CN111132471A - Production method of thermoelectric separation copper substrate - Google Patents
Production method of thermoelectric separation copper substrate Download PDFInfo
- Publication number
- CN111132471A CN111132471A CN201911414420.3A CN201911414420A CN111132471A CN 111132471 A CN111132471 A CN 111132471A CN 201911414420 A CN201911414420 A CN 201911414420A CN 111132471 A CN111132471 A CN 111132471A
- Authority
- CN
- China
- Prior art keywords
- substrate
- copper
- boss
- plate
- copper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 65
- 239000010949 copper Substances 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000926 separation method Methods 0.000 title claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000000227 grinding Methods 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims description 19
- 239000003814 drug Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- 238000003801 milling Methods 0.000 claims description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 3
- 230000003749 cleanliness Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000012856 packing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a production method of a thermoelectric separation copper substrate, which comprises the steps of simultaneously cutting a copper plate, an FR-4 substrate and PP according to the cutting size, grinding the substrate, cleaning the layout, removing unnecessary copper from the copper plate through exposure and etching, standing for 15min after exposure, exposing a boss with the required height, and preventing ink on the boss from being removed so as to protect the boss from being glued during pressing. The copper substrate is welded by an intelligent spot welding machine, and packaged by automatic cleaning equipment and packaging equipment, so that the welding efficiency and the automation of operation are improved, the demand of tin is reduced, the production cost is reduced, the environment-friendly effect is improved, the heating time is shortened, and the welding efficiency is improved.
Description
Technical Field
The invention relates to the technical field of copper substrates, in particular to a production method of a thermoelectric separation copper substrate.
Background
The copper substrate is the most expensive one of the metal substrates, the heat conduction effect is many times better than that of the aluminum substrate and the iron substrate, and the copper substrate is suitable for high-frequency circuits, areas with large high and low temperature changes and the heat dissipation and building decoration industries of precision communication equipment, and the copper substrate is commonly in the categories of a gold immersion copper substrate, a silver plating copper substrate, a tin spraying copper substrate, an antioxidant copper substrate and the like.
The traditional copper substrate production process has low efficiency and low automation degree, needs a large amount of manual assistance, and has high finished product quality, so the invention designs a production method of a thermoelectric separation copper substrate to solve the problems in the prior art.
Disclosure of Invention
The invention aims to provide a production method of a thermoelectric separation copper substrate, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a production method of a thermoelectric separation copper substrate comprises the following steps:
material cutting: simultaneously cutting the copper plate, the FR-4 substrate and the PP according to the cutting size, grinding the substrate, and cleaning the layout;
copper plate treatment: removing unnecessary copper from the copper plate by exposure and etching, standing for 15min after exposure, exposing the boss with required height, wherein the printing ink on the boss cannot be removed, so that the boss is protected from being glued during pressing;
a substrate processing step: the circuit pattern of the FR-4 board is exposed and etched, the FR-4 board needs to be kept still for 15min after exposure, and the FR-4 circuit ink can not be stripped so as to be beneficial to protecting the circuit from being glued during pressing;
drilling a plate: setting the positions and the number of the holes drilled on the copper plate, the FR-4 substrate and the PP, drilling positioning holes, aligning and fixing by using pins, and removing the FR-4 and the PP relative to a boss area of the copper plate in an edge milling or stamping mode;
browning and membrane stripping: performing brown oxidation treatment on the copper plate and the FR-4 substrate, then laminating and pressing, and performing film stripping treatment on the protective printing ink left in the previous process after pressing;
resistance welding step: automatic welding is carried out through a substrate welding spot welding machine, and a medium-frequency inversion direct current welding unit, a precision pressurizing machine head and a special welding head are matched;
the character processing steps are as follows: carrying out a processing process by a high-density processor, wherein the processing level reaches 7 nanometers;
surface treatment: brushing off and collecting dust adhered in the processing process through automatic cleaning equipment;
quality inspection: the automatic intermediate equipment inspects the basic cleanliness, plate bending and plate warping, edge, flame resistance, scratch and the like of the finished product through a plurality of groups of sensors and various sensors;
and (3) packaging a finished product: and packaging by an automatic packaging machine.
Preferably, the chemical solution used in the developing treatment in the copper plate processing step and the substrate processing step is weakly alkaline Na2CO3The liquid medicine is prepared.
Preferably, the chemical solution used in the etching stage is an acidic chemical solution.
Preferably, in the step of copper plate processing and the step of substrate processing, etching is performed for multiple times according to the thickness of the thick copper substrate, so that the etching times are set according to the thickness of the copper substrate until the hole diameter requirement is met.
Preferably, in the browning and stripping steps, the corrosion-resistant ink or the dry film is dissolved and stripped by using NaOH strong-alkaline liquid medicine.
Compared with the prior art, the invention has the beneficial effects that: the production method of the thermoelectric separation copper substrate welds through an intelligent spot welder, packs by using automatic cleaning equipment and packing equipment, improves welding efficiency and automation of operation, reduces the demand of tin, reduces production cost, improves environmental protection effect, shortens heating time, improves welding efficiency, and the core heat conduction component of the copper substrate manufactured by the production method is composed of aluminum oxide and silicon powder and a polymer filled with epoxy resin, has small thermal resistance, excellent viscoelastic performance, heat aging resistance and can bear mechanical and thermal stress.
Drawings
FIG. 1 is a schematic view of a conventional copper substrate according to the present invention;
FIG. 2 is a schematic view of a thermoelectric separation copper plate according to the present invention;
FIG. 3 is a schematic view of a copper substrate for thermoelectric separation according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention is shown: a production method of a thermoelectric separation copper substrate comprises the following steps: material cutting: simultaneously cutting the copper plate, the FR-4 substrate and the PP according to the cutting size, grinding the substrate, and cleaning the layout;
copper plate treatment: removing unnecessary copper from the copper plate by exposure and etching, standing for 15min after exposure, exposing the boss with required height, wherein the printing ink on the boss cannot be removed, so that the boss is protected from being glued during pressing;
a substrate processing step: the circuit pattern of the FR-4 board is exposed and etched, the FR-4 board needs to stand for 15min after exposure, and the FR-4 circuit ink can not be stripped, so that the circuit can be protected from being glued during pressing, the substrate protection effect is improved, and the service life of the substrate is prolonged;
drilling a plate: setting the drilling positions and the drilling quantity of the copper plate, the FR-4 substrate and the PP, drilling positioning holes, aligning and fixing by pins, and removing the FR-4 and the PP relative to a boss area of the copper plate in an edge milling or stamping mode, so that the cleaning effect is improved, and fine hair and scraps are avoided;
browning and membrane stripping: performing brown oxidation treatment on the copper plate and the FR-4 substrate, then laminating and pressing, and performing film stripping treatment on the protective printing ink left in the previous process after pressing;
resistance welding step: automatic welding is carried out through a substrate welding spot welding machine, and a medium-frequency inversion direct current welding unit, a precision pressurizing machine head and a special welding head are matched;
the character processing steps are as follows: carrying out a processing process by a high-density processor, wherein the processing level reaches 7 nanometers;
surface treatment: brushing off and collecting dust adhered in the processing process through automatic cleaning equipment;
quality inspection: the automatic intermediate equipment inspects the basic cleanliness, plate bending and plate warping, edge, flame resistance, scratch and the like of the finished product through a plurality of groups of sensors and various sensors, so that the yield of the finished product is improved;
and (3) packaging a finished product: pack through automatic packing machine, realize automatic packing, improve packing efficiency.
In this implementation: the liquid medicine used in the development treatment in the steps 2 and 3 is weakly alkaline Na2CO3The liquid medicine improves the developing effect, the liquid medicine used in the etching stage is acidic liquid medicine, the high efficiency in the etching process is improved, the time required by production is shortened, the yield is improved, etching is carried out for multiple times according to the thickness of the thick copper substrate in steps 2 and 3, the etching times are set according to the thickness of the copper substrate until the aperture requirement is met, the adaptability and the aperture accuracy are improved, in step 5, the corrosion-resistant ink or a dry film is dissolved and stripped by using NaOH strong alkaline liquid medicine, the stripping effect is improved, the adhesion is avoided, and the basic performance is prevented from being influenced.
The working principle is as follows: cutting the copper plate, the FR-4 substrate and the PP according to the cutting size, grinding the substrate, cleaning the layout, removing the unnecessary copper from the copper plate by exposure and etching, standing for 15min after exposure to expose the boss with the required height, wherein the printing ink on the boss cannot be removed so as to protect the boss from gluing during lamination, completing the circuit pattern of the FR-4 plate by exposure and etching, standing for 15min after exposure, and also not removing the film from the printing ink of the FR-4 circuit so as to protect the circuit from gluing during lamination, setting the drilling positions and the drilling quantity of the copper plate, the FR-4 substrate and the PP, drilling positioning holes, aligning and fixing by pins, removing the FR-4 and the PP relative to the boss area of the copper plate by edge milling or punching, and browning, The de-filming and solder resist are processed and then cleaned and packaged, and those not described in detail in this specification are well known to those skilled in the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (5)
1. A production method of a thermoelectric separation copper substrate is characterized in that: the method comprises the following steps:
(1) material cutting: simultaneously cutting the copper plate, the FR-4 substrate and the PP according to the cutting size, grinding the substrate, and cleaning the layout;
(2) copper plate treatment: removing unnecessary copper from the copper plate by exposure and etching, standing for 15min after exposure, exposing the boss with required height, wherein the printing ink on the boss cannot be removed, so that the boss is protected from being glued during pressing;
(3) a substrate processing step: the circuit pattern of the FR-4 board is exposed and etched, the FR-4 board needs to be kept still for 15min after exposure, and the FR-4 circuit ink can not be stripped so as to be beneficial to protecting the circuit from being glued during pressing;
(4) drilling a plate: setting the positions and the number of the holes drilled on the copper plate, the FR-4 substrate and the PP, drilling positioning holes, aligning and fixing by using pins, and removing the FR-4 and the PP relative to a boss area of the copper plate in an edge milling or stamping mode;
(5) browning and membrane stripping: performing brown oxidation treatment on the copper plate and the FR-4 substrate, then laminating and pressing, and performing film stripping treatment on the protective printing ink left in the previous process after pressing;
(6) resistance welding step: automatic welding is carried out through a substrate welding spot welding machine, and a medium-frequency inversion direct current welding unit, a precision pressurizing machine head and a special welding head are matched;
(7) the character processing steps are as follows: carrying out a processing process by a high-density processor, wherein the processing level reaches 7 nanometers;
(8) surface treatment: brushing off and collecting dust adhered in the processing process through automatic cleaning equipment;
(9) quality inspection: the automatic intermediate equipment inspects the basic cleanliness, plate bending and plate warping, edge, flame resistance, scratch and the like of the finished product through a plurality of groups of sensors and various sensors;
(10) and (3) packaging a finished product: and packaging by an automatic packaging machine.
2. The method for producing a copper substrate for thermoelectric separation according to claim 1, wherein: the liquid medicine used for the development treatment in the steps (2) and (3) is alkalescent Na2CO3The liquid medicine is prepared.
3. The method for producing a copper substrate for thermoelectric separation according to claim 1, wherein: the liquid medicine used in the etching stage is acidic liquid medicine.
4. The method for producing a copper substrate for thermoelectric separation according to claim 1, wherein: and (3) etching for multiple times according to the thickness of the thick copper substrate in the steps (2) and (3) so as to set the etching times according to the thickness of the copper substrate until the hole diameter requirement is met.
5. The method for producing a copper substrate for thermoelectric separation according to claim 1, wherein: in the step (5), the corrosion-resistant ink or the dry film is dissolved and stripped by using NaOH strong alkaline liquid medicine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911414420.3A CN111132471A (en) | 2019-12-31 | 2019-12-31 | Production method of thermoelectric separation copper substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911414420.3A CN111132471A (en) | 2019-12-31 | 2019-12-31 | Production method of thermoelectric separation copper substrate |
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| Publication Number | Publication Date |
|---|---|
| CN111132471A true CN111132471A (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911414420.3A Pending CN111132471A (en) | 2019-12-31 | 2019-12-31 | Production method of thermoelectric separation copper substrate |
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| Country | Link |
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| CN (1) | CN111132471A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118335875A (en) * | 2024-03-29 | 2024-07-12 | 苏州市亿利华电子有限公司 | PCB process based on high-heat-dissipation boss copper substrate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
| US20180352646A1 (en) * | 2017-06-01 | 2018-12-06 | Icp Technology Co., Ltd. | Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board |
| CN110112279A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of processing method of the thermoelectricity separating base plate for LED |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
-
2019
- 2019-12-31 CN CN201911414420.3A patent/CN111132471A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
| US20180352646A1 (en) * | 2017-06-01 | 2018-12-06 | Icp Technology Co., Ltd. | Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board |
| CN108848615A (en) * | 2018-07-27 | 2018-11-20 | 胜宏科技（惠州）股份有限公司 | A kind of production method of thermoelectricity split circuit plate |
| CN110112279A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of processing method of the thermoelectricity separating base plate for LED |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118335875A (en) * | 2024-03-29 | 2024-07-12 | 苏州市亿利华电子有限公司 | PCB process based on high-heat-dissipation boss copper substrate |
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Application publication date: 20200508 |