CN102044446A - Manufacturing method for blind hole windowing contraposition target of packaging baseplate - Google Patents
Manufacturing method for blind hole windowing contraposition target of packaging baseplate Download PDFInfo
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- CN102044446A CN102044446A CN2010105256798A CN201010525679A CN102044446A CN 102044446 A CN102044446 A CN 102044446A CN 2010105256798 A CN2010105256798 A CN 2010105256798A CN 201010525679 A CN201010525679 A CN 201010525679A CN 102044446 A CN102044446 A CN 102044446A
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Abstract
An embodiment of the invention discloses a manufacturing method for a blind hole windowing contraposition target of a packaging baseplate, comprising the following step: step a, attaching the target-sticking material on the target of the central baseplate; step b, laminating a match board on the central baseplate; step c, cutting off the area corresponding to the target-sticking material on the match board and tearing off the target-sticking material. In the manufacturing method for a blind hole windowing contrapuntal target of a packaging baseplate, the method changes a series of the process flows in the prior art including drilling hole, attaching dry film, exposuring, etching, laser drilling hole and decontaminating on the area corresponding to the target on the match board; only a layer of sticking material is needed to be attached on the target, and the corresponding part of the target is directly cut off after lamination; and the target-sticking material is uncovered to exposure the target; therefore, the flows are simplified and the manufacturing efficiency of blind hole windowing target of packaging baseplate is improved.
Description
Technical field
The present invention relates to PCB production technical field, more particularly, the blind hole that the relates to a kind of base plate for packaging contraposition target manufacture method of windowing.
Background technology
In recent years, along with people to microminiaturization, the surge of the consumption electronic products demand of lightening and more powerfulization of function, and the develop rapidly of semiconductor microelectronic technology, impel semiconductor packages densification more, make the width of lead, distance between the lead is more tiny, distance between the lead is developed to 15 μ m by 50um, the diameter in the hole on the pcb board develops into 50 μ m by 200 μ m, the structure in hole also is tending towards complicated in addition, hole, 2 rank appears, the hole, 3 rank and the hole of high-order more, the pcb board interlayer is by copper-plated through hole, buried via hole piles up to link to each other with blind hole realizes conduction.
The realization of the densification of base plate for packaging depends on directly that then the micro hole of pcb board interlayer connects and circuit, and along with the development of plate towards miniaturization and densification direction, the mode of blind hole that adopts increasing plate realizes the high density interconnect of circuit, so the blind hole formation technology of base plate for packaging becomes one of main key technology of manufacturing and encapsulation substrate.
Because the function of blind hole is the circuit that is communicated with adjacent two layers, be characterized in that the aperture is little, I reaches 50 μ m, and currently used machine drilling technology can't be carried out the processing of blind hole on the base plate for packaging because of the restriction of the micro-hole size that is subjected to machining accuracy own and can processes.Invented CO from 1994
2Since the laser drilling machine, obtained extensive use in the electronic circuit manufacturing.
Blind hole uses laser technology to realize processing at present, adopt the technologies of windowing more, promptly paste the dry film of one deck 20 μ m-40 μ m, handle through exposure imaging at the copper foil surface of pcb board, the Copper Foil that exposes the laser drilling position, utilize etching solution to remove the Copper Foil of punch position then, expose the resin of punch position, divest remaining dry film, pcb board is through the laser ablation pore-forming, behind the carbonization residue, vertically electroplate or the filling perforation plating in the cleaning hole, can be communicated with two-tier circuit up and down.
Because the requirement on machining accuracy of blind hole is very high, in the process of processing, a cover contraposition target need be set on base plate for packaging, proofread and correct with Working position blind hole, prevent other factor affecting machining accuracies.
At present in the industry, the laser blind hole of base plate for packaging all is that employing is a benchmark with the internal layer target to method for position, carry out lamination with being processed with the central substrate of target and the matching board of base plate for packaging, through machine drilling, paste dry film then, after overexposure, etching, the Copper Foil on the matching board is removed, adopt laser drill that the resin on the matching board is removed then, open the copper window so that carry out the processing of blind hole after removing the brill dirt at last, its idiographic flow is:
→ lamination → boring → subsides dry film → exposure → etching → laser drill → desmearing → open copper window ...
The window manufacture craft more complicated of contraposition target of above-mentioned laser blind hole has had a strong impact on the laser blind hole working (machining) efficiency of base plate for packaging.
Summary of the invention
In view of this, the blind hole that the invention provides a kind of base plate for packaging contraposition target manufacture method of windowing has been simplified the window manufacture method of contraposition target of the laser blind hole on the base plate for packaging, has improved operating efficiency.
For achieving the above object, the invention provides following technical scheme:
A kind of blind hole of base plate for packaging contraposition target manufacture method of windowing may further comprise the steps:
Step a, will paste on the target that target material is attached to central substrate;
Step b, matching board is laminated on the described central substrate;
Step c, will be on the described matching board and described subsides target material The corresponding area excision, and tear described subsides target material.
Preferably, the blind hole of above-mentioned base plate for packaging is windowed in the contraposition target manufacture method, and step c specific implementation is:
C1, on described matching board, hole, make on the described matching board edge distribution location hole with described subsides target material The corresponding area with the edge of described subsides target material The corresponding area;
C2, with cutter with the excision of zone corresponding on the described matching board with described subsides target material, and tear described subsides target material.
Preferably, the blind hole of above-mentioned base plate for packaging is windowed in the contraposition target manufacture method, and described subsides target material is than the big 1mm～2mm of size of target.
Preferably, the blind hole of above-mentioned base plate for packaging is windowed in the contraposition target manufacture method, and described subsides target material is than the big 1.5mm of size of described target.
From above-mentioned technical scheme as can be seen, the blind hole of the base plate for packaging that provides in the embodiment of the invention is windowed in the contraposition target manufacture method, before central substrate and matching board carry out lamination, on the target on the central substrate, attach a laminating target material earlier, central substrate and matching board carry out lamination then, behind the lamination, with on the matching board with the center matching board on the target The corresponding area excise, expose to paste and to paste target material behind the target material and open, the making of location target thereby the blind hole of finishing base plate for packaging is windowed, in the method provided by the invention, changed available technology adopting and on matching board, adopted boring with the target The corresponding area, paste dry film, exposure, etching, laser drill, a series of work flow such as remove to stain, only need on target, paste a laminating target material, directly the pairing position of target is excised behind the lamination, and open and paste target material and expose target and get final product, simplified flow process, the blind hole that the has improved base plate for packaging make efficiency of target of windowing.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The window flow chart of contraposition target manufacture method of the blind hole of the base plate for packaging that Fig. 1 provides for the embodiment of the invention;
The flow chart of matching board that Fig. 2 provides for the embodiment of the invention and the excision of pairing position;
The blind hole of the base plate for packaging that Fig. 3 provides for the embodiment of the invention is windowed and is pasted schematic diagram before the target in the contraposition target manufacture method;
The blind hole of the base plate for packaging that Fig. 4 provides for the embodiment of the invention is windowed and is pasted schematic diagram behind the target in the contraposition target manufacture method;
Window central substrate and matching board in the contraposition target manufacture method of the blind hole of the base plate for packaging that Fig. 5 provides for the embodiment of the invention carried out the schematic diagram of lamination;
The blind hole of the base plate for packaging that Fig. 6 provides for the embodiment of the invention is windowed and is pasted schematic diagram after target material is opened in the contraposition target manufacture method.
Embodiment
In order more clearly the scheme that the embodiment of the invention provided to be understood, make an explanation the technical term in the present specification as follows below:
Base plate for packaging: be used for chip protection, provide support and dispel the heat and provide chip to be communicated with the used circuit board of interface with external circuit.
Laser blind hole: the via that uses laser processing to come out, the copper layer of its Kong Yiduan is not punched.
Target: be used to expose or the figure of laser processing contraposition.
Lamination: the process that is used to increase the base plate for packaging or the printed board circuit number of plies.
Etching: unwanted material is removed by chemical method with soup.
Open the copper window: with etching method the Copper Foil of a certain position is removed, all the other local Copper Foils then keep.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
The blind hole that the embodiment of the invention discloses a kind of base plate for packaging manufacture method of contraposition target of windowing has been simplified the window manufacture method of contraposition target of laser blind hole, has improved operating efficiency.
Please refer to accompanying drawing 1, the window flow chart of manufacture method of contraposition target of the laser blind hole that Fig. 1 provides for the embodiment of the invention.
The window manufacture method of contraposition target of the encapsulation laser blind hole that the embodiment of the invention provides specifically may further comprise the steps:
Step a, will paste target material and cover and to be attached on the target of central substrate;
Please in conjunction with Fig. 3 and Fig. 4, central substrate comprises copper foil layer 1 and resin bed 2, central substrate is pasted the stickup of target material 4 after carrying out brown, the subsides target material 4 in this step needs exotic material to make, can not melt at 200 ℃～300 ℃, paste target material and must cover target 3 fully, preferred, the size of pasting target material 4 is greater than target 3 size 1.0mm～2.0mm, preferred, the size of pasting target material 4 is greater than target size 1.5mm.
Among the above-mentioned steps a, paste target material 4 and can be resistant to elevated temperatures adhesive tape, plastics, paper etc., the thickness requirement that pastes target material 4 is even.
Step b, matching board is laminated on the central substrate, and on the described matching board with described central substrate on the corresponding position of target position position mark;
Please in conjunction with the accompanying drawings 5, on the copper foil layer 1 of resin bed 2 both sides of central substrate, add matching board and carry out lamination, matching board comprises resin bed 5 and is arranged on copper foil layer 6 on the resin bed 5, resin bed 6 is through fitting together with the copper foil layer 1 of central substrate behind the laminations.
Step c, will be on the matching board with paste target material pairing position excision, and open the subsides target material.
Among the above-mentioned steps c, after tearing the subsides target material, can expose the internal layer target, so in the process of on matching board, excising, when scratching copper foil layer 6 and resin bed 5 with the pairing position of described subsides target material, should prevent to damage the target 3 of internal layer, with after pasting target material and opening as shown in Figure 6.
The blind hole of the base plate for packaging that provides in the embodiment of the invention is windowed in the contraposition target manufacture method, before central substrate and matching board carry out lamination, on the target on the central substrate, attach a laminating target material earlier, central substrate and matching board carry out lamination then, behind the lamination, with on the matching board with the center matching board on the target The corresponding area excise, expose to paste and just paste target material behind the target material and open, the making of location target thereby the blind hole of finishing base plate for packaging is windowed, in the method provided by the invention, having changed available technology adopting adopts with the target The corresponding area on matching board, boring, paste dry film, exposure, etching, laser drill, a series of work flow such as remove to stain, only need on target, paste a laminating target material, directly the pairing position of target is excised behind the lamination and get final product, simplified flow process, the blind hole that the has improved base plate for packaging make efficiency of target of windowing.
The laser blind hole that provides in the foregoing description is windowed in the contraposition target manufacture method, and step c specific implementation is:
C1, on described matching board, hole, make Distribution and localization hole on the described matching board with pasting target material The corresponding area edge;
C2, with cutter with position excision corresponding on the described matching board with pasting target material, and open described subsides target material.
Among the step c that provides in the present embodiment on matching board the zone corresponding with pasting target material hole, with on the mark matching board with paste the corresponding zone of target material, adopting cutter directly to go up on the matching board excises with the corresponding zone of subsides target material, adopt the location hole location simple in the above-mentioned steps, adopt cutter directly to excise, simple to operate, the efficient height.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (4)
1. the blind hole of the base plate for packaging contraposition target manufacture method of windowing is characterized in that, may further comprise the steps:
Step a, will paste on the target that target material is attached to central substrate;
Step b, matching board is laminated on the described central substrate;
Step c, will be on the described matching board and described subsides target material The corresponding area excision, and tear described subsides target material.
2. the blind hole of the base plate for packaging according to claim 1 contraposition target manufacture method of windowing is characterized in that step c specific implementation is:
C1, on described matching board, hole, make on the described matching board edge distribution location hole with described subsides target material The corresponding area with the edge of described subsides target material The corresponding area;
C2, with cutter with the excision of zone corresponding on the described matching board with described subsides target material, and tear described subsides target material.
3. the blind hole of the base plate for packaging according to claim 1 contraposition target manufacture method of windowing is characterized in that described subsides target material is than the big 1mm～2mm of size of target.
4. the blind hole of the base plate for packaging according to claim 3 contraposition target manufacture method of windowing is characterized in that described subsides target material is than the big 1.5mm of size of described target.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010525679A CN102044446B (en) | 2010-10-27 | 2010-10-27 | Manufacturing method for blind hole windowing contraposition target of packaging baseplate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010525679A CN102044446B (en) | 2010-10-27 | 2010-10-27 | Manufacturing method for blind hole windowing contraposition target of packaging baseplate |
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| CN102044446A true CN102044446A (en) | 2011-05-04 |
| CN102044446B CN102044446B (en) | 2012-10-10 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN104302111A (en) * | 2014-10-31 | 2015-01-21 | 华进半导体封装先导技术研发中心有限公司 | Method for manufacturing base plate alignment target |
| CN105530769A (en) * | 2014-09-30 | 2016-04-27 | 深南电路有限公司 | Processing method of printed circuit board and printed circuit board |
| CN106170183A (en) * | 2016-08-24 | 2016-11-30 | 山东蓝色电子科技有限公司 | A kind of single sided board high accuracy windowing method |
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| CN1198652A (en) * | 1997-05-06 | 1998-11-11 | 华通电脑股份有限公司 | Method for making multi-layer circuit board by sand-blasting to form blind hole |
| CN101080146A (en) * | 2006-05-24 | 2007-11-28 | 富葵精密组件(深圳)有限公司 | A method for making L2 blind hole of high-density interconnection circuit board |
| US20080257593A1 (en) * | 2007-04-23 | 2008-10-23 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101827498A (en) * | 2010-04-30 | 2010-09-08 | 深圳崇达多层线路板有限公司 | Alignment process of matrix-shaped laser drilling blind hole of circuit board |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
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| CN1198652A (en) * | 1997-05-06 | 1998-11-11 | 华通电脑股份有限公司 | Method for making multi-layer circuit board by sand-blasting to form blind hole |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN104244584B (en) * | 2013-06-24 | 2017-05-17 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN105530769A (en) * | 2014-09-30 | 2016-04-27 | 深南电路有限公司 | Processing method of printed circuit board and printed circuit board |
| CN105530769B (en) * | 2014-09-30 | 2019-02-05 | 深南电路有限公司 | A kind of processing method and printed circuit board of printed circuit board |
| CN104302111A (en) * | 2014-10-31 | 2015-01-21 | 华进半导体封装先导技术研发中心有限公司 | Method for manufacturing base plate alignment target |
| CN106170183A (en) * | 2016-08-24 | 2016-11-30 | 山东蓝色电子科技有限公司 | A kind of single sided board high accuracy windowing method |
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| CN102044446B (en) | 2012-10-10 |
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Effective date of registration: 20230314 Address after: Building 15, No. 18 Changjiang East Road, Shuofang Street, Xinwu District, Wuxi City, Jiangsu Province, 214142 Patentee after: Wuxi Guangxin Packaging Substrate Co.,Ltd. Address before: 214000 No. 18 Changjiang East Road, Wuxi New District, Jiangsu Province Patentee before: WUXI SHENNAN CIRCUITS Co.,Ltd. |
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