CN106058008A - Method for manufacturing LED metal substrate - Google Patents
Method for manufacturing LED metal substrate Download PDFInfo
- Publication number
- CN106058008A CN106058008A CN201610396241.1A CN201610396241A CN106058008A CN 106058008 A CN106058008 A CN 106058008A CN 201610396241 A CN201610396241 A CN 201610396241A CN 106058008 A CN106058008 A CN 106058008A
- Authority
- CN
- China
- Prior art keywords
- film
- led
- basal board
- metal basal
- insulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000002203 pretreatment Methods 0.000 claims abstract description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 9
- 235000006708 antioxidants Nutrition 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 238000012822 chemical development Methods 0.000 claims description 3
- 239000000356 contaminant Substances 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000011536 re-plating Methods 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000021736 acetylation Effects 0.000 abstract 1
- 238000006640 acetylation reaction Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a method for manufacturing an LED metal substrate. The method comprises the following steps: (1) pre-treatment, (2) film squeezing, (3) film alignment, (4) exposure, (5) developing, (6) etching, (7) film removal, (8) surface acetylation, (9) silvering, (10) insulating material manufacturing, and (11) cutting. According to the method disclosed by the invention, a copper substrate of an LED wafer is produced by semi-etching, so that the dimension precision is high, and the heat dissipation performance is good.
Description
Technical field
The present invention relates to the manufacture method of a kind of LED metal basal board, belong to LED-baseplate technical field.
Background technology
LED is a photoelectric cell, and in its work process, the electric energy of only 10%-40% is converted into luminous energy, remaining electric energy
Nearly all it is converted into heat energy, makes the temperature of LED raise.LED intensification is the main cause of LED performance degradation and inefficacy.
In great power LED, heat radiation is a big problem, and as being not added with cooling measure, then the wick temperature of great power LED can be anxious
Speed rises, and when its temperature is increased beyond maximum allowable temperature (usually 150 DEG C), great power LED can damage because of overheated.
In order to make the convenient heat radiation of LED, LED module has one piece of substrate, and substrate is provided with LED light-emitting component, generally, substrate
For ceramic substrate or metal basal board.Owing to producing substantial amounts of heat when LED light-emitting component works, therefore, substrate needs possess
Good heat conduction, heat-sinking capability.Because of the reason for convenience of heat radiation, copper base has been applied in LED industry, but existing skill
The metal basal board of art is all the substrate as whole LED module, makes insulating barrier and line layer on metallic substrates, then at circuit
On layer, LED chip installed by some glue, and prior art solves heat dissipation problem from the angle of LED module substrate, improves radiating effect.But
Prior art does not solve the heat dissipation problem of LED chip point glue installation place.The present invention proposes using copper metal basal board as LED core
The substrate of sheet.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of LED metal basal board, use half-etching to produce LED wafer
Copper base, can effectively solve LED unit heat dissipation problem.
For achieving the above object, present invention employs following technical proposals.
The manufacture method of a kind of LED metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water
Only, surface contaminant is removed；
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
(3) film aligning: carry out two-sided film aligning according to design configuration;
(4) exposure: use parallel exposing machine to be exposed；
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；
(7) film is moved back: photosensitive dry film is all returned；
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment;
(9) silver-plated: to select electroplated metal layer according to reality application, it may be possible to first electronickelling, re-plating silver, it is also possible to be direct plating
Silver, direct silver plating thicknesses relatively nickel plating silver is thick;
(10) insulant processing: fill insulant at total eclipse cutting, insulant herein is to play connection LED gold
Belong to effect and the insulating effect of two pieces of metallic plates of base board unit；
(11) cutting: cut along half-etching groove, obtain LED metal basal board unit.
Further preferably, carry out surface after moving back film and acetify, the most silver-plated, carry out insulant processing the most again.
Further preferably, insulant adds man-hour, makes reflector cover on half-etching groove.Insulant completion of processing
After, LED metal basal board unit attaches LED wafer, and makes fluorescent material layer, cut into single LED metal the most again
Base board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect
Protect copper alloy plate not oxidized；Chemical scavenging anti-oxidant layer after moving back film.
Beneficial effects of the present invention: use half-etching to produce the copper base of LED wafer, dimensional accuracy is high, heat dispersion
Good.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
The manufacture method of a kind of LED metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water
Only, surface contaminant is removed；
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
(3) film aligning: carry out two-sided film aligning according to design configuration;
(4) exposure: use parallel exposing machine to be exposed；
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；
(7) film is moved back: photosensitive dry film is all returned；
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment;
(9) silver-plated: to select electroplated metal layer according to reality application, it may be possible to first electronickelling, re-plating silver, it is also possible to be direct plating
Silver, direct silver plating thicknesses relatively nickel plating silver is thick.
(10) insulant processing: making reflector cover on half-etching groove, fill insulant at total eclipse cutting,
Insulant herein is effect and the insulating effect playing the two pieces of metallic plates connecting LED metal basal board unit；Insulant
After completion of processing, LED metal basal board unit attaches LED wafer, and makes fluorescent material layer
(11) cutting: cut along half-etching groove, obtain LED metal basal board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect
Protect copper alloy plate not oxidized；Chemical scavenging anti-oxidant layer after moving back film.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (2)
1. the manufacture method of a LED metal basal board, it is characterised in that comprise the following steps:
Pre-treatment: with copper alloy plate as raw material, carries out oil removal treatment, then cleans up with pure water, removes surface contaminant；
Press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
Film aligning: carry out two-sided film aligning according to design configuration;
Exposure: use parallel exposing machine to be exposed；
Development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
Etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board list
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；
Move back film: photosensitive dry film is all returned；
Surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment;
Silver-plated: first electronickelling, re-plating silver;Or it is the most silver-plated;
Insulant makes: fill insulant at total eclipse cutting, and insulant herein is to play connection LED metal basal board
The effect of two pieces of metallic plates of unit and insulating effect；
Cutting: cut along half-etching groove, obtain LED metal basal board unit.
The manufacture method of LED metal basal board the most according to claim 1, it is characterised in that pretreatment stage, cleans up
After, make anti-oxidant layer protection copper alloy plate on copper alloy plate surface not oxidized；Chemical scavenging antioxidant after moving back film
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610396241.1A CN106058008A (en) | 2016-06-07 | 2016-06-07 | Method for manufacturing LED metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610396241.1A CN106058008A (en) | 2016-06-07 | 2016-06-07 | Method for manufacturing LED metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106058008A true CN106058008A (en) | 2016-10-26 |
Family
ID=57171143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610396241.1A Pending CN106058008A (en) | 2016-06-07 | 2016-06-07 | Method for manufacturing LED metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106058008A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969069A (en) * | 2018-01-12 | 2018-04-27 | 深圳恒宝士线路板有限公司 | A kind of production method of the separated metal substrate of thermoelectricity |
| CN116121752A (en) * | 2022-12-26 | 2023-05-16 | 东莞赛诺高德蚀刻科技有限公司 | Metal radiating fin etching method with side wall protection and metal radiating fin |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| JP2012182357A (en) * | 2011-03-02 | 2012-09-20 | Toppan Printing Co Ltd | Lead frame substrate for led light emitting element, led light emitting element device, and lead frame for the led light emitting element |
| JP2015099874A (en) * | 2013-11-20 | 2015-05-28 | 凸版印刷株式会社 | Electronic element package and method for manufacturing the same |
-
2016
- 2016-06-07 CN CN201610396241.1A patent/CN106058008A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| JP2012182357A (en) * | 2011-03-02 | 2012-09-20 | Toppan Printing Co Ltd | Lead frame substrate for led light emitting element, led light emitting element device, and lead frame for the led light emitting element |
| JP2015099874A (en) * | 2013-11-20 | 2015-05-28 | 凸版印刷株式会社 | Electronic element package and method for manufacturing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969069A (en) * | 2018-01-12 | 2018-04-27 | 深圳恒宝士线路板有限公司 | A kind of production method of the separated metal substrate of thermoelectricity |
| CN116121752A (en) * | 2022-12-26 | 2023-05-16 | 东莞赛诺高德蚀刻科技有限公司 | Metal radiating fin etching method with side wall protection and metal radiating fin |
| CN116121752B (en) * | 2022-12-26 | 2023-10-13 | 东莞赛诺高德蚀刻科技有限公司 | Metal radiating fin etching method with side wall protection and metal radiating fin |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161026 |
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| WD01 | Invention patent application deemed withdrawn after publication |