CN108419372A - A kind of new-energy automobile power battery test system current-carrying board manufacturing method - Google Patents
A kind of new-energy automobile power battery test system current-carrying board manufacturing method Download PDFInfo
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- CN108419372A CN108419372A CN201810455501.7A CN201810455501A CN108419372A CN 108419372 A CN108419372 A CN 108419372A CN 201810455501 A CN201810455501 A CN 201810455501A CN 108419372 A CN108419372 A CN 108419372A
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- copper
- copper bar
- gong
- plate
- substrates
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Abstract
The present invention provides a kind of new-energy automobile power batteries to test system current-carrying board manufacturing method, including step：Copper bar makes；FR4 plates make；Current-carrying plate makes.The present invention passes through accurately controlling to 4 substrates of FR and the dimensional fits at the angles copper bar R, it is ensured that the reliability of product；The present invention pastes dry film in thick metal plated preceding addition, needs exposure imaging, improves efficiency, and ensures only electric thick gold at the desired position, avoids the waste of gold salt.
Description
Technical field
The invention belongs to Manufacturing Technology for PCB fields, and in particular to be that a kind of new-energy automobile power battery is surveyed
Test system current-carrying board manufacturing method.
Background technology
Power battery is the important component of new-energy automobile, and performance is most important to new-energy automobile, how to be improved dynamic
The charging time of power battery, service life, the weight for mitigating battery increase the cruising ability of battery, reduce cost, ensure to use
Security problems are current new-energy automobiles there is an urgent need to and must solve the problems, such as.Since the safety of power battery is asked
Topic is concerning the person and property safety, and therefore, the safety of power battery is extremely important, the safety testings such as short circuit, needle thorn, extruding
Also it need to should be carried out under conditions of having abundant environmental protection especially with caution.This just carries power battery testing system with current-carrying plate
Higher requirement is gone out.
Automobile power cell tests one kind that system is composite bus bar with current-carrying plate, the company with multi-level composite construction
Run in, has the Some features such as low repeatable electric property, inductive impedance, strong antijamming capability and reliability height.Vapour at present
Vehicle power battery testing system is made of current-carrying plate of routine PCB flows, is primarily present problems with：One, from engineering copper
Stock layout formula is designed into practical gong FR-4 substrates or copper bar, and FR-4 substrates and the dimensional fits at the angles copper bar R are difficult to accurately control, from
And process layout after influencing；Two, dry film is had in plating wire clamp point position when thick metal plated, leads to poor contact, gets rid of
Golden phenomenon, while the broken other positions being attached on copper bar of dry film have the problem of leakage copper exception；Three, automatic bevelling machine is maximum
Bevel edge thickness be 2.5mm, more than the PCB of 2.5mm can only manual bevel edge, and mainly goldfinger bevel facilitates inserting for pcb board
It pulls out, and the bevel edge machine in old process is unable to meet production requirement.
Invention content
For this purpose, the purpose of the present invention is to provide a kind of new-energy automobile power battery test system current-carrying plate making sides
Method.
The purpose of the present invention is what is be achieved through the following technical solutions.
A kind of new-energy automobile power battery test system current-carrying board manufacturing method, including step：Copper bar makes；FR4
Plate makes；Current-carrying plate makes.
Preferably, the copper bar makes, including：
Sawing sheet is carried out to copper base, then bores location hole, then carries out gong plate with the copper bar by copper base gong at required shape.
Preferably, it is described to copper base carry out sawing sheet, then bore location hole, then carry out gong plate with by copper base gong at institute
The copper bar of shape is needed, including：
Satisfactory small powder is outputed as requested using correct plate；
Then it presses normal drill parameter and carries out drilling processing；
It requires to carry out brown according to normal brown；
Gong plate is carried out after brown, and required copper bar is processed by copper coin gong board parameter.
Preferably, the FR4 plates, which make, includes：
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement；
Pre-treatment processing is carried out to the FR4 substrates, then carries out pressing dry film, exposure imaging progress inner figure making；
Then internal layer etching is carried out to FR4 substrates, forms inner line figure；
It finally drills to FR4 substrates, and gong plate is slotted.
Preferably, the current-carrying plate makes, including：
Pressing → drilling → removing glue → heavy copper → mono- time dry film → etching → gong slot → pad pasting → electricity gold → etching → welding resistance → gong
Plate → bevel edge → FQC → FQA → packaging.
Preferably, the current-carrying plate makes, including：
Copper bar is put into corresponding FR4 substrate grooves, and make adjacent composite bus bar fit clearance to control 0.15mm with
It is interior, it is pressed using the pressing formula of HTG001；Then drill out edge PTH hole using drilling machine, then use highly dense wood-pulp board, one piece
One is folded；Removal copper bar surface has residue glue；Chemistry removing glue is crossed, sinks copper twice；Encapsulating sections observation inner hole deposition after plate electricity when plate electricity
Copper situation, it is desirable that through-hole hole copper 5-8um；Outer graphics are done in the excessively super roughening of outer layer pre-treatment, pad pasting, exposure, development；As requested
Carry out graphic plating, etching；Then process gong goes out the copper bar section of side；Pad pasting, electric thick gold, following normal parameter etching,
Welding resistance, then shipment is packed in gong plate, bevel edge, detection as requested.
A kind of new-energy automobile power battery test system current-carrying board manufacturing method, including；To copper base carry out sawing sheet,
It bores location hole, carry out brown, then carry out gong plate with by the copper bar of copper base gong shape in the arc-shaped；Then FR4 base materials are selected, and
The FR4 substrates for meeting size dimension requirement are cut into, pre-treatment processing is carried out to the FR4 substrates, carries out pressing dry film, expose
Photodevelopment carries out inner figure making, carries out internal layer etching to FR4 substrates, forms inner line figure, drills to FR4 substrates,
And gong plate is slotted, the fluting is circular shape corresponding with the copper bar；The copper bar is put into corresponding FR4 substrates to open
In slot, wherein when the angles R of the fluting inside contract and its angle corresponding copper bar R is protruded, the angles R of the copper bar are more than the fluting
The angles R；When the angles R of the fluting are protruded and its angle corresponding copper bar R inside contracts, the angles R of the copper bar are less than the R of the fluting
Angle, and adjacent composite bus bar fit clearance will control within 0.15mm；Then it is pressed and is made using pressing formula
Edge PTH hole is drilled out with drilling machine, then uses highly dense wood-pulp board, one piece one folded；Removal copper bar surface has residue glue；Chemistry removing glue is crossed,
Heavy copper is twice；Encapsulating sections observation inner hole deposition copper situation after plate electricity when plate electricity, it is desirable that through-hole hole copper thickness 5-8um；Before outer layer
Super roughening, pad pasting were managed, exposure develops and does outer graphics；Graphic plating is carried out as requested, is etched；Then process gong goes out side
The copper bar section in face；Pad pasting, electric thick gold, the etching of following normal parameter, welding resistance, then gong plate as requested, bevel edge, detection,
Pack shipment.
New-energy automobile power battery provided by the invention tests system current-carrying board manufacturing method, by FR-4 substrates
With accurately controlling for the dimensional fits at the angles copper bar R, it is ensured that the reliability of product；The present invention is needed in thick metal plated preceding patch dry film
Exposure imaging improves efficiency, and ensures only electric thick gold at the desired position, avoids the waste of gold salt.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
The present invention provides the making sides that a kind of satisfactory new-energy automobile power battery tests system current-carrying plate
Method passes through accurately controlling to FR-4 substrates and the dimensional fits at the angles copper bar R, it is ensured that the reliability of product；The present invention exists
Dry film is pasted before thick metal plated, exposure imaging is needed, improves efficiency, and ensures only electric thick gold at the desired position, avoids gold
The waste of salt.
The specific production method of current-carrying plate of the present invention includes：Copper bar makes；FR4 plates make；Current-carrying plate makes.
Copper bar production process, including sawing sheet → drilling → gong plate.Copper bar is a kind of conducting heavy current product, is suitable for height
The electro-engineerings such as piezoelectricity device, switch contact, controller switching equipment, bus duct are also widely used in metal smelt, electrification plating, chemical industry burning
The super-large currents electrolysis for production engineering such as alkali.
Wherein the flow includes：Sawing sheet outputs satisfactory small powder as requested using correct plate；Then it presses just
Normal drilling parameter carries out drilling processing；Gong plate process is carried out after requiring brown according to normal brown, is processed by copper coin gong board parameter.
FR4 plates make：FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement；To institute
It states FR4 substrates and carries out pre-treatment processing, then carry out pressing dry film, exposure imaging progress inner figure making；Then to FR4 substrates
Internal layer etching is carried out, inner line figure is formed；It finally drills to FR4 substrates, and gong plate is slotted.
Wherein sawing sheet outputs satisfactory small powder as requested using correct plate；Then press normal drill parameter into
Row drilling processing；Gong plate process is carried out after requiring brown according to normal brown, is processed by copper coin gong board parameter.
The dimensional fits of FR4 substrates and the angles copper bar R when the present invention needs to pay attention to gong plate.Current-carrying plate of the present invention is composite bus bar
One kind, use national standard T2 red copper (copper contents：99.95% or so.It is bent 90 degree of surface flawless, tensile strength：≥300N/
Mm2, resistivity：≤ 0.017772 Ω mm2/m) with the FR-4 of high Tg (excellent electrical properties, operating temperature is higher, dimensionally stable,
Impact resistance, moisture-proof) cooperation is inlayed, then allow them to be integrally formed with colloid sealing fit clearance.
Wherein the present invention will consider the respective angles R to rear from engineering copper bar form design to practical gong FR-4 or copper bar
The influence of process layout, the control at the angles R are the most important things of engineering design and gong plate.The angles R that the present invention slots inside contract and its is right
When the angles the copper bar R protrusion answered, the angles R of the copper bar are more than the angles R of the fluting；When the angles R of fluting protrusion, it is corresponded to
Angles copper bar R when inside contracting, the angles R of the copper bar are less than the angles R of the fluting.
Many especially for some cooperation positions, the variation at the everywhere angles R will consider, and the compound mother of this type
Row's fit clearance will be controlled in 0.15mm.
Current-carrying plate makes, including：Pressing → drilling → removing glue → heavy copper → mono- time dry film → etching → gong slot → pad pasting →
Electric gold → etching → welding resistance → gong plate → bevel edge → FQC → FQA → packaging.Its detailed process is：Copper bar is put into corresponding
In FR4 substrate grooves, and adjacent composite bus bar fit clearance is made to control within 0.15mm, uses the pressing formula of HTG001
It is pressed；Then edge PTH hole is drilled out using drilling machine, then uses highly dense wood-pulp board, one piece one folded；Removal copper bar surface has residual
Glue；Chemistry removing glue is crossed, sinks copper twice；Encapsulating sections observation inner hole deposition copper situation after plate electricity when plate electricity, it is desirable that through-hole hole copper 5-
8um；Outer graphics are done in the excessively super roughening of outer layer pre-treatment, pad pasting, exposure, development；Graphic plating is carried out as requested, is etched；So
Process gong goes out the copper bar section of side afterwards；Pad pasting, electric thick gold, the etching of following normal parameter, welding resistance, then gong as requested
Plate, bevel edge, detection, packaging shipment.
Wherein need thick metal plated after pad pasting in the flow, and minimum golden thickness is 12um, and side also needs to be electroplated
Thick gold, thus then need in advance gong go out side, can not be conductive and since entire copper bar forms an isolated island, can not meet plating
The prerequisite of thick metal working sequence conduction.And it due to the FR-4 substrates that product structure bottom is 1.8mm thickness, can only be led by boring
Through-hole walks heavy electrolytic copper technique, and isolated island copper bar and the FR-4 of bottom single side copper thickness 1OZ are connected, and forms conductive path,
Simultaneously in heavy electrolytic copper, the speed of the heavy electrolytic copper of copper bar is significantly faster than that the speed of the heavy electrolytic coppers of single side copper foil FR-4.Go out to prevent from burning plate
It is existing, bottom FR-4 can only whole plate face sink electrolytic copper, and it is thick metal plated it is only necessary to there is conductive path, so before thick metal plated
Patch dry film process is added, it is ensured that only electric thick gold at the desired position, while can be to avoid the waste of gold salt.
In addition, since patch dry film is to overlay on entire plate face, dry film is had in plating wire clamp point position when thick metal plated, is caused
Poor contact occurs getting rid of golden phenomenon, while the broken other positions being attached on copper bar of dry film, and it is abnormal to have leakage copper, although can be with
Dry film and the dry film for wiping folder electric position off by hand are broken but less efficient, and the present invention can directly paste dry film using laminating machine, can
Disposably to scrape folder point position, without exposure, development greatly improves the efficiency.
It should also be noted that, the automatic maximum bevel edge thickness of bevelling machine is 2.5mm in PCB industries now, it is more than 2.5mm
PCB can only manual bevel edge, and mainly goldfinger bevel facilitates the plug of pcb board, bevel edge machine currently on the market also without
Method meets production, and the present invention can then make different adjustment according to production requirement, meet the special bevel edge requirement of product, to oblique
Side machine is reequiped, to meet the special bevel edge requirement that plate thickness is more than the production plate of 2.5mm.
In conclusion the present invention passes through accurately controlling to FR-4 substrates and the dimensional fits at the angles copper bar R, it is ensured that product
Reliability；The present invention pastes dry film in thick metal plated preceding addition, needs exposure imaging, improves efficiency, and ensures only needing
Position electric thick gold, avoid the waste of gold salt.The present invention, which solves conventional PCB flows, can not produce new-energy automobile power electric
The problem of system current-carrying plate, is tested in pond；And the new-energy automobile power battery test system current-carrying plate produced can be with
Improve the charging time of battery, the weight of service life, mitigation battery, increases the cruising ability of battery, reduce cost, ensure to make
With safety.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (7)
1. a kind of new-energy automobile power battery tests system current-carrying board manufacturing method, which is characterized in that including step：Copper bar
It makes；FR4 plates make；Current-carrying plate makes.
2. new-energy automobile power battery as described in claim 1 tests system current-carrying board manufacturing method, which is characterized in that
The copper bar makes, including：
Sawing sheet is carried out to copper base, then bores location hole, then carries out gong plate with the copper bar by copper base gong at required shape.
3. new-energy automobile power battery as claimed in claim 2 tests system current-carrying board manufacturing method, which is characterized in that
It is described that sawing sheet is carried out to copper base, location hole is then bored, then carries out gong plate with the copper bar by copper base gong at required shape, packet
It includes：
Satisfactory small powder is outputed as requested using correct plate；
Then it presses normal drill parameter and carries out drilling processing；
It requires to carry out brown according to normal brown；
Gong plate is carried out after brown, and required copper bar is processed by copper coin gong board parameter.
4. new-energy automobile power battery as claimed in claim 3 tests system current-carrying board manufacturing method, which is characterized in that
The FR4 plates make：
FR4 base materials are selected, and are cut into the FR4 substrates for meeting size dimension requirement；
Pre-treatment processing is carried out to the FR4 substrates, then carries out pressing dry film, exposure imaging progress inner figure making；
Then internal layer etching is carried out to FR4 substrates, forms inner line figure；
It finally drills to FR4 substrates, and gong plate is slotted.
5. new-energy automobile power battery as claimed in claim 4 tests system current-carrying board manufacturing method, which is characterized in that
The current-carrying plate makes, including：
Pressing → drilling → removing glue → heavy copper → mono- time dry film → etching → gong slot → pad pasting → electricity gold → etching → welding resistance → gong
Plate → bevel edge → FQC → FQA → packaging.
6. new-energy automobile power battery as claimed in claim 5 tests system current-carrying board manufacturing method, which is characterized in that
The current-carrying plate makes, including：
Copper bar is put into corresponding FR4 substrate grooves, and make adjacent composite bus bar fit clearance to control 0.15mm with
It is interior, it is pressed using the pressing formula of HTG001；Then drill out edge PTH hole using drilling machine, then use highly dense wood-pulp board, one piece
One is folded；Removal copper bar surface has residue glue；Chemistry removing glue is crossed, sinks copper twice；Encapsulating sections observation inner hole deposition after plate electricity when plate electricity
Copper situation, it is desirable that through-hole hole copper 5-8um；Outer graphics are done in the excessively super roughening of outer layer pre-treatment, pad pasting, exposure, development；As requested
Carry out graphic plating, etching；Then process gong goes out the copper bar section of side；Pad pasting, electric thick gold, following normal parameter etching,
Welding resistance, then shipment is packed in gong plate, bevel edge, detection as requested.
7. a kind of new-energy automobile power battery tests system current-carrying board manufacturing method, which is characterized in that including；To copper base
Sawing sheet is carried out, location hole is bored, carries out brown, then carries out gong plate with by the copper bar of copper base gong shape in the arc-shaped；Then it selects
FR4 base materials, and the FR4 substrates for meeting size dimension requirement are cut into, pre-treatment processing is carried out to the FR4 substrates, into
Row press dry film, exposure imaging carries out inner figure making, and internal layer etching is carried out to FR4 substrates, forms inner line figure, right
FR4 substrates drill, and gong plate is slotted, and the fluting is circular shape corresponding with the copper bar；The copper bar is put into relatively
In the FR4 substrates fluting answered, wherein when the angles R of the fluting inside contract and its angle corresponding copper bar R is protruded, the R of the copper bar
Angle is more than the angles R of the fluting；When the angles R of the fluting are protruded and its angle corresponding copper bar R inside contracts, the angles R of the copper bar
Less than the angles R of the fluting, and adjacent composite bus bar fit clearance will control within 0.15mm；Then using pressing formula
Press and drill out edge PTH hole using drilling machine, then use highly dense wood-pulp board, one piece one folded；Removal copper bar surface has residual
Glue；But chemistry removing glue sinks copper twice；Encapsulating sections observation inner hole deposition copper situation after plate electricity when plate electricity, it is desirable that through-hole hole copper is thick
Spend 5-8um；Outer graphics are done in the excessively super roughening of outer layer pre-treatment, pad pasting, exposure, development；Graphic plating is carried out as requested, is lost
It carves；Then process gong goes out the copper bar section of side；Pad pasting, electric thick gold, the etching of following normal parameter, welding resistance, then according to wanting
Ask gong plate, bevel edge, detection, packaging shipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455501.7A CN108419372B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing current carrying plate for new energy automobile power battery test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455501.7A CN108419372B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing current carrying plate for new energy automobile power battery test system |
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| Publication Number | Publication Date |
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| CN108419372A true CN108419372A (en) | 2018-08-17 |
| CN108419372B CN108419372B (en) | 2021-02-05 |
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| CN201810455501.7A Active CN108419372B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing current carrying plate for new energy automobile power battery test system |
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| CN106413265A (en) * | 2016-11-23 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | New energy automobile battery special circuit board production process |
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| CN107041067A (en) * | 2017-05-10 | 2017-08-11 | 深圳市深联电路有限公司 | A kind of preparation method of thermistor printed circuit board |
| CN107072080A (en) * | 2017-05-10 | 2017-08-18 | 深圳市深联电路有限公司 | A kind of copper-based PCB of bending preparation method |
| CN107548244A (en) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based |
| CN107613647A (en) * | 2017-08-21 | 2018-01-19 | 胜宏科技（惠州）股份有限公司 | A kind of preparation method of new energy intelligent charging system wiring board |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
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2018
- 2018-05-14 CN CN201810455501.7A patent/CN108419372B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413265A (en) * | 2016-11-23 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | New energy automobile battery special circuit board production process |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
| CN107041067A (en) * | 2017-05-10 | 2017-08-11 | 深圳市深联电路有限公司 | A kind of preparation method of thermistor printed circuit board |
| CN107072080A (en) * | 2017-05-10 | 2017-08-18 | 深圳市深联电路有限公司 | A kind of copper-based PCB of bending preparation method |
| CN107613647A (en) * | 2017-08-21 | 2018-01-19 | 胜宏科技（惠州）股份有限公司 | A kind of preparation method of new energy intelligent charging system wiring board |
| CN107548244A (en) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based |
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| CN108419372B (en) | 2021-02-05 |
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