CN202884521U - Light-emitting diode (LED) module with high thermal conductivity structure - Google Patents
Light-emitting diode (LED) module with high thermal conductivity structure Download PDFInfo
- Publication number
- CN202884521U CN202884521U CN2012202504979U CN201220250497U CN202884521U CN 202884521 U CN202884521 U CN 202884521U CN 2012202504979 U CN2012202504979 U CN 2012202504979U CN 201220250497 U CN201220250497 U CN 201220250497U CN 202884521 U CN202884521 U CN 202884521U
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- led
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- heat radiation
- wiring board
- heat conduction
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Abstract
The utility model relates to a light-emitting diode (LED) module with a high thermal conductivity structure. The LED module with the high thermal conductivity structure comprises an LED, an LED circuit board and a stereoscopic heat dissipation support lamp carrier, wherein the LED is provided with an electrode pin and a heat conduction foot, and the LED circuit board comprises a circuit layer and an insulating layer, a through hole which penetrates through the LED circuit board is formed in the position, corresponding to the heat conduction foot, of the LED circuit board, the stereoscopic heat dissipation support lamp carrier is combined on one side of the insulating layer, the heat conduction foot of the LED is adhered or combined on the stereoscopic heat dissipation support lamp carrier through the through hole which penetrates through the LED circuit board and. Thermal resistance of the circuit layer, the insulating layer, a gluing layer and the like is removed in the LED module, heat produced by the LED is directly transmitted on the stereoscopic heat dissipation support lamp carrier through the heat conduction foot, the heat produced can be conducted and diffused rapidly, reliability of the LED module product is improved, service life of the LED module product is prolonged, and the LED module with the high thermal conductivity structure is simple in manufacture method and economic and practical.
Description
Technical field
The utility model relates to the LED application, is specifically related to a kind of LED module of high conductive structure.
Background technology
The heat of tradition LED all is to support the light fixture carrier and distribute through LED base → tin cream weld layer → line layer → insulating barrier → aluminium base → heat conductive silica gel or heat-conducting silicone grease → solid heat radiation, the thermal resistance of these multilayers, still it is the insulating barrier of thermal conductivity factor minimum, can hinder the conduction velocity of heat, the heat conduction is very slow, the continuous cumulative rises of temperature, dissipation of heat is not gone out, product just is under a kind of condition of high temperature for a long time like this, also has been subject to certain impact in the reliability of its product and service life.According to the interrelated data analysis, nearly 70% fault all is to cause owing to the operating temperature of LED is too high in the application of LED.
Therefore, how to reduce thermal resistance, the heat that LED is produced can distribute as soon as possible, all is a difficult problem of LED industry all the time, and along with LED uses and develops rapidly in every field, it is just more and extremely more urgent to solve this difficult problem.
In order to address this problem, the utility model forms a through hole at the wiring board of the heat conduction pin correspondence position of LED, three-dimensional heat radiation is supported the heat conduction pin welding direct by the through hole of wiring board and LED of light fixture carrier and is fitted, greatly shorten the heat transfer distances of LED, when LED works, the heat that LED is produced directly passes on the three-dimensional heat radiation support light fixture carrier, and the heat that LED is produced can conduct as early as possible and distribute.Improved reliability and the life-span of product, and the LED module preparation method of this a kind of high conductive structure is simple, economical and practical.
The utility model content
Particularly, the utility model has disclosed a kind of LED module of high conductive structure, comprising: LED, described LED have electrode pin and heat conduction pin; The LED wiring board that comprises line layer and insulating barrier wherein, is provided with the through hole that passes described LED wiring board in the position corresponding with described heat conduction pin; The light fixture carrier is supported in the solid heat radiation that is combined in described insulating barrier one side; Wherein, the heat conduction pin of described LED is fitted via through hole or is combined in described three-dimensional heat radiation and supports on the light fixture carrier.
The LED module of this structure, the thermal impedance of line layer, insulating barrier, adhesive layer etc. has been lacked in the centre, the heat that LED is produced directly passes on the three-dimensional heat radiation support light fixture carrier by the heat conduction pin, the heat of generation can be conducted and distribute as early as possible, reliability and the life-span of product have been improved, and the LED module preparation method of this high conductive structure is simple, economical and practical.
According to an embodiment of the present utility model, described three-dimensional heat radiation is supported the light fixture carrier and is bonded on the described LED wiring board.
According to an embodiment of the present utility model, described three-dimensional heat radiation is supported the light fixture carrier and is bonded on the described LED wiring board by the heat curing-type adhesive layer.
According to an embodiment of the present utility model, it is that the light fixture carrier is supported in the solid heat radiation that is provided with radiating fin that the light fixture carrier is supported in described three-dimensional heat radiation.
According to an embodiment of the present utility model, the heat conduction of described LED was worn described through hole and directly was fitted on the surface of described three-dimensional heat radiation support light fixture carrier.
According to an embodiment of the present utility model, the heat conduction pin of described LED is welded on the described three-dimensional heat radiation support light fixture carrier by the tin cream that is filled in the described through hole, and the described electrode pin of described LED also is welded on the pad of described line layer.
According to an embodiment of the present utility model, described three-dimensional heat radiation is supported the light fixture carrier and is had boss in the position corresponding with the described through hole of described LED wiring board, described boss passes described through hole and described heat conduction hem facing is closed or combination, and described boss is concordant with the pad on the described line layer or near concordant.
According to an embodiment of the present utility model, the heat conduction pin of described LED is welded on the described boss by the tin cream that is filled in the described through hole, and the described electrode pin of described LED also is welded on the pad of described line layer.
According to an embodiment of the present utility model, described LED wiring board also comprises the solder mask that covers on the described line layer.
According to an embodiment of the present utility model, described LED module is made into LED illuminating module, LED bulb lamp, LED street lamp, LED fluorescent tube, LED panel light, LED shot-light, LED Down lamp or LED sign module.。
According to an embodiment of the present utility model, the through hole of the described heat conduction pin of described LED by the LED wiring board directly is welded on described three-dimensional heat radiation and supports on the light fixture carrier or directly be welded on described three-dimensional heat radiation and support on the described boss of light fixture carrier, and the described electrode pin of described LED is welded on the pad of described line layer.
According to an embodiment of the present utility model, described LED wiring board is FPC or rigidity wiring board.
According to an embodiment of the present utility model, the solid heat radiation that described three-dimensional heat radiation support light fixture carrier is the plane is supported the solid heat radiation of light fixture carrier or stereochemical structure and is supported the light fixture carrier.
According to an embodiment of the present utility model, described through hole is in the position of corresponding LED heat conduction pin, the solder mask of break-through wiring board, line layer, insulating barrier and form and penetrate the through hole that whole wiring board forms.
According to an embodiment of the present utility model, described boss is the position of corresponding LED heat conduction pin, supports in solid heat radiation that mode that the light fixture carrier adopts the mode of chemical etching or machining forms.
According to an embodiment of the present utility model, three-dimensional heat radiation is supported boss on the light fixture carrier and passed through hole on the wiring board, and is concordant with the pad of wiring board or near concordant.
According to the utility model, also specifically disclosed a kind of LED module of high conductive structure, can be on circuit board, a through hole is opened in the position corresponding with LED heat conduction pin; Supporting the contraposition of light fixture carrier with the solid heat radiation is pasted together, the heat conduction pin of LED directly is welded on three-dimensional heat radiation via the through hole of LED wiring board and supports on the light fixture carrier or directly be welded on three-dimensional heat radiation and support on the described boss of light fixture carrier, boss can be concordant with the LED pad of wiring board, and the electrode pin of LED is welded on the pad of line layer.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic cross-section according to a wiring board of making of the utility model one preferred embodiment.
Fig. 2 for according to the utility model one preferred embodiment with the cross sectional representation of wiring board after position corresponding to LED heat conduction pin forms through hole.
Fig. 3 is the schematic cross-section after adhesive layer is coated at the back side that is provided with the wiring board of through hole shown in Figure 2.
Fig. 4 is the schematic cross-section that supports the light fixture carrier according to the solid heat radiation of the utility model one preferred embodiment.
Fig. 5 supports the light fixture carrier at the schematic cross-section of the good boss of position processing and fabricating corresponding to LED heat conduction pin according to the solid heat radiation of the utility model one preferred embodiment.
Fig. 6 passes the cross section structure schematic diagram that the through hole contraposition of wiring board is pasted together for the boss that solid heat radiation is supported the light fixture carrier according to the utility model one preferred embodiment.
Fig. 7 is the schematic cross-section according to the LED module of the high conductive structure that will finish making of the utility model one preferred embodiment, wherein the LED electrode welding in the circuit board, the heat conduction pin directly is fitted in three-dimensional heat radiation and supports on the boss of light fixture carrier.
Fig. 8 is for supporting the cross section structure schematic diagram that light fixture carrier and wiring board contraposition are pasted together according to the utility model one preferred embodiment solid is dispelled the heat.
Fig. 9 is the schematic cross-section according to the LED module of the high conductive structure that will finish making of the utility model one preferred embodiment, wherein the LED electrode welding in the circuit board, heat conduction pin directly welding is fitted in three-dimensional heat radiation and supports on the light fixture carrier.
The specific embodiment
Specific embodiment below in conjunction with a kind of LED module of high conductive structure comes the utility model is described in more detail.But, it will be appreciated by those skilled in the art that these embodiments have only enumerated some specific embodiment of the present utility model, to the utility model and protection domain thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these specific embodiments under the situation of understanding basic conception of the present utility model, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.
In the utility model, " circuit " and " circuit " can use sometimes interchangeably.
The concrete example of the below take LED as components and parts described preferred embodiment of the present utility model.
1, according to an exemplary of the present utility model, adopt conventional method for manufacturing circuit board, through pressing dry film, figure shifts with single-side coated copper plate, exposure, develop, etching pastes epiphragma, then pass through pressing, character silk printing, OSP processes, and obtains the conventional line plate (as shown in Figure 1) that is comprised of insulating barrier 3, line layer 4, solder mask 5 as shown in Figure 1.Certainly, it will be understood by those skilled in the art that wiring board shown in Figure 1 only is illustrative rather than restrictive, other conventional one-sided circuit board, double-sided wiring board, multiaspect wiring board etc. all belong in the scope of the present utility model.
Because above processing step is the traditional handicraft of printed substrate, belongs to well known to those of ordinary skill in the art, just no longer carefully state at this.
2, with the wiring board of making, in position corresponding to LED heat conduction pin, use die punching, go out solder mask 5, the line layer 4 of break-through wiring board, the through hole 10 (as shown in Figure 2) of insulating barrier 3.
3, at the back side of the wiring board of making through hole 10, be coated with the adhesive layer 2 (as shown in Figure 3) of last layer heat curing-type.
4, solid heat radiation that will be is as shown in Figure 4 supported light fixture carrier 1 and fit together with the wiring board contraposition that scribbles heat curing-type adhesive layer 2, and is bonding with 150 ℃ to 180 ℃ 30 to 60 minutes hot-press solidifyings of PCB pressing machine that perseverance reaches, thereby obtains structure as shown in Figure 8.
Perhaps light fixture carrier 1 is supported in solid heat radiation as shown in Figure 4, in the position corresponding with LED heat conduction pin, process boss 8 (as shown in Figure 5) with the method for chemical etching or the method for machining.Solid heat radiation being supported through hole 10 that boss 8 on the light fixture carrier 1 passes wiring board will coat the wiring board of heat curing-type adhesive layer 2 and support the contraposition of light fixture carrier with three-dimensional heat radiation and fit together again, bonding with 150 ℃ to 180 ℃ 30 to 60 minutes hot-press solidifyings of PCB pressing machine that perseverance reaches, thus it is concordant with the pad of wiring board or near concordant structure (as shown in Figure 6) to form boss 8.
5, then the pad on the wiring board is carried out the anti-oxidant surface treatment of OSP, so that follow-up welding sequence and guarantee good thermal diffusivity.Above technique belongs to traditional handicraft, belongs to well known to those of ordinary skill in the art, just no longer carefully states at this.
6, SMT welding component.
According to a preferred embodiment, when SMT welding LED components and parts 9, adopt traditional SMT welding procedure, support the pad locations that light fixture carrier wiring board is used for welding component in the solid heat radiation of showing structure such as Fig. 6, with tin cream in the steel mesh printing, then be attached on the corresponding pad of wiring board through the electrode pin 6 of automatic placement machine with LED components and parts 9, heat conduction pin 7 correspondences with LED fit on the boss 8 of three-dimensional heat radiation support light fixture carrier simultaneously, through the reflow machine welding, just obtain cross section structure as shown in Figure 7.Like this, referring to for example shown in Figure 7, the heat conduction pin 7 of LED components and parts 9 just directly fits to three-dimensional heat radiation and supports on the boss 8 of light fixture carrier, so that LED components and parts 9 support the heat transfer circuit of light fixture carrier through having lacked tin cream weld layer, line layer, insulating barrier, adhesive layer to three-dimensional heat radiation, greatly shortened heat transfer distances, the heat that LED is produced directly passes on the three-dimensional heat radiation support light fixture carrier by the heat conduction pin, and the heat of generation can be conducted and distribute as early as possible.
Or according to another preferred embodiment, when SMT welding LED components and parts 9, adopt traditional SMT welding procedure, support the pad locations that light fixture carrier wiring board is used for welding component in the solid heat radiation of showing structure such as Fig. 8, with tin cream in the steel mesh printing, then be attached on the corresponding pad of wiring board through the electrode pin 6 of automatic placement machine with LED components and parts 9, heat conduction pin 7 correspondences with LED fit on the tin cream 11 at three-dimensional heat radiation support light fixture carrier wiring board through hole 10 places simultaneously, through the reflow machine welding, just obtain cross section structure as shown in Figure 9.Like this, referring to for example shown in Figure 9, the heat conduction pin 7 of LED components and parts 9 just directly is welded on the three-dimensional heat radiation support light fixture carrier by the tin cream 11 at wiring board through hole 10 places, so that LED components and parts 9 are when work, the heat that LED is produced directly passes on the three-dimensional heat radiation support light fixture carrier by heat conduction pin 7, and the heat of generation can be conducted and distribute as early as possible.
Because above-mentioned SMT technique belongs to traditional components and parts attachment process, belong to those skilled in the art and know, just no longer carefully state at this.
Below with a kind of specific embodiment and manufacture craft thereof of heat radiating type circuit board the utility model is described in detail by reference to the accompanying drawings.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (9)
1. the LED module of a high conductive structure is characterized in that, described LED module comprises:
LED, described LED have electrode pin and heat conduction pin;
The LED wiring board that comprises line layer and insulating barrier wherein, is provided with the through hole that passes described LED wiring board in the position corresponding with described heat conduction pin;
The light fixture carrier is supported in the solid heat radiation that is combined in described insulating barrier one side;
Wherein, the heat conduction pin of described LED is fitted via described through hole or is combined in described three-dimensional heat radiation and supports on the light fixture carrier.
2. LED module according to claim 1 is characterized in that: described three-dimensional heat radiation is supported the light fixture carrier and is bonded on the described LED wiring board.
3. LED module according to claim 2 is characterized in that: described three-dimensional heat radiation is supported the light fixture carrier and is bonded on the described LED wiring board by the heat curing-type adhesive layer.
4. LED module according to claim 1 is characterized in that: it is that the light fixture carrier is supported in the solid heat radiation that is provided with radiating fin that the light fixture carrier is supported in described three-dimensional heat radiation.
5. each described LED module according to claim 1-4 is characterized in that: the heat conduction of described LED was worn described through hole and directly was fitted on the surface of described three-dimensional heat radiation support light fixture carrier.
6. each described LED module according to claim 1-4, it is characterized in that: the heat conduction pin of described LED is welded on the described three-dimensional heat radiation support light fixture carrier by the tin cream that is filled in the described through hole, and the described electrode pin of described LED also is welded on the pad of described line layer.
7. each described LED module according to claim 1-4, it is characterized in that: described three-dimensional heat radiation is supported the light fixture carrier and is had boss in the position corresponding with the described through hole of described LED wiring board, described boss passes described through hole and described heat conduction hem facing is closed or combination, and described boss is concordant with the pad on the described line layer or near concordant.
8. LED module according to claim 7, it is characterized in that: the heat conduction pin of described LED is welded on the described boss by the tin cream that is filled in the described through hole, and the described electrode pin of described LED also is welded on the pad of described line layer.
9. each described LED module according to claim 1-4, it is characterized in that: described LED wiring board also comprises the solder mask that covers on the described line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202504979U CN202884521U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with high thermal conductivity structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202504979U CN202884521U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with high thermal conductivity structure |
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| Publication Number | Publication Date |
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| CN202884521U true CN202884521U (en) | 2013-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012202504979U Expired - Lifetime CN202884521U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with high thermal conductivity structure |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103277770A (en) * | 2013-06-19 | 2013-09-04 | 苏州信亚科技有限公司 | Efficiently-radiating LED panel light for clean room |
| CN104185361A (en) * | 2014-08-19 | 2014-12-03 | 曹欣纪 | Aluminum substrate and preparing method thereof |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| CN105674070A (en) * | 2016-01-18 | 2016-06-15 | 于兆成 | Waterproof coating technology LED character-pattern circuit board light source |
| CN107087382A (en) * | 2017-06-21 | 2017-08-22 | 中国电子科技集团公司第二十九研究所 | A kind of heat-radiating integrated transceiver architecture of antenna and preparation method |
| CN107172803A (en) * | 2017-06-27 | 2017-09-15 | 广东长虹电子有限公司 | A kind of electronic equipment of high radiating |
| CN111983849A (en) * | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | LED backlight module |
-
2012
- 2012-05-21 CN CN2012202504979U patent/CN202884521U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103277770A (en) * | 2013-06-19 | 2013-09-04 | 苏州信亚科技有限公司 | Efficiently-radiating LED panel light for clean room |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| CN104185361A (en) * | 2014-08-19 | 2014-12-03 | 曹欣纪 | Aluminum substrate and preparing method thereof |
| CN104185361B (en) * | 2014-08-19 | 2017-02-15 | 曹欣纪 | Aluminum substrate and preparing method thereof |
| CN105674070A (en) * | 2016-01-18 | 2016-06-15 | 于兆成 | Waterproof coating technology LED character-pattern circuit board light source |
| CN107087382A (en) * | 2017-06-21 | 2017-08-22 | 中国电子科技集团公司第二十九研究所 | A kind of heat-radiating integrated transceiver architecture of antenna and preparation method |
| CN107172803A (en) * | 2017-06-27 | 2017-09-15 | 广东长虹电子有限公司 | A kind of electronic equipment of high radiating |
| CN107172803B (en) * | 2017-06-27 | 2019-12-03 | 广东长虹电子有限公司 | A kind of electronic equipment of high heat dissipation |
| CN111983849A (en) * | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | LED backlight module |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130417 |