CN110112279B - Processing method of thermoelectric separation substrate for LED - Google Patents
Processing method of thermoelectric separation substrate for LED Download PDFInfo
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- CN110112279B CN110112279B CN201910424116.0A CN201910424116A CN110112279B CN 110112279 B CN110112279 B CN 110112279B CN 201910424116 A CN201910424116 A CN 201910424116A CN 110112279 B CN110112279 B CN 110112279B
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- 239000000758 substrate Substances 0.000 title claims abstract description 68
- 238000000926 separation method Methods 0.000 title claims abstract description 29
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 238000005530 etching Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000006087 Brown hydroboration reaction Methods 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a processing method of a thermoelectric separation substrate for an LED, which can avoid the influence of glue overflow generated in the manufacturing process of the thermoelectric separation substrate on the heat dissipation effect of the thermoelectric separation substrate, and comprises the following steps: cutting a copper substrate, drilling an alignment tool hole on the copper substrate, then covering a dry film on the copper substrate, exposing and developing, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, and forming a boss on the copper substrate, wherein the boss is used for contacting with an LED for heat conduction; carrying out brown oxidation treatment on the copper substrate, then pasting a PP sheet on the copper substrate, and windowing the PP sheet at a position corresponding to the boss; covering a layer of copper foil on the PP sheet, laminating and pressing the copper foil, the PP sheet and the copper substrate from top to bottom; and then, carrying out dry film pretreatment on the copper foil, pasting a dry film, then exposing and developing, removing the copper foil on the dry film of the boss through etching windowing, manufacturing a circuit, and removing the dry film on the boss to expose the boss.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a processing method of a thermoelectric separation substrate for an LED.
Background
Light-Emitting diodes (LEDs) are used as a new generation of solid-state Light source, have the advantages of long service life, high efficiency, energy saving, environmental protection, and the like, and are widely applied to lighting sources.
The core part of the LED is a PN junction, injected electrons and holes directly convert electric energy into light energy when the PN junction is compounded, but not all the converted light energy can be emitted outside the LED, and the light energy can be converted into heat energy by an absorption sheet in the PN junction and the epoxy resin/silica gel, and the heat energy has a great side effect on a lamp.
With the wide use of LEDs, the conventional heat dissipation medium and metal matrix structure of a high-power LED cannot meet the heat dissipation requirement. A thermoelectric separation base plate is used under the environment and is provided with an independent thermal channel bonding pad, the bonding pad is completely insulated from a chip, a gold wire, a bracket, an electric pin and the like of an LED, and a heat dissipation bonding pad can be connected into a whole on the whole PCB to limit the use of a limited heat dissipation area.
Among the prior art, the thermoelectric separation base plate is through high temperature lamination, with base plate, PP and copper foil range upon range of pressfitting, however at the in-process of lamination, the volume of overflowing glue is difficult to control, has the resin glue in the PP to spill over to the hot aisle pad on, remains the heat conduction that the resin glue on the hot aisle pad can influence for the unable radiating effect of thermoelectric separation base plate guarantees.
Disclosure of Invention
In view of the above problems, the present invention provides a method for processing a thermoelectric separation substrate for an LED, which can prevent an overflow glue generated during a manufacturing process of the thermoelectric separation substrate from affecting a heat dissipation effect of the thermoelectric separation substrate.
The technical scheme is as follows: a processing method of a thermoelectric separation substrate for an LED is characterized by comprising the following steps: cutting a copper substrate, drilling an alignment tool hole on the copper substrate, then covering a dry film on the copper substrate, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, and forming a boss corresponding to the pattern on the copper substrate, wherein the boss is used for contacting with an LED for heat conduction;
carrying out brown oxidation treatment on the copper substrate, then pasting a PP sheet on the copper substrate, and windowing the PP sheet at a position corresponding to the boss;
covering a layer of copper foil on the PP sheet, laminating and pressing the copper foil, the PP sheet and the copper substrate from top to bottom;
and then, carrying out dry film pretreatment on the copper foil, pasting a dry film, then exposing and developing, removing the copper foil on the dry film of the boss through etching windowing, manufacturing a circuit, and removing the dry film on the boss to expose the boss.
Furthermore, when the PP sheet is pasted, the alignment is carried out through the alignment tool hole.
Furthermore, when the copper foil on the dry film of the boss is removed by etching the window, the alignment is carried out through the alignment tool hole.
Further, after the outer layer circuit is manufactured and the copper foil on the dry film of the boss is removed by etching, the method also comprises the following steps: AOI optical detection → solder mask → surface treatment → molding → finished product packaging.
Further, the PP sheet is an FR4 grade prepreg, the model of the PP sheet is 1080, and the resin content is RC 68%.
Further, the thickness of the PP sheet is less than 100 um.
According to the processing method of the thermoelectric separation substrate for the LED, the traditional processing method of the thermoelectric separation substrate is improved, the dry film is pasted on the copper substrate before the PP and the copper foil are laminated, the resin adhesive is prevented from overflowing onto the boss in the laminating process to influence the heat dissipation effect of the thermoelectric separation substrate, the processing yield of the thermoelectric separation substrate is improved, the production cost is reduced, and the production efficiency is greatly improved; according to the invention, through browning, an oxide layer is generated on the surface of the copper so as to improve the joint force between the copper foil and the PP when the multilayer circuit board is pressed, so that the PP sheet and the copper substrate after lamination are combined more tightly, and the insulation performance is better.
Drawings
Fig. 1 is a schematic structural view of a thermoelectric separation substrate manufactured by a method of processing a thermoelectric separation substrate for an LED according to the present invention;
FIG. 2 is a schematic flow chart of a method of processing a thermoelectric separation substrate for LEDs according to the present invention;
description of reference numerals: 1: a copper substrate; 2: a boss; 3: a PP sheet; 4: copper foil; 5: printing ink; 6: an organic solderability preservative film; 7: and (3) drying the film.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, the thermoelectric separation substrate manufactured by the method for processing the thermoelectric separation substrate for the LED of the present invention includes a copper substrate 1, a boss 2 on the copper substrate, PP sheets 3 on both sides of the boss 2, and copper foils 4 on the PP sheets 3, wherein the copper foils 4 are coated with ink 5 for solder resist, the boss 2 is subjected to OSP surface treatment, and a layer of organic solder resist film 6 is chemically grown on the clean bare copper surface of the boss 2.
The processing method of the thermoelectric separation substrate for the LED comprises the following steps: cutting a copper substrate, drilling an alignment tool hole on the copper substrate, then covering a dry film on the copper substrate, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, and forming a boss corresponding to the pattern on the copper substrate, wherein the boss is used for contacting with an LED for heat conduction;
performing brown oxidation treatment on a copper substrate, then pasting a PP sheet on the copper substrate, windowing the PP sheet at a position corresponding to a boss, and aligning through an alignment tool hole when pasting the PP sheet, wherein in the embodiment, the PP sheet is an FR4 grade prepreg, the model of the PP sheet is 1080, the resin content is RC 68%, and the thickness of the PP sheet is less than 100 um;
covering a layer of copper foil on the PP sheet, laminating and pressing the copper foil, the PP sheet and the copper substrate from top to bottom;
then, carrying out dry film pretreatment on the copper foil, pasting a dry film, then exposing and developing, removing the copper foil on the dry film of the boss through etching windowing, carrying out alignment through an alignment tool hole when the copper foil on the dry film of the boss is removed through etching windowing, manufacturing a circuit, and removing the dry film on the boss to expose the boss;
the steps of pasting a dry film, exposing, developing and etching are that the dry film is pasted on a processed copper substrate in a hot pressing mode, so that the subsequent exposure production is facilitated, a negative film is aligned with the copper substrate pressed with the dry film, the negative film graph is transferred to a photosensitive dry film by utilizing the irradiation of ultraviolet light on an exposure machine, the unexposed dry film is dissolved and washed away by utilizing the alkalescence of developing solution (sodium carbonate), the exposed part is reserved, the copper surface can be exposed after the unexposed dry film is removed by the developing solution, and the exposed copper surface is dissolved and corroded by acid copper chloride to obtain the required part;
then performing AOI optical detection, resistance welding, surface treatment, molding and finished product packaging;
the AOI (automated Optical inspection) is called automatic Optical inspection, and is equipment for detecting common defects encountered in welding production based on an Optical principle, when the automatic inspection is carried out, a machine automatically scans a PCB (printed Circuit Board) through a camera, acquires images, compares the tested welding points with qualified parameters in a database, inspects the defects on the PCB through image processing, and displays/marks the defects through a display or an automatic mark for repairing personnel;
solder resist, also called solder mask and green oil, is one of the key processes in the manufacture of printed boards, and is mainly characterized in that a solder mask ink is coated on the board surface through screen printing or solder mask ink coating, a solder mask layer is covered on other places through exposure and development to expose a disc and a hole to be welded, and short circuit is prevented during welding;
bare copper has good solderability, but is easily affected by moisture and oxidation after being exposed to air for a long time, tends to exist in the form of oxide, and is unlikely to remain as original copper for a long time, so that the copper surface needs to be subjected to surface treatment, and the most basic purpose of the surface treatment is to ensure good solderability or electrical property;
and cutting the PCB into required overall dimension by a CNC forming machine, and finally packaging the finished product.
According to the processing method of the thermoelectric separation substrate for the LED, the traditional processing method of the thermoelectric separation substrate is improved, the dry film is pasted on the copper substrate before the PP and the copper foil are laminated, the resin adhesive is prevented from overflowing onto the boss in the laminating process to influence the heat dissipation effect of the thermoelectric separation substrate, the processing yield of the thermoelectric separation substrate is improved, the production cost is reduced, and the production efficiency is greatly improved; according to the invention, through browning, an oxide layer is generated on the surface of copper so as to improve the joint force between the copper foil and the PP when the multilayer circuit board is pressed, so that the PP sheet and the copper substrate after lamination are combined more tightly, and the insulation performance is better;
according to the invention, the alignment tool hole is drilled on the copper substrate, when the PP sheet is pasted, alignment is carried out through the alignment tool hole, and when the window is etched to remove the copper foil on the dry film of the boss, alignment is carried out through the alignment tool hole, so that the accuracy of windowing is ensured.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (2)
1. A processing method of a thermoelectric separation substrate for an LED is characterized by comprising the following steps: cutting a copper substrate, drilling an alignment tool hole on the copper substrate, then covering a dry film on the copper substrate, exposing and developing to enable the dry film to form a required pattern, removing the dry film on other areas except the pattern, carrying out depth-controlled etching on the copper substrate after exposure and development treatment, and forming a boss corresponding to the pattern on the copper substrate, wherein the boss is used for contacting with an LED for heat conduction;
carrying out brown oxidation treatment on the copper substrate, then pasting a PP sheet on the copper substrate, and windowing the PP sheet at a position corresponding to the boss;
covering a layer of copper foil on the PP sheet, laminating and pressing the copper foil, the PP sheet and the copper substrate from top to bottom;
then, carrying out dry film pretreatment on the copper foil, pasting a dry film, then exposing and developing, removing the copper foil on the dry film of the boss through etching windowing, manufacturing a circuit, and removing the dry film on the boss to expose the boss;
coating ink on the copper foil for solder resist, carrying out OSP surface treatment on a boss, and chemically growing an organic solder mask on the clean bare copper surface of the boss;
aligning through the aligning tool hole when the PP sheet is pasted; aligning through the alignment tool hole when the copper foil on the dry film of the boss is removed by etching and windowing;
the PP sheet is an FR4 grade prepreg, the model of the PP sheet is 1080, and the resin content is RC 68%;
the thickness of the PP sheet is less than 100 um.
2. The method of processing a thermoelectric separation substrate for an LED according to claim 1, wherein: after the outer layer circuit is manufactured and the copper foil on the dry film of the boss is removed by etching, the method also comprises the following steps: AOI optical detection → solder mask → surface treatment → molding → finished product packaging.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910424116.0A CN110112279B (en) | 2019-05-21 | 2019-05-21 | Processing method of thermoelectric separation substrate for LED |
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| CN201910424116.0A CN110112279B (en) | 2019-05-21 | 2019-05-21 | Processing method of thermoelectric separation substrate for LED |
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| CN110112279B true CN110112279B (en) | 2020-09-01 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111128986A (en) * | 2019-12-26 | 2020-05-08 | 乐健科技（珠海）有限公司 | Preparation method of LED light-emitting device |
| CN111132471A (en) * | 2019-12-31 | 2020-05-08 | 安徽全照电子有限公司 | Production method of thermoelectric separation copper substrate |
| CN111246656B (en) * | 2020-01-10 | 2021-10-29 | 昆山首源电子科技有限公司 | Thermoelectric separation copper-based circuit board for LED and preparation method thereof |
| CN118335875A (en) * | 2024-03-29 | 2024-07-12 | 苏州市亿利华电子有限公司 | PCB process based on high-heat-dissipation boss copper substrate |
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