CN110701584A - Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp - Google Patents
Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp Download PDFInfo
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- CN110701584A CN110701584A CN201911101382.6A CN201911101382A CN110701584A CN 110701584 A CN110701584 A CN 110701584A CN 201911101382 A CN201911101382 A CN 201911101382A CN 110701584 A CN110701584 A CN 110701584A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention provides a manufacturing method of a light-emitting diode light source and a manufacturing method of a light-emitting diode car lamp, wherein the manufacturing method of the light-emitting diode light source comprises the following steps: carrying out molding treatment on the metal substrate to obtain a positive electrode substrate and a negative electrode substrate which are arranged side by side; and respectively fixing the anode and the cathode of the light-emitting diode wafer on the anode substrate and the cathode substrate. The technical scheme of the invention mainly comprises two steps of manufacturing the metal substrate and fixing the light-emitting diode wafer, and the light-emitting diode wafer is directly fixed between the anode substrate and the cathode substrate which are arranged side by side without additionally manufacturing wires on the substrates, so that the manufacturing process steps are simplified, and the production efficiency is improved; and the metal substrate with the electric conduction and heat conduction functions is used for heat dissipation, a special heat dissipation device is not required to be added, and the cost can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of light emitting diodes, in particular to a light emitting diode light source manufacturing method and a light emitting diode car lamp manufacturing method.
Background
The conventional vehicular lamp includes a halogen lamp and a Light Emitting Diode (LED) lamp, wherein the halogen lamp belongs to the incandescent lamp type, and the tungsten filament inside the halogen lamp generates heat and emits light when current passes through the tungsten filament. The led car light is a car light manufactured by using an led package device as a light source, and generally has the characteristics of high brightness, rich color types, low power consumption, long service life and the like.
However, there are disadvantages associated with each of these two different vehicle lights. For halogen lamps, one is a relatively low intensity, typically, 55W halogen lamps are only 1000 lumens; secondly, the tungsten filament is adopted to emit heat and light, and the service life of the tungsten filament is shorter than that of a light-emitting diode lamp; thirdly, the lighting speed is lower than that of a light-emitting diode lamp, the lighting of a halogen lamp is a heating and lighting process, and the lighting time of the halogen lamp is different from several seconds to dozens of seconds according to different power; fourthly, the color temperature of the halogen lamp is warm and white, the color is yellow, and the illumination effect is poor; fifthly, the energy consumption of the halogen lamp is high, the power of the general halogen headlamp for the vehicle is about 55W, and the power of the light-emitting diode headlamp is 20W.
For the existing light-emitting diode vehicle lamp, although some defects of the traditional halogen vehicle lamp can be solved, some problems also exist, for example, although the front side and the back side can emit light, the light-gathering effect is inferior to that of the halogen vehicle lamp because the middle layer has a certain interval area; for another example, although the light emitting diode lamp generates heat less than a halogen lamp, a heat dissipation structure must be considered because the upper limit of the operating temperature of the light emitting diode lamp is less than 150 °, and an excessively high temperature may cause a Light Emitting Diode (LED) to burn out, etc.
Disclosure of Invention
In order to solve at least one of the problems, the invention provides a method for manufacturing a light-emitting diode light source and a method for manufacturing a light-emitting diode car light, wherein a positive substrate and a negative substrate are arranged side by side, and two poles of a light-emitting diode wafer are respectively arranged on the positive substrate and the negative substrate, so that the light-emitting diode light source with the integrated functions of electric conduction and heat dissipation is obtained, a special heat dissipation device is not needed, the light-emitting diode light source also has a large light-emitting angle and the like, the production process steps are simple, the manufacturing is convenient, and extra wiring on the substrates is not needed.
The embodiment of the invention provides a method for manufacturing a light-emitting diode light source, which comprises the following steps:
carrying out molding treatment on the metal substrate to obtain a positive electrode substrate and a negative electrode substrate which are arranged side by side;
and respectively fixing the anode and the cathode of the light-emitting diode wafer on the anode substrate and the cathode substrate.
Further, in the above method for manufacturing a light emitting diode light source, before fixing the light emitting diode chip, the method further includes:
and fixedly connecting the preset positions of the positive electrode substrate and the negative electrode substrate by using an insulating connecting structure.
Further, in the above method for manufacturing a light emitting diode light source, the positive electrode substrate and the negative electrode substrate are formed into a strip shape, and the two ends and/or adjacent edges of the strip-shaped positive electrode substrate and negative electrode substrate are fixedly connected by the insulating connection structure.
Further, in the above method for manufacturing a light emitting diode light source, the positive substrate and the negative substrate are provided with reserved areas for arranging LED beads, and the surfaces of the positive substrate and the negative substrate except the reserved areas are fixedly connected by the insulating connection structure.
Further, in the above-described method for manufacturing a light emitting diode light source, the positive electrode substrate and the negative electrode substrate are respectively formed to include substrate main bodies and convex structures on adjacent edges between the substrate main bodies, and pads for connecting positive electrodes or negative electrodes of the light emitting diode chips are provided on the convex structures.
Further, in the above method for manufacturing a light emitting diode light source, during the molding process, a position limiting hole or a position limiting groove is provided at a position adjacent to the bonding pad.
Further, in the above method for manufacturing a light emitting diode light source, when the positive electrode substrate and the negative electrode substrate are formed, the method further includes:
and printing white oil or pasting a white film on the surfaces of the positive electrode substrate and the negative electrode substrate.
Further, in the above method for manufacturing a light emitting diode light source, when the positive electrode substrate and the negative electrode substrate are formed, the method further includes:
and forming graphene layers on the surfaces of the positive electrode substrate and the negative electrode substrate.
Further, in the above method for manufacturing a light emitting diode light source, after the light emitting diode chip is fixed, the method further includes:
and carrying out bubble sealing and filling heat dissipation gas into the anode substrate and the cathode substrate fixed with the light-emitting diode chip.
Another embodiment of the present invention further provides a method for manufacturing a light emitting diode vehicle lamp, including:
obtaining an anode substrate and a cathode substrate fixed with a light-emitting diode wafer by adopting the light-emitting diode light source manufacturing method;
and connecting the positive electrode substrate and the negative electrode substrate with a connecting base.
The embodiment of the invention has the following advantages:
the manufacturing method of the light-emitting diode light source of the embodiment of the invention mainly comprises two working procedures of manufacturing the metal substrate and fixing the light-emitting diode wafer, and the light-emitting diode wafer is directly fixed between the anode substrate and the cathode substrate which are arranged side by side without additionally arranging wires on the substrates and the like, thereby simplifying the manufacturing process steps and improving the production efficiency; and the metal substrate with the electric conduction and heat conduction functions is used for heat dissipation, a special heat dissipation device is not required to be added, and the cost can be greatly reduced.
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible and comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a first flowchart illustrating a method for manufacturing an led light source according to embodiment 1 of the present invention;
fig. 2(a) -2 (c) show three kinds of schematic fixed connection diagrams of the positive electrode substrate and the negative electrode substrate of example 1 of the present invention;
FIG. 3 is a first schematic structural diagram of an LED light source according to embodiment 1 of the present invention;
FIG. 4 is a schematic view showing a second structure of an LED light source according to embodiment 1 of the present invention;
fig. 5 is a schematic flow chart showing a method of manufacturing an led vehicle lamp according to embodiment 2 of the present invention;
fig. 6(a) -6 (b) show two schematic structural diagrams of the led vehicle lamp according to embodiment 2 of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1, the present embodiment provides a method for manufacturing a light emitting diode light source, which is used to produce a light emitting diode light source. The following is a description of the method for manufacturing the led light source.
As shown in fig. 1, the method for manufacturing the led light source includes:
step S100, a metal substrate is subjected to a forming process to obtain a positive electrode substrate and a negative electrode substrate which are arranged side by side.
The step S100 is mainly a metal substrate manufacturing step of obtaining a positive electrode substrate and a negative electrode substrate arranged side by molding a metal substrate material. In this embodiment, the substrate material may be a metal substrate with good electrical and thermal conductivity, such as a copper substrate, an aluminum substrate, and the like. The shapes and sizes of the positive electrode substrate and the negative electrode substrate can be determined according to actual requirements, such as a strip shape, a semicircular shape and the like. Preferably, the positive electrode substrate and the negative electrode substrate are formed in a symmetrical structure to increase balance and beauty. The substrate size of the anode substrate and the cathode substrate is far larger than that of the light-emitting diode wafer, and a good heat dissipation effect can be achieved.
In the step S100, the metal substrate material may be molded into a predetermined shape by any one or a combination of stamping, wire cutting, etching, and the like, to form a positive electrode substrate and a negative electrode substrate including substrate bodies, respectively, and then pads for fixing the positive electrode and the negative electrode of the led chip are disposed at adjacent edges of the two substrate bodies. In this embodiment, the pads may be disposed on both the front and back surfaces of the positive substrate and the negative substrate.
For example, if the anode substrate and the cathode substrate are formed as stripe structures, preferably, the method for manufacturing the light emitting diode light source further includes: and fixedly connecting two ends and/or adjacent edges of the strip-shaped positive electrode substrate and the strip-shaped negative electrode substrate by using an insulating connecting structure. The insulating connection structure can be made of sealing glass or plastic clamping grooves. Taking the connection of both ends as an example, as shown in fig. 2(a), a strip-shaped positive electrode substrate and a strip-shaped negative electrode substrate may be placed side by side at a predetermined distance and then sealed and fixed at both ends of the substrates by using sealing glass or the like. Of course, a plastic clamping groove or the like can be used for clamping and fixing at one end or the middle position of the substrate. Alternatively, as shown in fig. 2(b), the substrates may be fixedly connected at their adjacent edges by a sealing glass or the like.
As another alternative, when the two substrates are fixedly connected side by side, the method further includes: and fixedly connecting the surfaces of the substrates of the anode substrate and the cathode substrate except for a reserved area by using an insulating connection structure, wherein the reserved area is used for arranging the light-emitting diode chip.
Exemplarily, as shown in fig. 2(c), an area may be reserved on the positive substrate and the negative substrate for disposing the led chip, and except the reserved area, an insulating connection structure having an insulating and light-reflecting effect is wrapped on the surfaces of the two substrates for fixed connection, specifically, a PTA material. It should be understood that the fixing connection schemes shown in fig. 2(a) -2 (c) are only examples, and in actual production, the location of the fixing connection and the selection of the insulating connection structure can be determined according to actual needs, and are not limited herein.
Further preferably, when the strip-shaped positive electrode substrate and the strip-shaped negative electrode substrate are formed, the molding process further includes: and forming I-shaped parts at one ends of the strip-shaped positive electrode substrate and the strip-shaped negative electrode substrate respectively and forming convex parts at the other ends of the strip-shaped positive electrode substrate and the strip-shaped negative electrode substrate respectively by adopting a cutting mode and the like. For example, as shown in fig. 3, the positive electrode substrate 10 and the negative electrode substrate 20 having a stripe structure are respectively formed with an "i" shaped portion a and a "convex" shaped portion B at both ends, so that both ends can be fixedly connected by an insulating connection structure. It is understood that the "i" and "convex" portions a and B can be used to increase the connection area between the insulating connection structure and the two substrates, thereby increasing the connection stability.
As another preferable mode for the step S100, when forming the positive electrode substrate and the negative electrode substrate including the substrate main body, the molding process further includes: convex structures are respectively formed on adjacent edges between two substrate bodies side by side, and then pads for fixing the light emitting diode chips are to be provided on the respective convex structures. Preferably, the bonding pads are arranged on the front side and the back side of the convex structure, so that the light-emitting diode wafers are arranged on the two sides of the substrate. As shown in fig. 3, the convex structures C of the positive electrode substrate 10 and the negative electrode substrate 20 are provided with pads 30 for connecting the positive electrode and the negative electrode of the light emitting diode chip, respectively.
It can be understood that, since the size of the led chip is often relatively small, after the led chip is fixed between the anode substrate and the cathode substrate, in order to prevent the two substrates from being too close to each other and possibly causing short circuit after power is applied, the distance between the two substrates can be properly separated by the convex structure without affecting the fixation of the led chip.
Preferably, in the molding process, the method for manufacturing an led light source further includes: and limiting holes or limiting grooves and other structures for limiting the flowing of the solder paste are arranged at the adjacent positions of the bonding pads. It can be understood that the limiting is mainly used to prevent the heated and liquid solder paste from flowing to a large area, so that the led chip will not be shifted when being fixed.
Preferably, in the molding process, the method for manufacturing an led light source further includes: and performing white oil printing or white film pasting treatment on the positive electrode substrate and the negative electrode substrate so as to improve the surface reflectivity of the substrates and further improve the light-emitting angle. Further preferably, when the positive electrode substrate and the negative electrode substrate are subjected to a subsequent process such as printing white oil or attaching a white film, the above-described stopper hole or stopper groove may not be provided at a position adjacent to the pad during the molding process.
Before the surface reflection increasing treatment, the method for manufacturing the light emitting diode light source further comprises the following steps: the positive electrode substrate and the negative electrode substrate are subjected to a surface treatment, which may include, but is not limited to, a rust removal, a deburring, and the like. Further, after the surface reflection increasing treatment, the method for manufacturing the light emitting diode light source further comprises the following steps: the positive electrode substrate and the negative electrode substrate are subjected to secondary surface treatment including pad plating treatment and oxidation prevention treatment.
Further, when the positive electrode substrate and the negative electrode substrate are formed, the method for manufacturing the light emitting diode light source further comprises the following steps: and forming graphene layers on the surfaces of the positive electrode substrate and the negative electrode substrate. For example, graphene materials may be coated on the surfaces of the positive electrode substrate and the negative electrode substrate by a coating method or the like to form the graphene layers.
It should be understood that, as for the sequence of the optional processing steps in the step S100, it is specifically possible to adapt according to the actual production process, and finally obtain the cathode substrate and the anode substrate arranged side by side.
Then, after the step S100, a light emitting diode wafer fixing step, i.e., a step S110, is performed to fix the positive electrode and the negative electrode of the light emitting diode wafer on the positive electrode substrate and the negative electrode substrate, respectively.
The step S110 mainly includes processes of dispensing solder paste, die bonding, and curing solder paste. The solder paste may be applied to the pads on the substrate by a die bonder, or the like, for example, but may be applied by printing or the like. Then, the led chips are placed on the corresponding pads, wherein the anodes of the led chips are correspondingly placed on the pads on the anode substrate and the cathodes are placed on the pads on the cathode substrate, and then the solder paste is cured by a reflow soldering machine or a heating table, so that the led chips are fixed between the anode substrate and the cathode substrate.
Optionally, after the led chip is fixed, the fixed led chip may be subjected to a photoelectric parameter test, and the led chip passing the test is screened out for subsequent processing, so as to ensure a certain yield.
As an optional solution, after the step S110, the method for manufacturing the light emitting diode light source further includes: and sealing bubbles of the positive electrode substrate and the negative electrode substrate on which the light-emitting diode wafer is fixed. Further preferably, the glass tube is charged with a heat-dissipating gas during bubble sealing. The heat dissipation gas may include, but is not limited to, one or more of helium, nitrogen, neon, argon, and other inert gases.
The bubble sealing material can be a material with strong light transmission such as transparent glass. Exemplarily, the anode substrate and the cathode substrate on which the led chip is mounted are placed in a glass tube, and the glass tube is sealed. It can be understood that the bubble sealing treatment can enable the obtained light-emitting diode light source to have a better light-emitting angle, and can also play a role in protecting the substrate and the like. The heat dissipation gas is mainly used for achieving the purpose of further heat dissipation when the light emitting diode light source works.
Optionally, before the sealing, external lead processing may be performed on the anode substrate and the cathode substrate to which the led chip is fixed through the connection terminal, so as to electrically connect the led light source obtained after the sealing with an external structure such as a driving power supply. For example, the positive substrate and the negative substrate with the led chip mounted thereon and two metal wires are correspondingly connected through the connection terminals, respectively, so that the positive substrate is connected to one metal wire and the negative substrate is connected to the other metal wire. Exemplarily, if a metal sheet or the like is used as the connection terminal, the thermal contraction coefficient of the metal sheet should be close to that of the bubble sealing material.
In this embodiment, can adopt the emitting diode flip chip of different encapsulation forms, also can adopt the good paster lamp pearl of direct encapsulation as the light source. For example, a CSP flip chip in the form of a CSP package may be used, or a conventional led flip chip may be used, and preferably, a fluorescent glue may be coated on the surface of the conventional led flip chip, so that the light emitting color of the led flip chip can be adjusted, and the led flip chip can be protected.
For example, the light emitting diode light source shown in fig. 4 can be obtained by the above-mentioned method for manufacturing a light emitting diode light source, wherein the light emitting diode light source comprises a strip-shaped positive substrate 10 and a strip-shaped negative substrate 20, the positive substrate 10 and the negative substrate 20 are respectively provided with a bonding pad 30, and a light emitting diode wafer 40 connected with the positive substrate 10 and the negative substrate 20 through the bonding pad 30, wherein the positive substrate 10 and the negative substrate 20 are arranged side by side, and the positive electrode and the negative electrode of the light emitting diode wafer 40 are respectively connected with the positive substrate 10 and the negative substrate 20. Since the bubble sealing process is also performed, the light emitting diode light source further includes a bubble case 50 for enclosing the positive electrode substrate 10 and the negative electrode substrate 20 provided with the light emitting diode chip described above in the case. Preferably, the strip-shaped positive electrode substrate 10 and the strip-shaped negative electrode substrate 20 are further provided with insulating connectors 60 at both ends thereof for fixedly connecting the two substrates.
The manufacturing method of the light-emitting diode light source mainly comprises two working procedures of manufacturing the metal substrate and fixing the light-emitting diode wafer, the anode substrate and the cathode substrate are arranged side by side, two poles of the light-emitting diode wafer are respectively arranged on the two substrates, the metal substrate with the electric conduction and heat dissipation functions is used for arranging the light-emitting diode wafer side by side, a special heat dissipation device is not needed to be added, the cost can be greatly reduced, the manufacturing process steps can be saved, the production efficiency can be greatly improved, and the like. In addition, the bubble sealing treatment is carried out and the heat dissipation gas is filled, so that the heat dissipation effect and the like can be further improved.
Example 2
Referring to fig. 5, the present embodiment provides a method for manufacturing an led vehicle lamp, which includes an led light source and a connection base, wherein the connection base is mainly used for fixing and supporting the led light source, and can also be used as an intermediate structure for connecting a power supply.
As shown in fig. 5, the method for manufacturing the led vehicle lamp mainly includes:
step S200, forming the metal substrate to obtain a positive electrode substrate and a negative electrode substrate which are arranged side by side, and respectively fixing the positive electrode and the negative electrode of the light-emitting diode wafer on the positive electrode substrate and the negative electrode substrate.
Exemplarily, the method for manufacturing the light emitting diode light source in the above embodiment 1 can be used to obtain the anode substrate and the cathode substrate on which the light emitting diode chip is fixed. It is understood that other alternatives of embodiment 1 are also applicable to this embodiment, and therefore will not be described in detail here.
Step S210, connecting the positive electrode substrate and the negative electrode substrate with a connection base. In this embodiment, the shape and structure of the connection base can be selected according to actual requirements, and are not limited herein.
Optionally, a driving circuit for driving the light emitting diode light source is further disposed inside the connection base, and when the connection base is connected to the two substrates, the driving circuit is electrically connected to the two substrates. Of course, the connection base can also be provided with a power supply interface for connecting a power supply required by the light emitting diode light source. In addition, if the light-emitting angle of the LED vehicle lamp needs to be adjusted, the LED light source can be connected with the connecting base through the chuck.
For example, the above-described method of manufacturing a light-emitting diode lamp can provide a light-emitting diode lamp having two structures as shown in fig. 6(a) and 6 (b). The led vehicle lamp shown in fig. 6(a) includes an led light source 1 and a connection base 2. The led vehicle lamp in fig. 6(b) further includes a power supply interface 3 and a chuck 4.
The light-emitting diode car lamp obtained by the manufacturing method of the light-emitting diode car lamp provided by the embodiment adopts a thermoelectric integrated light-emitting diode light source design, and does not need a special heat dissipation device; compared with the traditional halogen car lamp, the halogen car lamp has the characteristics of lower power, longer service life, higher lighting speed and the like, and compared with the existing design of the light-emitting diode car lamp with the structure of two substrates and a middle heat dissipation layer, the halogen car lamp can greatly reduce the thickness of the whole substrate and realize better light condensation effect and the like.
In all examples shown and described herein, any particular value should be construed as merely exemplary, and not as a limitation, and thus other examples of example embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above examples are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. A method of manufacturing an led light source, comprising:
carrying out molding treatment on the metal substrate to obtain a positive electrode substrate and a negative electrode substrate which are arranged side by side;
and respectively fixing the anode and the cathode of the light-emitting diode wafer on the anode substrate and the cathode substrate.
2. The method of claim 1, wherein prior to securing the led die, the method further comprises:
and fixedly connecting the preset positions of the positive electrode substrate and the negative electrode substrate by using an insulating connecting structure.
3. The method of claim 2, wherein the anode substrate and the cathode substrate are formed in a stripe shape,
and the two ends and/or the adjacent edges of the strip-shaped positive electrode substrate and the strip-shaped negative electrode substrate are fixedly connected by the insulating connection structure.
4. The method for manufacturing the light-emitting diode light source according to claim 2, wherein the positive electrode substrate and the negative electrode substrate are provided with reserved regions for arranging the LED beads, and the surfaces of the positive electrode substrate and the negative electrode substrate except the reserved regions are fixedly connected by the insulating connection structure.
5. The method of manufacturing an led light source according to claim 1, wherein the positive electrode substrate and the negative electrode substrate are each formed to include a substrate main body and a convex structure on adjacent edges between the substrate main bodies, and a pad for connecting a positive electrode or a negative electrode of the led chip is provided on the convex structure.
6. The method for manufacturing an LED light source according to claim 5, wherein a position limiting hole or a position limiting groove is formed at a position adjacent to the bonding pad during the molding process.
7. The method of manufacturing an led light source as claimed in claim 1 or 5, wherein in forming the positive electrode substrate and the negative electrode substrate, the method further comprises:
and printing white oil or pasting a white film on the surfaces of the positive electrode substrate and the negative electrode substrate.
8. The method of claim 1, wherein in forming the positive and negative substrates, the method further comprises:
and forming graphene layers on the surfaces of the positive electrode substrate and the negative electrode substrate.
9. The method of claim 1, wherein after the step of securing the led die, the method further comprises:
and (3) carrying out bubble sealing on the anode substrate and the cathode substrate fixed with the light-emitting diode chip and filling heat dissipation gas.
10. A method of manufacturing a light emitting diode vehicle lamp, comprising:
obtaining a positive electrode substrate and a negative electrode substrate on which a light emitting diode chip is fixed by using the method for manufacturing a light emitting diode light source according to any one of claims 1 to 9;
and connecting the positive electrode substrate and the negative electrode substrate with a connecting base.
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