dry film is removed by the developing solution, and the exposed copper surface is dissolved and corroded by acid copper chloride to obtain the required part;
then performing AOI optical detection, resistance welding, surface treatment and molding, and finally packaging a finished product;
the AOI (automated Optical inspection) is called automatic Optical inspection, and is equipment for detecting common defects encountered in welding production based on an Optical principle, when the automatic inspection is carried out, a machine automatically scans a PCB (printed Circuit Board) through a camera, acquires images, compares the tested welding points with qualified parameters in a database, inspects the defects on the PCB through image processing, and displays/marks the defects through a display or an automatic mark for repairing personnel;
solder resist, also called solder mask and green oil, is one of the key processes in the manufacture of printed boards, and is mainly characterized in that a solder mask ink is coated on the board surface through screen printing or solder mask ink coating, a solder mask layer is covered on other places through exposure and development to expose a disc and a hole to be welded, and short circuit is prevented during welding;
bare copper has good solderability, but is easily affected by moisture and oxidation after being exposed to air for a long time, tends to exist in the form of oxide, and is unlikely to remain as original copper for a long time, so that the copper surface needs to be subjected to surface treatment, and the most basic purpose of the surface treatment is to ensure good solderability or electrical property;
and cutting the PCB into required overall dimension by a CNC forming machine, and finally packaging the finished product.
According to the manufacturing process of the thermoelectric separation circuit board, the phenomenon that glue overflow generated in the manufacturing process of the thermoelectric separation circuit board influences the heat dissipation effect of the thermoelectric separation circuit board can be avoided, the new and old processing technologies are respectively used for manufacturing two LED lamps with the same model, the finished product rate of the thermoelectric separation circuit board manufactured by the new technology is higher, the production cost is reduced, the production efficiency is greatly improved, the combination effect between the resin and the copper substrate is better than that of the traditional laminating technology, and the product performance of the thermoelectric separation circuit board is improved;
the sand blasting process is to form high-speed spray beam with compressed air as power to spray the material to the surface of the workpiece to be treated at high speed, so as to change the appearance or shape of the surface of the workpiece. Due to the impact and cutting action of the abrasive on the surface of the workpiece, the surface of the copper substrate obtains certain cleanliness and different roughness, and the mechanical property of the surface of the copper substrate is improved, so that the fatigue resistance of the copper substrate is improved, the adhesive force between the copper substrate and resin is increased, the durability of the resin is prolonged, and the leveling and decoration of the resin are facilitated;
according to the invention, the alignment tool hole is drilled on the copper substrate, and when the copper foil on the dry film of the boss is removed by etching the window, the alignment is carried out through the alignment tool hole, so that the accuracy of windowing is ensured.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. A manufacturing process of a thermoelectric separation circuit board is characterized by comprising the following steps: cutting a copper substrate, covering the copper substrate with a dry film, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out controlled etching on the exposed and developed copper substrate, forming a boss corresponding to the pattern on the copper substrate, arranging the boss corresponding to the LED heat conduction bonding pad, and removing the dry film on the boss;
coating resin on the copper substrate, curing the resin, and grinding the resin layer on the boss to expose the boss;
then covering the dry film on the copper substrate, and removing the dry film in other areas except the lug boss through exposure and development;
plating a layer of copper foil on a copper substrate, and grinding the surface of the copper foil to ensure that the height of the surface of the copper foil is consistent;
then, a dry film is pasted on the copper foil, exposure and development are carried out, then the copper foil on the dry film of the boss is removed through etching, an outer-layer circuit is manufactured, and then the dry film on the boss is removed to enable the boss to be exposed;
after cutting the copper substrate, drilling an alignment tool hole on the copper substrate, and performing alignment through the alignment tool hole when etching to remove the copper foil on the dry film of the boss;
the copper substrate was subjected to sand blasting before resin coating.
2. The manufacturing process of the thermoelectric separation circuit board according to claim 1, wherein: after the outer layer circuit is manufactured and the copper foil on the dry film of the boss is removed by etching, the method also comprises the following steps: AOI optical detection → solder mask → surface treatment → molding → finished product packaging.
3. The manufacturing process of the thermoelectric separation circuit board according to claim 1, wherein: when the outer layer circuit is manufactured by etching, the copper foil where the outer layer circuit is located is separated from the boss of the copper substrate.
4. The manufacturing process of the thermoelectric separation circuit board according to claim 1, wherein: and plating copper foil on the copper substrate by adopting an electroplating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910424714.8A CN110112280B (en) | 2019-05-21 | 2019-05-21 | Manufacturing process of thermoelectric separation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910424714.8A CN110112280B (en) | 2019-05-21 | 2019-05-21 | Manufacturing process of thermoelectric separation circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110112280A CN110112280A (en) | 2019-08-09 |
| CN110112280B true CN110112280B (en) | 2020-09-01 |
Family
ID=67491424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910424714.8A Active CN110112280B (en) | 2019-05-21 | 2019-05-21 | Manufacturing process of thermoelectric separation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110112280B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856355B (en) * | 2019-10-08 | 2023-05-26 | 湖南维胜科技电路板有限公司 | Manufacturing method of LED circuit board with high heat dissipation performance |
| CN111048651B (en) * | 2019-12-27 | 2021-12-17 | 广州市鸿利秉一光电科技有限公司 | High-reflectivity UVLED substrate and production method |
| CN111132471A (en) * | 2019-12-31 | 2020-05-08 | 安徽全照电子有限公司 | Production method of thermoelectric separation copper substrate |
| CN111246656B (en) * | 2020-01-10 | 2021-10-29 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
| CN113660783A (en) * | 2021-08-18 | 2021-11-16 | 深圳市深联电路有限公司 | Thermoelectric separation metal substrate, manufacturing method, light emitting diode, light source and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| CN103745932A (en) * | 2014-01-23 | 2014-04-23 | 无锡江南计算技术研究所 | Production method of WB (wire-bonding) package substrate |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN108093561A (en) * | 2017-12-22 | 2018-05-29 | 珠海市航达科技有限公司 | A kind of production method of thermoelectricity separation printed circuit board |
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
-
2019
- 2019-05-21 CN CN201910424714.8A patent/CN110112280B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| CN103745932A (en) * | 2014-01-23 | 2014-04-23 | 无锡江南计算技术研究所 | Production method of WB (wire-bonding) package substrate |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN108093561A (en) * | 2017-12-22 | 2018-05-29 | 珠海市航达科技有限公司 | A kind of production method of thermoelectricity separation printed circuit board |
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110112280A (en) | 2019-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110112280B (en) | Manufacturing process of thermoelectric separation circuit board | |
| CN110112279B (en) | Processing method of thermoelectric separation substrate for LED | |
| CN106132098B (en) | A kind of manufacturing method of LED metal base circuit board | |
| CN106550558A (en) | A kind of pressing preparation method of embedding ceramic pcb board | |
| US20100149823A1 (en) | Lamp unit, circuit board, and method of manufaturing circuit board | |
| JP2004363542A (en) | Solder resist pattern formation method | |
| CN1222051C (en) | Making process of lighting device | |
| US6225139B1 (en) | Manufacturing method of an led of a type of round concave cup with a flat bottom | |
| CN111511120B (en) | Raided Pad manufacturing method | |
| CN202884521U (en) | Light-emitting diode (LED) module with high thermal conductivity structure | |
| CN109788635A (en) | A kind of novel processing method of printed circuit board | |
| CN104363707A (en) | Method for manufacturing high-heat-dissipativity LED baseplate | |
| US9245874B2 (en) | LED array having embedded LED and method therefor | |
| KR101236715B1 (en) | Production method of led module including chip on board dam using silicon molding type and led module by the production method | |
| KR101325086B1 (en) | Light emitting diode module and anufacturing method thereof | |
| CN117594726A (en) | Preparation method of LED packaging device | |
| TWI431742B (en) | Method of fabricating circuit board and basic circuit board | |
| WO2024021438A1 (en) | Method for manufacturing circuit board by means of transferring material through opening made by laser, and software and apparatus | |
| CN111246656A (en) | Thermoelectric separation copper-based circuit board for LED and preparation method thereof | |
| CN111225508B (en) | Manufacturing method of high-thermal-conductivity flexible circuit board suitable for three-dimensional space and circuit board | |
| KR101317952B1 (en) | Manufacturing method of led module including chip on board dam using transfer mold and led module thereby | |
| CN113260139A (en) | Copper-based printed circuit board with boss and processing method thereof | |
| US8403202B1 (en) | Method for soldering surface mounting LED to circuit board | |
| CN103716991A (en) | PCB for LEDs, manufacturing method thereof, light emitting device and lamp | |
| KR101214261B1 (en) | Metal printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |