CN107484402A - A kind of welding structure and welding method of metallic shield and pcb board - Google Patents
A kind of welding structure and welding method of metallic shield and pcb board Download PDFInfo
- Publication number
- CN107484402A CN107484402A CN201710677531.8A CN201710677531A CN107484402A CN 107484402 A CN107484402 A CN 107484402A CN 201710677531 A CN201710677531 A CN 201710677531A CN 107484402 A CN107484402 A CN 107484402A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- metallic shield
- welding
- card base
- neck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
Abstract
The present invention relates to the welding structure of a kind of metallic shield and pcb board, the extension of metallic shield sets flanging, the flanging is the solder side of metallic shield, the circle of extension one of the pcb board top layer is pcb board and the solder side of metallic shield, described welding structure includes fixing structure for buckle, and described fixing structure for buckle is used to metallic shield is fixed on into pcb board before welding；During welding, metallic shield and pcb board are fixed structure fixed by snap first, then by the flanging welded of metallic shield on the solder side that pcb board top layer extension one is enclosed.The present invention can realize stable welding in the welding process of metallic shield and pcb board, and it is bad to reduce the product caused by welding metal radome produces displacement.Solve the problems, such as that metallic shield causes Product jointing bad because producing displacement in welding process in the prior art.
Description
Technical field
The present invention relates to technical field of electronic equipment, and in particular to a kind of metallic shield and PCB for electronic equipment
The welding structure and welding method of plate.
Background technology
In order to solve the electromagnetic interference problem between electronic equipment internal and between electronic device, generally require in electronics
Shield is installed around electromagnetic radiation source in equipment, to reduce interference of the radiation source to peripheral circuits.The screen typically used
It is mostly the metallic shield being stamped to form to cover body.
Because the development of electronic circuit increasingly tends to miniaturization with integrated, requirement of the circuit module to reliability is also
Improve new high degree.Common circuit module can all be carried out for the screening ability improved to electromagnetic radiation using metallic shield
Faraday's electricity cage shields, then metallic shield and PCB fit structure are exactly a very important link, and this is related to producing
Product may be because that metallic shield failure welding influences the welding yield of product.
The method of industry inner metal shield passes through the spacing method of screw or mechanical structure using metal shell mostly at present
It is fixed.Particularly under the trend of module miniaturization, because metal shell and mechanical erection can not meet to minimize in itself
Requirement, therefore, using metal shell carry out mechanical method reformed into module minimize obstruction.
Meanwhile the method for the surface soldered radome being widely used at present, due to not done in welding process
Method carries out spacing control to metallic shield, and radome is subjected to displacement and caused when usually can install or weld because of metallic shield
With electronic device short circuit, cause the welding yield of product not high.
The content of the invention
It is an object of the invention to provide the welding structure of a kind of metallic shield and pcb board, and the present invention is by setting buckle
Fixed structure, in welding, metallic shield is fixed on pcb board first, then welded again, avoids welding process
The displacement of middle metallic shield, the yield of welding is improved, the generation of electronic device short circuit is avoided, to solve prior art
During welding metal radome, the problem of yield is low, so as to cause electronic device generation short-circuit is welded.
To achieve the above object, welded scheme of the invention is：A kind of welding knot of metallic shield and pcb board
Structure, described metallic shield are welded on the surface of pcb board top layer, and the extension of the metallic shield outwards turns down formation and turned up
Side, the flanging are the solder side of metallic shield, and the circle of extension one of the pcb board top layer is pcb board and metallic shield
Solder side, described welding structure includes fixing structure for buckle, and described fixing structure for buckle is used for before welding by metal
Radome is fixed on pcb board；During welding, metallic shield and pcb board are fixed structure fixed by snap first, so
The flanging of metallic shield is welded on the solder side that the extension one of pcb board top layer encloses afterwards.
Further, according to welding structure of the present invention, described fixing structure for buckle includes being located at metallic shield
Card base on cover, and the neck on pcb board.
Further, at least two cards are set according to welding structure of the present invention, the periphery of the metallic shield
Pin, the correspondence position of the pcb board are provided with the neck coordinated with each card base.
Further, according to welding structure of the present invention, the card base on the metallic shield is " convex " that upside down
Shape structure, the neck on the pcb board is " recessed " shape structure.
Further, according to welding structure of the present invention, described fixing structure for buckle includes being located at metallic shield
Neck on cover, and the card base on pcb board.
Further, at least two cards are set according to welding structure of the present invention, the periphery of the metallic shield
Groove, the correspondence position of the pcb board are provided with the card base coordinated with each neck.
Further, according to welding structure of the present invention, the card base on the pcb board is " convex " shape structure, described
Neck on metallic shield is " recessed " the shape structure that upside down.
Further, according to welding structure of the present invention, the length of the card base is less than the thickness of pcb board, so that
Card base does not influence the welding of PCB bottoms.
Further, set according to welding structure of the present invention, the pad of the input/output function pin of the pcb board
The bottom in pcb board is counted, so that metallic shield is with after pcb board welding, forming the control module of chip form.
Present invention also offers the welding method of a kind of metallic shield and pcb board, the scheme of welding method of the present invention is：
First, metallic shield is fixed on pcb board top layer by structure fixed by snap, realizes the weldering that metallic shield is covered on pcb board
Connect the fixation of position；Then, the extension one of the flanging of metallic shield and pcb board top layer is enclosed into solderable junction and is welded on one
Rise, realize the stable welding of metallic shield and pcb board.
The beneficial effect that the present invention reaches：The present invention can be used for the design of the circuit module of miniaturization, be that module is small-sized
The welding manner of a new metallic shield is provided after change.
The present invention can realize stable welding in the welding process of metallic shield and pcb board, substantially reduce because of weldering
Connect metallic shield and produce displacement and the bad risk of caused product.
Brief description of the drawings
Fig. 1 is the structural representation for the metallic shield that the embodiment of the present invention one sets card base；
Fig. 2 is the schematic diagram of the metallic shield card base of the embodiment of the present invention one；
Fig. 3 is the structural representation for the pcb board that the embodiment of the present invention one sets neck.
Embodiment
The present invention is further detailed explanation with specific embodiment below in conjunction with the accompanying drawings.
For the present invention in the welding to metallic shield and pcb board, metallic shield is welded to the table of the top layer of pcb board
Face, the extension outward bending 90 of metallic shield0, flanging is formed, the flanging is the welding of metallic shield and pcb board
Face, the circle of extension one of pcb board top layer is pcb board and the solder side of metallic shield.
Welding structure includes fixing structure for buckle, and described fixing structure for buckle is used for before welding, by metallic shield
It is fixed on pcb board, to avoid metallic shield in welding process from producing displacement.
During welding, metallic shield and pcb board are fixed structure fixed by snap first, then by metallic shield
In the solderable junction that the extension one that the flanging of cover is welded on pcb board top layer is enclosed.So as to avoid metal screen in welding process
The displacement of cover is covered, causes the generation of the electronic device short circuit phenomenon caused by Product jointing is bad.
Embodiment one：
Present embodiment discloses a kind of welding structure for metallic shield and pcb board, the extension of metallic shield to
Outer bending 900, flanging is formed, the flanging is the solder side of metallic shield and pcb board, and the extension one of pcb board top layer is enclosed
For pcb board and the solder side of metallic shield.
As Figure 1-3, the periphery of the metallic shield sets card base, the correspondence position of the pcb board be provided with
The neck that each card base coordinates, described card base and neck coordinate, and form fixing structure for buckle, and the card base and neck of the present embodiment are equal
Two (in such as Fig. 3, two necks of A and B) are arranged to, card base is " convex " the shape structure that upside down, and neck is " recessed " shape structure, this
The buckle structure of shape, it is a kind of Embedded fixing structure for buckle.
In welding, card base is inserted in neck first, metallic shield fixed, then turning up along metallic shield
The solderable junction that side and pcb board top layer extension one are enclosed is welded, and metallic shield and pcb board is welded together, wherein blocking
Not weld the position of pin and neck.Certainly, as further optimizing, the design of card base and neck could be arranged to 3 with
On, to reach higher stability.
Right angle portions can be processed into fillet etc. by the processing of card base and neck, the minor modifications of these details be all
Under the constraint of this patent new construction.Meanwhile do not constrained by technique, milling, a punching press lamp mode can be used to be constructed.
The length of the present embodiment card base is set smaller than the thickness of pcb board so that control module after the completion of welding can be with
Meet the attachment process requirement of mother baby plate.The pcb board of the present embodiment is by the pad design of input and output pin at the bottom of pcb board
Layer, design on control circuit pcb board top layer, so in radome welding after turn into the control module of chip form,
Then can easily secondary welding on other pcb boards.
Embodiment two：
Present embodiment discloses a kind of welding structure for metallic shield and pcb board, it is different from embodiment one it
It is in card base being arranged on pcb board, neck is arranged on metallic shield, and card base is " convex " shape structure, and neck is upside down
" recessed " shape structure.In welding, neck is blocked into card base first, fixes the position that metallic shield is covered on pcb board, then
Welded again.
For the present embodiment because card base is located at pcb board, the length of card base is less than or equal to the thickness of pcb board naturally.
In other embodiments, it is any type of as long as the positioning that metallic shield is covered on pcb board before welding can be realized
Fixing structure for buckle is within protection scope of the present invention.
The present invention can realize stable welding in the welding process of metallic shield and pcb board, substantially reduce because of weldering
Connect metallic shield produce displacement and caused product is bad.
Claims (9)
1. the welding structure of a kind of metallic shield and pcb board, described metallic shield is welded on the surface of pcb board top layer,
Characterized in that,
Outwards turnover forms flanging for the extension of the metallic shield, and the flanging is the solder side of metallic shield, institute
State the circle of extension one of pcb board top layer includes buckle fixed knot for pcb board and the solder side of metallic shield, described welding structure
Structure, described fixing structure for buckle are used to metallic shield is fixed on into pcb board before welding；During welding, pass through card first
Metallic shield and pcb board are fixed button fixed structure, and the flanging of metallic shield then is welded on into pcb board top layer
Extension one enclose solder side on.
2. welding structure according to claim 1, it is characterised in that described fixing structure for buckle includes being located at metal screen
Cover the card base on cover, and the neck on pcb board.
3. welding structure according to claim 2, it is characterised in that the periphery of the metallic shield sets at least two
Card base, the correspondence position of the pcb board are provided with the neck coordinated with each card base.
4. welding structure according to claim 3, it is characterised in that the card base on the metallic shield upside down
" convex " shape structure, the neck on the pcb board is " recessed " shape structure.
5. welding structure according to claim 1, it is characterised in that described fixing structure for buckle includes being located at metal screen
Cover the neck on cover, and the card base on pcb board.
6. welding structure according to claim 5, it is characterised in that the periphery of the metallic shield sets at least two
Neck, the correspondence position of the pcb board are provided with the card base coordinated with each neck.
7. welding structure according to claim 6, it is characterised in that the card base on the pcb board is " convex " shape structure, institute
It is " recessed " the shape structure that upside down to state the neck on metallic shield.
8. according to the welding structure described in claim any one of 1-7, it is characterised in that the length of the card base is less than pcb board
Thickness so that card base does not influence the welding of pcb board bottom.
9. welding structure according to claim 1, it is characterised in that the weldering of the input/output function pin of the pcb board
Disk designs the bottom in pcb board, so that metallic shield is with after pcb board welding, forming the control module of chip form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710677531.8A CN107484402A (en) | 2017-08-09 | 2017-08-09 | A kind of welding structure and welding method of metallic shield and pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710677531.8A CN107484402A (en) | 2017-08-09 | 2017-08-09 | A kind of welding structure and welding method of metallic shield and pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107484402A true CN107484402A (en) | 2017-12-15 |
Family
ID=60599884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710677531.8A Pending CN107484402A (en) | 2017-08-09 | 2017-08-09 | A kind of welding structure and welding method of metallic shield and pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484402A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2652227A1 (en) * | 1989-09-19 | 1991-03-22 | Legrand Sa | Printed-circuit board with screening cover |
| CN102036478A (en) * | 2010-12-13 | 2011-04-27 | 幸星(南京)数码有限公司 | PCB (Printed Circuit Board) and manufacture method |
| CN102237885A (en) * | 2010-04-20 | 2011-11-09 | 国民技术股份有限公司 | Wireless communication module |
| CN203279460U (en) * | 2013-06-05 | 2013-11-06 | 广东欧珀移动通信有限公司 | Shielding structural member and electronic apparatus equipped therewith |
| CN106028627A (en) * | 2016-07-26 | 2016-10-12 | 深圳天珑无线科技有限公司 | Circuit board assembly |
| CN205755259U (en) * | 2016-06-08 | 2016-11-30 | 深圳市信维通信股份有限公司 | A kind of radome and pcb board |
| CN207626003U (en) * | 2017-08-09 | 2018-07-17 | 上海小糸车灯有限公司 | A kind of welding structure of metallic shield and pcb board |
-
2017
- 2017-08-09 CN CN201710677531.8A patent/CN107484402A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2652227A1 (en) * | 1989-09-19 | 1991-03-22 | Legrand Sa | Printed-circuit board with screening cover |
| CN102237885A (en) * | 2010-04-20 | 2011-11-09 | 国民技术股份有限公司 | Wireless communication module |
| CN102036478A (en) * | 2010-12-13 | 2011-04-27 | 幸星(南京)数码有限公司 | PCB (Printed Circuit Board) and manufacture method |
| CN203279460U (en) * | 2013-06-05 | 2013-11-06 | 广东欧珀移动通信有限公司 | Shielding structural member and electronic apparatus equipped therewith |
| CN205755259U (en) * | 2016-06-08 | 2016-11-30 | 深圳市信维通信股份有限公司 | A kind of radome and pcb board |
| CN106028627A (en) * | 2016-07-26 | 2016-10-12 | 深圳天珑无线科技有限公司 | Circuit board assembly |
| CN207626003U (en) * | 2017-08-09 | 2018-07-17 | 上海小糸车灯有限公司 | A kind of welding structure of metallic shield and pcb board |
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