CN105895782A - Manufacturing method of RGB (Red Green Blue) module metal substrate - Google Patents
Manufacturing method of RGB (Red Green Blue) module metal substrate Download PDFInfo
- Publication number
- CN105895782A CN105895782A CN201610396239.4A CN201610396239A CN105895782A CN 105895782 A CN105895782 A CN 105895782A CN 201610396239 A CN201610396239 A CN 201610396239A CN 105895782 A CN105895782 A CN 105895782A
- Authority
- CN
- China
- Prior art keywords
- rgb
- film
- metal basal
- manufacturing
- basal board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 title claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 238000011161 development Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 239000003963 antioxidant agent Substances 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 9
- 235000006708 antioxidants Nutrition 0.000 claims description 9
- 238000012822 chemical development Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000356 contaminant Substances 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000011536 re-plating Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 239000011810 insulating material Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a manufacturing method of an RGB (Red Green Blue) module metal substrate, which comprises the following steps of: (1) pretreatment; (2) film pressing; (3) film alignment; (4) exposure; (5) development; (6) etching; (7) film stripping; (8) surface acetification; (9) silver plating; (10) manufacturing of an insulating material; (11) cutting; and the like. The manufacturing method is used for manufacturing an RGB LED (Light-Emitting Diode) substrate, processing cost is sharply reduced, and meanwhile, reliability is also greatly improved.
Description
Technical field
The present invention relates to the manufacture method of a kind of RGB module metal basal board, belong to RGB matrix technique field.
Background technology
Small size RGB LED obtains Rapid Popularization, if RGB 1010 is a size of because of its size is little, luminous efficiency is high
1.0mm*1.0mm, is the baseplate material being applied to Small Distance display screen electronic component, and currently mainly RGB substrate has filling holes with resin
Plate, copper base for post plate, the former reliability is relatively poor, the latter's good reliability, and processing cost is of a relatively high.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of RGB module metal basal board, be used for manufacturing RGB LED module
Metal basal board, processing cost drastically declines, and is also greatly improved in reliability simultaneously.
For achieving the above object, present invention employs following technical proposals.
The manufacture method of a kind of RGB module metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water
Only, surface contaminant is removed；
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
(3) film aligning: carry out two-sided film aligning according to design configuration；During design configuration, the LED wafer of single RGB module
The square layout of base board unit, the LED wafer base board unit in the single direction of RGB module is 2-9；
(4) exposure: use parallel exposing machine to be exposed；
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；And etch multiple die bond region for placing LED chip；
(7) film is moved back: photosensitive dry film is all returned；
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment；
(9) silver-plated: to select electroplated metal layer according to reality application, it may be possible to first electronickelling, re-plating silver, it is also possible to be direct plating
Silver, direct silver plating thicknesses relatively nickel plating silver is thick.
(10) insulant processing: fill insulant at total eclipse cutting, insulant herein is to play connection
The effect of two pieces of metallic plates of RGB metal basal board unit and insulating effect；
(11) cutting: along half-etching groove cut, obtain RGB module metal basal board, RGB module metal basal board include 4,9,
16,25,36,49,64 or 81 LED wafer base board units, the square arrangement of LED wafer base board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect
Protect copper alloy plate not oxidized；Chemical scavenging anti-oxidant layer after moving back film.
Preferably, arrange exposure parameter to be 30000mJ, 9-11 lattice can be arranged on by gage.
Preferably, speed control be 3.5m/min, breakpoint be that 40-70% develops.
Beneficial effects of the present invention: compared to tradition RGB base plate processing method, processing cost of the present invention drastically declines, with
Time reliability on be also greatly improved.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
The manufacture method of a kind of RGB module metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water
Only, surface contaminant is removed；
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
(3) film aligning: carry out two-sided film aligning according to design configuration；During design configuration, the LED wafer of single RGB module
The square layout of base board unit, the LED wafer base board unit in the single direction of RGB module is 2-9；
(4) exposure: use parallel exposing machine to be exposed；
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；And etch multiple die bond region for placing LED chip；
(7) film is moved back: photosensitive dry film is all returned；
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment；
(9) silver-plated: to select electroplated metal layer according to reality application, it may be possible to first electronickelling, at electrosilvering, it is also possible to be direct plating
Silver, direct silver plating thicknesses relatively nickel plating silver is thick.
(10) insulant processing: fill insulant at total eclipse cutting, insulant herein is to play connection
The effect of two pieces of metallic plates of RGB metal basal board unit and insulating effect；
(11) cutting: along half-etching groove cut, obtain RGB module metal basal board, RGB module metal basal board include 4,9,
16,25,36,49,64 or 81 LED wafer base board units, the square arrangement of LED wafer base board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect
Protect copper alloy plate not oxidized；Chemical scavenging anti-oxidant layer after moving back film.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (2)
1. the manufacture method of a RGB module metal basal board, it is characterised in that comprise the following steps:
Pre-treatment: with copper alloy plate as raw material, carries out oil removal treatment, then cleans up with pure water, removes surface contaminant；
Press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer；
Film aligning: carry out two-sided film aligning according to design configuration；During design configuration, the LED wafer substrate of single RGB module
The square layout of unit, the LED wafer base board unit in the single direction of RGB module is 2-9；
Exposure: use parallel exposing machine to be exposed；
Development: the photosensitive dry film after chemical development exposure, exposes figure to be etched；
Etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove；Metal basal board list
The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter；And etch multiple die bond region for placing LED chip；
Move back film: photosensitive dry film is all returned；
Surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment；
Silver-plated: first electronickelling, re-plating silver；Or it is the most silver-plated；
Insulant is processed: fill insulant at total eclipse cutting；
Cutting: along half-etching groove cut, obtain RGB module metal basal board, RGB module metal basal board include 4,9,16,
25,36,49,64 or 81 LED wafer base board units, the square arrangement of LED wafer base board unit.
The manufacture method of RGB-LED metal basal board the most according to claim 1, it is characterised in that further preferably, also may be used
In pretreatment stage, after cleaning up, make anti-oxidant layer protection copper alloy plate on copper alloy plate surface not oxidized；Moving back
Chemical scavenging anti-oxidant layer after film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610396239.4A CN105895782A (en) | 2016-06-07 | 2016-06-07 | Manufacturing method of RGB (Red Green Blue) module metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610396239.4A CN105895782A (en) | 2016-06-07 | 2016-06-07 | Manufacturing method of RGB (Red Green Blue) module metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895782A true CN105895782A (en) | 2016-08-24 |
Family
ID=56709990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610396239.4A Pending CN105895782A (en) | 2016-06-07 | 2016-06-07 | Manufacturing method of RGB (Red Green Blue) module metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105895782A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026207A (en) * | 2006-02-23 | 2007-08-29 | 宏齐科技股份有限公司 | Light-emitting diode package structure and its package method |
| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| JP2015099874A (en) * | 2013-11-20 | 2015-05-28 | 凸版印刷株式会社 | Electronic element package and method for manufacturing the same |
| CN204424309U (en) * | 2015-01-30 | 2015-06-24 | 博罗承创精密工业有限公司 | A kind of two cup LED support |
-
2016
- 2016-06-07 CN CN201610396239.4A patent/CN105895782A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026207A (en) * | 2006-02-23 | 2007-08-29 | 宏齐科技股份有限公司 | Light-emitting diode package structure and its package method |
| CN101855735A (en) * | 2007-11-19 | 2010-10-06 | 松下电器产业株式会社 | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device |
| JP2015099874A (en) * | 2013-11-20 | 2015-05-28 | 凸版印刷株式会社 | Electronic element package and method for manufacturing the same |
| CN204424309U (en) * | 2015-01-30 | 2015-06-24 | 博罗承创精密工业有限公司 | A kind of two cup LED support |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |
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| WD01 | Invention patent application deemed withdrawn after publication |