CN202585531U - Light-emitting diode (LED) circuit board with bowl-shaped concave cups - Google Patents
Light-emitting diode (LED) circuit board with bowl-shaped concave cups Download PDFInfo
- Publication number
- CN202585531U CN202585531U CN 201220206283 CN201220206283U CN202585531U CN 202585531 U CN202585531 U CN 202585531U CN 201220206283 CN201220206283 CN 201220206283 CN 201220206283 U CN201220206283 U CN 201220206283U CN 202585531 U CN202585531 U CN 202585531U
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- layer
- copper
- bowl
- recessed cup
- led
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Abstract
A light-emitting diode (LED) circuit board with bowl-shaped concave cups comprises a glass fiber layer, a copper layer, a gold-plating layer, an insulation ink layer and a plurality of metal connection points, wherein the glass fiber layer serves as a non-conductive layer, a lower layer of the copper layer presses the glass fiber layer to form a copper multi-film composite, a copper layer of the copper multi-film composite is provided with a plurality of concave cups, a plurality of through holes penetrate the copper multi-film composite, the gold-plating layer is plated on an upper layer of the copper multi-film composite and the peripheral edges of the concave cups, the insulation ink layer is printed on the surface of the gold-plating layer, and the plurality of metal connection points are plated on the insulation ink layer. The LED circuit board with the bowl-shaped concave cups is capable of improving the heat dissipation method of a traditional LED lamp group and combining the functions of a circuit board and heat dissipation, so that an LED heat dissipation module is manufactured through an integrated-shaping manufacturing process.
Description
Technical field
The utility model is relevant for the LED module that dispels the heat, especially a kind of led circuit plate with the recessed cup of bowl-type.
Background technology
At present because energy crisis makes the modern for the solution of seeking in the electricity consumption comparatively to save.Therefore also make many LED lamp products gradually in liked by the user, advantage such as its former because low power consuming, power saving, life-span are long, durable, on using than conventional bulb and fluorescent tube power saving.
Because of using demand increasing, more and more high-power LED also develop gradually and use, and the heat dissipation problem that is therefore faced is also more and more important gradually, and present existing technology is on lamp housing, to use heat radiation material or thermal grease heat radiation.But its shortcoming causes radiating effect effectively to remedy by the heat that is produced nothing more than because power is more and more with using the LED number of die.
Therefore, the inventor needs a kind of new technology of design badly to improve its problem.
The utility model content
So the purpose of the utility model is for solving the problem on the above-mentioned prior art; A kind of led circuit plate with the recessed cup of bowl-type is proposed in the utility model; The radiating mode of this improvement LED heat radiation module in the past; Combine the design and the processing procedure of heat radiation material to create with circuit board, and can effectively promote radiating efficiency, the problem of dispelling the heat for high-capacity LED lamp that present industry faces can effectively solve.
For reaching above-mentioned purpose; The utility model proposes a kind of led circuit plate with the recessed cup of bowl-type, is on the copper base of tool glass fiber, to form recessed cup, and utilizes printing process to form ink lay and solder joint; To be used to implant LED crystal grain; And form circuit via modes such as routings, and wherein comprise: a glass layer, this glass layer is as non-conductive layer; One bronze medal layer; The laminated of this copper layer is should glass layer and form the composite wood of a bronze medal multilayer film; Have recessed cup and several vias that at least one supplies to install LED crystal grain on the copper layer of the composite wood of this copper multilayer film, these several vias run through the composite wood of this copper multilayer film; One Gold plated Layer, this Gold plated Layer are plated on upper strata and this all edge of recessed cup of the composite wood of this copper multilayer film; One dielectric ink layer, this insulating oil rete are printed in this Gold plated Layer surface, and make this dielectric ink layer with predetermined pattern attached on this Gold plated Layer, the Gold plated Layer of below is exposed in the part; And several metallic contacts, this metallic contact is plated on this dielectric ink layer.
Hold the above, the bottom that is shaped as the tool plane of this recessed cup is circular-arc bowl type all around.
Hold the above, this via is the penetration boring that is formed on the composite wood of this copper multilayer film.
Hold the above, this recessed cup is the non-penetrating type boring that is formed on the composite wood copper layer of this copper multilayer film.
Hold the above, respectively be provided with at least one LED crystal grain in this recessed cup, this LED crystal grain is connected with the wire bonder routing with this metallic contact.
Hold the above, in addition in said circuit board outer enclosure one epoxy resin layer.
Hold the above; This dielectric ink layer is the ultraviolet irradiation that utilizes exposure machine; Ultraviolet ray will penetrate the printing opacity position that is arranged in this dielectric ink layer top egative film, and this dielectric ink layer of below, irradiation printing opacity position, make the ink lay of corresponding position attached on this Gold plated Layer.
The utility model can be improved the radiating mode of LED lamp group in the past; The function of combined circuit plate and heat radiation produces LED heat radiation module with integrated processing procedure; Combine the design and the processing procedure of heat radiation material to create with circuit board; And can effectively promote radiating efficiency, reach long-time use, anti-instantaneous large-current, radiating effect is good, brightness is even, the stability advantages of higher.
Can further understand the characteristic and the advantage thereof of the utility model by the explanation of hereinafter, during reading and please refer to accompanying drawing.
Description of drawings
The sketch map of Fig. 1 is the manufacturing flow chart of the utility model.
The sketch map of Fig. 2 is the structural perspective of the utility model.
The sketch map of Fig. 3 is the structure front view of the utility model.
The sketch map of Fig. 4 is the manufacturing flow chart that the substrate of the utility model combines with LED crystal grain.
Fig. 5 is the sketch map that the substrate of the utility model combines with LED crystal grain.
[main element symbol description]
10 bronze medal layers, 11 via, 12 recessed cups
40 dielectric ink layers, 50 metallic contact, 60 LED crystal grain
70 epoxide-resin glues.
Embodiment
Now sincerely form with regard to the structure of the utility model, and the effect and the advantage that can produce, conjunction with figs., a preferred embodiment of lifting the utility model specifies as follows.
Please refer to Fig. 1, the utlity model has the led circuit plate of the recessed cup of bowl-type, it comprises following manufacturing step:
(1) getting a bronze medal layer is base material;
(2) below this base material another layer of pressing glass fiber as non-conductive layer;
(3) utilize CNC boring on the copper layer, to form several vias that penetrate;
(4) the copper coin upper surface at this base material is covered with one deck dry film;
(5) carry out the mode of etching step, dry film and copper material partly etched away to take pictures and to develop;
(6) again this dry film is removed; And make residual copper coin can be used as the usefulness of led light source heat radiation backward, wherein etch away the usefulness of the zone of part copper layer mainly as insulation, this part is exposed glass fiber;
(7) utilize CNC boring that preposition is carried out non-penetrating type boring and forms several recessed cups, this recessed cup is used to install LED crystal grain;
(8) carry out the sandblast operation, diamond dust is sprayed on copper face and all edges of recessed cup, carried out surface coarsening and smooth operation;
(9) this copper coin surface and all edges of recessed cup is gold-plated with increase conductivity and thermal diffusivity, and be beneficial to routing operation backward;
(10) residual dirt and the acidic materials on cleaning base plate (copper coin) face;
(11) on this copper coin, carry out print steps, printing last layer dielectric ink;
(12) will be as the egative film of light shield to being positioned on the copper coin face;
(13) with this substrate with contraposition egative film through exposure machine, and utilization ultraviolet irradiation, ultraviolet ray will penetrate the printing opacity position in the egative film, and the ink lay of below, irradiation printing opacity position, and make the ink lay at these positions fully attached on this copper coin face;
(14) remove this egative film;
(15) ad-hoc location at this ink lay plates a plurality of metallic contacts as contact and routing use;
(16) with this substrate through developer and spray potash and through chemical action, potash can develop the ink lay that does not receive ultraviolet irradiation and remove, and exposes the gilding of bottom surface;
(17) toast;
(18) with the substrate of full wafer, be divided into several pieces little substrates through punching press;
Please refer to Fig. 2 and Fig. 3, the led circuit plate with the recessed cup of bowl-type of the utility model comprises:
One bronze medal layer 10; The laminated unification glass layer 20 of this copper layer 10 forms the composite wood 15 of a bronze medal multilayer film as non-conductive layer; And utilizing CNC boring that composite wood 15 brills of this copper multilayer film are formed a plurality of vias 11 thoroughly and utilize CNC boring to carry out non-penetrating type boring and form several recessed glass 12 for these copper layer 10 prepositions, this recessed cup 12 is used to install this LED crystal grain 60.
One Gold plated Layer 30, this Gold plated Layer 30 are plated on composite wood 15 and this recessed cup 12 all edges of this copper multilayer film, with increase conductivity and thermal diffusivity, and are beneficial to the operation of routing backward.
One dielectric ink layer 40; This insulating oil rete is printed in this Gold plated Layer 30 surfaces; The substrate that wherein will have the contraposition egative film is through exposure machine, and the utilization ultraviolet irradiation, and ultraviolet ray will penetrate the printing opacity position in the egative film; And this dielectric ink layer 40 of below, irradiation printing opacity position, and make the ink lay at these positions fully attached on this Gold plated Layer 30.And with this dielectric ink layer 40 through developers and spray solution of potassium carbonate and through chemical action, solution of potassium carbonate can develop the ink lay that does not receive ultraviolet irradiation fall, and expose this Gold plated Layer 30 of bottom surface.
A plurality of metallic contacts 50, this metallic contact 50 are plated on this dielectric ink layer 40, and this metallic contact 50 uses as contact and routing.
After being divided into several pieces little substrates, carry out the second stage of the utility model, be the circuit substrate and the sketch map that LED crystal grain combines of the utility model, see also the sketch map that Fig. 4 combines with LED crystal grain for the substrate of the utility model, comprising the following step:
(1) prepares LED crystal grain 60;
(2) go up elargol with automatically dropping glue machine point;
(3) to consolidate fixedly crystal grain position of brilliant machine automatically;
(4) reach solid brilliant purpose with high-temperature baking;
(5) reach the positive and negative electrode conducting with automatic wire bonder routing after, test with rush of current again;
(6) encapsulate with the outside of epoxy resin again in LED crystal grain and whole base plate;
(7) with the baking completion in about 8 hours down of about Celsius temperature 120 degree.
LED by the recessed cup of the made easy heat radiation of above-mentioned steps flow process; Such as Fig. 5 demonstration, this LED crystal grain 60 is fixed in this recessed cup, utilizes the routing technology that the positive and negative electrode on this LED crystal grain 60 is connected on the metallic contact 50; Seal up an epoxide-resin glue 70 at last again, can accomplish.
The utility model is with CNC computer drilling machine in the copper layer; And utilize special milling cutter to have the bottom on plane; Become the recessed cup of circular-arc bowl type all around, and this LED crystal grain 60 is arranged in this recessed cup 12, utilize the routing technology that this LED crystal grain 60 is electrically connected with metallic contact 50 again; Be loaded on this epoxy resin glue envelope 70 more at last, make that it reaches long-time use, anti-instantaneous large-current, radiating effect is good, brightness is even, the stability advantages of higher.The radiating mode of improvement LED heat radiation module in the past combines the design and the processing procedure of heat radiation material to create with circuit board, and can effectively promote radiating efficiency, and the problem of dispelling the heat for high-capacity LED lamp that present industry faces can effectively solve.
In sum, the design of consideration of human natureization of the present invention quite meets actual demand.Its concrete shortcoming of improving prior art obviously has breakthrough progressive advantage compared to prior art, the enhancement that has effect really, and non-being easy to reached.
Above-listed detailed description is specifying to a possible embodiments of the utility model; But this embodiment is not the claim in order to restriction the utility model; Allly do not break away from the equivalence that the utility model skill spirit does and implement or change, all should be contained in the protection range of the utility model.
Claims (7)
1. led circuit plate with the recessed cup of bowl-type, its characteristic comprises:
A glass layer, this glass layer is as non-conductive layer;
A copper layer; The laminated of this copper layer is should glass layer and form the composite wood of a bronze medal multilayer film; Have the recessed cup and several vias that form at least one confession installation LED crystal grain on the copper layer of the composite wood of this copper multilayer film, these several vias run through the composite wood of this copper multilayer film;
A Gold plated Layer, this Gold plated Layer are plated on upper strata and this all edge of recessed cup of the composite wood of this copper multilayer film;
A dielectric ink layer, this insulating oil rete are printed in this Gold plated Layer surface, and make this dielectric ink layer with predetermined pattern attached on this Gold plated Layer, the Gold plated Layer of below is exposed in the part; And
Several metallic contacts, this metallic contact are plated on this dielectric ink layer.
2. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1 is characterized in that: the bottom that is shaped as the tool plane of this recessed cup is circular-arc bowl type all around.
3. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1 is characterized in that: this via is the penetration boring that is formed on the composite wood of this copper multilayer film.
4. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1 is characterized in that: this recessed cup is the non-penetrating type boring that is formed on the composite wood copper layer of this copper multilayer film.
5. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1 is characterized in that: respectively be provided with at least one LED crystal grain in this recessed cup, this LED crystal grain is connected with the wire bonder routing with this metallic contact.
6. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1 is characterized in that: in addition in said circuit board outer enclosure one epoxy resin layer.
7. the led circuit plate with the recessed cup of bowl-type as claimed in claim 1; It is characterized in that: this dielectric ink layer is the ultraviolet irradiation that utilizes exposure machine; Ultraviolet ray will penetrate the printing opacity position that is arranged in this dielectric ink layer top egative film; And this dielectric ink layer of below, irradiation printing opacity position makes the ink lay of corresponding position attached on this Gold plated Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220206283 CN202585531U (en) | 2012-05-09 | 2012-05-09 | Light-emitting diode (LED) circuit board with bowl-shaped concave cups |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220206283 CN202585531U (en) | 2012-05-09 | 2012-05-09 | Light-emitting diode (LED) circuit board with bowl-shaped concave cups |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202585531U true CN202585531U (en) | 2012-12-05 |
Family
ID=47254909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220206283 Expired - Fee Related CN202585531U (en) | 2012-05-09 | 2012-05-09 | Light-emitting diode (LED) circuit board with bowl-shaped concave cups |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202585531U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311410A (en) * | 2013-06-13 | 2013-09-18 | 苏州金科信汇光电科技有限公司 | Integrated LED with high thermal conductivity and high breakdown voltage |
-
2012
- 2012-05-09 CN CN 201220206283 patent/CN202585531U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311410A (en) * | 2013-06-13 | 2013-09-18 | 苏州金科信汇光电科技有限公司 | Integrated LED with high thermal conductivity and high breakdown voltage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20140509 |