CN212305766U - PCB, PCB with welding agent brushed in advance and electronic module - Google Patents

Abstract

The utility model discloses a PCB board and brush PCB board and electronic module that has the welding agent in advance, wherein, a PCB board, include: the PCB board is provided with a positioning groove for installing the shielding case, the groove width of the positioning groove is larger than the wall thickness of the shielding case to form a gap, and the gap can at least partially contain the welding agent. The utility model discloses a set up the constant head tank that is used for installing the shield cover on the PCB board, it is more stable when the installation to make the shield cover, the position stagger has been avoided PCB board and shield cover welding process to appear, the problem that the direction is not right, greatly increased PCB board and shield cover welded success rate, very big improvement the production efficiency of PCB board, and reduced the cost of repairing and bringing, and the wall thickness of constant head tank width is greater than the shield cover can hold the clearance of welding agent in order to form, the problem that there is empty solder rosin joint in shield cover and PCB board welding has been solved.

Description

PCB, PCB with welding agent brushed in advance and electronic module

Technical Field

The utility model relates to a production and processing of PCB board and the technical field of installation indicate a PCB board and brush PCB board and electronic module that has the welding agent in advance especially.

Background

The shielding case is a metal case, can prevent electromagnetic interference, and plays a role in shielding components on the PCB. The shield separates the two spatial regions to control the induction and radiation of electromagnetic waves from one region to the other.

Shielding cases have been widely used in electronic products. With the miniaturization of electronic products and the diversification of functions, the shapes and sizes of the shielding cases are becoming more and more diversified and complicated. Due to the uncertainty of the shape of the shield and the layout of the PCB, most shields are generally made as custom parts.

In the SMT link of the whole manufacturing process of mounting the components on the PCB through the surface mounting technology and mounting the plug-in components through the double-in line, the components are firstly placed at the designated positions on the PCB, and then whether the direction and the positions are accurate or not is checked. After the correctness is confirmed, the shielding case is placed at the designated position on the PCB in the second step, the direction and the position of the shielding case are required to be checked and confirmed again at the moment, the shielding case can enter a reflow oven, and after the shielding case is taken out of the oven and cooled, the welding quality of the SMT device on the whole board is required to be checked for the third time.

In addition, the conventional shield cover is mounted in the following manner: and brushing solder paste on the bonding pad of the PCB, then placing the shielding case in the area provided with the solder paste, and welding the PCB and the shielding case together through a reflow soldering process. The method has the problem that the welding strength of the shielding case and the PCB is influenced due to the empty solder joint during the welding of the shielding case and the PCB.

Disclosure of Invention

The utility model discloses a PCB board and brush PCB board and electronic module that has the welding agent in advance, through the region at PCB board installation shield cover set up with shield cover complex constant head tank, and the wall thickness that the groove width of constant head tank is greater than the shield cover is in order to form the clearance that can hold the welding agent, has solved shield cover and PCB board welding and has had the problem of empty solder rosin joint. Meanwhile, the accuracy of the welding position of the PCB and the shielding case is guaranteed.

The utility model provides a technical scheme as follows:

a PCB board comprising:

the PCB board is provided with a positioning groove for installing the shielding case, the groove width of the positioning groove is larger than the wall thickness of the shielding case to form a gap, and the gap can at least partially contain the welding agent.

This technical scheme, through set up the constant head tank that is used for installing the shield cover on the PCB board, it is more stable when the installation to make the shield cover, the position stagger has appeared in PCB board and shield cover welding process, the problem that the direction is not right, greatly increased PCB board and shield cover welded success rate, very big improvement the production efficiency of PCB board, and reduced the cost of repairing and bringing, and the groove width of constant head tank is greater than the wall thickness of shield cover in order to form the clearance that can hold the welding agent, the problem that there is empty solder rosin joint in shield cover and PCB board welding has been solved.

Preferably, the groove width of the positioning groove is 1.5-2.5 times of the wall thickness of the shielding case.

This technical scheme, with the groove width setting of constant head tank within this scope, satisfy placing of shield cover promptly, be favorable to the better welding agent that holds in clearance simultaneously.

Preferably, the positioning groove may be a closed groove or an interrupted groove.

This technical scheme, the concrete form of constant head tank can set up according to actual demand, has increased the variety of constant head tank form.

A PCB board brushed with soldering flux in advance comprises any one of the PCB boards, wherein the PCB board is provided with a plurality of soldering flux grooves;

and brushing a welding agent on the PCB in advance to cool and fix the welding agent on the PCB, wherein the welding agent is arranged on two side edges of the positioning groove and is close to the positioning groove.

According to the technical scheme, the welding agent is coated on the PCB in advance, so that the efficiency of subsequently assembling the shielding case is greatly accelerated, and the production efficiency is greatly improved.

An electronic module, comprising: any one of the above described PCB boards;

the shielding cover is arranged on the positioning groove;

the welding agent is arranged in the positioning groove and used for fixing the shielding case and the PCB.

This technical scheme adopts the PCB board installation shield cover that is equipped with the constant head tank, has solved shield cover and PCB board welding and has had the problem of empty solder rosin joint. Meanwhile, the accuracy of the welding position of the PCB and the shielding case is guaranteed. The performance of the electronic module is greatly improved.

A manufacturing method of a PCB board comprises the following steps:

the PCB board set up the constant head tank on the PCB board, the constant head tank can be used to install the shield cover, just the groove width of constant head tank is greater than the wall thickness of shield cover forms the clearance.

This technical scheme is used for installing the constant head tank of shield cover through setting up on the PCB board to PCB board and shield cover welding position's accuracy has been ensured.

Preferably, the positioning groove is processed by etching.

This technical scheme makes the PCB board come out with the constant head tank etching when etching metal circuit, has add the constant head tank when not influencing PCB board manufacture process to shorten the preparation process of this PCB board greatly, further increased production efficiency.

An assembly method of an electronic module adopts the PCB board; wherein the content of the first and second substances,

step S0: brushing a welding agent at a position close to the positioning groove in advance;

step S1: placing the shielding case in the positioning groove;

step S2: and heating the shielding case and the PCB in a furnace, melting the welding agent, flowing into the positioning groove to be in contact with the shielding case, taking out the shielding case and the PCB, and cooling.

According to the technical scheme, when the SMT is used for punching, the installation of the shielding cover on the PCB is realized, the manufacturing process is shortened, and the production efficiency is further increased. Preferably, by the mounting method, the problem of empty solder joint and insufficient solder joint existing in the welding of the shielding case and the PCB is solved. Meanwhile, the accuracy of the welding position of the PCB and the shielding case is guaranteed.

Preferably, the welding agent is coated on two side edges of the width of the positioning groove and is close to the positioning groove.

This technical scheme brushes the welding agent in the both sides limit of constant head tank groove width, and is close to the constant head tank, and the welding agent of being convenient for flows into the constant head tank after melting in, has improved the reliability of equipment greatly.

Preferably, the solder is flush with the PCB board.

This technical scheme has further increased the reliability that the welding agent flows into in the constant head tank after melting.

Compared with the prior art, the utility model discloses a PCB board and brush PCB board and electronic module that has the welding agent in advance have following beneficial effect:

1. through setting up the constant head tank that is used for installing the shield cover on the PCB board, make the shield cover more stable when the installation, avoided PCB board and shield cover welding process position to stagger, the problem that the direction is not right, greatly increased PCB board and shield cover welded success rate, very big improvement the production efficiency of PCB board, and reduced the cost that the reprocesses and bring.

2. When SMT is used for punching, the installation of the shielding cover on the PCB is realized, the manufacturing process is shortened, and the production efficiency is further increased. Preferably, by the mounting method, the problem of empty solder joint and insufficient solder joint existing in the welding of the shielding case and the PCB is solved. Meanwhile, the accuracy of the welding position of the PCB and the shielding case is guaranteed.

Drawings

The above features, technical features, advantages and implementation manners of a PCB board and an electronic module previously brushed with solder will be further described in a clearly understandable manner with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of the assembled PCB and shield case of the present invention;

FIG. 2 is a schematic structural diagram of the PCB board of the present invention;

fig. 3 is a schematic structural diagram of the shielding case of the present invention;

FIG. 4 is a schematic view of the shield of the present invention being placed in a positioning groove coated with a solder;

FIG. 5 is a flow chart of the PCB manufacturing process of the present invention;

the reference numbers illustrate:

PCB board 100, constant head tank 101, base plate 111, conductive metal sheet 112, dry film 113, circuit substrate 114, shield cover 200, solder 300.

Detailed Description

In order to more clearly illustrate embodiments of the present invention or technical solutions in the prior art, specific embodiments of the present invention will be described below with reference to the accompanying drawings. It is obvious that the drawings in the following description are only examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be obtained from these drawings without inventive effort.

For the sake of simplicity, only the parts relevant to the present invention are schematically shown in the drawings, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".

The utility model discloses an embodiment, it is shown with reference to fig. 1 and 2, a PCB board, including PCB board 100, wherein, this PCB board 100 is equipped with constant head tank 101 on the installation region of shield cover 200. It should be noted that the width of the positioning groove 101 is larger than the wall thickness of the PCB 100 to form a gap, and the solder 300 can be at least partially contained in the gap, and the solder 300 is solder paste. Through set up the constant head tank 101 that is used for installing shield cover 200 on PCB board 100, make shield cover 200 more stable when the installation, avoided PCB board 100 and shield cover 200 welding process position to appear staggering, the not right problem of direction, greatly increased PCB board 100 and shield cover 200 welded success rate, very big improvement PCB board 100's production efficiency, and reduced the cost that the reprocesses and bring.

Preferably, referring to fig. 2, the positioning groove 101 is a closed annular groove, and in actual production, the positioning groove 101 may be a closed groove or an interrupted groove. Through setting up constant head tank 101 annular groove, be convenient for set up the welding position of shield cover 200 in constant head tank 101 totally, further increased the stability that shield cover 200 placed in constant head tank 101, very big improvement PCB board 100 and shield cover 200 welding position's accuracy. Of course, in actual production, the specific shape of the positioning slot 101 is determined according to the size of the electronic components to be shielded and protected on the actual PCB 100.

Preferably, the width of the positioning groove 101 is 1.5-2.5 times of the wall thickness of the shielding case 200, and the width of the positioning groove 101 is set within the range, so that the shielding case 200 can be placed, and the welding agent 300 can be accommodated in a better gap.

It should be noted that the specific design dimensions of the groove width and the groove depth of the positioning groove 101 are not mandatory, and in principle, the specific features of the positioning groove 101 may be set according to actual production requirements on the premise of satisfying the installation of the shielding case 200 and ensuring the structural strength of the PCB 100.

In another embodiment of the present disclosure, referring to fig. 2, a PCB board with solder brushed in advance adopts the PCB board in the above embodiment, wherein the solder 300 is brushed on the PCB board 100 in advance, so that the solder 300 is cooled and fixed on the PCB board 100, and the solder 300 is located on both sides of the positioning groove 101 and is close to the positioning groove 101. By painting the solder 300 on the PCB 100 in advance, the efficiency of subsequently assembling the shield can 200 is greatly increased, and the production efficiency is greatly improved.

In another embodiment of the present disclosure, referring to fig. 1, an electronic module includes a PCB 100 of any of the above embodiments, a positioning groove 101 on the PCB 100 is secured and installed by a shielding cover 200, and a soldering flux 300 is disposed on the positioning groove 101 to fix the shielding cover 200 and the PCB 100. The PCB 100 with the positioning grooves 101 is adopted to install the shielding case 200, and the problem that the shielding case 200 and the PCB 100 are welded to be in a void welding and insufficient welding mode is solved. Meanwhile, the accuracy of the welding position of the PCB 100 and the shielding case 200 is guaranteed, and the performance of the electronic module is greatly improved.

In another embodiment of the present disclosure, a method for manufacturing a PCB board includes: the positioning groove 101 is formed on the PCB 100, and the groove width of the positioning groove 101 is greater than the wall thickness of the PCB 100, so that a certain gap is formed when the shield can 200 is mounted in the positioning groove 101. The positioning grooves are processed by etching, and the steps of the method for manufacturing the PCB 100 will be described in detail below.

Referring to fig. 5, the steps of the manufacturing method include: step S0: first, the conductive metal sheet 112 is connected to the surface of the substrate 111, and the conductive metal sheet 112 is bonded to the surface of the substrate 111. The surface size of the substrate 111 is generally the same as the size of the conductive metal sheet 112. Step S1: the dry film 113 is attached to the surface of the conductive metal sheet 112, and a press molding process is performed. Note that the conductive metal sheet 112 is located between the dry film 113 and the substrate 111. Step S2: attaching the circuit substrate 114 to the surface of the dry film 113, wherein the circuit substrate 114 is provided with a pattern layer with the same size as the specification of the positioning groove 101 at the position corresponding to the mounting of the shielding case 200, and is exposed by irradiating UV light; printing a pattern layer on the dry film 113; it should be noted that the pattern layer further includes a line pattern. Step S3: and developing the pattern layer on the dry film 113 by using a developing solution, removing the dry film 113 without the pattern layer printed on the dry film 113, and exposing a part of the conductive metal sheet 112. The developing solution is sodium carbonate. Step S4: the conductive metal sheet 112 is etched into a patterned layer by using an etching solution, and the etched portion is the exposed conductive metal sheet 112. Step S5: the residual dry film 113 is removed. That is, the manufacturing process of the PCB 100 is completed, and the circuit pattern and the positioning groove 101 are processed during etching.

Preferably, the conductive metal sheet 112 is made of copper foil metal, and the copper foil metal has the advantages of being easily adhered to the substrate 111 and having good conductivity, thereby greatly improving the performance of the PCB 100. Further preferably, the substrate 111 is made of PP polyester glass fiber, and the substrate 111 is made of PP polyester glass fiber, so that the tensile strength and the bending strength of the substrate 111 are greatly enhanced, and the substrate has heat resistance, and the service life of the PCB 100 is prolonged.

In another embodiment of the present disclosure, referring to fig. 1-4, an assembling method of an electronic module, when performing SMT component assembly, includes: step S0: brushing a welding agent 300 on the PCB 100 in advance, wherein the welding agent 300 is brushed on two sides of the positioning groove 101; step S1: installing the shielding case 200 in the positioning groove 101; step S2: and (3) putting the shielding case 200 and the PCB 100 into a furnace for heating, taking out the shielding case 200 and the PCB 100 for cooling after the welding agent 300 is melted and flows into the positioning groove 101, and welding the shielding case 200 and the PCB 100 by the welding agent 300.

By realizing the installation of the shielding case 200 on the PCB 100 during SMT component printing, the manufacturing process is greatly shortened, and the production efficiency is further increased. Preferably, by the mounting method, the problem of empty solder joint and insufficient solder joint existing in the welding of the shielding case 200 and the PCB 100 is solved. Meanwhile, the accuracy of the welding position of the PCB 100 and the shield can 200 is guaranteed.

Preferably, the solder 300 is flush with the PCB 100, which further increases the reliability of the solder 300 flowing into the positioning groove 101 after melting.

It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (5)

1. A PCB board, comprising:

the PCB board is provided with a positioning groove for installing the shielding case, the groove width of the positioning groove is larger than the wall thickness of the shielding case to form a gap, and the gap can at least partially contain the welding agent.

2. The PCB board of claim 1, wherein:

the groove width of the positioning groove is 1.5-2.5 times of the wall thickness of the shielding cover.

3. The PCB board of claim 1, wherein:

the positioning groove can be a closed groove or an interrupted groove.

4. A PCB board pre-brushed with solder, comprising the PCB board of any one of claims 1-3, wherein;

and brushing a welding agent on the PCB in advance to cool and fix the welding agent on the PCB, wherein the welding agent is arranged on two side edges of the positioning groove and is close to the positioning groove.

5. An electronic module, comprising: a PCB board as claimed in any one of claims 1 to 3;

the shielding cover is arranged on the positioning groove;

the welding agent is arranged in the positioning groove and used for fixing the shielding case and the PCB.

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