CN107969069A - A kind of production method of the separated metal substrate of thermoelectricity - Google Patents
A kind of production method of the separated metal substrate of thermoelectricity Download PDFInfo
- Publication number
- CN107969069A CN107969069A CN201810031330.5A CN201810031330A CN107969069A CN 107969069 A CN107969069 A CN 107969069A CN 201810031330 A CN201810031330 A CN 201810031330A CN 107969069 A CN107969069 A CN 107969069A
- Authority
- CN
- China
- Prior art keywords
- thermal conductive
- film
- conductive zone
- thermoelectricity
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 title claims abstract description 16
- 230000005619 thermoelectricity Effects 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims abstract description 8
- 238000005660 chlorination reaction Methods 0.000 claims abstract description 6
- 238000011161 development Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000003384 imaging method Methods 0.000 claims abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A kind of production method of the separated metal substrate of thermoelectricity, the present invention relates to metal substrate technical field；Its procedure of processing is as follows：Purchase heat radiating metal base material; full page is first printed into wet film; after carrying out pattern transfer again with the graphic making film of thermal conductive zone, contraposition development; in addition to thermal conductive zone; protected at remaining with etchant resist; it is clean to reuse the surface copper foil etching that etching mode is revealed thermal conductive zone; the etching solution of insulating heat-conductive glue-line that thermal conductive zone is exposed using main component as sulfuric acid is stung into eating away again; rewetting film exposure imaging carries out pattern transfer; after making normal circuitous pattern; after carrying out second etch using chlorination copper etchant solution, film is moved back, you can.By chemistry sting erosion in a manner of remove the surface copper foil and insulating heat-conductive glue-line on thermal conductive zone surface, rather than laminar manner realizes that thermoelectricity separates again in a manner of physical mechanical bores gong, and mode is quick, convenient, global consistency is good, and processing is simple, of low cost.
Description
Technical field
The present invention relates to metal substrate technical field, and in particular to a kind of production method of the separated metal substrate of thermoelectricity.
Background technology
The separated metal substrate of thermoelectricity can effectively reduce emitting led temperature because heat transfer efficiency is high at present, so that its
Brightness decay is few, and the service life extends, and is subject to the favor in terms of high-end great power LED.But current manufacture method is complicated, it is of high cost,
Yield is low, causes to influence its occupation rate of market.Making the method for thermoelectricity separating base plate at present is, first by electrolytic copper foil drill flute,
Again by drill flute at heat-conducting glue or P, afterwards with aluminium base or it is copper-based together with stack and press, then drill and make figure, from technique,
Drilling operating has three times, and cost is higher, and copper foil and P glue are all the objects for being inconvenient to be machined, and cannot all speckle with dust
Deng foreign matter, otherwise when finished product assembling is heated will likely plate bursting, it crimps the quality and proof voltage that adhesion will directly affect surface
Value, it would be highly desirable to improve.
The content of the invention
In view of the defects and deficiencies of the prior art, the present invention intends to provide a kind of simple in structure, design rationally, make
With the production method of the separated metal substrate of convenient thermoelectricity, by chemistry sting erosion in a manner of remove the surface copper on thermal conductive zone surface
Paper tinsel and insulating heat-conductive glue-line, rather than laminar manner realizes that thermoelectricity separates again in a manner of physical mechanical bores gong, mode is fast, just
Profit, global consistency are good, and processing is simple, of low cost.
To achieve the above object, the technical solution adopted by the present invention is：Its procedure of processing is as follows：Purchase heat radiating metal base
Material, first prints wet film by full page, then after carrying out pattern transfer with the graphic making film of thermal conductive zone, contraposition development, except thermal conductive zone
Outside, protected with etchant resist at remaining, reuse the surface copper foil erosion that etching mode (chlorination copper etchant solution) is revealed thermal conductive zone
Carve clean, then the etching solution of insulating heat-conductive glue-line that thermal conductive zone is exposed using main component as sulfuric acid is stung into eating away, the exposure of rewetting film
Development carries out pattern transfer, after making normal circuitous pattern, after carrying out second etch using chlorination copper etchant solution, moves back film, i.e.,
Can.
After above-mentioned technique, the present invention has the beneficial effect that：The separated metal substrate of a kind of thermoelectricity of the present invention
Production method, by chemistry sting erosion in a manner of remove the surface copper foil and insulating heat-conductive glue-line on thermal conductive zone surface, rather than with physics
Laminar manner realizes that thermoelectricity separates to the mode of power auger gong again, and mode is quick, convenient, global consistency is good, and processing is simple, cost
It is cheap.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the product structure schematic diagram of processing and fabricating shaping of the present invention.
Fig. 2 is sectional view along A-A in Fig. 1.
Description of reference numerals：
Heat radiating metal base material 1, insulating heat-conductive glue-line 2, surface copper foil 3, graph layer 4, thermal conductive zone 5.
Embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings.
Referring to as depicted in figs. 1 and 2, the technical solution that present embodiment uses is：Its procedure of processing is as follows：From
Manufacturer buys CCL (copper-clad laminate-heat radiating metal base material 1) back, and full page first is printed wet film, then the figure 4 with thermal conductive zone 5
Make the film, after contraposition development carries out pattern transfer, protected in addition to thermal conductive zone 5, at remaining with etchant resist, reuse etching side
Formula (chlorination copper etchant solution) etches the surface copper foil 3 that thermal conductive zone 5 is revealed totally, then the thermal plastic insulation that thermal conductive zone 5 is exposed
Layer 2 stings eating away with special liquid medicine (composition maintains secrecy, mainly sulfuric acid), and rewetting film exposure imaging carries out pattern transfer, makes just
After normal circuitous pattern, after carrying out second etch using chlorination copper etchant solution, film is moved back, you can.
After above-mentioned technique, present embodiment has the beneficial effect that：A kind of thermoelectricity described in present embodiment
The production method of separated metal substrate, by chemistry sting erosion in a manner of remove the surface copper foil and insulating heat-conductive on thermal conductive zone surface
Glue-line, rather than laminar manner realizes that thermoelectricity separates again in a manner of physical mechanical bores gong, mode is quick, convenient, global consistency
Good, processing is simple, of low cost.
The above, is merely illustrative of the technical solution of the present invention and unrestricted, those of ordinary skill in the art are to this hair
The other modifications or equivalent substitution that bright technical solution is made, without departing from the spirit and scope of technical solution of the present invention,
It should all cover among scope of the presently claimed invention.
Claims (1)
- A kind of 1. production method of the separated metal substrate of thermoelectricity, it is characterised in that：Its procedure of processing is as follows：Purchase heat radiating metal Base material, first prints wet film by full page, then after carrying out pattern transfer with the graphic making film of thermal conductive zone, contraposition development, except heat conduction Protected outside area, at remaining with etchant resist, it is clean to reuse the surface copper foil etching that etching mode is revealed thermal conductive zone, then will lead Etching solution of the insulating heat-conductive glue-line that hot-zone is exposed using main component as sulfuric acid stings eating away, and rewetting film exposure imaging carries out figure and turns Move, after making normal circuitous pattern, after carrying out second etch using chlorination copper etchant solution, move back film, you can.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810031330.5A CN107969069A (en) | 2018-01-12 | 2018-01-12 | A kind of production method of the separated metal substrate of thermoelectricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810031330.5A CN107969069A (en) | 2018-01-12 | 2018-01-12 | A kind of production method of the separated metal substrate of thermoelectricity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107969069A true CN107969069A (en) | 2018-04-27 |
Family
ID=61994058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810031330.5A Pending CN107969069A (en) | 2018-01-12 | 2018-01-12 | A kind of production method of the separated metal substrate of thermoelectricity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107969069A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111954368A (en) * | 2020-08-03 | 2020-11-17 | 深圳恒宝士线路板有限公司 | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572998A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN103545171A (en) * | 2012-07-17 | 2014-01-29 | 北大方正集团有限公司 | Method of removing surface protection material from high-power device |
| CN103945641A (en) * | 2014-05-13 | 2014-07-23 | 张伯平 | High thermal conductive circuit board and production method thereof |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
| CN205657910U (en) * | 2016-05-12 | 2016-10-19 | 深圳市仁创艺电子有限公司 | Metal substrate thermoelectric separation structure |
| CN106058008A (en) * | 2016-06-07 | 2016-10-26 | 共青城超群科技协同创新股份有限公司 | Method for manufacturing LED metal substrate |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN207947939U (en) * | 2018-01-12 | 2018-10-09 | 深圳恒宝士线路板有限公司 | A kind of structure of the metal substrate of thermoelectricity separation |
-
2018
- 2018-01-12 CN CN201810031330.5A patent/CN107969069A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572998A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN103545171A (en) * | 2012-07-17 | 2014-01-29 | 北大方正集团有限公司 | Method of removing surface protection material from high-power device |
| CN103945641A (en) * | 2014-05-13 | 2014-07-23 | 张伯平 | High thermal conductive circuit board and production method thereof |
| CN104159404A (en) * | 2014-07-31 | 2014-11-19 | 简玉苍 | Manufacturing method for discrete thermo-electricity separated ALPCB (Aluminum Printed Circuit Board) |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
| CN205657910U (en) * | 2016-05-12 | 2016-10-19 | 深圳市仁创艺电子有限公司 | Metal substrate thermoelectric separation structure |
| CN106058008A (en) * | 2016-06-07 | 2016-10-26 | 共青城超群科技协同创新股份有限公司 | Method for manufacturing LED metal substrate |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
| CN207947939U (en) * | 2018-01-12 | 2018-10-09 | 深圳恒宝士线路板有限公司 | A kind of structure of the metal substrate of thermoelectricity separation |
Non-Patent Citations (1)
| Title |
|---|
| 吴朝晖;程浩;章军;罗素扑;陈明祥;: "大功率LED封装基板技术与发展现状", 半导体光电, no. 01, 15 February 2016 (2016-02-15) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111954368A (en) * | 2020-08-03 | 2020-11-17 | 深圳恒宝士线路板有限公司 | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101709858B (en) | Making methods of LED lighting high-efficiency heat-radiating aluminum baseplate and LED light source | |
| CN101345277B (en) | Production method of illuminating diode apparatus | |
| CN107408544B (en) | The system and method that can be transmitted with electric energy for combined hot | |
| CN107278030A (en) | The preparation method that a kind of thermoelectricity separates LED board | |
| CN104735915A (en) | Method for forming conductor line on insulating substrate | |
| JP6965436B2 (en) | Embedded electrode substrate for transparent light emitting element display and its manufacturing method | |
| CN207947939U (en) | A kind of structure of the metal substrate of thermoelectricity separation | |
| CN101472449A (en) | Combined structure and method of radiator and circuit | |
| CN107408582A (en) | Thick damage cushion for the solar cell metallization based on paper tinsel | |
| CN110112280A (en) | A kind of manufacture craft of thermoelectricity separate circuit boards | |
| US10985300B2 (en) | Encapsulation method for flip chip | |
| CN108322993A (en) | A kind of the pcb board part and its processing method of thermoelectricity separation | |
| TWM300003U (en) | Improved circuit board structure capable of combining heat sink | |
| CN107969069A (en) | A kind of production method of the separated metal substrate of thermoelectricity | |
| JP2007157836A (en) | Wiring circuit board | |
| CN103068151B (en) | Heat radiating material | |
| TWI460076B (en) | A substrate manufacturing method and a structure for simplifying the process | |
| CN104470215B (en) | The preparation method and products obtained therefrom of printed circuit board (PCB) with micro- radiator | |
| KR102032419B1 (en) | Copper based metal PCB | |
| CN201306682Y (en) | Heat-dissipating LED module plate | |
| CN104333981A (en) | Manufacturing method of LED heat radiating substrate and LED module with substrate | |
| CN210671131U (en) | Aluminum substrate with radiating fins | |
| CN106058008A (en) | Method for manufacturing LED metal substrate | |
| CN105810804A (en) | LED (Light Emitting Diode) light emitting device, LED light source substrate and manufacturing method thereof | |
| CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |