CN205755259U - A kind of radome and pcb board - Google Patents
A kind of radome and pcb board Download PDFInfo
- Publication number
- CN205755259U CN205755259U CN201620555171.5U CN201620555171U CN205755259U CN 205755259 U CN205755259 U CN 205755259U CN 201620555171 U CN201620555171 U CN 201620555171U CN 205755259 U CN205755259 U CN 205755259U
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- China
- Prior art keywords
- radome
- pcb board
- dip foot
- foot
- dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
This utility model provides a kind of radome and pcb board, enclosure frame arranges at least one DIP foot that can be inserted into pcb board, described pcb board is provided with at least one for the receiving hole accommodating radome DIP foot, can realize when radome is welded in pcb board being accurately positioned, reduce skew, avoid the conducting of radome and other electronic devices and components, largely reduce the risk of short circuit.
Description
Technical field
This utility model relates to electronic technology field, particularly relates to a kind of radome and pcb board.
Background technology
Radome is widely used in the field such as mobile phone, GPS, is used for preventing electromagnetic interference, to the electronic component on pcb board and
LCM plays shielding action.The development of integrated circuit has driven miniaturization and the densification of electronic component, increasing electronics unit device
Part concentrates on a small region.As it is shown in figure 1, radome 1 great majority are by SMT (Surface Mount Technology table
Face encapsulates) technique and tin cream be together welded on pcb board 2, and during welding, the off normal of radome 1 will result in radome 1 and other electricity
The conducting of sub-components and parts, and then have the risk of short circuit, even result in the damage of whole circuit board unrepairable.
Utility model content
Technical problem to be solved in the utility model is: occur displacement or inclined when radome is welded in PCB
The phenomenon moved.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is: a kind of radome, including cover body frame
Frame, described enclosure frame includes that at least one can be inserted into the DIP foot of pcb board.
Further, described DIP foot is longer than other legs.
Further, the height of described DIP foot is 1.2-1.6mm.
Further, described DIP foot is a pair, is positioned at enclosure frame diagonal angle corner.
Further, described DIP foot is two right, is positioned at four corners of enclosure frame.
A kind of pcb board, described pcb board is provided with at least one for the receiving hole accommodating radome DIP foot.
Further, described pcb board there is a pair DIP foot receiving hole.
Further, described pcb board there are two pairs of DIP foot receiving holes.
Further, the degree of depth of described receiving hole is 1.2-1.6mm.
The beneficial effects of the utility model are: by designing at least one DIP foot on radome enclosure frame, welding
Time, DIP foot is inserted in pcb board, can realize being accurately positioned of radome, and radome is relative to the skew of PCB horizontal direction and shakes
Momentum is the least, can avoid the conducting of radome and other electronic devices and components, largely reduces the risk of short circuit;If shielding
The receiving hole that cover DIP foot is not inserted on pcb board, radome magnitude of inclination can relatively big or the serious skew of generation, electricity in the case of this
Sub-components and parts can quickly note abnormalities radome jack-up and process in time during detection before SMT.
Accompanying drawing explanation
Fig. 1 is that prior art radome welds schematic diagram;
Fig. 2 is this utility model enclosure frame DIP foot close-up schematic view;
Fig. 3 is that this utility model DIP foot positions pcb board schematic diagram;
Label declaration:
1, radome;2, pcb board;3, enclosure frame;4, DIP foot.
Detailed description of the invention
By describing technology contents of the present utility model in detail, being realized purpose and effect, below in conjunction with embodiment and join
Conjunction accompanying drawing is explained.
The design of this utility model most critical is: designs at least one on radome enclosure frame and can be inserted into pcb board
DIP foot, can realize being accurately positioned of radome during welding, reduce skew, it is to avoid radome is led with other electronic devices and components
Logical, largely reduce the risk of short circuit.
Refer to Fig. 2 and Fig. 3, a kind of radome, including enclosure frame, described enclosure frame includes that at least one can be inserted
Enter the DIP foot of pcb board.
Knowable to foregoing description, the beneficial effects of the utility model are: design DIP foot on radome enclosure frame,
During welding, DIP foot is inserted in pcb board, it is achieved being accurately positioned of radome, reduces the skew of horizontal direction and rocks, it is to avoid screen
Cover the conducting of cover and other electronic devices and components, largely reduce the risk of short circuit.
Further, described DIP foot is longer than other legs.
Seen from the above description, DIP foot is longer than other legs is inserted in pcb board, it is achieved location, if radome
DIP foot is not inserted into pcb board, and radome magnitude of inclination can be relatively big or serious skew occurs, and in the case of this, electronic devices and components can be
Radome jack-up, can quickly note abnormalities and process in time during detection before SMT.
Further, the height of described DIP foot is 1.2-1.6mm.
Seen from the above description, the height of DIP foot can adjust according to specific needs.
Further, described DIP foot is a pair, is positioned at enclosure frame diagonal angle corner.
Further, described DIP foot is two right, is positioned at four corners of enclosure frame.
Seen from the above description, when DIP foot is a pair or two pairs, radome can be made preferably to be positioned on pcb board,
Reduce side-play amount further.
This utility model further relates to a kind of pcb board, and described pcb board is provided with at least one for accommodating radome DIP foot
Receiving hole.
Seen from the above description, pcb board is provided with the receiving hole of special receiving DIP foot, coordinates radome to realize location.
Further, described pcb board there is a pair DIP foot receiving hole.
Further, described pcb board there are two pairs of DIP foot receiving holes.
Seen from the above description, on pcb board the quantity of receiving hole and position by the quantity of the DIP foot on radome and position
Depending on.
Further, the degree of depth of described receiving hole is 1.2-1.6mm.
Seen from the above description, the degree of depth of receiving hole is as the criterion can accommodate DIP foot.
Embodiment
Refer to Fig. 2 and Fig. 3, embodiment one of the present utility model is: a kind of radome, including enclosure frame 3, described cover
Body framework 3 includes that at least one can be inserted into the DIP foot 4 of pcb board, is provided with at least one for accommodating DIP foot 4 on pcb board
Receiving hole.
Preferably, the length of described DIP foot 4 is longer than other leg, so that DIP foot 4 is inserted in pcb board, it is achieved
Location.
Optionally, the height of described DIP foot 4 is 1.2-1.6mm;Preferably, the degree of depth of described receiving hole and described DIP foot
The height of 4 matches, and is also 1.2-1.6mm.
Preferably, described DIP foot 4 is a pair, is positioned at enclosure frame diagonal angle corner, and further preferred DIP foot 4 is two
Right, it is positioned at four corners of enclosure frame, so that radome location is better achieved, at utmost reduces side-play amount;Preferably, institute
State quantity and the position consistency of the quantity of receiving hole and position and DIP foot 4.
In the present embodiment, when radome is welded on pcb board, DIP foot 4 is firstly inserted into the receiving hole on pcb board, right
Radome positions, and is together welded on pcb board with tin cream the most again;When radome DIP foot 4 is not inserted on pcb board accommodating
Kong Shi, radome magnitude of inclination can be relatively big or serious skew occurs, in the case of this electronic devices and components can radome jack-up,
Can quickly note abnormalities and process in time during detection before SMT.
In sum, a kind of radome that this utility model provides, enclosure frame sets at least one and can be inserted into pcb board
DIP foot, can realize being accurately positioned of radome during welding, reduce horizontal-shift and rock, it is to avoid radome and other electronics
The conducting of components and parts, largely reduces the risk of short circuit.And the receiving hole accommodating DIP foot is set on pcb board, holds
The degree of depth of receiving bore, position and quantity are determined by height, position and the quantity of DIP foot, preferably to position, at utmost reduce
Side-play amount.The location structure of this utility model design is simple, it is adaptable to batch production.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every
Utilize the equivalents that this utility model description and accompanying drawing content are made, or be directly or indirectly used in relevant technology neck
Territory, is the most in like manner included in scope of patent protection of the present utility model.
Claims (9)
1. a radome, including enclosure frame, it is characterised in that described enclosure frame includes that at least one can be inserted into pcb board
DIP foot.
Radome the most according to claim 1, it is characterised in that described DIP foot is longer than other legs.
Radome the most according to claim 2, it is characterised in that the height of described DIP foot is 1.2-1.6mm.
4. according to the radome described in any one of claims 1 to 3, it is characterised in that described DIP foot is a pair, is positioned at cover body
Framework diagonal angle corner.
5. according to the radome described in any one of claims 1 to 3, it is characterised in that described DIP foot is two right, is positioned at cover body
Four corners of framework.
6. a pcb board, it is characterised in that described pcb board is provided with at least one for the receiving accommodating radome DIP foot
Hole.
Pcb board the most according to claim 6, it is characterised in that have a pair DIP foot receiving hole on described pcb board.
Pcb board the most according to claim 6, it is characterised in that have two pairs of DIP foot receiving holes on described pcb board.
9. according to the pcb board described in any one of claim 6 to 8, it is characterised in that the degree of depth of described receiving hole is 1.2-
1.6mm。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620555171.5U CN205755259U (en) | 2016-06-08 | 2016-06-08 | A kind of radome and pcb board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620555171.5U CN205755259U (en) | 2016-06-08 | 2016-06-08 | A kind of radome and pcb board |
Publications (1)
Publication Number | Publication Date |
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CN205755259U true CN205755259U (en) | 2016-11-30 |
Family
ID=57360099
Family Applications (1)
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CN201620555171.5U Active CN205755259U (en) | 2016-06-08 | 2016-06-08 | A kind of radome and pcb board |
Country Status (1)
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CN (1) | CN205755259U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107484402A (en) * | 2017-08-09 | 2017-12-15 | 上海小糸车灯有限公司 | A kind of welding structure and welding method of metallic shield and pcb board |
-
2016
- 2016-06-08 CN CN201620555171.5U patent/CN205755259U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107484402A (en) * | 2017-08-09 | 2017-12-15 | 上海小糸车灯有限公司 | A kind of welding structure and welding method of metallic shield and pcb board |
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GR01 | Patent grant |