CN108419372B - Method for manufacturing current carrying plate for new energy automobile power battery test system - Google Patents
Method for manufacturing current carrying plate for new energy automobile power battery test system Download PDFInfo
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- CN108419372B CN108419372B CN201810455501.7A CN201810455501A CN108419372B CN 108419372 B CN108419372 B CN 108419372B CN 201810455501 A CN201810455501 A CN 201810455501A CN 108419372 B CN108419372 B CN 108419372B
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- copper bar
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Abstract
The invention provides a method for manufacturing a current-carrying plate for a new energy automobile power battery test system, which comprises the following steps: manufacturing a copper bar; manufacturing an FR4 board; and manufacturing the current-carrying plate. The invention ensures the reliability of the product by accurately controlling the size matching of the FR-4 substrate and the R angle of the copper bar; according to the invention, the dry film is added before the thick gold is electroplated, exposure and development are required, the efficiency is improved, the thick gold is ensured to be electroplated only at the required position, and the waste of gold salt is avoided.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a method for manufacturing a current-carrying plate for a new energy automobile power battery testing system.
Background
The power battery is an important part of a new energy automobile, the performance of the power battery is very important for the new energy automobile, and the problems of how to improve the charging time and the service life of the power battery, reduce the weight of the battery, increase the cruising ability of the battery, reduce the cost, ensure the use safety and the like are the problems which are urgently needed and must be solved by the new energy automobile at present. Because the safety problem of the power battery is related to personal and property safety, the safety of the power battery is very important, and safety tests such as short circuit, needling, extrusion and the like are also needed to be carried out carefully under the condition of sufficient environmental protection. This puts higher demands on the current-carrying plate for the power battery test system.
The current-carrying plate for the automobile power battery testing system is one of composite busbars, has a connecting bar with a multi-layer composite structure, and has the characteristics of repeatable electrical performance, low inductance impedance, strong anti-interference capability, high reliability and the like. At present, a current-carrying plate for an automobile power battery test system is manufactured by adopting a conventional PCB process, and the current-carrying plate mainly has the following problems: firstly, designing an actual FR-4 substrate or copper bar from an engineering copper bar pattern, wherein the dimensional matching of the FR-4 substrate and an R corner of the copper bar is difficult to accurately control, so that the subsequent process makeup is influenced; secondly, a dry film is generated at the position of a clamping point of the electroplating line during thick gold electroplating, so that poor contact and gold throwing are caused, and meanwhile, the dry film is broken and attached to other positions on the copper bar, so that the problem of abnormal copper leakage is caused; the maximum bevel edge thickness of the automatic bevel edge machine is 2.5mm, the PCB larger than 2.5mm can only be manually beveled, and mainly is a golden finger bevel edge, so that the PCB can be conveniently plugged and pulled out, and the bevel edge machine in the conventional flow can not meet the production requirement.
Disclosure of Invention
Therefore, the invention aims to provide a method for manufacturing a current carrying plate for a new energy automobile power battery testing system.
The purpose of the invention is realized by the following technical scheme.
A method for manufacturing a current carrying plate for a new energy automobile power battery test system comprises the following steps: manufacturing a copper bar; manufacturing an FR4 board; and manufacturing the current-carrying plate.
Preferably, the copper bar is manufactured by:
cutting the copper substrate, drilling a positioning hole, and then routing the copper substrate to form the copper bar with the required shape.
Preferably, the copper base plate is opened the material, then bores the locating hole, then gongs the board in order to gong the copper base plate into the copper bar of required shape, includes:
cutting small materials meeting the requirements by using the correct plate materials according to the requirements;
then, drilling according to normal drilling parameters;
browning according to the normal browning requirement;
and (4) carrying out routing after the browning, and processing the required copper bar according to the routing parameters of the copper plate.
Preferably, the FR4 board making comprises:
selecting an FR4 base material, and cutting the FR4 base material into FR4 base plates meeting the size requirement;
preprocessing the FR4 substrate, and then performing dry film pressing, exposure and development to manufacture an inner layer pattern;
then, carrying out inner layer etching on the FR4 substrate to form an inner layer circuit pattern;
and finally, drilling holes in the FR4 substrate, and milling and grooving.
Preferably, the current-carrying plate is manufactured by:
pressing → drilling → removing glue → copper deposition → one time dry film → etching → routing groove → pasting → electric gold → etching → solder mask → routing board → bevel → FQC → FQA → packaging.
Preferably, the current-carrying plate is manufactured by:
placing the copper bars into corresponding FR4 substrate grooves, controlling the fit clearance of adjacent composite busbars within 0.15mm, and performing press fit by using a press fit program of HTG 001; drilling PTH holes by using a drilling machine, and stacking the PTH holes by using high-density wood pulp plates; removing residual glue on the surface of the copper bar; chemical degumming and copper deposition twice; when the board is electrified, the board is electrified and then is cut into glue-pouring slices to observe the copper deposition condition in the hole, and the copper of the through hole is required to be 5-8 um; performing outer layer pretreatment, super-roughening, film pasting, exposure and development to form an outer layer pattern; electroplating and etching the pattern according to the requirement; then routing the section of the copper bar on the side surface in the process; pasting a film, electrically thickening gold, then etching by normal parameters, welding resistance, then routing and beveling according to requirements, detecting, packaging and delivering.
A method for manufacturing a current carrying plate for a new energy automobile power battery test system comprises the following steps of; cutting the copper substrate, drilling a positioning hole, performing brown oxidation, and then routing the copper substrate into a circular-arc-shaped copper bar; selecting an FR4 base material, cutting the FR4 base material into an FR4 base plate meeting the size requirement, carrying out pretreatment processing on the FR4 base plate, carrying out dry film pressing and exposure development to manufacture an inner layer pattern, carrying out inner layer etching on the FR4 base plate to form an inner layer circuit pattern, drilling the FR4 base plate, and routing and slotting the base plate, wherein the slotting is in an arc shape corresponding to the copper bar; placing the copper bar into a corresponding FR4 substrate slot, wherein when the R angle of the slot is retracted inwards and the R angle of the corresponding copper bar is projected, the R angle of the copper bar is larger than the R angle of the slot; when the R angle of the slot protrudes and the R angle of the corresponding copper bar retracts, the R angle of the copper bar is smaller than the R angle of the slot, and the matching gap of the adjacent composite busbars is controlled within 0.15 mm; then using a pressing program to perform pressing and using a drilling machine to drill PTH holes, and then using high-density wood pulp plates to stack one by one; removing residual glue on the surface of the copper bar; chemical degumming and copper deposition twice; when the board is electrified, the board is electrified and then is cut into glue-pouring slices to observe the copper deposition condition in the hole, and the thickness of the copper in the through hole is required to be 5-8 um; performing outer layer pretreatment, super-roughening, film pasting, exposure and development to form an outer layer pattern; electroplating and etching the pattern according to the requirement; then routing the section of the copper bar on the side surface in the process; pasting a film, electrically thickening gold, then etching by normal parameters, welding resistance, then routing and beveling according to requirements, detecting, packaging and delivering.
According to the method for manufacturing the current carrying plate for the new energy automobile power battery testing system, the reliability of a product is ensured by accurately controlling the size matching of the FR-4 substrate and the R angle of the copper bar; according to the invention, the dry film is pasted before the thick gold is electroplated, exposure and development are required, the efficiency is improved, the thick gold is ensured to be electroplated only at the required position, and the waste of gold salt is avoided.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a method for manufacturing a current-carrying plate for a new energy automobile power battery test system, which meets the requirements, and ensures the reliability of a product by accurately controlling the size matching of an FR-4 substrate and an R angle of a copper bar; according to the invention, the dry film is pasted before the thick gold is electroplated, exposure and development are required, the efficiency is improved, the thick gold is ensured to be electroplated only at the required position, and the waste of gold salt is avoided.
The specific manufacturing method of the flow carrying plate comprises the following steps: manufacturing a copper bar; manufacturing an FR4 board; and manufacturing the current-carrying plate.
The copper bar manufacturing process comprises cutting → drilling → routing. The copper bar is a high-current conductive product, is suitable for electrical engineering of high and low voltage electrical appliances, switch contacts, power distribution equipment, bus ducts and the like, and is also widely used for super-high current electrolytic smelting engineering of metal smelting, electrochemical plating, chemical caustic soda and the like.
Wherein the process comprises the following steps: cutting the correct plate material to obtain small materials meeting the requirements according to the requirements; then, drilling according to normal drilling parameters; and performing a routing process after the browning is performed according to the normal browning requirement, and processing according to the routing parameters of the copper plate.
The FR4 board manufacturing method comprises the following steps: selecting an FR4 base material, and cutting the FR4 base material into FR4 base plates meeting the size requirement; preprocessing the FR4 substrate, and then performing dry film pressing, exposure and development to manufacture an inner layer pattern; then, carrying out inner layer etching on the FR4 substrate to form an inner layer circuit pattern; and finally, drilling holes in the FR4 substrate, and milling and grooving.
Cutting the small materials which meet the requirements by using a correct plate material according to the requirements; then, drilling according to normal drilling parameters; and performing a routing process after the browning is performed according to the normal browning requirement, and processing according to the routing parameters of the copper plate.
According to the invention, the FR4 substrate is matched with the R corner of the copper bar in size when the board is routed. The flow carrying plate is one of composite busbars, and is formed by embedding and matching national standard T2 red copper (copper content is about 99.95 percent, no crack is formed on the surface of the flow carrying plate when the flow carrying plate is bent at 90 degrees, the tensile strength is more than or equal to 300N/mm2, and the resistivity is more than or equal to 0.017772 omega mm2/m) and high Tg FR-4 (excellent electrical performance, higher working temperature, stable size, impact resistance and moisture resistance), and sealing a matching gap by using colloid to enable the copper and the FR-4 to be integrated.
In the invention, from the design of the engineering copper bar pattern to the actual routing of FR-4 or copper bars, the influence of respective R corners on the subsequent process makeup is considered, and the control of the R corners is the important factor in the engineering design and routing. When the R angle of the slot is retracted inwards and the R angle of the corresponding copper bar is protruded, the R angle of the copper bar is larger than the R angle of the slot; when the R angle of the slot is protruded and the R angle of the corresponding copper bar is retracted, the R angle of the copper bar is smaller than the R angle of the slot.
Especially, for a plurality of matching positions, the change of the R angle at each position is considered, and the matching gap of the composite busbar of the type is controlled to be 0.15 mm.
The current-carrying plate is manufactured by the following steps: pressing → drilling → removing glue → copper deposition → one time dry film → etching → routing groove → pasting → electric gold → etching → solder mask → routing board → bevel → FQC → FQA → packaging. The specific process comprises the following steps: placing the copper bars into corresponding FR4 substrate grooves, controlling the fit clearance of adjacent composite busbars within 0.15mm, and performing press fit by using a press fit program of HTG 001; drilling PTH holes by using a drilling machine, and stacking the PTH holes by using high-density wood pulp plates; removing residual glue on the surface of the copper bar; chemical degumming and copper deposition twice; when the board is electrified, the board is electrified and then is cut into glue-pouring slices to observe the copper deposition condition in the hole, and the copper of the through hole is required to be 5-8 um; performing outer layer pretreatment, super-roughening, film pasting, exposure and development to form an outer layer pattern; electroplating and etching the pattern according to the requirement; then routing the section of the copper bar on the side surface in the process; pasting a film, electrically thickening gold, then etching by normal parameters, welding resistance, then routing and beveling according to requirements, detecting, packaging and delivering.
Wherein need electroplate thick gold behind the pad pasting in this flow, and minimum gold is thick for 12um, and the side needs electroplate thick gold equally, then need gong out the side in advance consequently, and because whole copper bar forms an isolated island, can't electrically conduct, can't satisfy the electrically conductive prerequisite of electroplate thick gold process. And because the bottom layer of the product structure is the FR-4 substrate with the thickness of 1.8mm, the isolated island copper bar and the FR-4 with the thickness of 1OZ of the single-sided copper foil at the bottom layer can be connected to form a conductive path only by the process of drilling a via hole to sink the electrolytic copper, and simultaneously, the speed of sinking the electrolytic copper of the copper bar is obviously higher than that of sinking the electrolytic copper of the FR-4 of the single-sided copper foil. In order to prevent burning, the bottom layer FR-4 can only deposit electrolytic copper on the whole board surface, and the thick gold electroplating only needs to be provided with a conductive path, so that a dry film pasting procedure is added before the thick gold electroplating, the thick gold is ensured to be electroplated only at the required position, and the waste of gold salt can be avoided.
In addition, because the dry film is pasted on the whole plate surface, the dry film is generated at the position of the clamping point of the electroplating line when thick gold is electroplated, so that poor contact is caused, the gold throwing phenomenon occurs, and meanwhile, the dry film fragments are adhered to other positions on the copper bar, so that copper leakage is abnormal.
It should also be noted that the maximum bevel edge thickness of the automatic beveling machine in the existing PCB industry is 2.5mm, PCBs larger than 2.5mm can only be beveled manually, and mainly are golden finger bevel edges, so that the PCB can be conveniently plugged and pulled out, the current beveling machine on the market cannot meet the production, the invention can make different adjustments according to the production requirements, meet the special bevel edge requirements of products, and refit the beveling machine to meet the special bevel edge requirements of production plates with plate thicknesses exceeding 2.5 mm.
In conclusion, the reliability of the product is ensured by accurately controlling the dimensional matching of the FR-4 substrate and the R corner of the copper bar; according to the invention, the dry film is added before the thick gold is electroplated, exposure and development are required, the efficiency is improved, the thick gold is ensured to be electroplated only at the required position, and the waste of gold salt is avoided. The invention solves the problem that the conventional PCB process cannot produce the current-carrying plate for the new energy automobile power battery test system; and the produced current-carrying plate for the new energy automobile power battery testing system can improve the charging time and the service life of the battery, reduce the weight of the battery, increase the cruising ability of the battery, reduce the cost and ensure the use safety.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (1)
1. A method for manufacturing a current carrying plate for a new energy automobile power battery test system is characterized by comprising the following steps: manufacturing a copper bar, namely cutting small materials meeting the requirements by using a correct copper substrate plate according to the requirements; then, drilling according to normal drilling parameters; browning according to the normal browning requirement; carrying out routing after the browning, and processing the required copper bar according to the routing parameters of the copper plate; making FR4 board: selecting an FR4 base material, and cutting the FR4 base material into FR4 base plates meeting the size requirement; preprocessing the FR4 substrate, and then performing dry film pressing, exposure and development to manufacture an inner layer pattern; then, carrying out inner layer etching on the FR4 substrate to form an inner layer circuit pattern; finally, drilling holes in the FR4 substrate, and milling and grooving the board; the open slot is in an arc shape corresponding to the copper bar; placing the copper bars into corresponding FR4 substrate slots, wherein the matching gap of adjacent composite busbars is controlled within 0.15mm, and when the R angle of each slot is retracted and the R angle of the corresponding copper bar is protruded, the R angle of each copper bar is larger than the R angle of each slot; when the R angle of the slot is protruded and the R angle of the corresponding copper bar is retracted, the R angle of the copper bar is smaller than the R angle of the slot; manufacturing a current-carrying plate: putting the copper bar into the corresponding FR4 substrate groove for pressing; drilling PTH holes by using a drilling machine, and stacking the PTH holes by using high-density wood pulp plates; removing residual glue on the surface of the copper bar; chemical degumming and copper deposition twice; when the board is electrified, the board is electrified and then is cut into glue-pouring slices to observe the copper deposition condition in the hole, so that the copper of the through hole is 5-8 um; performing outer layer pretreatment, super-roughening, film pasting, exposure and development to form an outer layer pattern; electroplating and etching the pattern according to the requirement; then routing the section of the copper bar on the side surface in the process; pasting a film, electrically thickening gold, then etching by normal parameters, welding resistance, then routing and beveling according to requirements, detecting, packaging and delivering.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455501.7A CN108419372B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing current carrying plate for new energy automobile power battery test system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810455501.7A CN108419372B (en) | 2018-05-14 | 2018-05-14 | Method for manufacturing current carrying plate for new energy automobile power battery test system |
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| CN108419372A CN108419372A (en) | 2018-08-17 |
| CN108419372B true CN108419372B (en) | 2021-02-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106413265A (en) * | 2016-11-23 | 2017-02-15 | 胜宏科技（惠州）股份有限公司 | New energy automobile battery special circuit board production process |
| CN106550558A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of pressing preparation method of embedding ceramic pcb board |
| CN107072080B (en) * | 2017-05-10 | 2020-04-21 | 深圳市深联电路有限公司 | Manufacturing method of bent copper-based PCB |
| CN107041067A (en) * | 2017-05-10 | 2017-08-11 | 深圳市深联电路有限公司 | A kind of preparation method of thermistor printed circuit board |
| CN107613647B (en) * | 2017-08-21 | 2023-05-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of new energy intelligent charging system circuit board |
| CN107548244B (en) * | 2017-08-30 | 2020-02-28 | 景旺电子科技(龙川)有限公司 | Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
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