CN204272571U - There is printed circuit board (PCB) and the LED light source module of micro-radiator - Google Patents
There is printed circuit board (PCB) and the LED light source module of micro-radiator Download PDFInfo
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- CN204272571U CN204272571U CN201420725142.XU CN201420725142U CN204272571U CN 204272571 U CN204272571 U CN 204272571U CN 201420725142 U CN201420725142 U CN 201420725142U CN 204272571 U CN204272571 U CN 204272571U
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- printed circuit
- radiator
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- circuit board
- pcb
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Abstract
The utility model provides a kind of printed circuit board (PCB) and the LED light source module with micro-radiator, and this printed circuit board (PCB) comprises: cooling base; Be arranged on the insulating bond on cooling base, it has at least one first through hole; Be arranged on the tellite on insulating bond, its positive terminal pad and negative terminal pad of having at least one second through hole and laying respectively at the second through hole both sides, the second through hole aligns with described first through hole; Be arranged on the micro-radiator in the first through hole and the second through hole, itself and cooling base and tellite close contact.The utility model has the printed circuit board (PCB) of micro-radiator and LED light source module and has that preparation is simple, cost is low, the advantage of perfect heat-dissipating.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB) and LED light source module; More particularly, the utility model relates to a kind of printed circuit board (PCB) and the LED light source module with micro-radiator.
Background technology
Light-emitting diode (LED) generally becomes the alternative source of light of incandescent source, fluorescence light source and halogen light source recently, and it can be the applications such as medical treatment, military affairs, signboard, signal, aviation, navigation, vehicle, portable set, commercialization and lighting of home and provides low energy consumption, long-life illumination.
LED chip also produces a large amount of heat energy while providing high brightness to export, and causes its temperature significantly to raise.But in high temperature environments, can there is the problems such as colour cast, brightness reduction, shortening in useful life in LED, even can fault and cannot using immediately.
In order to solve the heat dissipation problem of LED, generally adopt the metal base printed circuit board with excellent heat dispersion performance as the installation carrier of the LED such as LED chip and LED lamp bead.Such as, Chinese patent 201120173993.4 discloses a kind of printed circuit board (PCB) with metal micro-radiator, it comprises a conventional printed circuit boards and the metal back layer with the stacked setting of this conventional printed circuit boards, a bottom surface at least away from this metal back layer in two bottom surfaces of this conventional printed circuit boards is provided with layers of copper circuit, the one side that metal back layer contacts with conventional printed circuit boards is provided with one or more micro-radiator of cylindrical metal be connected as a single entity with metal back layer, this one or more metal micro-radiator protrudes from metal back layer surface and corresponding embedding is run through in one or more cylindricality through holes of conventional printed circuit boards, the end face of metal micro-radiator and conventional printed circuit boards away from metal back layer a bottom surface set by layers of copper circuit between leave spacing.
During use, LED is installed and is directly installed on metal micro-radiator, heat in LED conducts to fast after the metal back layer with larger area of dissipation through metal micro-radiator and distributes, therefore, under LED can be maintained lower working temperature by this printed circuit board (PCB), promote the performance and used life of LED.
But, because metal back layer in this printed circuit board (PCB) and the micro-radiator of cylindrical metal are one, therefore, by conventional printed circuit boards and metal back layer is stacked arrange time, need to arrange location structure with the through-hole alignment by micro-radiator and conventional printed circuit boards, complex procedures, makes the cost of manufacture of printed circuit board (PCB) higher.And, adopt the printed circuit board (PCB) of said structure, distance between the end face of layers of copper circuit and the end face of micro-radiator can only control in the scope of 20 microns to 50 microns, easily produce when LED lamp bead being soldered to printed circuit board (PCB) welding cavity etc. defect, cause LED lamp bead conduct electricity or heat conduction bad.
Summary of the invention
For the deficiencies in the prior art, the purpose of this utility model is that providing a kind of prepares simple, that cost the is low printed circuit board (PCB) with micro-radiator and LED light source module.
To achieve these goals, on the one hand, the utility model provides a kind of printed circuit board (PCB) with micro-radiator, and it comprises: cooling base; Be arranged on the insulating bond on cooling base, it has at least one first through hole; Be arranged on the tellite on insulating bond, its positive terminal pad and negative terminal pad of having at least one second through hole and being separately positioned on the second through hole both sides, the second through hole aligns with the first through hole; Be arranged on the micro-radiator in the first through hole and the second through hole, itself and cooling base and tellite close contact.
In the utility model, cooling base can be prepared from by single materials such as aluminium, copper, aluminium oxide ceramics or aluminium nitride ceramicss, also can be the composite plate with layer structure, such as aluminum-based copper-clad plate, aluminum oxide ceramics copper-clad plate or aluminium nitride ceramics copper-clad plate.Adopt the composite plate with copper clad layers can strengthen the adhesion of cooling base and micro-radiator, reduce the thermal resistance between micro-radiator and cooling base, improve the heat dispersion of printed circuit board (PCB).
Micro-radiator can pass through the method for silk screen printing copper slurry or silver slurry in the first through hole and the second through hole and prepare.This method can obtain micro-radiator expeditiously, is very suitable for the large-scale batch production of printed circuit board (PCB).Preferably, the conductive coefficient of silver slurry and copper slurry is more than or equal to 13.5W/m.k.
Micro-radiator also can be prepared by the method for horizontal tin-spraying in the first through hole and the second through hole.Tin has the characteristic that fusing point is lower, conductive coefficient is high, adopts tin to prepare micro-radiator, not only technique is easy to realize, and the micro-radiator obtained has good heat conductivility.In the utility model, term " tin " not only comprises tin simple substance, but also comprises the ashbury metal that Theil indices is more than 95%.Preferably, the conductive coefficient of tin is more than or equal to 65W/m.k.
According to above technical scheme, micro-radiator and cooling base separate, therefore, can utilize insulating bond by tellite and cooling base bonding after make micro-radiator, do not need to arrange location structure between cooling base and tellite, thus simplify production process and reduce the cost of manufacture of printed circuit board (PCB).Further, micro-radiator and tellite close contact, namely all filled by micro-radiator with whole second through hole on the direction of micro-radiator top surface being parallel, and therefore the cross-sectional area of micro-radiator is large, and thermal resistance is little.On the contrary, in the prior art, because metal back layer and the micro-radiator of cylindrical metal are one, therefore between the through hole and metal micro-radiator of conventional printed circuit boards, gap is certainly existed, the through hole space of conventional printed circuit boards can not be used effectively, the cross-sectional area of metal micro-radiator is little, and thermal resistance is large.
According to an embodiment of the present utility model, the spacing between the end face of positive terminal pad, negative terminal pad and the end face of micro-radiator is less than 10 microns.
When LED lamp bead is assembled to printed circuit board (PCB), its positive pole, heat sink and negative pole are soldered to positive terminal pad, micro-radiator and negative terminal pad respectively, if the gap between the end face of the end face of positive terminal pad, negative terminal pad and micro-radiator is excessive, then easily produce in weld zone cavity etc. defect, cause conduction or heat conduction bad.Adopt printed circuit board (PCB) of the prior art, spacing between the end face of its positive terminal pad, negative terminal pad and the end face of micro-radiator can only control in the scope being less than 50 microns, and the spacing in printed circuit board (PCB) of the present utility model between the end face of positive terminal pad, negative terminal pad and the end face of micro-radiator controls in the scope being less than 10 microns, therefore, printed circuit board (PCB) of the present utility model can reduce the generation of weld defect.
According to another embodiment of the present utility model, cooling base comprises ceramic base material and is formed on ceramic base material, is positioned at the copper clad layers of micro-radiator side.Such as, cooling base is aluminum oxide ceramics copper-clad plate or the copper-clad plate of aluminium nitride pottery.Adopt the cooling base comprising ceramic base material can improve the withstand voltage properties of printed circuit board (PCB) well.
According to another embodiment of the present utility model, cooling base comprises aluminium base and the copper clad layers forming on aluminum substrates, be positioned at micro-radiator side, this cooling base has that aluminium is lightweight, cost is low and the advantage of copper perfect heat-dissipating concurrently, and has good machinability.
According to another embodiment of the present utility model, tellite comprises the patterned conductive layer be arranged on insulating bond, and is arranged on the patterning solder mask on insulating bond and patterned conductive layer.Conductive layer is set directly on insulating bond by this scheme, to reduce the thickness of printed circuit board (PCB), thus realizes the miniaturization of printed circuit board (PCB) and LED illumination product; Meanwhile, in the program, micro-radiator has less height, and thermal resistance is little, and the heat dispersion of printed circuit board (PCB) is better.
Preferably, the THICKNESS CONTROL of conductive layer at 10 microns to 35 microns, the THICKNESS CONTROL of insulating bond at 15 microns to 40 microns, with by the Altitude control of micro-radiator at smaller value.
More preferably, the Altitude control of micro-radiator is 30 microns to 50 microns.
According to another embodiment of the present utility model, tellite comprises the dielectric layer be arranged on insulating bond, setting patterned conductive layer on the dielectric layer, and is arranged on the patterning solder mask on dielectric layer and conductive layer.
To achieve these goals, on the other hand, the utility model additionally provides a kind of LED light source module, and it comprises the printed circuit board (PCB) of at least one LED and above arbitrary technical scheme, and LED is arranged on micro-radiator of this printed circuit board (PCB).
Concrete, LED is LED lamp bead or LED chip.
In above LED light source module, one or more LED can be set on a micro-radiator.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of printed circuit board embodiment 1 of the present utility model;
Fig. 2 is the structural representation of printed circuit board embodiment 2 of the present utility model;
Fig. 3 is the structural representation of LED light source module embodiment 1 of the present utility model;
Fig. 4 is the structural representation of LED light source module embodiment 2 of the present utility model.
Embodiment
Printed circuit board embodiment 1
The printed circuit board (PCB) of the present embodiment comprises copper pedestal 10, the insulating bond 20 be arranged on copper pedestal 10, the patterned conductive layer 30 be arranged on insulating bond 20, the patterning solder mask 40 be arranged on insulating bond 20 and conductive layer 30, and micro-radiator 50.
Insulating bond 20 is provided with the first through hole, solder mask 40 is limited with the second through hole, the first through hole and the second through hole alignment, micro-radiator 50 is arranged in the first through hole and the second through hole, and with copper pedestal 10, insulating bond 20 and solder mask 40 close contact.Conductive layer 30 comprises positive terminal pad 31 and negative terminal pad 32, the two be respectively formed at micro-radiator 50 both sides and with its isolation, the spacing between the end face of micro-radiator 50 and the end face of positive terminal pad 31 and negative terminal pad 32 is 3 microns.
In the present embodiment, the thickness of copper pedestal 10 is 1 millimeter, and the thickness of insulating bond 20 is 25 microns, and the thickness of conductive layer 30 is 17 microns, and the height of micro-radiator 50 is 45 microns.
In the present embodiment, micro-radiator 50 is prepared by the method for horizontal tin-spraying (i.e. hot air leveling) in the first through hole and the second through hole, it uses the gun-metal that tin accounts for 99.7wt%, copper accounts for 0.3wt%, and conductive coefficient is 65W/m.k.
Printed circuit board embodiment 2
The printed circuit board (PCB) of the present embodiment comprises cooling base 10, the insulating bond 20 be arranged on cooling base 10, the FR4 printed circuit board (PCB) be arranged on insulating bond 20, and micro-radiator 50.FR4 printed circuit board (PCB) comprises the dielectric layer 60 be arranged on insulating bond 20, the patterned conductive layer 30 be arranged on dielectric layer 60, and is arranged on the patterning solder mask 40 on dielectric layer 60 and conductive layer 30.
Insulating bond 20 is provided with the first through hole, FR4 printed circuit board (PCB) is provided with the second through hole, first through hole and the second through hole alignment, micro-radiator 50 is arranged in the first through hole and the second through hole, and with cooling base 10, insulating bond 20 and FR4 printed circuit board (PCB) compact siro spinning technology.Conductive layer 30 comprises positive terminal pad 31 and negative terminal pad 32, the two be respectively formed at micro-radiator 50 both sides and with its isolation, the spacing between the end face of positive terminal pad 31, negative terminal pad 32 and the end face of micro-radiator 50 is less than 10 microns.
To be the aluminium base 11 of 1 millimeter and thickness the be copper clad layers 12 of 100 microns that cooling base 10 comprises thickness, and copper clad layers 12 is positioned at the side at micro-radiator 50 place.
In the present embodiment, micro-radiator 50 is prepared by the method for horizontal tin-spraying (i.e. hot air leveling) in the first through hole and the second through hole equally, it uses the gun-metal that tin accounts for 99.7wt%, copper accounts for 0.3wt%, and conductive coefficient is 65W/m.k.
Printed circuit board embodiment 3
The difference of the present embodiment and embodiment 1 is only: in the present embodiment, micro-radiator starches (manufacturer: Tatsuta Electric Wire & Cable Co. by silk screen printing copper in the first through hole and the second through hole, Ltd., model: AE2217, conductive coefficient: 13.5W/m.k) method prepare.
Printed circuit board embodiment 4
The difference of the present embodiment and embodiment 1 is only: in the present embodiment, cooling base has layer structure, and it comprises ceramic base material and be formed on ceramic base material, is positioned at the copper clad layers of micro-radiator side.
LED light source module embodiment 1
Shown in composition graphs 1 and Fig. 3, the LED light source module of the present embodiment comprises printed circuit board embodiment 1 and the LED chip 61 be arranged on micro-radiator 50, its positive pole, negative pole are electrically connected to positive terminal pad 31 and negative terminal pad 32 respectively by gold thread 62, gold thread 63, and package lens 64 is formed on a printed circuit and coated LED chip 61, gold thread 62 and gold thread 63.
LED light source module embodiment 2
Shown in composition graphs 1 and Fig. 4, the LED lamp bead 70 that the LED light source module of the present embodiment comprises printed circuit board embodiment 2 and is arranged on micro-radiator 50, its positive pole 71, heat sink 72 and negative pole 73 be respectively welded to positive terminal pad 31, micro-radiator 50 and negative terminal pad 32.
Although the utility model discloses as above with preferred embodiment, and is not used to limit scope of the present utility model.Those of ordinary skill in the art, not departing from invention scope of the present utility model, the equal improvement done according to the utility model, should be invention scope of the present utility model and contained.
Claims (10)
1. have a printed circuit board (PCB) for micro-radiator, it comprises:
Cooling base;
Be arranged on the insulating bond on described cooling base, it has at least one first through hole;
Be arranged on the tellite on described insulating bond, its positive terminal pad and negative terminal pad of having at least one second through hole and laying respectively at described second through hole both sides, described second through hole aligns with described first through hole;
It is characterized in that:
Be arranged on the micro-radiator in described first through hole and described second through hole, itself and described cooling base and described tellite close contact.
2. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, the spacing between the end face of described positive terminal pad and negative terminal pad and the end face of described micro-radiator is less than 10 microns.
3. printed circuit board (PCB) as claimed in claim 1, is characterized in that, described cooling base comprises ceramic base material and is formed on described ceramic base material, is positioned at the copper clad layers of described micro-radiator side.
4. printed circuit board (PCB) as claimed in claim 1, is characterized in that, described cooling base comprises aluminium base and is formed on described aluminium base, is positioned at the copper clad layers of described micro-radiator side.
5. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described tellite comprises the patterned conductive layer be arranged on described insulating bond, and is arranged on the patterning solder mask on described insulating bond and described patterned conductive layer.
6. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, the thickness of described conductive layer is 10 microns to 35 microns, and the thickness of described insulating bond is 15 microns to 40 microns.
7. printed circuit board (PCB) as claimed in claim 6, it is characterized in that, the height of described micro-radiator is 30 microns to 50 microns.
8. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described tellite comprises the dielectric layer be arranged on described insulating bond, the patterned conductive layer be arranged on described dielectric layer, and is arranged on the patterning solder mask on described dielectric layer and described conductive layer.
9. a LED light source module, comprises at least one LED, it is characterized in that, described LED light source module also comprises the printed circuit board (PCB) as described in any one of claim 1-8, and described LED is arranged on described micro-radiator.
10. LED light source module as claimed in claim 9, it is characterized in that, described LED is LED lamp bead or LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420725142.XU CN204272571U (en) | 2014-11-26 | 2014-11-26 | There is printed circuit board (PCB) and the LED light source module of micro-radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420725142.XU CN204272571U (en) | 2014-11-26 | 2014-11-26 | There is printed circuit board (PCB) and the LED light source module of micro-radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272571U true CN204272571U (en) | 2015-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420725142.XU Expired - Fee Related CN204272571U (en) | 2014-11-26 | 2014-11-26 | There is printed circuit board (PCB) and the LED light source module of micro-radiator |
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| Country | Link |
|---|---|
| CN (1) | CN204272571U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109695826A (en) * | 2019-03-01 | 2019-04-30 | 力普士科技（珠海）有限公司 | Integral type UV-LED light source module group and preparation method thereof |
| CN110233198A (en) * | 2018-05-09 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | Route LED support production method, route LED support and LED |
-
2014
- 2014-11-26 CN CN201420725142.XU patent/CN204272571U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110233198A (en) * | 2018-05-09 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | Route LED support production method, route LED support and LED |
| CN109695826A (en) * | 2019-03-01 | 2019-04-30 | 力普士科技（珠海）有限公司 | Integral type UV-LED light source module group and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20191126 |
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| CF01 | Termination of patent right due to non-payment of annual fee |