CN108848615A - A kind of production method of thermoelectricity split circuit plate - Google Patents
A kind of production method of thermoelectricity split circuit plate Download PDFInfo
- Publication number
- CN108848615A CN108848615A CN201810842864.6A CN201810842864A CN108848615A CN 108848615 A CN108848615 A CN 108848615A CN 201810842864 A CN201810842864 A CN 201810842864A CN 108848615 A CN108848615 A CN 108848615A
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- China
- Prior art keywords
- copper
- substrate
- piece
- convex
- billet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of production method of thermoelectricity split circuit plate, including:Then copper base sawing sheet, the drill tools hole on copper base are etched the upper surface of copper base to form convex copper billet corresponding with LED lamp bead thermal land；FR4 substrate sawing sheet is etched away bottom copper foil using the dual platen of 0.075mm 2/2oz；The sum of thickness of FR4 substrate and PP piece is greater than the height of convex copper billet；Drilling and fluting, FR4 substrate is placed on above PP piece, to the convex copper billet grooved bore on FR4 substrate and PP piece while drill tools hole and corresponding copper base, slot size big 0.20mm more unilateral than convex copper billet；FR4 substrate, PP piece, copper base are overlapped and are pressed from top to bottom, the slot correspondence of FR4 substrate and PP on piece covers on the convex copper billet of copper base；Subtract copper to HOZ, from the residue glue flowed on convex copper billet in PP piece when then pressing by grinding removal to the top layer copper foil of FR4 substrate.
Description
Technical field
The present invention relates to wiring board production fields, more particularly to a kind of production method of thermoelectricity split circuit plate.
Background technique
Although LED light is more many than conventional incandescent energy conservation and environmental protection, current electric energy is converted into light efficiency and also there was only 30% left side
The right side, remaining electricity are all converted into thermal energy.Therefore engineer can be considered as when designing LED lamp panel copper-based etc. improve
Heat dissipation problem, to guarantee LED light security performance and service life.
Thermoelectricity separation is a kind of one of technology for improving radiating efficiency, and heat refers to that the thermal land on LED board, electricity refer to
Electrode on LED board, the two are isolated by insulating materials.Thermal land function be exactly it is thermally conductive, the effect of electrode be exactly it is conductive, it is this
Packaged type is known as thermoelectricity separation.The structure of thermoelectricity split circuit plate is usually the bottom setting copper base of assist side, copper-based
Set convex copper on plate, thermal land is arranged on convex copper, and LED lamp bead is mounted on thermal land, therefore can directly and copper base
Contact progress is thermally conductive, and heat conduction and heat radiation is high-efficient, can extend the service life of LED light, lose on the electrode and wiring board of LED lamp bead
It is carved with the layers of copper electrical connection of route.General method is to copper foil, PP piece when the production of such wiring board, and copper base is unified to slot,
Then it is pressed after riveted, there are two defects for such method：First is that copper foil easy fold in fluting, is not easy positioning fluting；Two
It is that remaining residue glue is difficult to remove in convex copper position and plate face after direct riveted presses together.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of production method of thermoelectricity split circuit plate, including:
Then copper base sawing sheet, the drill tools hole on copper base are etched to be formed and lead with LED lamp bead to the upper surface of copper base
The corresponding convex copper billet of hot weld disk；
FR4 substrate sawing sheet is etched away bottom copper foil using the dual platen of 0.075mm 2/2oz；
The sum of thickness of FR4 substrate and PP piece is greater than the height of convex copper billet；
Drilling and fluting, FR4 substrate is placed on above PP piece, then to FR4 substrate and PP piece while drill tools hole and corresponding copper
Convex copper billet grooved bore on substrate, slot size big 0.20mm more unilateral than convex copper billet；
FR4 substrate, PP piece, copper base are overlapped and are pressed from top to bottom, the slot correspondence of FR4 substrate and PP on piece is covered in copper
On the convex copper billet of substrate；
Subtract copper to HOZ, then by flowing to convex copper billet from PP piece when grinding removal pressing to the top layer copper foil of FR4 substrate
On residue glue.
Preferably, grinding removal pressing when after flowing to the residue glue on convex copper billet in PP piece, further include line pattern →
Etching → AOI → anti-welding → text → drilling → surface treatment → molding → test → FQC → packaging.
Preferably, the sum of thickness of the FR4 substrate and PP piece is 0.05mm bigger than the height of convex copper billet.
Preferably, when drilling and slot, cover board is placed above FR4 substrate.
The production method of thermoelectricity split circuit plate provided by the invention substitutes copper foil using FR4 plate, due on FR4 plate
Layers of copper is attached on substrate, forms support, therefore do not have and be not easy to position, when punching is slotted the problem of fold；And FR4 substrate and
The sum of thickness of PP piece is greater than the height of the convex copper billet of copper base, therefore forms a recess, pressing when pressing at the convex copper billet of copper base
When gummosis flow into recess in, without being spilled over in FR4 substrate layers of copper, after the layers of copper of FR4 substrate is subtracted copper, then to convex copper
Grinding is carried out at block can remove residue glue.
Detailed description of the invention
Fig. 1 is the production method embodiment thermoelectricity split circuit plate pressing stack of thermoelectricity split circuit plate provided by the invention
Schematic diagram.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
In the specific implementation, the sawing sheet of copper base, FR4 substrate, PP piece is first carried out.When copper base sawing sheet, on copper base
Then drill tools hole is etched the upper surface of copper base to form convex copper billet corresponding with LED lamp bead thermal land.And FR4
When substrate sawing sheet, using the dual platen of 0.075mm 2/2oz, bottom copper foil is etched away.
Particular, it is to be noted that the sum of thickness of FR4 substrate and PP piece is 0.05mm bigger than the height of convex copper billet.
Then it drills and slots, FR4 substrate is placed on above PP piece, then cover cover board, it is then same to FR4 substrate and PP piece
When drill tools hole and corresponding copper base on convex copper billet grooved bore, slot size big 0.2mm more unilateral than convex copper billet.
Thermoelectricity split circuit plate pressing stack as shown in Figure 1, FR4 substrate 1, PP piece 2, copper base 3 are overlapped from top to bottom
And press, the slot correspondence of FR4 substrate and PP on piece covers on the convex copper billet 31 of copper base, due to the thickness of FR4 substrate and PP piece
The sum of degree is bigger than the height of convex copper billet, therefore a recess is formed at convex copper billet, in glue flow direction recess when pressing in PP piece, and
FR4 substrate and the slot size of PP on piece big 0.2mm more unilateral than convex copper billet, thus the layers of copper 11 on FR4 substrate and convex copper billet it
Between do not contact, namely layers of copper for carrying out connection to LED lamp bead and real for carrying out thermally conductive convex copper billet to LED lamp bead
Separation is showed.
Then subtract copper to HOZ, then by flowing from PP piece when grinding removal pressing to the top layer copper foil of FR4 substrate
Residue glue onto convex copper billet.
Next, in grinding removal pressing after flowing to the residue glue on convex copper billet in PP piece, then carry out subsequent production work
Sequence, including line pattern → etching → AOI → anti-welding → text → drilling → surface treatment → molding → test → FQC → packet
Dress.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (4)
1. a kind of production method of thermoelectricity split circuit plate, including:
Then copper base sawing sheet, the drill tools hole on copper base are etched to be formed and lead with LED lamp bead to the upper surface of copper base
The corresponding convex copper billet of hot weld disk；
FR4 substrate sawing sheet is etched away bottom copper foil using the dual platen of 0.075mm 2/2oz；
The sum of thickness of FR4 substrate and PP piece is greater than the height of convex copper billet；
Drilling and fluting, FR4 substrate is placed on above PP piece, then to FR4 substrate and PP piece while drill tools hole and corresponding copper
Convex copper billet grooved bore on substrate, slot size big 0.20mm more unilateral than convex copper billet；
FR4 substrate, PP piece, copper base are overlapped and are pressed from top to bottom, the slot correspondence of FR4 substrate and PP on piece is covered in copper
On the convex copper billet of substrate；
Subtract copper to HOZ, then by flowing to convex copper billet from PP piece when grinding removal pressing to the top layer copper foil of FR4 substrate
On residue glue.
2. the production method according to thermoelectricity split circuit plate described in claim 1, it is characterised in that：Grinding removal pressing when from
It further include line pattern → etching → AOI → anti-welding → text → drilling → surface after flowing to the residue glue on convex copper billet in PP piece
Processing → molding → test → FQC → packaging.
3. the production method according to thermoelectricity split circuit plate described in claim 1, it is characterised in that：The FR4 substrate and PP piece
The sum of thickness it is 0.05mm bigger than the height of convex copper billet.
4. the production method according to thermoelectricity split circuit plate described in claim 1, it is characterised in that：When drilling and fluting, in FR4
Cover board is placed above substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810842864.6A CN108848615B (en) | 2018-07-27 | 2018-07-27 | A kind of production method of thermoelectricity split circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810842864.6A CN108848615B (en) | 2018-07-27 | 2018-07-27 | A kind of production method of thermoelectricity split circuit plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108848615A true CN108848615A (en) | 2018-11-20 |
| CN108848615B CN108848615B (en) | 2019-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810842864.6A Active CN108848615B (en) | 2018-07-27 | 2018-07-27 | A kind of production method of thermoelectricity split circuit plate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN110996498A (en) * | 2019-12-26 | 2020-04-10 | 乐健科技（珠海）有限公司 | Method for preparing reflective circuit board |
| CN111132471A (en) * | 2019-12-31 | 2020-05-08 | 安徽全照电子有限公司 | Production method of thermoelectric separation copper substrate |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
| CN113660783A (en) * | 2021-08-18 | 2021-11-16 | 深圳市深联电路有限公司 | Thermoelectric separation metal substrate, manufacturing method, light emitting diode, light source and application |
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| CN103702515A (en) * | 2013-12-26 | 2014-04-02 | 广州市德晟照明实业有限公司 | High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
| CN205657910U (en) * | 2016-05-12 | 2016-10-19 | 深圳市仁创艺电子有限公司 | Metal substrate thermoelectric separation structure |
| CN106102329A (en) * | 2016-08-22 | 2016-11-09 | 景旺电子科技(龙川)有限公司 | A kind of embedding potsherd metal base printed circuit board manufacture method |
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| CN108093561A (en) * | 2017-12-22 | 2018-05-29 | 珠海市航达科技有限公司 | A kind of production method of thermoelectricity separation printed circuit board |
| CN108575046A (en) * | 2018-05-22 | 2018-09-25 | 绵阳启创电子科技有限公司 | A kind of high heat conduction composite base material multilayer printed circuit board |
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2018
- 2018-07-27 CN CN201810842864.6A patent/CN108848615B/en active Active
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| CN103702515A (en) * | 2013-12-26 | 2014-04-02 | 广州市德晟照明实业有限公司 | High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110112280B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Manufacturing process of thermoelectric separation circuit board |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN110996498A (en) * | 2019-12-26 | 2020-04-10 | 乐健科技（珠海）有限公司 | Method for preparing reflective circuit board |
| CN111132471A (en) * | 2019-12-31 | 2020-05-08 | 安徽全照电子有限公司 | Production method of thermoelectric separation copper substrate |
| CN111246656A (en) * | 2020-01-10 | 2020-06-05 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
| CN113660783A (en) * | 2021-08-18 | 2021-11-16 | 深圳市深联电路有限公司 | Thermoelectric separation metal substrate, manufacturing method, light emitting diode, light source and application |
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| Publication number | Publication date |
|---|---|
| CN108848615B (en) | 2019-07-02 |
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