TWM502251U - LED heat dissipation substrate - Google Patents

Description

LED heat sink substrate

This creation is related to LED lamps, and more specifically refers to an LED heat sink substrate with low resistance value, high energy and light energy conversion efficiency and better working efficiency.

According to LED, LED has the advantages of energy saving, power saving, fast reaction time and long life cycle, so it is widely used in LCD backlight, mobile phone backlight, horn light, automobile, art lighting, building lighting, stage lighting control, home lighting, etc. commodity. Since the input power of a general LED is only about 15-20% converted from light energy into light energy, nearly 80-85% of the electrical energy is converted into heat energy, and the conversion power is not high, and the heat energy generated when the LED is illuminated cannot be exported, which will enable The LED interface temperature is too high, which in turn affects luminous efficiency, stability and service life. At present, there are several types of heat dissipation for LEDs, including air dissipation, substrate heat dissipation, heat dissipation by gold wires, and thermal conduction from conduction vias if they are eutectic or flip chip processes.

The substrate heat dissipation LED is a commonly used heat dissipation method. Generally, the LED module is electrically connected to a heat dissipation substrate, and the heat dissipation substrate comprises an aluminum substrate. Since the pure aluminum is too soft, aluminum alloy is generally used. Aluminum plate Using screen printing technology to coat a layer of low thermal resistance thermal insulation material, which is composed of special polymer filled with special ceramics, has small thermal resistance, excellent viscoelasticity, anti-heat aging ability, and can withstand mechanical and thermal stress. On the insulating layer, a layer of copper foil is added by pressing to form a line on the copper foil.

Although the LED module is electrically connected to the copper foil circuit on the heat dissipation substrate, the overall configuration is the preferred heat dissipation method of the current LED. However, the resistance value and the conversion efficiency of the electric energy and the light energy still need to be improved.

Therefore, in view of the above-mentioned shortcomings, the creators have collected relevant materials, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, they have designed a new patent for such LED heat-dissipating substrates.

The main purpose of this creation is to provide an LED heat-dissipating substrate that can solve the missing problems. It does not use copper foil to make circuit, has low resistance value, and has high conversion efficiency of electric energy and light energy, and is more efficient and progressive. With business value.

In order to achieve the foregoing objectives, the present invention provides an LED heat dissipating substrate for bonding an LED thereon, comprising a metal layer, which is an alumina sheet; a thermally conductive insulating layer disposed on the surface of the metal layer; The circuit layer is printed on the surface of the thermally conductive insulating layer by graphene.

Further, the metal layer is an alumina having a nanopore.

Further, the thermally conductive insulating layer is made of boron nitride.

Further, the circuit layer is screen printed on the surface of the thermally conductive insulating layer with a graphene ink.

10‧‧‧LED heat sink substrate

12‧‧‧metal layer

14‧‧‧thermal insulation layer

16‧‧‧ circuit layer

The first figure is a schematic diagram of a preferred embodiment of the present invention.

In the following, a preferred embodiment of the present invention will be described in detail with reference to the drawings:

Referring to the first embodiment, the LED heat dissipation substrate 10 of the preferred embodiment is particularly suitable for low temperature LEDs, and includes a metal layer 12, a thermal conductive insulating layer 14 and a circuit layer 16.

The metal layer 12 is an anodized aluminum with a nano-scale hole, and its pore size, density and the like can be changed according to requirements, and the thermal conductivity is good, and the LED heat dissipation effect is provided.

The thermal conductive insulating layer 14 is made of boron nitride or the like, and is provided on the surface of the metal layer 12 (either by deposition or coating, etc.), and the boron nitride has high insulating property, high thermal conductivity and high temperature resistance, and can be effectively used as The metal layer 12 and the thermally conductive insulating layer of the circuit layer 16 improve heat dissipation efficiency.

The circuit layer 16 uses a graphene ink to screen the circuit on the surface of the thermal conductive insulating layer 14 for electrical connection of subsequent LED modules. The graphene material has extremely low resistance value and good electrical conductivity. .

The LED heat dissipation substrate 10 is constituted by the above components. It is used for subsequent steps of connecting the LED module, the upper insulating varnish, the printed solder paste layer and the reflow soldering to make the finished LED product.

Therefore, the LED heat dissipation substrate 10 is composed of each metal layer 12, a heat conductive insulating layer 14 and a circuit layer 16, and only the metal layer 12 is made of a metal material, and the circuit layer 16 is made of a graphene ink. The printing method is formed, and the manufacturing method is simpler than the conventional method of bonding the copper foil to the copper foil, and the circuit of the LED heat dissipation substrate 10 has a low resistance value (about 25 ohms), and the conversion efficiency of the electric energy and the light energy is high. (Up to about 40%), low heat generation and high heat dissipation efficiency. Therefore, its working efficiency and product performance are better than those of conventional LED heat-dissipating substrates made of copper foil. It is especially suitable for room temperature below 25 °C (5 Lighting up to 15 ° C) is of great commercial value.

It can be seen from the above that the LED heat dissipation substrate is composed of the metal layer, the heat conductive insulation layer and the circuit layer, and has low resistance value, high conversion efficiency of electric energy and light energy, and work efficiency can be known. LED heat-dissipating substrates made of copper foil are better, and have progressive and commercial value.

However, the above description is only a preferred embodiment of the present invention. When it is not possible to limit the scope of the patent protection of the present invention, the simple equivalent change and replacement according to the scope of the patent application and the contents of the specification of the present invention are All should remain within the scope of protection covered by the scope of this patent application.

10‧‧‧LED heat sink substrate

12‧‧‧metal layer

14‧‧‧thermal insulation layer

16‧‧‧ circuit layer

Claims (4)

An LED heat dissipating substrate for bonding an LED thereon, comprising: a metal layer, an alumina sheet; a thermally conductive insulating layer disposed on the surface of the metal layer; and a circuit layer printed on the graphene screen The circuit is on the surface of the thermally conductive insulating layer. The LED heat dissipating substrate according to claim 1, wherein the metal layer is an alumina having a nanopore. The LED heat dissipation substrate according to claim 1, wherein the heat conductive insulation layer is made of boron nitride. The LED heat dissipating substrate according to claim 1, wherein the circuit layer is printed on the surface of the thermally conductive insulating layer by a graphene ink screen.