CN201153128Y - Encapsulation construction of LED - Google Patents
Encapsulation construction of LED Download PDFInfo
- Publication number
- CN201153128Y CN201153128Y CNU2008200030045U CN200820003004U CN201153128Y CN 201153128 Y CN201153128 Y CN 201153128Y CN U2008200030045 U CNU2008200030045 U CN U2008200030045U CN 200820003004 U CN200820003004 U CN 200820003004U CN 201153128 Y CN201153128 Y CN 201153128Y
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- China
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- metal substrate
- electrode pin
- light
- package structure
- emitting diode
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Abstract
An LBD packaging structure at least includes an LBD and a metal substrate. The LBD is provided with two electrode pins, wherein, each electrode pin is provided with at least one locating hole. Each metal substrate is provided with at least a fixing part which is used for correspondingly passing through the locating hole of each electrode pin and pressing and fixing the pin on the metal substrate. The LBD packaging structure provided by the utility model can avoid jointing the electrode pins of the LBD on the metal substrate by a welding way, and can easily locate the LBD on the metal substrate; in addition, the case that the LBD is damaged when the joint between the electrode pins and the metal substrate is eliminated can be avoided.
Description
Technical field
The utility model relates to a kind of package structure for LED, the particularly a kind of package structure for LED of light-emitting diode on metal substrate that engage.
Background technology
Light-emitting diode (Light Emitting Diode; LED) it is low to have an operating voltage, and power consumption is little, the luminous efficiency height, and the reaction time is short, and is photochromic pure, sound construction, shock resistance, vibration resistance, stable and reliable for performance, in light weight, characteristics such as the little and cost of volume is low.Along with development of technology, the revealable brightness degree of light-emitting diode is more and more higher, its application also more and more widely, for example: the large tracts of land picture and text show full-color screen, state indication, sign illumination, signal demonstration, Backlight For Liquid Crystal Display Panels or room light.
Traditional light-emitting diode can be engaged in metal substrate, connects in order to carry out circuit.When light-emitting diode is engaged in metal substrate, can engage the pin of light-emitting diode on metal substrate by the spot welding mode.Yet, when too high, cause light-emitting diode chip for backlight unit to be burnt easily as if the spot welding temperature.And when the pin of light-emitting diode is engaged on the metal substrate, the situation of deviations also takes place easily, thereby increase the joint difficulty between light-emitting diode and the metal substrate.
The utility model content
One of the purpose of this utility model is, a kind of package structure for LED is provided, to replace welding manner engages light-emitting diode on metal substrate electrode pin.
This another novel purpose is, provides a kind of package structure for LED, to locate light-emitting diode exactly on metal substrate.
According to a kind of technical scheme of the present utility model be: package structure for LED includes light-emitting diode and metal substrate at least.Light-emitting diode is provided with two electrode pins, and wherein each electrode pin is provided with at least one location hole.Metal substrate is engaged in the electrode pin respectively accordingly, and is man-to-man juncture, and wherein metal substrate is provided with at least one fixed part, and fixed part passes the location hole of electrode pin accordingly, and pressing and fixing electrode pin is on each described metal substrate.
Another kind of technical scheme of the present utility model is: LED encapsulation module comprises a plurality of light-emitting diodes and two metal substrates at least.Each light-emitting diode is provided with two electrode pins, and each described electrode pin is provided with at least one location hole.Metal substrate is engaged in the described electrode pin of each described light-emitting diode respectively accordingly, wherein each described metal substrate is provided with a plurality of fixed parts, and described fixed part is the location hole that passes each described electrode pin respectively accordingly, and each described electrode pin of pressing and fixing is on each described metal substrate.
The electrode pin that the package structure for LED that the utility model provides can be avoided using welding manner to engage light-emitting diode and can be located light-emitting diode on metal substrate easily on metal substrate.And can avoid when removing engaging between electrode pin and the metal substrate situation that light-emitting diode is damaged.
Further specify the utility model below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 to Fig. 3 is the utility model embodiment one schematic perspective view.
Fig. 4 to Fig. 6 is the utility model embodiment two schematic perspective views.
Fig. 7 is the utility model embodiment three schematic perspective views.
Fig. 8 is the utility model embodiment four schematic top plan view.
Fig. 9 is the utility model embodiment four side schematic views.
Label declaration:
100: package structure for LED
110,110b: light-emitting diode
111: the electrode pin
112,112c: location hole
120,120a, 120b: metal substrate
121,121b, 121c: fixed part
122: pressing portion
100b: LED encapsulation module
Embodiment
Embodiment one
As shown in Figure 1 to Figure 3, a kind of package structure for LED, this package structure for LED 100 include light-emitting diode 110 and two metal substrates 120 at least.Light-emitting diode 110 is engaged on these two metal substrates 120, in order to form the circuit connection or to dispel the heat.
Light-emitting diode 110 is provided with two electrode pins 111, and it is engaged on the metal substrate 120 respectively accordingly.Each electrode pin 111 is made with metal material, and is man-to-man juncture, and wherein each electrode pin 111 is provided with at least one location hole 112.
The metal substrate 120 of present embodiment corresponds respectively to the electrode pin 111 of light-emitting diode 110 and is provided with.The material of metal substrate 120 can be the material that aluminium or copper etc. have good heat-conducting effect, with further lifting radiating effect.Each metal substrate 120 is provided with at least one fixed part 121, in order to form the location, and the electrode pin 111 of pressing and fixing light-emitting diode 110 is on metal substrate 120, thereby electrode pin 111 can firmly be engaged in metal substrate 120, and can form conduction and connect effect.The fixed part 121 of present embodiment is positioned at the bonding station of electrode pin 111 and metal substrate 120, can be positioned easily on the metal substrate 120 with convenience electrode pin 111 in assembling process.Fixed part 121 can integrated mode be formed on the metal substrate 120, for example forms metal substrate 120 with impact style.Fixed part 121 passes the location hole 112 of electrode pin 111, and bending pressing electrode pin 111, thus can be firmly fixedly the electrode pin 111 of light-emitting diode 110 on metal substrate 120.Therefore, the electrode pin 111 of light-emitting diode 110 can need not welding manner and form joint, and firmly bonding electrodes pin 111 is on metal substrate 120.
It should be noted that also can utilize between electrode pin 111 and the metal substrate 120 conduction then the material (not shown) further increase and engage effect, for example can form elargol between electrode pin 111 and metal substrate 120, with increase joint stable degree.
In the present embodiment, each electrode pin 111 is provided with a location hole 112, so that the fixed part 121 of metal substrate 120 can pass location hole 112, and bending pressing electrode pin 111.At this moment, two fixed parts 121 of metal substrate 120 can be distinguished in the opposite direction and bend, and with further lifting fixed effect, increase bond stability.Yet the overbending direction of these fixed parts 121 can be not limited thereto, and it can bend towards any direction respectively, with pressing and fixing electrode pin 111 on metal substrate 120.
As shown in Figure 1 to Figure 3, when assembling the package structure for LED 100 of present embodiment, make the fixed part 121 of metal substrate 120 pass the location hole 112 of electrode pin 111 respectively, thereby the electrode pin 111 that can distinguish butt light-emitting diode 110 accordingly is on metal substrate 120, and is man-to-man butt mode.At this moment, electrode pin 111 can be located easily by fixed part 121 and is connected on the metal substrate 120.Then, bend each fixed part 121, with each described electrode pin 111 of pressing and fixing on metal substrate 120, thereby finish the assembling of package structure for LED 100.
Therefore, the package structure for LED 100 of present embodiment and its assemble method need not to use the mode of welding to form and engage, and its assembling process is simple and easy relatively, can significantly reduce the processed complex degree.And the electrode pin 111 of light-emitting diode 110 can form the location easily by fixed part 121, thereby improves accurate positioning and packaging efficiency.
Embodiment two
, below only describe to shown in Figure 6 as Fig. 4, then repeat no more for something in common with regard to present embodiment and embodiment one difference.Compared to embodiment one, each metal substrate 120a of embodiment two also is provided with at least one pressing portion 122, its outer rim corresponding to electrode pin 111 is provided with, and by the lateral inner bending of electrode pin 111, with the electrode pin 111 of further pressing and fixing light-emitting diode 110 on metal substrate 120a.Pressing portion 121 can be formed on the metal substrate 120a by integrated mode, for example forms on the metal substrate 120a with impact style.Therefore, the package structure for LED 100 of embodiment two can be further fixed part 121 and pressing portion 122 by metal substrate 120a firmly engage light-emitting diode 110 and metal substrate 120a, and need not to use welding manner.
Embodiment three
As shown in Figure 7, below only describe, then repeat no more for something in common with regard to present embodiment and embodiment one difference.Compared to embodiment two, two metal substrate 120b of embodiment three can be in order to engaging a plurality of light-emitting diode 110b, thereby can form LED encapsulation module 100b.At this moment, metal substrate 120b can bend, with the formation stereochemical structure, thereby the variation in moulding of increase LED encapsulation module 100b.
Embodiment four
As Fig. 8 and shown in Figure 9, below only describe with regard to present embodiment and embodiment one difference, then repeat no more for something in common.Compared to embodiment one, each electrode pin 111 of embodiment four is provided with two location hole 112c, and each metal substrate 120 is provided with two fixed part 121c, passing the location hole 112c of electrode pin 111 respectively accordingly, and each described electrode pin 111 of pressing and fixing is on metal substrate 120.At this moment, two of each metal substrate 120 fixed part 121c can distinguish in the opposite direction and bend.Therefore, the package structure for LED 110 of embodiment four can further promote the joint stable degree between light-emitting diode 110 and the metal substrate 120.
By the foregoing description as can be known, package structure for LED of the present utility model and its assemble method can utilize electrode pin that easy assemble method engages light-emitting diode on metal substrate, and can avoid using welding manner.And in assembling process, light-emitting diode can be positioned on the metal substrate easily.In addition, because that the electrode pin of the light-emitting diode mode by mechanical engagement forms is fixing, when need were removed engaging between electrode pin and the metal substrate, light-emitting diode can be avoided the situation (compared to solder joints) damaged, and reusable.
Above-described embodiment only is used to illustrate technological thought of the present utility model and characteristics, its purpose makes those skilled in the art can understand content of the present utility model and is implementing according to this, when can not only limiting claim of the present utility model with present embodiment, be all equal variation or modifications of doing according to the spirit that the utility model disclosed, still drop in the claim of the present utility model.
Claims (10)
1. package structure for LED is characterized in that comprising:
One light-emitting diode is provided with two electrode pins, and wherein each electrode pin is provided with at least one location hole;
Two metal substrates, be engaged in this two electrode pins respectively accordingly, wherein each metal substrate is provided with at least one fixed part, and this fixed part passes this location hole of each electrode pin accordingly, and each described electrode pin of pressing and fixing is on each described metal substrate.
2. package structure for LED according to claim 1 is characterized in that: the material of described metal substrate is a kind of in aluminium, copper or the iron.
3. package structure for LED according to claim 1 is characterized in that: this fixed part is formed on the described metal substrate in integrated mode.
4. package structure for LED according to claim 3 is characterized in that: this fixed part is formed on the described metal substrate with impact style.
5. package structure for LED according to claim 1, it is characterized in that: each described electrode pin is provided with a plurality of location holes, and each described metal substrate is provided with a plurality of fixed parts, passing described location hole respectively accordingly, and each described electrode pin of pressing and fixing is on each described metal substrate.
6. package structure for LED according to claim 1, it is characterized in that: each metal substrate is provided with at least one pressing portion, this pressing portion is provided with corresponding to the outer rim of described electrode pin, by the lateral inner bending of this electrode pin, and each described electrode pin of pressing and fixing is on each described metal substrate.
7. package structure for LED according to claim 6 is characterized in that: this pressing portion is formed on this metal substrate in integrated mode.
8. package structure for LED according to claim 7 is characterized in that: this pressing portion is formed on this metal substrate with impact style.
9. LED encapsulation module is characterized in that comprising:
A plurality of light-emitting diodes, wherein each described light-emitting diode is provided with two electrode pins, and each described electrode pin is provided with at least one location hole;
Two metal substrates, be engaged in the described electrode pin of each described light-emitting diode respectively accordingly, wherein each described metal substrate is provided with a plurality of fixed parts, and this fixed part passes this location hole of each described electrode pin respectively accordingly, and each described electrode pin of pressing and fixing is on each described metal substrate.
10. LED encapsulation module according to claim 9 is characterized in that: this metal substrate forms a default stereochemical structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200030045U CN201153128Y (en) | 2008-01-10 | 2008-01-10 | Encapsulation construction of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200030045U CN201153128Y (en) | 2008-01-10 | 2008-01-10 | Encapsulation construction of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201153128Y true CN201153128Y (en) | 2008-11-19 |
Family
ID=40128803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200030045U Expired - Fee Related CN201153128Y (en) | 2008-01-10 | 2008-01-10 | Encapsulation construction of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201153128Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456297A (en) * | 2010-10-14 | 2012-05-16 | 上海科斗电子科技有限公司 | Laminated light-emitting diode (LED) display screen and LED-technology-based stereoscopic display |
| CN110701584A (en) * | 2019-11-12 | 2020-01-17 | 深圳市欣上科技有限公司 | Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp |
-
2008
- 2008-01-10 CN CNU2008200030045U patent/CN201153128Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456297A (en) * | 2010-10-14 | 2012-05-16 | 上海科斗电子科技有限公司 | Laminated light-emitting diode (LED) display screen and LED-technology-based stereoscopic display |
| CN102456297B (en) * | 2010-10-14 | 2016-07-06 | 上海科斗电子科技有限公司 | Stacking LED display and the three-dimensional display based on LED technology |
| CN110701584A (en) * | 2019-11-12 | 2020-01-17 | 深圳市欣上科技有限公司 | Method for manufacturing light-emitting diode light source and method for manufacturing light-emitting diode car lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20140110 |