CN114340160A - Tin spraying character design process - Google Patents
Tin spraying character design process Download PDFInfo
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- CN114340160A CN114340160A CN202111555763.9A CN202111555763A CN114340160A CN 114340160 A CN114340160 A CN 114340160A CN 202111555763 A CN202111555763 A CN 202111555763A CN 114340160 A CN114340160 A CN 114340160A
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- circuit board
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Abstract
The invention discloses a tin spraying character design process which is characterized by comprising the following steps of: manufacturing a laminated circuit board; outer layer line processing, comprising: processing an inner layer, covering a layer of dry film on the laminated circuit board, and etching again; grinding a plate; spraying drought-resistant green oil: covering resin on the copper-clad surface of the laminated circuit board and forming a window and a character window; exposing, namely exposing and developing the circuit board coated with the resin by using a film, curing the insulating layer to form a final circuit board, and developing into a non-electronic code form; carrying out tin spraying, namely carrying out tin spraying treatment on the final circuit board; and (5) post-treatment. The tin plating and windowing characters are combined to obtain information such as production period, cost brought by screen printing or jet printing of related electronic code information is reduced, and production and enterprise benefits are facilitated.
Description
Technical Field
The invention relates to the field of PCB (printed circuit board) manufacturing, in particular to a tin spraying character design process.
Background
In the current pcb manufacturing, in order to facilitate the process problems such as the production process change cycle tracing and the like, the process silk-screen or jet-printed characters need to be added on the board surface independently, and then the production cycle is inquired during the factory inspection, so that the factory and the inquiry of the quality problems are facilitated. The existing process designs characters in an electronic code format for query, so that the cost is high, and the enterprise production is not facilitated.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a tin spraying character design process which can reduce the production cost and improve the product quality by using the tin spraying characters.
The tin spraying character design process comprises the following steps: manufacturing a laminated circuit board; outer layer line processing, comprising: processing an inner layer, covering a layer of dry film on the laminated circuit board, and etching again; grinding a plate; spraying drought-resistant green oil: covering resin on the copper-clad surface of the laminated circuit board and forming a window and a character window; exposing, namely exposing and developing the circuit board coated with the resin by using a film, curing the insulating layer to form a final circuit board, and developing into a non-electronic code form; carrying out tin spraying, namely carrying out tin spraying treatment on the final circuit board; and (5) post-treatment.
The tin spraying character design process provided by the embodiment of the invention at least has the following beneficial effects: on the basis of original circuit board manufacture, when processing outer layer circuit, the inner layer dry film is etched and then is windowed, except for the circuit, a character window is additionally arranged, the copper-coated surface is reserved, then green oil processing is carried out, and tin plating is carried out after exposure and development. The character window correspondingly displays information such as production period and the like, and characters do not need to be additionally printed by silk screen or jet printing, so that the production process is simplified, the flow problem is solved, the production is optimized, and the cost is reduced.
In the above-mentioned tin-sprayed character design process, the character window area is 0.27 to 0.30 square meter in the outer layer circuit processing.
In the above-mentioned tin-spraying character design process, the thickness of the resin coating is 0.02 to 0, 05mm in the outer layer circuit treatment.
As the above-mentioned tin-spraying character design process, the outer layer circuit treatment comprises the following steps: cutting: cutting the copper-clad plate according to the required size; etching: covering a wet film on the surface of the copper-clad plate to form a primary circuit; and (3) laminating: arranging the copper-clad plate with the manufactured preliminary circuit and an insulating plate at preset positions and carrying out pressing treatment to form a laminated circuit board; drilling: through holes are drilled in the laminated wiring board at positions corresponding to the circuit elements.
According to the tin spraying character design process, the drilling comprises the following steps: pre-processing, namely mechanically drilling holes on the preliminary circuit board to enable the positions corresponding to the through holes to reach a preset depth; cleaning; drilling through, namely mechanically drilling through the through hole on the preliminary circuit board; secondary cleaning; and detecting, namely detecting the number of holes of the primary circuit board after secondary cleaning.
According to the tin spraying character design process, the hole diameter of the drilled hole is 0.2-4.0 mm.
In the tin-spraying character design process, the pressing is carried out by adopting a plastic rivet.
According to the tin spraying character design process, the thickness of the laminated circuit board after the pressing step is 0.3-3.2 mm.
According to the tin spraying character design process, the wet film and the dry film are made of photosensitive materials.
In the above tin-spraying character design process, the post-processing includes routing the outer shape and optically detecting the outer layer circuit.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a process flow diagram of the present invention;
fig. 2 is a flow chart of the drilling process of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, the invention provides a tin spraying character design process, which comprises the following steps:
s101: cutting the copper-clad plate to form the copper-clad plate with required size so as to form the inner-layer copper-clad plate.
S102: and the inner layer circuit is formed by covering a layer of wet film on the copper foil of the surface of the copper-clad plate, reserving the required circuit and etching to form a primary circuit board. The wet film is a photosensitive material for subsequent exposure.
S103: and (3) laminating, namely arranging the inner-layer copper-clad plate and the insulating plate according to a preset position, and performing laminating treatment to form a laminated circuit board and form the laminated circuit board. Preferably, the thickness of the board after press bonding is 0.3 to 3.2 mm.
S104: and drilling holes, namely drilling through holes at positions corresponding to the circuit elements on the laminated circuit board, wherein the through holes comprise positioning holes and heat dissipation holes for welding the circuit elements.
S105: and (4) processing an inner layer, covering a layer of dry film on the laminated circuit board, and etching again. The dry film is a photosensitive material for subsequent exposure.
S106: and (5) grinding the laminated circuit board processed in the step S105 to facilitate subsequent processing.
S107: spraying drought-prevention green oil: covering resin on the copper-clad surface of the laminated circuit board and forming a window and a character window; it can be understood that the window is a copper-clad surface exposed outside after the resin insulating layer is covered, so as to retain the circuit and the character window, then the resin is covered, the copper-clad surface of the opening position is exposed after the resin is dried, and then the subsequent treatment is carried out.
S108: and exposing, namely exposing and developing the circuit board coated with the resin by using a film, forming an inner layer circuit pattern after developing, reserving a copper-coated surface, and curing the insulating layer to form a final circuit board. The characters do not need to be printed by silk screen or jet printing, the production process is simplified, the flow problem is solved, the production is optimized, and the cost is reduced.
S109: and (4) carrying out tin spraying treatment on the final circuit board. It should be noted that, the tin spraying surface treatment is easy to be coated with tin after the window is opened and the green oil treatment is carried out, and if the window is changed into the electronic code, the tin spraying effect is poor because the image is dense, the tin spraying difficulty is high, and copper is easy to leak. And the non-electric code is more beneficial to production. S110: and (5) post-treatment.
It should be noted that the processing capacity of the tin-sprayed character provided by the invention is improved from 12mil to 8mil, the processing flow and period are shortened, the processing cost is reduced, the convenience brought by flow information is ensured, the production is facilitated, and the development of enterprises is promoted.
Further, as a preferable but non-limiting aspect of the present invention, in the outer layer wiring processing step, the character window area is 0.27 to 0.30 square meters. The character window will carry out relevant production information such as tinning display production cycle, and through the form of non-electric character code, then can increase certain windowing area, be favorable to the promotion of tinning's effect. Therefore, 0.27 to 0.30 square meter is preferable.
Further, as a preferable but non-limiting aspect of the present invention, in the outer layer wiring processing step, the thickness of the resin coating is 0.02 to 0, 05 mm. It should be noted that the solder mask green oil treatment applied with the resin can protect the circuit and the copper foil, and if the thickness is too thin, the corresponding protection effect cannot be achieved, and if the thickness is too thick, the risk of subsequent continuous welding may be brought, so the scheme is preferably 0.02 to 0.05 mm.
Referring to fig. 2, in step S104, drilling includes the steps of:
and S201, preprocessing, namely mechanically drilling on the preliminary circuit board to enable the position corresponding to the through hole to reach a preset depth. And pre-drilling the drilling points to form the abdicating grooves one by one, so that the drilling is more accurate.
And S202, cleaning. Optionally, debris from the drilled holes is washed away with high pressure water or with air to prevent scratching of the face.
And S203, drilling through, wherein the through hole is drilled through by mechanical drilling on the preliminary circuit board. The drilling point of the pre-drilled hole is aligned with the abdicating groove to drill through, so that the precision of the position of the drilling point is ensured, and the quality of the circuit board is improved. Preferably, the bore diameter of the bore is 0.2 to 4.0 mm.
And S204, secondary cleaning. Further cleaning and preventing the surface of the board from scratching.
And S205, detecting, namely detecting the number of holes of the primary circuit board after secondary cleaning. And detecting the positions and the number of the drilling points.
Further, as a preferred but non-limiting aspect of the present invention, in step S103, a pressing process is performed using plastic rivets. And the step of pressing is to melt the prepreg by heating at high temperature and high pressure, flow the prepreg and convert the prepreg into a solidified sheet. So as to bond one or more inner layer etched back plates (subjected to blackening or browning) and the copper foil into a multilayer plate. And; the pressing process adopts the plastic rivet to solve the problem that the inner layer short circuit is caused by rivet scraps generated in the traditional metal rivet riveting process, the length of the rivet is adjusted, the surface of a blooming surface is upward, and the problem of buckling of a copper foil at a nailing position is solved.
Further, the post-processing of step S110 includes routing and optically detecting the outer layer circuit. And the gong shape is the finished product obtained by performing edge extension and cutting on the whole circuit board after the step S109 is completed. And the outer layer circuit is optically detected to detect whether defective products exist or not, so that the overall product quality is ensured.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A tin spraying character design process is characterized by comprising the following steps:
manufacturing a laminated circuit board;
outer layer line processing, comprising:
inner layer treatment: covering a layer of dry film on the laminated circuit board and etching the laminated circuit board;
grinding a plate;
spraying drought-prevention green oil: covering resin on the copper-clad surface of the laminated circuit board and forming a window and a character window;
exposing, namely exposing and developing the circuit board coated with the resin by using a film, curing the insulating layer to form a final circuit board, and developing into a non-electronic code form;
carrying out tin spraying, namely carrying out tin spraying treatment on the final circuit board; and (5) post-treatment.
2. The tin-sprayed character design process of claim 1, wherein the character window area is 0.27 to 0.30 square meters in outer layer line processing.
3. The tin-sprayed character design process of claim 1, wherein the thickness of the resin smear in the outer layer wiring process is 0.02 to 0, 05 mm.
4. The tin-sprayed character design process of claim 1, wherein the laminated circuit board fabrication comprises the steps of:
cutting: cutting the copper-clad plate according to the required size;
etching: covering a wet film on the surface of the copper-clad plate to form a primary circuit;
and (3) laminating: arranging the copper-clad plate with the manufactured preliminary circuit and an insulating plate at preset positions and carrying out pressing treatment to form a laminated circuit board;
drilling: through holes are drilled in the laminated wiring board at positions corresponding to the circuit elements.
5. The tin-sprayed character design process of claim 4, wherein the drilling comprises the steps of:
pre-processing, namely mechanically drilling holes on the preliminary circuit board to enable the positions corresponding to the through holes to reach a preset depth;
cleaning;
drilling through, namely mechanically drilling through the through hole on the preliminary circuit board;
secondary cleaning;
and detecting, namely detecting the number of holes of the primary circuit board after secondary cleaning.
6. The tin-sprayed character design process of claim 4, wherein the bore diameter of the bore is 0.2 to 4.0 mm.
7. The tin-sprayed character design process of claim 4, wherein the pressing is performed with plastic rivets.
8. The tin-sprayed character design process as claimed in claim 7, wherein the thickness of the laminated wiring board after the press-fitting step is 0.3 to 3.2 mm.
9. The tin-sprayed character design process according to claim 7, wherein the wet film and the dry film are both photosensitive materials.
10. The tin-sprayed character design process of claim 1, wherein the post-processing comprises routing and optically detecting outer layer traces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111555763.9A CN114340160A (en) | 2021-12-17 | 2021-12-17 | Tin spraying character design process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111555763.9A CN114340160A (en) | 2021-12-17 | 2021-12-17 | Tin spraying character design process |
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| CN114340160A true CN114340160A (en) | 2022-04-12 |
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| CN202111555763.9A Pending CN114340160A (en) | 2021-12-17 | 2021-12-17 | Tin spraying character design process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082746A (en) * | 2023-10-12 | 2023-11-17 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
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| US3956043A (en) * | 1972-08-25 | 1976-05-11 | Ciba-Geigy Corporation | Process for the manufacture of printed multi-layer circuits |
| JP2001060637A (en) * | 1999-08-23 | 2001-03-06 | Hitachi Chem Co Ltd | Semiconductor package |
| CN103796433A (en) * | 2014-01-16 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN108366497A (en) * | 2018-01-22 | 2018-08-03 | 江门崇达电路技术有限公司 | A kind of production method of the precise circuit board of spray tin surfaces processing |
| CN110519944A (en) * | 2019-08-09 | 2019-11-29 | 深圳市迅捷兴科技股份有限公司 | Complex copper thick substrate production method |
| CN112203436A (en) * | 2020-10-09 | 2021-01-08 | 惠尔丰(中国)信息系统有限公司 | PCB (printed circuit board) resistance welding process |
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2021
- 2021-12-17 CN CN202111555763.9A patent/CN114340160A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3956043A (en) * | 1972-08-25 | 1976-05-11 | Ciba-Geigy Corporation | Process for the manufacture of printed multi-layer circuits |
| JP2001060637A (en) * | 1999-08-23 | 2001-03-06 | Hitachi Chem Co Ltd | Semiconductor package |
| CN103796433A (en) * | 2014-01-16 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN108366497A (en) * | 2018-01-22 | 2018-08-03 | 江门崇达电路技术有限公司 | A kind of production method of the precise circuit board of spray tin surfaces processing |
| CN110519944A (en) * | 2019-08-09 | 2019-11-29 | 深圳市迅捷兴科技股份有限公司 | Complex copper thick substrate production method |
| CN112203436A (en) * | 2020-10-09 | 2021-01-08 | 惠尔丰(中国)信息系统有限公司 | PCB (printed circuit board) resistance welding process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117082746A (en) * | 2023-10-12 | 2023-11-17 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
| CN117082746B (en) * | 2023-10-12 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
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