CN109661098B - PCB metal hole copper embedding structure and processing technology thereof - Google Patents

PCB metal hole copper embedding structure and processing technology thereof Download PDF

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Publication number
CN109661098B
CN109661098B CN201811470353.2A CN201811470353A CN109661098B CN 109661098 B CN109661098 B CN 109661098B CN 201811470353 A CN201811470353 A CN 201811470353A CN 109661098 B CN109661098 B CN 109661098B
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hole
copper
pcb
copper block
block
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CN109661098A (en
Inventor
文明
赵铁良
张海方
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Xiamen Sihe Microelectronics Co.,Ltd.
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Shenzhen Zhongli New Energy Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Abstract

The invention discloses a PCB metal hole copper embedding structure. This PCB metal hole inlays copper structure includes: the PCB comprises a PCB board, a first through hole, a second through hole, a third through hole, a first copper block, a second copper block and a third copper block; the first through hole, the second through hole and the third through hole respectively penetrate through the PCB, the first through hole is provided with a first copper deposition hole wall, the second through hole is provided with a second copper deposition hole wall, and the third through hole is provided with a third copper deposition hole wall; the circumferences of the first copper block, the second copper block and the third copper block are all provided with teeth; the first copper block is embedded into a first through hole with a first copper deposition hole wall, the second copper block is embedded into a second through hole with a second copper deposition hole wall, and the third copper block is embedded into a third through hole with a third copper deposition hole wall. The invention also provides a processing technology of the PCB metal hole copper embedding structure, and realizes an additional copper embedding mode of the PCB except the copper embedding technology.

Description

PCB metal hole copper embedding structure and processing technology thereof
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a PCB metal hole copper embedding structure and a processing technology thereof.
Background
With the diversified development of product miniaturization and high power, the conventional multilayer flat PCB can not bear larger heat dissipation requirements, the existing PCB copper embedding process is complex, two sides of the PCB can not be completely exposed and leaked on the surface, the PCB needs to be embedded during processing, and the processing period is long. Moreover, in the existing PCB copper embedding process, copper can be only pressed in a hole without a metal wall, but not embedded in the metal hole.
Therefore, the existing PCB copper-burying process has the following defects:
(1) the existing process is only manually put in, so that the speed is slow and the efficiency is low;
(2) the single PCB is embedded with too many copper grains, and the cost of the copper embedding process is too high.
Therefore, the existing PCB manufacturing process is still to be improved and developed.
Disclosure of Invention
In order to solve the technical problems, the invention provides a PCB metal hole copper-embedded structure and a processing technology thereof.
PCB metal hole inlays copper structure includes: the PCB comprises a PCB board, a first through hole, a second through hole, a third through hole, a first copper block, a second copper block and a third copper block; the first through hole, the second through hole and the third through hole respectively penetrate through the PCB, the first through hole is provided with a first copper deposition hole wall, the second through hole is provided with a second copper deposition hole wall, and the third through hole is provided with a third copper deposition hole wall; the circumferences of the first copper block, the second copper block and the third copper block are all provided with teeth; the first copper block is embedded into a first through hole with a first copper deposition hole wall, the second copper block is embedded into a second through hole with a second copper deposition hole wall, and the third copper block is embedded into a third through hole with a third copper deposition hole wall.
In one embodiment, the tooth depth of the teeth of the first copper block, the second copper block and the third copper block is 0.15 mm.
In one embodiment, the PCB board sequentially includes, from bottom to top, an insulating layer, a conductive layer, a substrate layer, a conductive layer, and an insulating layer.
In one embodiment, the insulating layer is an ink layer, the substrate layer is a PE layer, and the conductive layer is a copper foil layer.
In one embodiment, the PCB metal hole is embedded with a copper structure, and further comprises solder paste and a chip; the chip is attached to the PCB through solder paste.
In one embodiment, the first through hole is an elliptical hole, the second through hole is a circular hole, and the third through hole is a square hole.
The invention also provides a processing technology of the PCB metal hole copper-embedded structure, which comprises the following steps:
s1: a first through hole, a second through hole and a third through hole are correspondingly formed in the positions, where the chips need to be attached, of the PCB respectively;
s2: respectively depositing copper in a first through hole, a second through hole and a third through hole, so that the first through hole is provided with a first copper deposition hole wall, the second through hole is provided with a second copper deposition hole wall, and the third through hole is provided with a third copper deposition hole wall;
s3: and designing the shapes of the corresponding first copper block with teeth, the second copper block with teeth and the third copper block with teeth according to the shapes of the first through hole, the second through hole and the third through hole.
S4: placing the PCB on an alignment jig, aligning a first copper block with teeth, a second copper block with teeth and a third copper block with teeth by an operator by using a rocking disc jig, and connecting the rocking disc jig with the PCB alignment jig by using a positioning pin and a positioning hole;
s5: and placing the aligned jig between an upper table top and a lower table top of a plane press, and embedding the toothed first copper block, the toothed second copper block and the toothed third copper block into the first through hole, the second through hole and the third through hole respectively by using the press.
The processing technology provided by the invention also comprises the following steps: after the step of S5, chips are mounted on the PCB boards by solder paste, respectively.
The invention has at least the following advantages:
according to the invention, the secondary forming of the first copper block, the second copper block, the third copper block and the PCB is realized by embedding the first copper block, the second copper block and the third copper block, the copper particles are shaken by the shaking disc jig to be quickly aligned, and finally, the pressing machine is used for pressing, so that the processing period of the PCB is reduced, the direct heat conduction among the first copper block, the second copper block, the third copper block and the PCB is realized, the defect of poor heat conduction of the PCB is solved, and another copper embedding mode except the copper embedding process of the PCB is realized.
Drawings
FIG. 1 is an exploded view of a PCB with copper via embedded structure according to an embodiment of the present invention;
FIG. 2 is a top view of the first copper block, the second copper block, and the third via of FIG. 1 of the present invention; and
fig. 3 is a schematic diagram of a processing process of a copper-embedded metal via structure of a PCB according to an embodiment of the present invention.
Reference numbers in the figures:
a PCB metal hole copper embedding structure 100, a PCB 1, a first through hole 2, a second through hole 3, a third through hole 4, a first copper block 5, a second copper block 6, a third copper block 7, solder paste 8, a chip 9, a first copper precipitation hole wall 21, a second copper precipitation hole wall 31, a third copper precipitation hole wall 41, an insulating layer 10, a conducting layer 11, a base material layer 12, a conducting layer 13, a base material layer 14, a base material layer 15, a conducting layer 16, a base material layer 17, a conducting layer 18, an insulating layer 19, a rocking disc jig 20, a positioning pin 30, a positioning hole 40, an upper table board 50 and a lower table board 60 of a plane press.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 is an exploded view of a metal via-in-copper structure of a PCB according to an embodiment of the present invention. Fig. 2 is a top view of the first copper block, the second copper block, and the third via of fig. 1 according to the present invention. Fig. 3 is a schematic diagram of a processing process of a copper-embedded metal via structure of a PCB according to an embodiment of the present invention.
Referring to fig. 1, the PCB metal via copper-embedded structure 100 includes a PCB board 1, a first through hole 2, a second through hole 3, a third through hole 4, a first copper block 5, a second copper block 6, and a third copper block 7. The first through hole 2, the second through hole 3 and the third through hole 4 respectively penetrate through the PCB 1, the first through hole 2 is provided with a first copper deposition hole wall 21, the second through hole 3 is provided with a second copper deposition hole wall 31, and the third through hole 4 is provided with a third copper deposition hole wall 41. The first copper block 5 is embedded in the first through hole 2 with the first copper deposition hole wall 21, the second copper block 6 is embedded in the second through hole 3 with the second copper deposition hole wall 31, and the third copper block 7 is embedded in the third through hole 4 with the third copper deposition hole wall 41.
Referring to fig. 2, further, the first copper block 5, the second copper block 6, and the third copper block 7 are provided with teeth on the circumference. Specifically, in the present embodiment, the tooth depth of each of the teeth of the first copper block 5, the second copper block 6, and the third copper block 7 is 0.15 mm.
The PCB board 1 sequentially comprises an insulating layer 10, a conducting layer 11, a base material layer 12, a conducting layer 13, a base material layer 14, a base material layer 15, a conducting layer 16, a base material layer 17, a conducting layer 18 and an insulating layer 19 from bottom to top. Specifically, in this embodiment, the insulating layer is an ink layer, the substrate layer is a PE layer, and the conductive layer is a copper foil layer.
The PCB metal hole is embedded with a copper structure 100, and further comprises solder paste 8 and a chip 9. The chip 9 is attached to the PCB board 1 by solder paste 8.
Specifically, in the present embodiment, the first through-hole 2 is an elliptical hole, the second through-hole 3 is a circular hole, and the third through-hole 4 is a square hole.
Referring to fig. 3, the present invention further provides a process for fabricating a copper-embedded structure of a metal via of a PCB, comprising the following steps:
s1: a first through hole 2, a second through hole 3 and a third through hole 4 are correspondingly formed in the position, where the chip 9 is required to be attached, of the PCB 1;
s2: respectively depositing copper in a first through hole 2, a second through hole 3 and a third through hole 4, so that the first through hole 2 has a first copper deposition hole wall 21, the second through hole 3 has a second copper deposition hole wall 31, and the third through hole 4 has a third copper deposition hole wall 41;
s3: the shapes of the first copper block 5 with teeth, the second copper block 6 with teeth and the third copper block 7 with teeth are designed according to the shapes of the first through hole 2, the second through hole 3 and the third through hole 4.
S4: placing the PCB 1 on an alignment jig, aligning a first copper block 5 with teeth, a second copper block 6 with teeth and a third copper block 7 with teeth by an operator by using a rocking disc jig, and connecting the rocking disc jig with the alignment jig of the PCB 1 by using a positioning pin and a positioning hole;
s5: the aligned jig is placed between an upper table surface and a lower table surface of a plane press, and a first copper block 5 with teeth, a second copper block 6 with teeth and a third copper block 7 with teeth are respectively embedded into the first through hole 2, the second through hole 3 and the third through hole 4 by the press.
The method also comprises the following steps: after the step S5, the chips 9 are mounted on the PCB board 1 by the solder paste 8, respectively.
Specifically, in the method, the PCB 1 sequentially includes, from bottom to top, an insulating layer 10, a conductive layer 11, a substrate layer 12, a conductive layer 13, a substrate layer 14, a substrate layer 15, a conductive layer 16, a substrate layer 17, a conductive layer 18, and an insulating layer 19. Specifically, in this embodiment, the insulating layer is an ink layer, the substrate layer is a PE layer, and the conductive layer is a copper foil layer.
Specifically, in the method, the tooth depth of the teeth of the first copper block 5, the second copper block 6 and the third copper block 7 is 0.15 mm.
Specifically, in the method, the first through hole 2 is an elliptical hole, the second through hole 3 is a circular hole, and the third through hole 4 is a square hole.
The invention has at least the following advantages:
according to the invention, the secondary forming of the first copper block 5, the second copper block 6, the third copper block 7 and the PCB 1 is realized by embedding the first copper block 5, the second copper block 6 and the third copper block 7, the copper particles are shaken by a rocking disc jig to be quickly aligned, and finally, the pressing machine is used for pressing, so that the processing period of the PCB 1 is reduced, the direct heat conduction among the first copper block 5, the second copper block 6, the third copper block 7 and the PCB 1 is realized, the defect of poor heat conduction of the PCB is solved, and an additional copper embedding mode except a copper embedding process of the PCB is realized.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (7)

1. The utility model provides a PCB metal hole inlays copper structure which characterized in that includes: the PCB comprises a PCB board, a first through hole, a second through hole, a third through hole, a first copper block, a second copper block and a third copper block; the first through hole, the second through hole and the third through hole respectively penetrate through the PCB, the first through hole is provided with a first copper deposition hole wall, the second through hole is provided with a second copper deposition hole wall, and the third through hole is provided with a third copper deposition hole wall; the circumferences of the first copper block, the second copper block and the third copper block are all provided with teeth; the first copper block is embedded into a first through hole with a first copper precipitation hole wall, the second copper block is embedded into a second through hole with a second copper precipitation hole wall, and the third copper block is embedded into a third through hole with a third copper precipitation hole wall;
the processing technology of the PCB metal hole copper embedding structure is characterized by comprising the following steps:
s1: a first through hole, a second through hole and a third through hole are correspondingly formed in the positions, where the chips need to be attached, of the PCB respectively;
s2: respectively depositing copper in a first through hole, a second through hole and a third through hole, so that the first through hole is provided with a first copper deposition hole wall, the second through hole is provided with a second copper deposition hole wall, and the third through hole is provided with a third copper deposition hole wall;
s3: designing the shapes of the corresponding first copper block with teeth, the second copper block with teeth and the third copper block with teeth according to the shapes of the first through hole, the second through hole and the third through hole;
s4: placing the PCB on an alignment jig, aligning a first copper block with teeth, a second copper block with teeth and a third copper block with teeth by an operator by using a rocking disc jig, and connecting the rocking disc jig with the PCB alignment jig by using a positioning pin and a positioning hole;
s5: and placing the aligned jig between an upper table top and a lower table top of a plane press, and embedding the toothed first copper block, the toothed second copper block and the toothed third copper block into the first through hole, the second through hole and the third through hole respectively by using the press.
2. The PCB metal hole copper embedding structure of claim 1, wherein the teeth of the first copper block, the second copper block and the third copper block have a tooth depth of 0.15 mm.
3. The PCB metal hole-embedded copper structure of claim 1, wherein the PCB comprises an insulating layer, a conductive layer, a substrate layer, a conductive layer and an insulating layer from bottom to top.
4. The PCB metal hole-embedded copper structure of claim 3, wherein the insulating layer is an ink layer, the substrate layer is a PE layer, and the conductive layer is a copper foil layer.
5. The PCB metal via-in-copper structure of claim 1, further comprising solder paste and a chip; the chip is attached to the PCB through solder paste.
6. The PCB metal hole copper embedding structure of any one of claims 1 to 5, wherein the first through hole is an elliptical hole, the second through hole is a circular hole, and the third through hole is a square hole.
7. The PCB metal via-in-copper structure of claim 1, further comprising: after the step of S5, chips are mounted on the PCB boards by solder paste, respectively.
CN201811470353.2A 2018-12-04 2018-12-04 PCB metal hole copper embedding structure and processing technology thereof Active CN109661098B (en)

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CN109661098B true CN109661098B (en) 2020-08-25

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114364130A (en) * 2021-12-22 2022-04-15 鹤山市中富兴业电路有限公司 Manufacturing method of copper-embedded column PCB

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161756A (en) * 1988-12-15 1990-06-21 Furukawa Electric Co Ltd:The Electrically insulated heat pipe cooling device
CN201789685U (en) * 2010-08-25 2011-04-06 深圳中富电路有限公司 Copper block for board embedded with same
CN104853523A (en) * 2015-05-18 2015-08-19 惠州市金百泽电路科技有限公司 Buried and embedded copper block PCB manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9101084B2 (en) * 2011-12-30 2015-08-04 Peking University Founder Group Co., Ltd. Method of fabricating PCB board and PCB board
CN105072829A (en) * 2015-08-21 2015-11-18 昆山大洋电路板有限公司 Thick copper plate single-sided pressing process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161756A (en) * 1988-12-15 1990-06-21 Furukawa Electric Co Ltd:The Electrically insulated heat pipe cooling device
CN201789685U (en) * 2010-08-25 2011-04-06 深圳中富电路有限公司 Copper block for board embedded with same
CN104853523A (en) * 2015-05-18 2015-08-19 惠州市金百泽电路科技有限公司 Buried and embedded copper block PCB manufacturing method

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Effective date of registration: 20210930

Address after: 361000 room 1624, 16 / F, building e, Xiamen center, No. 567, Haicang Avenue, Haicang District, Xiamen City, Fujian Province

Patentee after: Xiamen Sihe Microelectronics Co.,Ltd.

Address before: 518000 South Huancheng Road, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province 67-1

Patentee before: SHENZHEN ZHONGLI NEW ENERGY TECHNOLOGY Co.,Ltd.