CN102036478A - PCB (Printed Circuit Board) and manufacture method - Google Patents
PCB (Printed Circuit Board) and manufacture method Download PDFInfo
- Publication number
- CN102036478A CN102036478A CN2010105851524A CN201010585152A CN102036478A CN 102036478 A CN102036478 A CN 102036478A CN 2010105851524 A CN2010105851524 A CN 2010105851524A CN 201010585152 A CN201010585152 A CN 201010585152A CN 102036478 A CN102036478 A CN 102036478A
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- soldering paste
- plate body
- pad
- metallic shield
- printed circuit
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Abstract
The invention discloses a PCB (Printed Circuit Board) comprising a board body, a bonding pad and at least one metal shielding hood. The bonding pad is arranged on the board body and tightly connected by simultaneously arranging soldering paste on the bonding pad and the shielding hood, and positioning buckles are also arranged for positioning and fixing the shielding hood to remarkably improve the shielding effect in practical use without arranging additional equipment and have remarkable use effect. Meanwhile, the invention also discloses a manufacture method of the PCB.
Description
Technical field
The present invention relates to a kind of electronic component and install and manufacture method, specifically, is the particularly structure and the manufacture method thereof of printed board pad and radome device of a kind of printed circuit assembly.
Background technology
Printed circuit board claims pcb board again, and it is according to design with circuit theory diagrams, realizes the needed function of circuit designers.Specifically, pcb board is to realize function by circuit connection diagram, at first because figure has reproducibility and consistency, has therefore reduced the mistake of wiring and assembling, has saved maintenance, debugging and the review time of equipment; Secondly can realize standardization in design, be beneficial to exchange; Moreover its wiring density height, therefore volume is little, and is in light weight, is beneficial to the miniaturization of electronic equipment, is beneficial to mechanization, automated production, improved labor productivity and reduced the cost of electronic equipment.
Continuous development along with science and technology, the volume of electronic devices and components is more and more littler, so increasing components and parts can be arranged on the pcb board, wherein some components and parts is comparatively responsive to electromagnetic interference, therefore need cover metal radome thereon, the principle of electromagnetic shield-ing by metal shields external electromagnetic wave fully, so it needs excellent sealing performance, in other words, need exactly radome is combined closely with pcb board.Being to utilize soldering paste that both are integrally welded in the prior art, specifically, is following dual mode: a kind of is at the edge of radome soldering paste to be set, and then radome is placed on the pad of pcb board setting, and the heating soldering paste makes it to mutually combine; Another kind is on the pad of pcb board soldering paste to be set, and then radome is provided with on it, and the heating soldering paste makes it to mutually combine.Though above-mentioned dual mode is easy and simple to handle, its failure welding rate is all very high, specifically, in welding process, soldering paste can not soak into pad and radome sometimes fully, in other words, both are not by firm the connecting as one of soldering paste, the rosin joint that just is commonly called as; Moreover, in welding process, can diffuse to the surface of radome after the solder paste melts, thereby can thicken the surface thickness of radome, and cause bad order, and then cause the short circuit of components and parts inside.
Summary of the invention
The object of the present invention is to provide a kind of printed circuit board of brand new, it makes it to be connected closely by on pad and radome soldering paste being set simultaneously, locating button is set simultaneously in order to location and fixed mask cover; The present invention discloses the manufacture method of above-mentioned printed circuit board.
The present invention is realized by following technical solution:
A kind of printed circuit board, comprise plate body, pad and metallic shield, described metallic shield is provided with 1 at least, described pad is arranged on the plate body, described metallic shield edge is provided with soldering paste, soldering paste is set on pad, and the soldering paste position on the described pad is corresponding mutually with the soldering paste position on the metallic shield.
As a kind of improvement of the present invention, described printed circuit board also comprises locating button, and described locating button is arranged on the plate body, and described locating button size is corresponding with the metallic shield size.
Locating button is set can be limited in metallic shield on the correct position, and the function that metallic shield is fixing is also arranged simultaneously.
As a kind of improvement of the present invention, described soldering paste is arranged on the edge on each limit of metallic shield.
On each limit of metallic shield soldering paste being set can be welded on metallic shield on the pad fully, thereby has guaranteed the shielding of printed circuit board.
A kind of manufacture method of aforesaid printed circuit board may further comprise the steps:
1) on plate body pad and radome solder pad, soldering paste is set;
2) at plate body the soldering paste place is set and mounts components and parts and locating button;
3) soldering paste on the heating plate body makes the components and parts that mount on the pad fixedly connected with plate body, and heating radome solder pad makes soldering paste be solidified into scolding tin;
4) metallic shield is installed on the radome geometrical clamp closely;
5) at radome marginal position printing soldering paste;
6) scolding tin and the soldering paste on the metallic shield that adds on the thermal weld radome solder pad makes both fixedly connected.
As a kind of improvement of the present invention, when before on the plate body soldering paste being set, plate body being carried out silk screen printing.
On plate body, be provided with and carry out silk screen printing before the soldering paste and at first can determine the installation site of element, thereby reduced the possibility that the assembling mistake takes place; Secondly can not produce mistake in the time of can guaranteeing to print because of the difference in height that the generation of locating button and pad is set yet.
Printed circuit board of the present invention can improve shield effectiveness in actual use significantly, and need not to add unnecessary equipment, so result of use is comparatively remarkable; And use welding method welding of the present invention can significantly improve the yields of welding back finished product, guaranteed the good heat radiation of printed circuit board simultaneously.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is a pad schematic diagram of the present invention.
Fig. 3 is a metallic shield schematic diagram of the present invention.
Wherein 1-plate body, 2-radome solder pad, 3-metallic shield, 4-soldering paste, 5-locating button.
Embodiment
Below in conjunction with Figure of description the present invention is further described in detail:
The present invention relates to a kind of printed circuit board, comprise a plate body 1, described plate body 1 adopts insulating material to make, a face of plate body 1 is provided with some pad (not shown) in order to electronic device to be installed, be pasted with Copper Foil on a face of plate body 1 pad is connected, the direction that mounts of Copper Foil is that the connected mode of pad is operated according to the requirement of circuit design drawing.Plate body 1 can be single layer structure, promptly only has only one in one side the plate body 1 of Copper Foil to be set, and can also be sandwich construction, is about to the thin plate body 1 that polylith is provided with Copper Foil and is bonded into an integral slab, and the selection of plate body 1 is decided according to the complexity of circuit.
On the another side of plate body 1, be printed with components and parts schematic diagram in order to indication components and parts putting position, the user can be arranged on components and parts on the correct position according to the indication of schematic diagram, thereby has avoided the fault that causes because mistake put by components and parts.
In the present invention, because the components and parts that are arranged on the printed circuit board need good electromagnetic shielding, therefore printed circuit board of the present invention also is furnished with metallic shield 3.By metallic shield 3 components and parts are covered, the principle of electromagnetic shield-ing that utilizes metal is isolated the electromagnetic signal and the components and parts in the external world, described metallic shield 3 is connected with printed circuit board by the mode of soldering paste welding, better in order to make it shield effectiveness, connect more firm, generally adopt and on the printing face on the printed circuit board, install radome solder pad 2 additional, metallic shield 3 is welded on the pad 2.In the present invention, with metallic shield 3 edges soldering paste 4 is set all on the described radome solder pad 2, the consumption of soldering paste 4 is comparatively sufficient in welding like this; And owing to be provided with soldering paste on radome solder pad 2 and the metallic shield 3, be that soldering paste 4 has soaked into both fully, in welding process when the soldering paste that carries on radome solder pad 2 and the metallic shield 34 is bonding because of melted by heat, the carrying out that both are also firm bonding.Therefore the phenomenon of rosin joint can not occur, welding quality is guaranteed.
In the present invention, on described plate body, also be equipped with locating button 5, locating button 5 is arranged on the plate body, described locating button 5 cross sections are arc, its recess is oppositely arranged, and the distance between the recess is slightly less than the size of metallic shield 3, like this when metallic shield 3 is installed on it, locating button 5 can firmly block metallic shield 3, thereby makes metallic shield 3 more tight with combining of printed circuit board.
The present invention provides a kind of manufacture method of above-mentioned printed circuit board simultaneously, specifically, may further comprise the steps:
1) on plate body pad and radome solder pad, soldering paste is set;
2) at plate body the soldering paste place is set and mounts components and parts and locating button;
3) soldering paste on the heater body makes the components and parts that mount on the pad fixedly connected with plate body, and heating radome solder pad makes soldering paste be solidified into scolding tin;
4) metallic shield is installed on the radome geometrical clamp closely;
5) at radome marginal position printing soldering paste;
6) scolding tin and the soldering paste on the metallic shield that adds on the thermal weld radome solder pad makes both fixedly connected.
In the present invention,, plate body sent into carry out silk screen printing in the screen process press, so the position of components and parts can be fixed, be convenient to carry out remaining element and put setting when before on the plate body soldering paste being set.
The above only is preferred embodiment of the present invention, is not to be the restriction of the present invention being made any other form, and according to any modification or equivalent variations that technical spirit of the present invention is done, still belongs to the present invention's scope required for protection.
Claims (5)
1. printed circuit board, comprise plate body (1), pad (2) and metallic shield (3), described metallic shield (3) is provided with 1 at least, described pad (2) is arranged on the plate body (1), it is characterized in that: described metallic shield (3) edge is provided with soldering paste (4), soldering paste (4) is set on pad (2), and the soldering paste on the described pad (4) position is corresponding mutually with soldering paste (4) position on the metallic shield (3).
2. a kind of printed circuit board according to claim 1, it is characterized in that: described printed circuit board also comprises locating button (5), described locating button (5) is arranged on the plate body (1), and described locating button (5) size is corresponding with metallic shield (3) size.
3. a kind of printed circuit board according to claim 2 is characterized in that: described soldering paste (4) is arranged on the edge on each limit of metallic shield (3).
4. the manufacture method of an a kind of printed circuit board as claimed in claim 1 is characterized in that: may further comprise the steps:
1) on plate body pad and radome solder pad, soldering paste is set;
2) at plate body the soldering paste place is set and mounts components and parts and locating button;
3) soldering paste on the heating plate body makes the components and parts that mount on the pad fixedly connected with plate body, and heating radome solder pad makes soldering paste be solidified into scolding tin;
4) metallic shield is installed on the radome geometrical clamp closely;
5) at radome marginal position printing soldering paste;
6) scolding tin and the soldering paste on the metallic shield that adds on the thermal weld radome solder pad makes both fixedly connected.
5. the manufacture method of a kind of printed circuit board according to claim 4 is characterized in that: when before on the plate body soldering paste being set plate body being carried out silk screen printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105851524A CN102036478A (en) | 2010-12-13 | 2010-12-13 | PCB (Printed Circuit Board) and manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105851524A CN102036478A (en) | 2010-12-13 | 2010-12-13 | PCB (Printed Circuit Board) and manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102036478A true CN102036478A (en) | 2011-04-27 |
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ID=43888568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105851524A Pending CN102036478A (en) | 2010-12-13 | 2010-12-13 | PCB (Printed Circuit Board) and manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102036478A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN105934072A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | PCB and mobile terminal with same |
| CN106455463A (en) * | 2016-09-30 | 2017-02-22 | 奇酷互联网络科技（深圳）有限公司 | Shielding device, manufacturing method of shielding device and electronic equipment |
| CN106851969A (en) * | 2017-04-01 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board (PCB) and its processing technology |
| CN107484402A (en) * | 2017-08-09 | 2017-12-15 | 上海小糸车灯有限公司 | A kind of welding structure and welding method of metallic shield and pcb board |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
-
2010
- 2010-12-13 CN CN2010105851524A patent/CN102036478A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN102291940B (en) * | 2011-08-01 | 2013-05-01 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN105934072A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | PCB and mobile terminal with same |
| CN106455463A (en) * | 2016-09-30 | 2017-02-22 | 奇酷互联网络科技（深圳）有限公司 | Shielding device, manufacturing method of shielding device and electronic equipment |
| CN106851969A (en) * | 2017-04-01 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board (PCB) and its processing technology |
| CN107484402A (en) * | 2017-08-09 | 2017-12-15 | 上海小糸车灯有限公司 | A kind of welding structure and welding method of metallic shield and pcb board |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
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Application publication date: 20110427 |