CN102938971A - Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof - Google Patents
Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof Download PDFInfo
- Publication number
- CN102938971A CN102938971A CN2012104726259A CN201210472625A CN102938971A CN 102938971 A CN102938971 A CN 102938971A CN 2012104726259 A CN2012104726259 A CN 2012104726259A CN 201210472625 A CN201210472625 A CN 201210472625A CN 102938971 A CN102938971 A CN 102938971A
- Authority
- CN
- China
- Prior art keywords
- metal
- boss
- insulating barrier
- copper foil
- windowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a single-side printed circuit board with ultrahigh heat conducting performance and a manufacturing method thereof. A metal boss used for mounting high-power electronic elements or chips is arranged on a metal substrate, circuits are arranged on other areas except the metal boss, the metal boss is integrally connected with the metal substrate, and non-conductor positions of the high-power electronic elements or chips can directly contact with the metal boss on the metal substrate. As the metal substrate is a copper substrate or aluminum substrate with heat conductivity coefficient higher than 200W/mK, the electronic elements or chips directly contact with the metal substrate, good heat conduction effect can be achieved, and radiating requirements of electronic elements or chips with power higher than 150W are met. Further, the heat transfer coefficient of an existing PCB is increased from 10W/mK to 200W/mK, stability and reliability of high-power electronic elements and high-speed computing chips are improved greatly, while service lives of the high-power electronic elements and high-speed computing chips are prolonged.
Description
Technical field
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is a kind of single side printed wiring board and manufacture method of super-high heat-conductive performance.
Background technology
Along with electronic product to multifunction, short thin light little future development, design space for the printed circuit board (PCB) that carries electronic product is more and more intensive, the requirement of signal frequency and transmission rate is also more and more higher, the power of employed electronic devices and components, chip arithmetic speed are also increasing, and these electronic devices and components or chip electric energy major part during operation changes into dissipation of heat, and this must have higher requirement to the heat dispersion of wiring board.
According to statistics, the heat maximum that the ultimate version in Intel processors 3.6G Pentium 4 produces when moving can reach 115W, when CPU usage reaches 100%, its temperature can be up to 98 ℃, therefore high-power chip or electronic devices and components must be considered its heat dissipation problem, if it is bad to dispel the heat when work, will cause its inner temperature constantly to raise, cause electronic devices and components or chip because of the overheated phenomenons such as disabler that cause.Especially aspect the electronic product of high-power, high computing, dealing with improperly of heat can directly cause electronic devices and components or chip to burn, and causes potential safety hazard from face.Must adopt advanced heat radiation technique and the radiating mode of excellent performance effectively to take away heat for this reason, guarantee electronic devices and components or chip in the maximum temperature that can bear with interior normal operation.
Mode by PCB lifting electronic devices and components or chip cooling mainly contains following several at present:
1, adopt the slightly high FR4 material of heat conduction as the substrate of PCB, to improve its heat dispersion, still the highest conductive coefficient of FR4 is 1.0W/m.K at present, is difficult to satisfy the ever-increasing demand of electronic product power.
2, increase metallic conductor in the PCB lower end, to strengthen its heat dispersion.Common metallic conductor has aluminium block, copper billet etc., is subjected to PCB to have warpage and the even impact of circuit copper thickness ununiformity, has the space between PCB and the metallic conductor, and its heat dispersion is limited.
3, by using the space between high heat conduction adhesive sheet solution PCB and the metallic conductor, to promote its heat dispersion (such as aluminum-based circuit board or copper base circuit board), at present the maximum conductive coefficient of this adhesive sheet only has 10W/mK, is to be difficult to satisfy to the radiating requirements of powerful electronic devices and components or chip.
Hence one can see that, the coefficient of heat transfer maximum of PCB electronic devices and components or chip also only has 10W/mK at present, can't satisfy the height heat radiation requirement of high-power electronic product or the chip of 150W, be difficult to guarantee stability, reliability and the useful life of high-power electronic component and high-speed computation chip.
Summary of the invention
Given this, the object of the present invention is to provide a kind of single side printed wiring board and manufacture method of super-high heat-conductive performance, to satisfy the height heat radiation requirement of high-power electronic product or chip, guarantee stability, reliability and the useful life of high-power electronic component and high-speed computation chip.
The objective of the invention is to be achieved through the following technical solutions.
A kind of single side printed wiring board of super-high heat-conductive performance comprises:
One metal-based layer is provided with on this metal-based layer for the boss that high-power electronic component or high-power chip are installed;
One insulating barrier, this insulating barrier is identical with the metal-based layer shape size, and is provided with corresponding with above-mentioned lug boss position on the insulating barrier and shape size is identical first windows;
One copper foil layer, this copper foil layer is identical with the metal-based layer shape size, and is provided with corresponding with above-mentioned lug boss position on the copper foil layer and shape size is identical second windows;
Copper foil layer, insulating barrier are covered on the metal-based layer from top to bottom successively, and described boss correspondence is arranged in second windows and first window, and boss upper surface and copper foil layer upper surface are on the same level face.
Preferably, described insulating barrier is prepreg or with the adhesive sheet of heat conduction function.
Preferably, described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer of 260W/mK or conductive coefficient be for satisfying 〉=base copper of 400W/mK.
Preferably, described metal-based layer and boss are one-body molded.
The present invention also provides a kind of manufacture method of single side printed wiring board of super-high heat-conductive performance, comprising:
S1, make the metal-based layer with boss, and described lug boss position is for installing the position of high-power chip or high-power electronic component;
S2, make and to have insulating barrier and the copper foil layer of windowing, make the position of windowing of insulating barrier and copper foil layer corresponding with lug boss position, and make the shape of windowing, big or small identical with the shape of cross section size of boss of insulating barrier and copper foil layer;
S3, metal-based layer boss place face is carried out brown process, then the insulating barrier correspondence of windowing is attached on the metal-based layer, and makes the boss correspondence be arranged in windowing of insulating barrier; Afterwards the copper foil layer correspondence of windowing is covered on the insulating barrier, and make windowing of copper foil layer corresponding with windowing of insulating barrier, make the boss correspondence be arranged in windowing of copper foil layer; Then copper foil layer, insulating barrier and metal-based layer are carried out lamination, form single side printed wiring board.
Preferably, S1 specifically comprises:
S101, by horizontal Plate grinder metal-based layer is carried out cleaning surfaces;
S102, removal are used for installing the lug boss position metal in addition of high-power electronic component or chip, make the metal-based layer with boss.
Preferably, S102 comprises:
According to the machining file that weaves, remove the Metal Substrate of file assigned address by the mode of electric gong.
Preferably, S102 comprises:
By applying or overlay antiacid or the alkali resistant diaphragm, shift the film and expose according to working out good figure, and will need the diaphragm of the Metal Substrate removed to develop to fall, to expose Metal Substrate, remove unwanted Metal Substrate by acid etching or alkaline etching afterwards.
Preferably, described insulating barrier is prepreg or adhesive sheet; Described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer or the conductive coefficient of 260W/mK satisfy 〉=base copper of 400W/mK.
Preferably, also comprise after the S3:
Single side printed wiring board is carried out circuit, welding resistance, character technique; And carry out at last the SMT processing procedure, the non-conductor position of high-power electronic component or high-power chip is placed on the boss of metal-based layer.
Be provided with on the single side printed wiring board of the present invention for the metal boss that high-power electronic component or chip are installed, other zones beyond this metal boss correspond to circuit pack, described metal boss and metal-based layer connect as one, the non-conductor position of high-power electronic component or chip can directly contact with the metal-based layer boss, because metal-based layer is conductive coefficient greater than the copper base of 200W/mK or aluminium base, and electronic devices and components and chip directly are in contact with it, therefore can realize good heat-conducting effect, satisfied the radiating requirements of power greater than 150W electronic devices and components or chip, the present invention makes the coefficient of heat transfer of present pcb board rise to 200W/mK by 10W/mK, stability and the reliability of high-power electronic component and high-speed computation chip have greatly been improved, the useful life of having improved simultaneously high-power electronic component and high-speed computation chip.
Description of drawings
Fig. 1 is the schematic perspective view of the single side printed wiring board of super-high heat-conductive performance of the present invention.
Fig. 2 is the structural representation of the single side printed wiring board of super-high heat-conductive performance of the present invention.
Fig. 3 is the making flow chart of the single side printed wiring board of super-high heat-conductive performance of the present invention.
Identifier declaration among the figure: metal-based layer 1, boss 101, insulating barrier 2, first window 201, copper foil layer 3, second windows 301.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Core concept of the present invention is: by at conductive coefficient greater than the copper base of 200W/mK or aluminium basely produce one and be used for installation power greater than the high-power electronic component of 150W or the boss of high-power chip, the non-conductor position of electronic devices and components or chip is directly contacted with the upper surface of this Metal Substrate boss, since between electronic devices and components or chip and the Metal Substrate boss without heat-conducting insulated film, therefore effectively raise radiating efficiency, the conductive coefficient of whole wiring board is risen to more than the 200W/mK by maximum 10W/mK, realized the heat radiation requirement of high-power electronic component and chip, improve stability and the reliability of product, prolonged useful life.
See also Fig. 1, shown in Figure 2, Fig. 1 is the schematic perspective view of the single side printed wiring board of super-high heat-conductive performance of the present invention; Fig. 2 is the structural representation of the single side printed wiring board of super-high heat-conductive performance of the present invention.The invention provides a kind of single side printed wiring board of super-high heat-conductive performance, it is mainly used in solving present PCB conductive coefficient can't break through 10W/mK, can not realize the problem of the high heat conduction and heat radiation of high-power chip that 150W is above or electronic devices and components.
Wherein the single side printed wiring board of super-high heat-conductive performance of the present invention includes metal-based layer 1, insulating barrier 2 and copper foil layer 3, and metal-based layer 1, insulating barrier 2 are identical with the shape size of copper foil layer 3.
Metal-based layer 1 by conductive coefficient satisfy 〉=the aluminium base or conductive coefficient of 260W/mK satisfies 〉=the copper matrix manufacturing of 400W/mK forms, its thickness is made according to different pcb boards and is required differently, is preferably 1-5mm in the present embodiment; Be provided with for the boss 101 that high-power electronic component or high-power chip are installed at metal-based layer 1, designing requirement when the quantity of boss 101 is according to the making single sided board here is corresponding, can be for a plurality of, also can be one, need the quantity of the high-power chip installed or electronic devices and components relevant in concrete and the graphic designs, its position also in correspondence and the graphic designs position of high-power chip or electronic devices and components identical.
Boss 101 can obtain by the Metal Substrate that the mode of electric gong is removed the file assigned address; also can be by applying or overlaying antiacid or the alkali resistant diaphragm; expose according to working out the good figure transfer film; and will need the diaphragm of the Metal Substrate removed to develop to fall; to expose Metal Substrate; remove unwanted Metal Substrate by acid etching or alkaline etching afterwards; and the corresponding Metal Substrate of removing or the Metal Substrate thickness that etches away can be according to actual needs and different; general control is at 15um-100um in the present embodiment, so the height of boss 101 also corresponds to 15um-100um.
In addition, the shape of cross section of boss 101 is according to the shape of different chips or electronic devices and components and different, can correspond to circle, rectangle or other geometries, it is corresponding identical with the contact-making surface shape of chip or electronic devices and components, is preferably rectangle in the present embodiment.
Need to prove that boss 101 can be one-body molded with metal-based layer 1, also can combination forming, namely select the Metal Substrate of same material, make respectively, then combine.
Insulating barrier 2 is mainly made by prepreg (PP) or adhesive sheet, and is provided with corresponding with above-mentioned boss 101 positions on the insulating barrier 2 and shape size is identical first windows 201, and the concrete first window quantity of 201 is identical with boss 101.
Be provided with corresponding with above-mentioned boss 101 positions on the copper foil layer 3 and shape size is identical second windows 301; And the second window quantity of 301 is corresponding identical with the quantity of boss 101.
Brown is carried out on metal-based layer 1 surface of producing boss 101 to be processed, so that its rough surface, then insulating barrier 2 correspondences are sticked on this face, and make boss 101 correspondences be arranged in windowing on the insulating barrier 2, again copper foil layer 3 correspondences are covered on the insulating barrier 2 afterwards, and make on the insulating barrier 2 window corresponding overlapping with insulating barrier 2, and make boss 101 correspondences be arranged in windowing of insulating barrier 2, then whole metal-based layer 1, insulating barrier 2 and copper foil layer 3 are carried out lamination treatment, form the single side printed wiring board with super-high heat-conductive coefficient.
And need to prove here, the single side printed wiring board Copper Foil aspect of producing need to guarantee smooth, be to need to be on the same level face behind the upper surface lamination of the upper surface of boss 101 and copper foil layer 3, so that follow-up line pattern is made and chip and electronic devices and components are carried out the SMT processing procedure.
The chip that the present invention can install needs or the non-conductor position of electronic devices and components directly contact with the upper surface of Metal Substrate boss, thereby realize that electronic devices and components or chip Metal Substrate direct and wiring board fits tightly, to reach the conductive coefficient more than the 200W/mK, the present invention has effectively supported the fast development of high-power electronic product; Be conducive to promote the stable of the heat radiation upgrading of new-energy automobile product, high-power outdoor lighting heat radiation improvement and inter-city rail transit power module.
More than be the explanation to the single side printed wiring board of super-high heat-conductive performance of the present invention, be further described below in conjunction with the manufacture method of the single side printed wiring board of 3 pairs of super-high heat-conductive performances of the present invention of accompanying drawing.
See also shown in Figure 3ly, Fig. 3 is the making flow chart of the single side printed wiring board of super-high heat-conductive performance of the present invention.The present invention also provides a kind of manufacture method of single side printed wiring board of super-high heat-conductive performance, and it comprises that specifically step is as follows:
S1, make the metal-based layer with boss, and described lug boss position is for installing the position of high-power chip or high-power electronic component;
First-selection need to prove that the metal-based layer with boss of making is formed in one here, and its production method specifically can adopt electric gong or etching.
S101, by horizontal Plate grinder metal-based layer is carried out cleaning surfaces;
S102, removal are used for installing the lug boss position metal in addition of high-power electronic component or chip, make the metal-based layer with boss.
According to the machining file that weaves, remove the Metal Substrate of file assigned address by the mode of electric gong.
By applying or overlay antiacid or the alkali resistant diaphragm, shift the film and expose according to working out good figure, and will need the diaphragm of the Metal Substrate removed to develop to fall, to expose Metal Substrate, remove unwanted Metal Substrate by acid etching or alkaline etching afterwards.
S2, make and to have insulating barrier and the copper foil layer of windowing, make the position of windowing of insulating barrier and copper foil layer corresponding with lug boss position, and make the shape of windowing, big or small identical with the shape of cross section size of boss of insulating barrier and copper foil layer;
Wherein said insulating barrier is prepreg or adhesive sheet; Described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer or the conductive coefficient of 260W/mK satisfy 〉=base copper of 400W/mK.
The position of windowing of insulating barrier and copper foil layer should be corresponding with the lug boss position on the above-mentioned metal-based layer, and its concrete quantity also should be consistent.
S3, metal-based layer boss place face is carried out brown process, then the insulating barrier correspondence of windowing is attached on the metal-based layer, and makes the boss correspondence be arranged in windowing of insulating barrier; Afterwards the copper foil layer correspondence of windowing is covered on the insulating barrier, and make windowing of copper foil layer corresponding with windowing of insulating barrier, make the boss correspondence be arranged in windowing of copper foil layer; Then copper foil layer, insulating barrier and metal-based layer are carried out lamination, form single side printed wiring board.
Single side printed wiring board is carried out circuit, welding resistance, character technique; And carry out at last the SMT processing procedure, the non-conductor position of high-power electronic component or high-power chip is placed on the boss of metal-based layer.
The present invention rises to 200W/mK with the coefficient of heat transfer of traditional PCB electronic devices and components or chip by 10W/mK; Greatly improved stability and the reliability of high-power electronic component and high-speed computation chip, the electronic product that has supported power 〉=150W is fast-developing, has improved its useful life.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the single side printed wiring board of a super-high heat-conductive performance is characterized in that comprising:
One metal-based layer is provided with on this metal-based layer for the boss that high-power electronic component or high-power chip are installed;
One insulating barrier, this insulating barrier is identical with the metal-based layer shape size, and is provided with corresponding with above-mentioned lug boss position on the insulating barrier and shape size is identical first windows;
One copper foil layer, this copper foil layer is identical with the metal-based layer shape size, and is provided with corresponding with above-mentioned lug boss position on the copper foil layer and shape size is identical second windows;
Copper foil layer, insulating barrier are covered on the metal-based layer from top to bottom successively, and described boss correspondence is arranged in second windows and first window, and boss upper surface and copper foil layer upper surface are on the same level face.
2. the single side printed wiring board of super-high heat-conductive performance according to claim 1 is characterized in that described insulating barrier is prepreg or with the adhesive sheet of heat conduction function.
3. the single side printed wiring board of super-high heat-conductive performance according to claim 1, it is characterized in that described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer or the conductive coefficient of 260W/mK satisfy 〉=base copper of 400W/mK.
4. the single side printed wiring board of super-high heat-conductive performance according to claim 1 is characterized in that described metal-based layer and boss are one-body molded.
5. manufacture method such as the single side printed wiring board of super-high heat-conductive performance as described in the claim 1～4 is characterized in that comprising:
S1, make the metal-based layer with boss, and described lug boss position is for installing the position of high-power chip or high-power electronic component;
S2, make and to have insulating barrier and the copper foil layer of windowing, make the position of windowing of insulating barrier and copper foil layer corresponding with lug boss position, and make the shape of windowing, big or small identical with the shape of cross section size of boss of insulating barrier and copper foil layer;
S3, metal-based layer boss place face is carried out brown process, then the insulating barrier correspondence of windowing is attached on the metal-based layer, and makes the boss correspondence be arranged in windowing of insulating barrier; Afterwards the copper foil layer correspondence of windowing is covered on the insulating barrier, and make windowing of copper foil layer corresponding with windowing of insulating barrier, make the boss correspondence be arranged in windowing of copper foil layer; Then copper foil layer, insulating barrier and metal-based layer are carried out lamination, form single side printed wiring board.
6. the manufacture method of the single side printed wiring board of super-high heat-conductive performance according to claim 5 is characterized in that S1 specifically comprises:
S101, by horizontal Plate grinder metal-based layer is carried out cleaning surfaces;
S102, removal are used for installing the lug boss position metal in addition of high-power electronic component or chip, make the metal-based layer with boss.
7. the manufacture method of the single side printed wiring board of super-high heat-conductive performance according to claim 6 is characterized in that S102 comprises:
According to the machining file that weaves, remove the Metal Substrate of file assigned address by the mode of electric gong.
8. the manufacture method of the single side printed wiring board of super-high heat-conductive performance according to claim 6 is characterized in that S102 comprises:
By applying or overlay antiacid or the alkali resistant diaphragm, shift the film and expose according to working out good figure, and will need the diaphragm of the Metal Substrate removed to develop to fall, to expose Metal Substrate, remove unwanted Metal Substrate by acid etching or alkaline etching afterwards.
9. the manufacture method of the single side printed wiring board of super-high heat-conductive performance according to claim 6 is characterized in that described insulating barrier is prepreg or adhesive sheet; Described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer or the conductive coefficient of 260W/mK satisfy 〉=base copper of 400W/mK.
10. the manufacture method of the single side printed wiring board of super-high heat-conductive performance according to claim 6 is characterized in that also comprising after the S3:
Single side printed wiring board is carried out circuit, welding resistance, character technique; And carry out at last the SMT processing procedure, the non-conductor position of high-power electronic component or high-power chip is placed on the boss of metal-based layer.
The present invention also provides a kind of manufacture method of single side printed wiring board of super-high heat-conductive performance, comprising:
S1, make the metal-based layer with boss, and described lug boss position is for installing the position of high-power chip or high-power electronic component;
S2, make and to have insulating barrier and the copper foil layer of windowing, make the position of windowing of insulating barrier and copper foil layer corresponding with lug boss position, and make the shape of windowing, big or small identical with the shape of cross section size of boss of insulating barrier and copper foil layer;
S3, metal-based layer boss place face is carried out brown process, then the insulating barrier correspondence of windowing is attached on the metal-based layer, and makes the boss correspondence be arranged in windowing of insulating barrier; Afterwards the copper foil layer correspondence of windowing is covered on the insulating barrier, and make windowing of copper foil layer corresponding with windowing of insulating barrier, make the boss correspondence be arranged in windowing of copper foil layer; Then copper foil layer, insulating barrier and metal-based layer are carried out lamination, form single side printed wiring board.
Preferably, S1 specifically comprises:
S101, by horizontal Plate grinder metal-based layer is carried out cleaning surfaces;
S102, removal are used for installing the lug boss position metal in addition of high-power electronic component or chip, make the metal-based layer with boss.
Preferably, S102 comprises:
According to the machining file that weaves, remove the Metal Substrate of file assigned address by the mode of electric gong.
Preferably, S102 comprises:
By applying or overlay antiacid or the alkali resistant diaphragm, shift the film and expose according to working out good figure, and will need the diaphragm of the Metal Substrate removed to develop to fall, to expose Metal Substrate, remove unwanted Metal Substrate by acid etching or alkaline etching afterwards.
Preferably, described insulating barrier is prepreg or adhesive sheet; Described metal-based layer be conductive coefficient satisfy 〉=aluminum base layer or the conductive coefficient of 260W/mK satisfy 〉=base copper of 400W/mK.
Preferably, also comprise after the S3:
Single side printed wiring board is carried out circuit, welding resistance, character technique; And carry out at last the SMT processing procedure, the non-conductor position of high-power electronic component or high-power chip is placed on the boss of metal-based layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104726259A CN102938971A (en) | 2012-11-20 | 2012-11-20 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104726259A CN102938971A (en) | 2012-11-20 | 2012-11-20 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102938971A true CN102938971A (en) | 2013-02-20 |
Family
ID=47697815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104726259A Pending CN102938971A (en) | 2012-11-20 | 2012-11-20 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102938971A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
| WO2015078345A1 (en) * | 2013-11-26 | 2015-06-04 | 广州兴森快捷电路科技有限公司 | Boss-type metal-based sandwich rigid-flex board and preparation method therefor |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
| CN106413241A (en) * | 2016-09-09 | 2017-02-15 | 景旺电子科技(龙川)有限公司 | Manufacturing method of boss plate |
| CN106455291A (en) * | 2016-08-22 | 2017-02-22 | 景旺电子科技(龙川)有限公司 | Metal copper-based printed board structure with high heat dissipation and preparation method thereof |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN107969068A (en) * | 2017-12-22 | 2018-04-27 | 珠海欣中祺电子科技有限公司 | A kind of radiating circuit plate |
| CN108832235A (en) * | 2018-08-02 | 2018-11-16 | 浙江省嘉兴市宇凡滤波器技术有限公司 | Surface Mount dielectric waveguide filter, filter installed cassette and circuit board |
| CN108901121A (en) * | 2018-07-17 | 2018-11-27 | 景旺电子科技(龙川)有限公司 | A kind of wiring board and preparation method thereof |
| CN109922596A (en) * | 2019-03-19 | 2019-06-21 | 珠海市航达科技有限公司 | A kind of thermally conductive printed circuit board of IGBT and processing method |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110112279A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of processing method of the thermoelectricity separating base plate for LED |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
| CN113260139A (en) * | 2021-06-07 | 2021-08-13 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board with boss and processing method thereof |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101660728A (en) * | 2009-09-07 | 2010-03-03 | 南京汉德森科技股份有限公司 | Heat-radiating substrate for alternating current LED light source |
| CN201878420U (en) * | 2010-11-09 | 2011-06-22 | 深圳市富翔科技有限公司 | Radiating PCB (printed circuit board) structure |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
| CN102655714A (en) * | 2012-04-09 | 2012-09-05 | 苏睿 | Manufacturing process of metal substrate high-conductivity metal base circuit board |
| CN202889779U (en) * | 2012-11-20 | 2013-04-17 | 深圳市博敏电子有限公司 | Single side printed wiring board with superelevation heat-conducting property |
-
2012
- 2012-11-20 CN CN2012104726259A patent/CN102938971A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101660728A (en) * | 2009-09-07 | 2010-03-03 | 南京汉德森科技股份有限公司 | Heat-radiating substrate for alternating current LED light source |
| CN201878420U (en) * | 2010-11-09 | 2011-06-22 | 深圳市富翔科技有限公司 | Radiating PCB (printed circuit board) structure |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
| CN102655714A (en) * | 2012-04-09 | 2012-09-05 | 苏睿 | Manufacturing process of metal substrate high-conductivity metal base circuit board |
| CN202889779U (en) * | 2012-11-20 | 2013-04-17 | 深圳市博敏电子有限公司 | Single side printed wiring board with superelevation heat-conducting property |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
| WO2015078345A1 (en) * | 2013-11-26 | 2015-06-04 | 广州兴森快捷电路科技有限公司 | Boss-type metal-based sandwich rigid-flex board and preparation method therefor |
| US9942976B2 (en) | 2013-11-26 | 2018-04-10 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Preparation method of a boss-type metal-based sandwich rigid-flex circuit board |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
| CN106455291B (en) * | 2016-08-22 | 2019-06-11 | 景旺电子科技(龙川)有限公司 | A kind of copper-based printed board structure of high-cooling property metal and preparation method thereof |
| CN106455291A (en) * | 2016-08-22 | 2017-02-22 | 景旺电子科技(龙川)有限公司 | Metal copper-based printed board structure with high heat dissipation and preparation method thereof |
| CN106413241A (en) * | 2016-09-09 | 2017-02-15 | 景旺电子科技(龙川)有限公司 | Manufacturing method of boss plate |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN107969068A (en) * | 2017-12-22 | 2018-04-27 | 珠海欣中祺电子科技有限公司 | A kind of radiating circuit plate |
| CN108901121A (en) * | 2018-07-17 | 2018-11-27 | 景旺电子科技(龙川)有限公司 | A kind of wiring board and preparation method thereof |
| CN108832235A (en) * | 2018-08-02 | 2018-11-16 | 浙江省嘉兴市宇凡滤波器技术有限公司 | Surface Mount dielectric waveguide filter, filter installed cassette and circuit board |
| CN109922596A (en) * | 2019-03-19 | 2019-06-21 | 珠海市航达科技有限公司 | A kind of thermally conductive printed circuit board of IGBT and processing method |
| CN110112280A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of manufacture craft of thermoelectricity separate circuit boards |
| CN110112279A (en) * | 2019-05-21 | 2019-08-09 | 安捷利（番禺）电子实业有限公司 | A kind of processing method of the thermoelectricity separating base plate for LED |
| CN110112279B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Processing method of thermoelectric separation substrate for LED |
| CN110112280B (en) * | 2019-05-21 | 2020-09-01 | 安捷利（番禺）电子实业有限公司 | Manufacturing process of thermoelectric separation circuit board |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
| CN113260139A (en) * | 2021-06-07 | 2021-08-13 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board with boss and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102938971A (en) | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof | |
| CN103517557B (en) | Process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit | |
| CN202889779U (en) | Single side printed wiring board with superelevation heat-conducting property | |
| JP2008218618A (en) | Printed circuit board | |
| CN108770191B (en) | New energy automobile copper base line circuit board and manufacturing method thereof | |
| CN106982544A (en) | A kind of radiator structure of high power density Switching Power Supply | |
| CN102821584B (en) | Heat release device | |
| CN202121492U (en) | Power source and power source casing thereof | |
| KR20100131835A (en) | Radiant heat led board | |
| CN204887685U (en) | Printed circuit board and terminal with heat radiation structure | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN214099627U (en) | Intelligent power module | |
| CN203912327U (en) | Heat-radiation polyimides circuit board with metallic holes and copper core | |
| CN214592109U (en) | Circuit board with heat dissipation groove | |
| CN206575656U (en) | Concentrate heat radiating type reinforced circuit board | |
| CN104735904A (en) | Heat dissipation printed circuit board and manufacturing method thereof | |
| CN219247880U (en) | Access switch for wind power control system | |
| CN210075681U (en) | Copper-clad aluminum substrate with double copper layers and high-efficiency heat dissipation function | |
| CN107949156A (en) | A kind of double-sided wiring board | |
| US11662087B2 (en) | Power supply device and high-power illumination system | |
| CN212183811U (en) | High-precision circuit board | |
| CN105165128A (en) | Electric assembly to be mounted on top-hat rail | |
| CN217985523U (en) | Circuit board with heat dissipation protection assembly | |
| CN215499721U (en) | Circuit board with good heat dissipation performance | |
| CN219437228U (en) | Multilayer high-conductivity aluminum-based circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130220 |