CN220935378U - Transparent printed circuit board structure - Google Patents
Transparent printed circuit board structure Download PDFInfo
- Publication number
- CN220935378U CN220935378U CN202321976505.2U CN202321976505U CN220935378U CN 220935378 U CN220935378 U CN 220935378U CN 202321976505 U CN202321976505 U CN 202321976505U CN 220935378 U CN220935378 U CN 220935378U
- Authority
- CN
- China
- Prior art keywords
- transparent
- copper foil
- heat dissipation
- board structure
- dissipation copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 26
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000003466 welding Methods 0.000 abstract description 10
- 238000007639 printing Methods 0.000 abstract description 2
- 239000012780 transparent material Substances 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A transparent printed wiring board structure comprising; a transparent base plate; the thermosetting transparent ink circuit layer is positioned at the upper end of the transparent base plate so as to form silk screen printing; the application selects a base plate made of transparent material as a matrix, adopts secondary printing and welding resistance, firstly forms silk screen printing on the thermosetting transparent ink circuit layer, then forms a transparent layer by using the photosensitive transparent ink for welding resistance, then exposes and develops an IC position with a welding resistance bridge (the spacing is less than 0.1 mm) for automatic alignment and exposure by CCD, solves the problems of deviation of the alignment of the welding resistance bridge and bridge dropping short circuit at the IC position, ensures the transparency of the circuit board base material, and keeps the integrity of the welding resistance bridge of the circuit board.
Description
Technical Field
The utility model relates to the technical field of PCBs, in particular to a transparent printed circuit board structure.
Background
At present, a circuit pattern is usually manufactured on transparent glass (or other transparent substrates) by an etching method in the process of manufacturing a transparent board by a PCB, and then a transparent cover film or transparent photosensitive solder resist ink is used for external insulation protection to form the transparent board. But this method has production drawbacks: 1. the efficiency of the coating film is low, and the alignment deviation between the windowing of the PAD position of the coating film and the PAD of the circuit board is large; 2. solder resist bridges (the spacing is less than 0.1 mm) are arranged at the positions of the densely bonded ICs, and the requirements of customers cannot be met in the actual production process (the solder resist bridges are easy to fall off, and the soldering process is easy to cause a tin connection short circuit); 3. the adoption of photosensitive solder resist ink (containing light yellow curing agent component) can not meet the requirement of transparency (industry standard > 85%) of customers.
Disclosure of utility model
In order to solve the problems, the technical scheme provides a transparent printed circuit board structure.
In order to achieve the above purpose, the technical scheme is as follows:
A transparent printed wiring board structure comprising;
a transparent base plate;
The thermosetting transparent ink circuit layer is positioned at the upper end of the transparent base plate so as to form silk screen printing;
And the photosensitive solder resist ink layer is positioned at the upper end of the thermosetting transparent ink circuit layer.
In some embodiments, the transparent base sheet is FR-4 material and has a transparency of 85%.
In some embodiments, the transparent substrate board is provided with solder resist bridges at the IC locations, the solder resist bridges having a pitch of less than 0.1mm.
In some embodiments, the transparent base layer board comprises an upper board and a lower board, wherein the upper board is covered with a first heat dissipation copper foil, the lower board is covered with a second heat dissipation copper foil, the upper board and the lower board are positioned on the first heat dissipation copper foil and the second heat dissipation copper foil, heat dissipation holes are formed in the first heat dissipation copper foil and the second heat dissipation copper foil, heat dissipation holes penetrate through heat conduction strips, and the second heat dissipation copper foil is provided with a window.
In some embodiments, the second heat dissipating copper foil has a larger area than the first heat dissipating copper foil.
The application has the beneficial effects that:
The application selects the base plate made of transparent material as the base body, adopts secondary printing and welding resistance, firstly forms silk screen printing on a thermosetting transparent ink circuit layer, then forms the transparent layer by using photosensitive transparent ink welding resistance, and then the CCD automatic alignment exposure firstly exposes and develops the IC position with a welding resistance bridge (the spacing is less than 0.1 mm), thereby solving the problems of deviation of the alignment of the welding resistance bridge and bridge dropping short circuit at the IC position, ensuring the transparency of the circuit board base material and keeping the integrity of the welding resistance bridge of the circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of a first embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a second embodiment of the present utility model.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Referring to FIGS. 1-2, a transparent printed circuit board structure includes;
a transparent base plate 1;
A thermosetting transparent ink circuit layer 2 positioned at the upper end of the transparent base plate 1 to form silk screen printing;
And the photosensitive solder resist ink layer 3 is positioned at the upper end of the thermosetting transparent ink circuit layer 2.
Further, the transparent base plate 1 is made of FR-4 material, and the transparency is 85%.
Furthermore, the transparent base layer board 1 is provided with solder resist bridges at the IC position, and the spacing between the solder resist bridges is smaller than 0.1mm.
The application adopts transparent FR-4 substrate transparency (85% of industry standard); secondly, specific transparent solder resist ink (photosensitive solder resist ink and thermosetting solder resist ink are used in a matching way) is adopted to solve the problem that the transparency of the base material and the circuit is insufficient; finally, silk-screen photosensitive transparent ink is adopted, and then the CCD is automatically aligned and exposed to expose and develop the solder resist bridge (the spacing is smaller than 0.1 mm) arranged at the IC position, so that the problems of misalignment and bridge dropping short circuit of the solder resist bridge arranged at the IC position are solved.
In this embodiment, the transparent base plate 1 includes an upper plate 11 and a lower plate 12, the upper plate 11 is covered with a first heat dissipation copper foil 13, the lower plate 12 is covered with a second heat dissipation copper foil 14, the upper plate 11 and the lower plate 12 are located in the first heat dissipation copper foil 13 and the second heat dissipation copper foil 14 and are provided with heat dissipation holes, the heat dissipation holes penetrate through a heat conduction strip 15, and the second heat dissipation copper foil 14 is provided with a window 16.
According to the application, the heat radiating area is effectively enlarged through the first heat radiating copper foil, and then the absorbed heat is transmitted to the second heat radiating copper foil of the lower plate through the heat conducting strip, and due to the design of windowing of the second heat radiating copper foil, the heat is well discharged from the windowing, and then the good heat radiating performance is obtained.
In this embodiment, the area of the second heat dissipating copper foil 14 is larger than that of the first heat dissipating copper foil 13, so that the heat dissipation performance is further improved.
The foregoing description of the preferred embodiments of the present application is not intended to limit the scope of the application, but rather is presented in the claims.
Claims (5)
1. The transparent printed circuit board structure is characterized by comprising;
A transparent base plate (1);
A thermosetting transparent ink circuit layer (2) which is positioned at the upper end of the transparent base layer plate (1) so as to form silk screen printing;
and the photosensitive solder resist ink layer (3) is positioned at the upper end of the thermosetting transparent ink circuit layer (2).
2. The transparent printed wiring board structure according to claim 1, wherein: the transparent base layer plate (1) is made of FR-4 material, and the transparency is 85%.
3. The transparent printed wiring board structure according to claim 2, wherein: the transparent base layer plate (1) is provided with solder resist bridges at the IC position, and the spacing of the solder resist bridges is smaller than 0.1mm.
4. The transparent printed wiring board structure according to claim 1, wherein: transparent base plate (1) is including upper plate (11) and hypoplastron (12), upper plate (11) cover has first heat dissipation copper foil (13), hypoplastron (12) cover has second heat dissipation copper foil (14), upper plate (11) and hypoplastron (12) are located first heat dissipation copper foil (13) and second heat dissipation copper foil (14) are equipped with the louvre, the louvre passes has heat conduction strip (15), windowing (16) have been seted up to second heat dissipation copper foil (14).
5. The transparent printed wiring board structure of claim 4, wherein: the second heat dissipation copper foil (14) has a larger area than the first heat dissipation copper foil (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976505.2U CN220935378U (en) | 2023-07-25 | 2023-07-25 | Transparent printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976505.2U CN220935378U (en) | 2023-07-25 | 2023-07-25 | Transparent printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220935378U true CN220935378U (en) | 2024-05-10 |
Family
ID=90940187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321976505.2U Active CN220935378U (en) | 2023-07-25 | 2023-07-25 | Transparent printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220935378U (en) |
-
2023
- 2023-07-25 CN CN202321976505.2U patent/CN220935378U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |