CN211580301U - Flexible circuit board with thick copper fine circuit - Google Patents
Flexible circuit board with thick copper fine circuit Download PDFInfo
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- CN211580301U CN211580301U CN202020692361.8U CN202020692361U CN211580301U CN 211580301 U CN211580301 U CN 211580301U CN 202020692361 U CN202020692361 U CN 202020692361U CN 211580301 U CN211580301 U CN 211580301U
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- circuit
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a flexible line way board with meticulous circuit of thick copper, including the substrate, be equipped with the copper circuit on the substrate, it has the permanent membrane of sensitization to fill around the copper circuit, and the lower extreme has the epoxy glue respectively to coat on the substrate, and the opposite side laminating that the permanent membrane of sensitization was kept away from to the epoxy glue has the polyimide. The utility model has the advantages that: the photosensitive permanent film can be used for printing a fine thick circuit with the line width/line distance of 10/10um and the thickness of 60 um; the photosensitive permanent film always protects the thick circuit from being scratched and lodging in the manufacturing process, and the yield is improved; a film removing process is not needed in the printed circuit board, so that the efficiency is improved; the permanent membrane of sensitization replaces the protection film, realizes filling the line width/line spacing and is 10/10um, and thickness is 60 um's thick circuit, breaks through the technical limitation of current protection film.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a flexible line way board with meticulous circuit of thick copper.
Background
With the portability and high performance of various electronic devices, circuit boards become fine, and the high density of the circuit boards in the market is higher and higher. The fine thick copper circuit has the advantages of high density, large sectional area, small resistance and quick heat dissipation. For example, to produce thick copper fine lines with 60um copper thickness, 10um line width and 10um line spacing, the etching method is difficult to make due to the limit of etching factor, so only electroplating additive method can be adopted. The current stage of the electroplating addition method for producing the thick copper fine circuit mainly has the following technical difficulties: 1. the fine thick circuit requires that the photosensitive dry film has excellent adhesion resolution under the condition of thick thickness, and no common dry film with the thickness of more than 60um and the adhesion resolution of 10/10 exists in the current market; 2. the thick copper circuit is not protected in the processes of film removal, micro etching and protective film pressing, and is easy to fall and scratch under the condition of a larger thickness-to-width ratio of 60/10um, so that the yield is reduced; 3. in the process of pressing the protective film, the requirement on the filling property of the protective film is extremely high, and a slit with the depth of 60um and the width of 10um needs to be filled, so that the existing material is difficult to meet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible line way board with meticulous circuit of thick copper to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a flexible line way board with meticulous circuit of thick copper, includes the substrate, is equipped with the copper circuit on the substrate, it has the permanent membrane of sensitization to fill around the copper circuit, the lower extreme has the epoxy glue of coating respectively on the substrate, the epoxy glue is kept away from the opposite side laminating of the permanent membrane of sensitization has the polyimide.
Preferably, the photosensitive permanent film is printed with thick lines with the line width of 15+/-10um, the line distance of 15+/-10um and the thickness of 60um +/-30 um.
Preferably, the photosensitive permanent film is exposed, developed and plated with copper to form a circuit structure.
Preferably, the epoxy glue is attached to one side of the polyimide and is pressed on a thick line with the line width of 15+/-10um, the line distance of 15+/-10um and the thickness of 60um +/-30 um.
Preferably, be equipped with 2 um's thickness copper on the substrate, its reverse side is attached with 25um and easily tears the protection film off.
Preferably, the photosensitive permanent film is attached with a photosensitive permanent film and a pattern with the thickness of 65um +/-30um on the base material through film pressing, exposure and development, and the thickness of the film is 5-10um thicker than that of the circuit.
Advantageous effects
The flexible circuit board with thick copper fine circuits provided by the utility model can print fine thick circuits with the line width/line distance of 10/10um and the thickness of 60um by applying the photosensitive permanent film; the photosensitive permanent film always protects the thick circuit from being scratched and lodging in the manufacturing process, and the yield is improved; a film removing process is not needed in the printed circuit board, so that the efficiency is improved; the permanent membrane of sensitization replaces the protection film, realizes filling the line width/line spacing and is 10/10um, and thickness is 60 um's thick circuit, breaks through the technical limitation of current protection film.
Drawings
FIG. 1 is a schematic cross-sectional view of a fine thick line formed by a photosensitive permanent film according to the present invention;
FIG. 2 is a schematic cross-sectional view of a thick circuit filled with a photosensitive permanent film as a protective film according to the present invention;
FIG. 3 is a schematic cross-sectional view of the height difference between the soft and hard combined plate filled with the photosensitive permanent film of the present invention.
Reference numerals
1-base material, 2-copper circuit, 3-photosensitive permanent film, 4-epoxy glue, 5-polyimide, 6-hard board, 7 conductive glue, 8-electromagnetic shielding metal layer and 9-flexible circuit board.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.
Example 1
As shown in fig. 1, a flexible printed circuit board with thick copper fine lines includes a substrate 1, a copper line 2 is arranged on the substrate 1, a photosensitive permanent film 3 is filled around the copper line 2, epoxy glue 4 is coated on the upper and lower ends of the substrate 1 respectively, and polyimide 5 is attached to the other side of the photosensitive permanent film 3 away from the epoxy glue 4.
Preferably, the photosensitive permanent film 3 is printed with a thick circuit with a line width of 10um, a line distance of 10um and a thickness of 60 um.
Preferably, the photosensitive permanent film 3 is exposed, developed, and copper-plated to form a wiring structure.
Preferably, the epoxy glue 4 is attached to one side of the polyimide 5 and is pressed on a thick circuit with the line width of 15+/-10um, the line distance of 15+/-10um and the thickness of 60um +/-30 um.
Preferably, be equipped with 2 um's thickness copper on the substrate 1, its reverse side is attached to have 25um easily to tear the protection film.
Preferably, the photosensitive permanent film 3 is formed by laminating, exposing and developing a photosensitive permanent film and a pattern having a thickness of 65um on a substrate.
The manufacturing process flow is as follows: 1. preparing a base material: the reverse side of the copper with the thickness of 2um is provided with a protective film which is easy to tear and is 25 um; 2. laminating a photosensitive permanent film, exposing and developing to ensure that the photosensitive permanent film with the thickness of 65um and a required pattern are attached to the base material; 3. electroplating 60um copper; 4. tearing off the bottom protective film; 5. micro-etching to remove the bottom thin copper; 6. and pressing the protective film.
Printing a thick circuit with the line width/line distance of 10/10um and the thickness of 60um by using a photosensitive permanent film; the photosensitive permanent film is reserved in the circuit board, and the circuit is protected in the manufacturing process; a film removing process is not needed in the printed circuit board; the photosensitive permanent film is used for filling the thick circuit to replace a protective film, and the thick circuit with the line width/line distance of 10/10um and the thickness of 60um can be filled; and a photosensitive permanent film is used for filling the break difference between the soft and hard combined plates to replace a protective film.
Example 2
Aiming at the rigid-flexible board, the large height difference between the rigid board and the flexible board locally reaches 200um, the high filling property characteristic of the photosensitive permanent film is applied by pressing the photosensitive permanent film as the protective film, and the filling problem which can not be solved by the common protective film is solved. The brief process flow is as follows: 1. laminating a photosensitive permanent film on the rigid-flexible board; 2. carrying out overall exposure and development; 3. then pressing the electromagnetic shielding film; 4. and finally, baking.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the protection scope of the present invention.
Claims (6)
1. A flexible wiring board with thick copper fine wiring, comprising a base material (1), characterized in that: be equipped with copper circuit (2) on substrate (1), it has permanent membrane of sensitization (3) to fill around copper circuit (2), the bottom coating has epoxy glue (4) respectively on substrate (1), epoxy glue (4) are kept away from the opposite side laminating of the permanent membrane of sensitization (3) has polyimide (5).
2. The flexible wiring board with thick copper fine wiring according to claim 1, characterized in that: the photosensitive permanent film (3) is printed with a thick circuit with the line width of 15+/-10um, the line distance of 15+/-10um and the thickness of 60um +/-30 um.
3. The flexible wiring board with thick copper fine wiring according to claim 1, characterized in that: and the photosensitive permanent film (3) is exposed, developed and plated with copper to form a circuit structure.
4. The flexible wiring board with thick copper fine wiring according to claim 3, characterized in that: epoxy glue (4) laminate in polyimide (5) one side, and the pressfitting in the linewidth is 15+/-10um, the line spacing is 15+/-10um, and thickness is on the thick circuit of 60um +/-30 um.
5. The flexible wiring board with thick copper fine wiring according to claim 1, characterized in that: be equipped with the thickness copper of 2um on substrate (1), its reverse side is attached with 25um and easily tears the protection film.
6. The flexible wiring board with thick copper fine wiring according to claim 1, characterized in that: the photosensitive permanent film (3) is attached with a photosensitive permanent film and a pattern with the thickness of 65um +/-30um on a base material through film pressing, exposure and development, and the thickness of the film is 5-10um thicker than that of the circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020692361.8U CN211580301U (en) | 2020-04-29 | 2020-04-29 | Flexible circuit board with thick copper fine circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020692361.8U CN211580301U (en) | 2020-04-29 | 2020-04-29 | Flexible circuit board with thick copper fine circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580301U true CN211580301U (en) | 2020-09-25 |
Family
ID=72527859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020692361.8U Active CN211580301U (en) | 2020-04-29 | 2020-04-29 | Flexible circuit board with thick copper fine circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211580301U (en) |
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2020
- 2020-04-29 CN CN202020692361.8U patent/CN211580301U/en active Active
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