CN102927483A - Integrated flip type LED illuminating assembly - Google Patents
Integrated flip type LED illuminating assembly Download PDFInfo
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- CN102927483A CN102927483A CN2012104725951A CN201210472595A CN102927483A CN 102927483 A CN102927483 A CN 102927483A CN 2012104725951 A CN2012104725951 A CN 2012104725951A CN 201210472595 A CN201210472595 A CN 201210472595A CN 102927483 A CN102927483 A CN 102927483A
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Abstract
The invention relates to an integrated flip type LED (Light Emitting Diode) illuminating assembly. The integrated flip type LED illuminating assembly comprises an LED circuit, a glass carrier for bearing the LED circuit as well as a flip type LED chip which is directly welded in a flip way and is packaged on the glass carrier, wherein the LED circuit and the flip type LED chip are integrated on the glass carrier. According to the integrated flip type LED illuminating assembly, the heat radiating performance and the light emitting performance of the LED lamp are greatly improved and a traditional LED circuit board structure is omitted, so that materials and the labor cost are greatly saved. The glass has favorable light transmitting performance, so that the glass can be used as an outer protecting structure of the LED lamp, fox example, the glass is directly used as a lamp tube of the LED lamp. Therefore, the materials, the price and the mounting cost are further saved.
Description
Technical field
The present invention relates to the LED lighting field, be specifically related to a kind of novel integrated upside-down mounting type LED light fixture that has.
Background technology
In the LED lighting of prior art, generally all be to adopt packaged LED on tradition (flexibility) wiring board independently, then external circuits forms.
No matter the FPC of prior art is single sided board, dual platen or multi-panel, generally all adopts copper material or Cu alloy material as wiring material layer.For example, in traditional double-faced flexible wiring board, the structure of its FPC is, the centre is a layer insulating (for example being made by typical PI material), be respectively equipped with the line layer that Copper Foil is made on the two sides of insulating barrier, be respectively equipped with the covering rete that (for example mode of bonding, coating, coating or printing) play protective action (be typically CVL or relevant can resistant to elevated temperatures PVC class insulating materials) in the outside of this two-layer line layer.
The defective of the FPC of this prior art is many-sided.One of them important defective is that independent wiring board need to be arranged, thereby material cost or purchase cost are high.In addition, LED is encapsulated on the led circuit of wiring board, and this led circuit generally is to place on the insulating barrier.The material of insulating barrier has many kinds, and wherein the most commonly used is polytetrafluoroethylene (PTFE), polyimides, polyester and PI (PI) material.Polyimide material has non-flammable, physical dimension is stable, has higher tensile strength, and the ability with the welding temperature of bearing, polyester is also referred to as PETG (being called for short PET), its physical property is similar to polyimides, have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester presents rigidity in cryogenic applications.These materials all can be used for forming insulating barrier.
But this class insulating layer material has common shortcoming, and the heat conductivility that is exactly them is all very poor, and generally speaking, their thermal conductivity factor is generally approximately between the 0.08-0.3W/mK.The not vaporific heat dissipation problem of heat when this can cause LED work, thereby service life, durability and the reliability of reduction LED.Therefore, the LED ligthing paraphernalia of prior art, particularly great power LED utensil also need to add larger radiator structure, and this has not only increased cost, but also are difficult for installing and carrying, and have affected the use field.
Moreover, this base polymer adopts the situation that also is difficult to adapt to follow-up welding LED, for example soldering, eddy-current heating welding etc.
In addition, because it is long that traditional formal dress type LED has thermally conductive pathways, thermal resistance is larger, and the electrode of this structure and the lead-in wire also can block part light bright dipping etc. defective, traditional formal dress type led chip is not optimum for light extraction efficiency and the hot property of whole device.Not enough in order to overcome formal dress type led chip, developed flip chip type led chip (Flip chip) technology.
The package method of flip chip type led chip for example, at first preparation has the large scale led chip of suitable eutectic welding, the silicon substrate for preparing simultaneously corresponding size, and make the golden conductive layer of eutectic welding electrode thereon and draw conductive layer (ultrasonic wave gold ball bonding point).Then, utilize the eutectic welding equipment that large scale flip chip type led chip and (silicon) substrate is welded together.
In the flip chip type LED of prior art, the direct face-down bonding of the both positive and negative polarity of flip chip type led chip is on (silicon) substrate and flip chip type LED is provided, when using, also need (silicon) substrate of this flip chip type LED is installed on device or its heat abstractor with for example heat-conducting glue, form final LED luminescent device.The LED encapsulating structure of this LED luminescent device and technique more complicated, although adopted heat-conducting glue, because the heat conductivility of heat-conducting glue itself is limited, and the heat radiation number of plies is many, and therefore path length also can cause high thermal resistance, and heat dispersion is not good etc.
Therefore, along with LED illumination use more and more extensive, need that objectively more superior LED illuminating material is arranged, structure and compacter, cost is lower, thermal diffusivity and the higher LED ligthing paraphernalia of reliability.
This area needs integrated LED light fixture, to satisfy the needs of above-mentioned LED ligthing paraphernalia.More need in the art integrated upside-down mounting type LED light fixture, in order to further satisfy in the technical development more high-power LED illuminator tool and the more demand of high light-emitting rate.
Need with other in view of the above, and proposed the present invention.
Summary of the invention
In view of the above, the present invention has been proposed.The present invention is intended to solve above technical problem with other.
According to a basic conception of the present invention, adopt glass directly to be arranged in circuit on glass as the supporting body of led circuit, thereby replace existing insulation layer structure, and the flip chip type led chip directly is encapsulated on the led circuit on glass, omitted traditional board structure of circuit, greatly shortened processing step, greatly saved process costs, material cost, and simplified the structure of LED illuminating device and reduced assembly cost.
According to another design of the present invention, on the integrated led circuit on described glass carrier of flip chip type led chip, with further raising luminous efficiency, improve heat dispersion and reduce manufacturing cost.
Particularly, because LED ligthing paraphernalia of the present invention has omitted traditional insulating barrier of thermal conductivity and poor heat resistance, directly the flip chip type led chip is integrated on the glass carrier that thermal conductivity and heat resistance want more advantageous and light transmission is splendid, therefore will greatly improve thermal diffusivity and heat resistance, improve light transmission, and can greatly simplify device architecture and production cost.
According to the present invention, a kind of integrated upside-down mounting type LED light fixture is provided, comprising: led circuit; Carry the glass carrier of described led circuit; With direct face-down bonding and the flip chip type led chip on being encapsulated on the described glass carrier, wherein, described led circuit and flip chip type led chip are integrated on described glass carrier.
According to a preferred embodiment of the invention, described led circuit is one or more directly to be combined in the plain conductor on the described glass carrier; Or directly be printed on conductive rubber on the described glass carrier, conduction lotion or conduction slurry.
According to a preferred embodiment of the invention, described plain conductor is directly to be bonded in copper on the described glass carrier or copper alloy band, aluminum or aluminum alloy band.
According to a preferred embodiment of the invention, described glass carrier is provided with the groove of predetermined circuit patterns, the metal melting fluid is poured into a mould or is poured in form described led circuit in the described groove.
According to a preferred embodiment of the invention, be furnished with welding resistance printing ink in the side of the described led circuit of carrying of described glass carrier, be preferably transparent welding resistance printing ink.
According to a preferred embodiment of the invention, also comprise being arranged in being connected and being spaced from the pad of a segment distance with described led circuit conduction on the described glass carrier, the solder bump on the described flip chip type led chip directly welds with described pad alignment.
According to a preferred embodiment of the invention, also comprise additional heat sink, the spaced apart segment distance of described heat sink and described led circuit.
According to a preferred embodiment of the invention, heat sink and described pad directly in conjunction with or from described pad, directly draw.
According to a preferred embodiment of the invention, heat sink can be silicon plate or ceramic wafer, for example the silicon nitride plate.
According to a preferred embodiment of the invention, heat sink also can be the good metallic plate of heat conductivility, for example copper coin, aluminium sheet, the perhaps heat-conducting glue of printing.
According to a preferred embodiment of the invention, described plain conductor is metal band, and described glass is the glass plate with slot, and wherein, described metal band directly is inserted in provides described led circuit in the described slot.
According to a preferred embodiment of the invention, also comprise: be arranged on the reflector layer on the side of the described flip chip type led chip of installation of described glass carrier; Perhaps, be arranged on reflector layer on the side of the described flip chip type led chip of not installing of described glass carrier.
According to a preferred embodiment of the invention, described reflector layer is aluminium film, silverskin, silver-colored reflector layer or white insulation reflective membrane.
According to a preferred embodiment of the invention, described led circuit is the conductive silver paste of direct serigraphy on described glass carrier.
According to a preferred embodiment of the invention, described led circuit is the tin cream of direct serigraphy on described glass carrier.
According to a preferred embodiment of the invention, described glass carrier is glass bulb, and wherein said led circuit is carried on the inboard of described glass bulb.
According to a preferred embodiment of the invention, described reflector layer is aluminium film or silver-colored reflector layer.
According to a preferred embodiment of the invention, described reflector layer is white insulation reflective membrane.
According to a preferred embodiment of the invention, described glass carrier is glass tube, and wherein said led circuit is carried on the inside of described glass tube.
According to a preferred embodiment of the invention, on the described led circuit LED rectifier is installed also.
According to the present invention, owing to adopt glass to replace existing insulation layer structure as the supporting body of led circuit, and directly be encapsulated in the flip chip type led chip on glass.The thermal conductivity of glass be existing insulating layer material thermal conductivity 5-10 doubly about, therefore will greatly improve the heat dispersion of LED lamp.
Moreover, owing to can adopt direct installation of COB mode to be integrated on the glass carrier flip chip type led chip and other electronic devices and components, have therefore in fact omitted traditional LED circuit board structure, this will greatly save material and cost of labor again.
In addition, because glass itself has good light transmission, so itself namely can be used as the outer safeguard structure of LED lamp, for example directly as the fluorescent tube of LED lamp.Therefore, this will further save material, price and installation cost again.
Moreover, because glass can free forming and processing, therefore glass is in conduct insulation, heat radiation, printing opacity carrier, can also process all kinds of secondary optics curved surfaces, so that the light that LED is sent carries out various secondary optics shapings and processing, to be applied to all kinds of specific occasions, stage lighting for example, etc.
Therefore, the present invention is representing important breakthrough and the improvement for traditional LED lighting field.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present invention.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
By reading in conjunction with the following drawings this specification, it is more apparent that features, objects and advantages of the invention will become, in the accompanying drawings:
Fig. 1 is according to an embodiment of the invention as the glass plate of carrier.
Fig. 2 has schematically shown the metal band as the LED circuit on being bonded in of one embodiment of the invention glass plate shown in Figure 1.
Fig. 3 has schematically shown the flip chip type LED on being connected in of one embodiment of the invention LED circuit shown in Figure 2, and wherein the flip chip type led chip directly is encapsulated on the glass carrier.
Fig. 4 has schematically shown similarly another embodiment of structure of the present invention and shown in Figure 3, difference is, additional heat sink on the glass carrier also is provided.
The specific embodiment
The below will be described in more detail the present invention.
Glass is a kind of transparent, airtight, and the material of tool certain degree of hardness.Glass is chemical inertness in surroundings, also can not work with biology.Glass generally is insoluble to acid (exception: hydrofluoric acid and glass reaction generate SiF4, thereby cause the corrosion of glass); But be dissolved in highly basic, for example cesium hydroxide.
The glass of narrow sense is defined as: the inorganic substances of crystallization do not occur in fused mass in cooling procedure.According to this definition, with the additive method beyond the fusion method, the amorphous substance of making such as methods such as vacuum evaporation, radiation exposure, gel heating can not be called glass.Also have the amorphous metal and the amorphous polymers material that are different from inorganic substances on forming can not be called glass.Yet the glass definition of broad sense is carried out the classification of science according to methods such as the materials behavior of making and character to glass, if certain material demonstrates the various characteristic properties that typical classical glass has, so, no matter how it forms, can be referred to as glass.
Glass is a kind of amorphous body.The glass that melts cools off rapidly (excessively cold), and each molecule does not form glass because there being enough time to form crystal.
The composition of simple glass mainly is silica (SiO
2, namely quartzy, the main component of sand).And pure silicon soil fusing point is 2000 degree Celsius, generally can add sodium carbonate (Na when therefore making glass
2CO
3, i.e. soda) with potash (K
2CO
3, potash), the tripoli fusing point will be down to about 1000 degree Celsius like this.But sodium carbonate can make glass soluble in water, therefore usually also will add an amount of calcium oxide (CaO) and make glass water insoluble.
The coefficient of heat conduction of prevailing glass is about 1.38W/mK.And at present in the led circuit plate thermal conductivity factor of used insulating layer material generally approximately between the 0.08-0.3W/mK.Therefore, the thermal conductivity factor of simple glass be the customary insulation layer material 5-17 doubly between, its heat conductivility will be far superior to the customary insulation layer material.
In addition, glass is the same with PI, polytetrafluoroethylene (PTFE), rubber-like macromolecule or most plastic or other material, all is extraordinary electrical insulator.These materials under low pressure (hundreds of even upper kilovolt) all can be used as safe insulator.To hundreds of volt high pressure, obviously glass is very suitable insulating materials for several volts of common LED application scenario.
Moreover, glass is transparent to visible light, and its light transmittance is very high.Pure glass also is transparent to infrared ray, can cause several kilometers long, makes the glass fibre of communication purposes.Therefore, for LED illumination, this will be for the LED ligthing paraphernalia provides additional extraordinary light transmission, and has improved the luminous heat dissipation problem that is difficult for blazing abroad and causes of led section.
Before describing the present invention in detail, those skilled in the art are to be understood that, " components and parts " should do the understanding on the most wide in range connotation in this application, the components and parts that namely comprise all types of electronic devices and components for circuit, electric components or other type, various resistance for example, the components and parts of various surface mount (SMT) type, the components and parts of support rack type, various high power devices etc., comprise great power LED, etc.
In addition, term " wiring board " and " circuit board " can use interchangeably in the application.
The present invention is described in further detail below in conjunction with drawings and Examples.But, it will be appreciated by those skilled in the art that these embodiments have only enumerated some the preferred embodiments of the present invention, to the present invention and protection domain thereof without any restriction.For example, as the layout of the band of an embodiment of conducting wire be not limited to shown in the accompanying drawing and specific embodiment described, as the position of the layout of the conducting resinl (or conductive paste) of another embodiment of conducting wire with mode also is not limited to shown in the accompanying drawing and specific embodiment is described, etc.Those of ordinary skill in the art is understanding under the situation of basic conception of the present invention, can carry out some apparent variation and changes to these, and these all are within the scope of the present invention.Scope of the present invention is only limited by claim.
As shown in Figure 1, provide glass carrier 1, this glass carrier can be common glass plate, and its thickness for example can be about 1-20mm.According to another preferred embodiment, this glass carrier can also be cylindrical tube, the LED circuit directly can be arranged in the inboard of this glass tube.This glass carrier also can be roughly spherical glass bulb.
Fig. 2 has shown two LED circuits 2 in glass plate 1 layout of one embodiment of the invention.Certainly, it will be understood by those skilled in the art that and can arrange one or more circuits 2 at circuit 2, this depends on specific application ﹠ design.
Common LED circuit material is Copper Foil.But, also can substitute Copper Foil as wiring material layer as line material with aluminium or aluminium alloy (or aluminium foil), not only can guarantee the satisfactory electrical conductivity of circuit, more crucial a bit is greatly to reduce the material cost of wiring board.For example, the material cost of aluminum wiring board will be the copper foil circuit plate 1/4th or even lower.Certainly, those skilled in the art obviously are appreciated that and also can adopt other material to be used as the material of line layer, for example iron, steel etc., and these all belong to scope of the present invention.
According to a preferred embodiment, adopt Copper Foil band 2 as the LED circuit.The Copper Foil band 2 that for example scribbles conducting resinl or epoxy adhesive directly is bonded on the glass 1, thereby obtains structure shown in Figure 2.Adopt conducting resinl as adhesive, will more be conducive to conduction and the heat radiation of LED circuit 2.
According to another preferred embodiment, also glass plate can be molded as and have slot, will metal band 2 directly inserting in the slots provides the LED that is arranged on glass plate circuit.
According to another preferred embodiment can also be on glass plate 1 shown in Figure 1 direct coating conducting resinl (or conductive paste, tin cream for example perhaps conduct electricity slurry, for example silver slurry), thereby obtain two or more the LED circuits 2 that are arranged side by side.Directly the method for coating conducting resinl preferably can adopt the mode of the circuitous pattern that serigraphy designs in advance on glass plate, then is cured processing, thereby obtains being solidificated in the led circuit on the glass plate.
According to another embodiment of the present invention, also can be at the groove that directly is molded into predetermined circuit patterns on glass, then with metal (for example aluminium, copper, iron, stainless steel or tin, or metal alloy, etc.) melt flow stream directly pour into a mould (perfusion) in this groove, form LED circuit 2 after solidifying.
The line pattern of LED circuit 2 is not limited to shown in the accompanying drawing of the present invention, but can change according to the design of circuit.
Then, can be on this LED circuit 2 flip LED chips.
Fig. 3 has schematically shown the direct face-down bonding on LED circuit 2 shown in Figure 2 of one embodiment of the invention and the flip chip type led chip 3 of encapsulation.
According to a preferred embodiment, provide flip chip type led chip 3, if white light LEDs then needs to put first glue, upper fluorescent material.Provide solder bump (or claiming soldered ball, for example gold solder ball) at led chip 3.The glass plate that is connected with led circuit conduction which is provided with and is spaced from the pad (not shown) of a segment distance tips upside down on the led chip 3, so that the respective pad that is connected (or directly drawing from led circuit 2) with the led circuit conduction on the glass plate is aimed at the solder bump on the led chip 3, then for example by the welding (for example adopting wave-soldering), so just with led chip 3 direct face-down bondings on the glass plate with led circuit and be spaced from the pad of a segment distance.Then, can encapsulate this led chip 3 (for example adopting the silica gel sealing), oven dry is tested, thereby directly is encapsulated in the flip LED on this glass carrier 1.
Know for the those of ordinary skill in electronic devices and components field with auxiliary process step afterwards before other of flip chip type led chip, therefore give unnecessary details no longer one by one.
In structure shown in Figure 3, flip chip type led chip 3 for example welds and is encapsulated on the front of glass carrier 1 with solder-ball flip, the heat of distributing when led chip 3 is luminous will be dispersed on the larger area glass carrier 1 with the shortest path (omitted substrate and substrate junction is combined in carrier or additional adhesive-layer on heat sink), thereby be conducive to heat radiation.
According to another preferred embodiment, in structure shown in Figure 4, in order further to improve heat radiation, the particularly heat radiation of high-power LED chip can also be from drawing or directly be combined heat sink (radiator) 4 with the respective pad that the solder bump of led chip 3 is directly aimed at welding.As shown in Figure 4, for example, heat sink 4 extend between two led circuits 2 and are spaced from a segment distance.Like this, quite a few of the heat of high-power LED chip 3 heat radiation just can directly directly be guided on heat sink 4 by solder bump, pad.This is heat sink 4 can be silicon plate or ceramic wafer, for example the silicon nitride plate.Certainly, this is heat sink 4 also can be the good metallic plate of heat conductivility, for example heat-conducting glue of copper coin, aluminium sheet or printing etc. (for example this heat sink 4 can be reserved when design processing circuit pattern, for example by directly from the sheet metal directly die-cut or printing obtain).In order to be beneficial to heat radiation, to avoid short circuit and to hinder bright dipping, this is heat sink 4 with the spaced apart one section larger distance of led circuit.
Except encapsulation flip chip type led chip, according to concrete application and/or design, on led circuit, also may need to install other electronic devices and components.According to a preferred embodiment of the invention, the components and parts that mount or carry at glass plate circuit of the present invention can comprise all kinds of LED and each quasi-resistance.For example, the model of LED can comprise: 335,3528,5050,5060, etc.The model of resistance can comprise as follows: 0603,0805,0812, etc.
According to a preferred embodiment, can the LED rectifier be installed at glass plate led circuit of the present invention, so that directly for example the 220V alternating current directly is rectified into the direct current that is fit to the LED normal working voltage, thereby exempted the use to additional rectifier structure, so that the more compact structure of whole integrated upside-down mounting type LED light fixture of the present invention, and cost is lower, is more convenient for installing and using.
Obviously, this area designer is appreciated that fully according to different application scenarios and customer requirement, and flexible circuitry panel products of the present invention can comprise various types of LED, resistance and other components and parts etc.
Based on the structure limitation of flip chip type led chip, always some is only different from the light direction of design, or even opposite for led chip, that is, and oppositely (towards glass carrier) bright dipping and side bright dipping.
In order further to improve the luminous efficiency of LED, and be convenient to further heat radiation, can install and the packaged transparent welding resistance printing ink of LED circuit 2 brushings that comprises whole components and parts of led chip 3, and at the back side of glass carrier 1 (namely not arranging the side of LED circuit) reflector layer is set, for example paste reflective membrane, be coated with or plate reflective aluminium lamination, reflective silver layer, or stick bright aluminium sheet, etc.Like this, the light towards glass plate 1 sends of led chip 3 is reflected on the front light direction of expection, so not only can increases substantially the luminous efficiency of led chip 3, and can therefore help heat radiation.Moreover, also directly having omitted traditional flip chip type led chip at the needs of the reflective silverskin of substrate plating, saved processing step and corresponding material and process costs, is killing three birds with one stone.
Certainly, as substituting of reflector layer is set at the glass plate back side, also can stick the white reflection film of insulation in the front of glass carrier 1 (side of flip chip type led chip namely is installed).So also can play equally increases effect reflective and the raising luminous efficiency.
Above by the agency of specific embodiments of the invention.Yet should be appreciated that under the premise without departing from the spirit and scope of the present invention, can carry out various modifications.Therefore, other embodiment also belongs to the protection domain of claim of the present invention.Therefore the present invention is not limited to disclosed the drawings and specific embodiments, and scope of the present invention is limited by claim.
Claims (10)
1. an integrated upside-down mounting type LED light fixture is characterized in that, described integrated upside-down mounting type LED light fixture comprises:
Led circuit;
Carry the glass carrier of described led circuit; With
Directly face-down bonding and be encapsulated on the described glass carrier on the flip chip type led chip,
Wherein, described led circuit and flip chip type led chip are integrated on described glass carrier.
2. LED light fixture according to claim 1 is characterized in that: described led circuit is one or more directly to be combined in the plain conductor on the described glass carrier; Or directly be printed on conductive rubber on the described glass carrier, conduction lotion or conduction slurry.
3. LED light fixture according to claim 2 is characterized in that: described plain conductor is directly to be bonded in copper on the described glass carrier or copper alloy band, aluminum or aluminum alloy band.
4. LED light fixture according to claim 1, it is characterized in that: described glass carrier is provided with the groove of predetermined circuit patterns, with the cast of metal melting fluid or be poured in and form described led circuit in the described groove.
5. according to each described LED light fixture in the claims, it is characterized in that: the side at the described led circuit of carrying of described glass carrier is furnished with welding resistance printing ink, is preferably transparent welding resistance printing ink.
6. according to each described LED light fixture in the claims, it is characterized in that: also comprise being arranged in being connected and being spaced from the pad of a segment distance with described led circuit conduction on the described glass carrier, the solder bump on the described flip chip type led chip directly welds with described pad alignment.
7. according to each described LED light fixture in the claims, it is characterized in that: also comprise additional heat sink, the spaced apart segment distance of described heat sink and described led circuit.
8. LED light fixture according to claim 2, it is characterized in that: described plain conductor is metal band, and described glass is the glass plate with slot, and wherein, described metal band directly is inserted in provides described led circuit in the described slot.
9. each described LED light fixture is characterized in that according to claim 1-8, also comprises:
Be arranged on the reflector layer on the side of the described flip chip type led chip of installation of described glass carrier; Perhaps
Be arranged on the reflector layer on the side of the described flip chip type led chip of not installing of described glass carrier.
10. LED light fixture according to claim 9 is characterized in that: described reflector layer is aluminium film, silverskin, silver-colored reflector layer or white insulation reflective membrane.
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| CN2012104725951A CN102927483A (en) | 2012-11-20 | 2012-11-20 | Integrated flip type LED illuminating assembly |
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| CN103237410A (en) * | 2013-05-06 | 2013-08-07 | 田茂福 | Non-etched aluminum substrate and manufacturing method thereof |
| CN103560196A (en) * | 2013-10-31 | 2014-02-05 | 上海大学 | Inverted LED chip structure and packaging structure for inverted LED chip structure |
| CN105371161A (en) * | 2014-08-26 | 2016-03-02 | 蔡鸿 | LED direct type backlight and light emitting method thereof |
| WO2016029808A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor |
| CN109973851A (en) * | 2019-04-24 | 2019-07-05 | 深圳市欣上科技有限公司 | The light-emitting LED soft light bar of double-deck route wide-angle and luminous product |
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| CN113451240A (en) * | 2020-03-25 | 2021-09-28 | 淇芯半导体(深圳)有限公司 | System embedded with carbon-containing black heat-conducting glue and heat-conducting fin containing carbon-containing black heat-conducting glue |
| CN114842792A (en) * | 2022-03-27 | 2022-08-02 | 深圳市美矽微半导体有限公司 | Wiring structure of LED (light emitting diode) carrier plate and carrier plate thereof |
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