CN201928514U - Embedded strong-current and large-power PCB (printed circuit board) - Google Patents
Embedded strong-current and large-power PCB (printed circuit board) Download PDFInfo
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- CN201928514U CN201928514U CN2011200518671U CN201120051867U CN201928514U CN 201928514 U CN201928514 U CN 201928514U CN 2011200518671 U CN2011200518671 U CN 2011200518671U CN 201120051867 U CN201120051867 U CN 201120051867U CN 201928514 U CN201928514 U CN 201928514U
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- embedded
- central layer
- copper foil
- pcb board
- power
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Abstract
The utility model discloses an embedded strong-current and large-power PCB (printed circuit board) which comprises a core board, a first copper foil layer arranged on the upper surface of the core board and a second copper foil layer arranged on the lower surface of the core board, wherein the core board is also provided with at least one hollow-out groove, and a conductor structural part which shares the same shape with the hollow-out groove and has the thickness no larger than that of the core board is fixed, locked and embedded in the hollow-out groove. Compared with the prior art, in the embedded strong-current and large-power PCB, the conductor structural part is embedded in an inner layer of the PCB, interconnection of a large current output end and an instrument input end is formed with the utilization of a hole or the surface on the conductor structural part, and the encapsulation of components is encapsulated by a part of lines of other circuits except the large-power conductor structural part embedded in the PCB so as to realize the control of the circuit, thereby a circuit control part being completed by replacing original wire connection, and the problems that the assembly procedure is complex, the connecting end is easy to loosen, high and low voltage as well as strong and weak currents can not be simultaneously carried out, lines are in a mess, the occupied space is large and the cost is higher of strong-current and large-power electronic product in the integration process of the power parts and the control parts.
Description
Technical field
The utility model belongs to pcb board manufacturing technology field, and the high-power pcb board of particularly a kind of embedded heavy current is mainly used in the power part of heavy current great-power electronic product and controls integration partly.
Background technology
Printed circuit board (PCB) (Printed Circuit Board) is called for short PCB, claims printed board again, is one of vitals of electronic product.With the electronic product of printed circuit board manufacturing have reliability height, high conformity, mechanical strength height, in light weight, volume is little, be easy to advantages such as standardization.Every kind of electronic equipment almost arrives computer, communication equipment, electronic radar system greatly for a short time to electronic watch, calculator, as long as there are electronic devices and components, the electric interconnection between them will use printed board.
Early stage in electronic technology development, circuit is made of power supply, lead, switch and components and parts.Components and parts all connect with lead, and fixedly the carrying out at the space neutral body of element.Along with development of electronic technology, it is very complicated that the function of electronic product, structure become, and component placement, interconnection wiring all are subjected to very big spatial limitation, if use the space wire laying mode, will make electronic product become dazzled.Therefore just require electronic component and wiring to be planned by pcb board.
And along with the development of electronic product to lightweight and portability, pcb board not only and deposited its original electrical interconnection and supported the effect of components and parts also plays with power partly and the effect partly integrated of control.Yet as shown in Figure 1; for realizing power part and control function partly; present most heavy current great-power electronic product is with the output of big electric current, when the instrument input is connected; all be to adopt certain thickness metal derby conductor (copper bar) to carry out interconnected; connect with electric wire at interconnected circuit output, input simultaneously, to realize the partly normalization of function of circuit control.
Though this connected mode can partly partly be combined the function that reaches product with circuit control etc. with the power of heavy current great-power electronic product, but its assembling procedure complexity, the link that connects by electric wire become flexible easily, the strong and weak electric current of high-low pressure can not carry out simultaneously, can only separate independence; And circuit in disorder, take up room greatly, metal derby conductor (copper bar) exposes oxidation and corrosion easily in air, needs to adopt thicker metal derby conductor, causes cost higher.
The utility model content
In view of this, the purpose of this utility model is to provide a kind of embedded heavy current high-power pcb board, existing assembling procedure complexity, link become flexible easily in power and control part integration process, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room big to solve present heavy current great-power electronic product, and cost is than problems such as height.
For achieving the above object, the utility model is mainly by the following technical solutions:
The high-power pcb board of a kind of embedded heavy current, comprise central layer (1) and be arranged at first copper foil layer (4) of central layer (1) upper surface, second copper foil layer (5) of central layer (1) lower surface, described first copper foil layer (4) is pressed together on the upper surface of central layer (1) by first prepreg (2), described second copper foil layer (5) is pressed together on the lower surface of central layer (1) by second prepreg (3), also be provided with at least one hollow slots (101) on the described central layer (1), to be embedded with a shape identical with hollow slots (101) for fixed card in this hollow slots (101), and thickness is not more than the conductor structure spare (6) of central layer (1), described conductor structure spare (6) is provided with at least two wire guides that run through (601), described first copper foil layer (4) is provided with first perforation (401) corresponding with above-mentioned wire guide (601), second copper foil layer (5) is provided with second perforation (501) corresponding with above-mentioned wire guide (601), described wire guide (601), first perforation (401), second perforation (501) runs through connection; Described first prepreg (2) is provided with first through hole (201) corresponding with wire guide (601), and second prepreg (3) is provided with and wire guide (601) corresponding second through hole (301).
Wherein said hollow slots (101) is closed holddown groove, and these closed holddown groove four limits are positioned at central layer (1), and conductor structure spare (6) fixed card is embedded in this closed holddown groove, and the metallic conductor plate can all be embedded in the central layer.
Wherein said hollow slots (101) is open holddown groove, this open holddown groove is positioned on the central layer (1), and run through central layer (1) both sides or a side, conductor structure spare (6) fixed card is embedded in this open holddown groove, and the two ends of conductor structure spare (6) are positioned at the both sides or a side of central layer (1) outside, both sides, and the metallic conductor plate can partly be embedded in the central layer; Be embedded in central layer for metallic conductor board part; all the other partly expose in the central layer outside; exposed metallic conductor plate surface does not externally need insulating barrier protection; exposed part metallic conductor plate externally can random length carry out the arbitrary shape making, and the solid space that can form multidimensional connects arbitrarily.
Wherein said conductor structure spare (6) is a metallic conductor plate, and the metallic conductor buttress carries out moulding according to the shape that design embeds in the central layer, and compact dimensions is not more than the hollow slots size at central layer, and the thickness of metallic conductor plate and size are not subjected to any restriction.
Wherein said conductor structure spare (6) is formed by a plurality of metallic conductor plate mutual superposition, and isolate by insulating barrier between the adjacent two metallic conductor plates, the metallic conductor buttress carries out moulding according to the shape that design embeds in the central layer, compact dimensions is not more than the hollow slots size at central layer, and the thickness of metallic conductor plate and size are not subjected to any restriction.
Compared with prior art, the utility model is embedded into conductor structure spare in the internal layer of pcb board, utilize the wire guide on the conductor structure spare to form the interconnected of big current output terminal and instrument input, simultaneously by the control of the realization of the circuit on the pcb board copper foil layer to circuit, thereby replacing electric wire connects, existing assembling procedure complexity, link become flexible easily in power and control part integration process, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room big, the cost problem of higher to have solved heavy current great-power electronic product.
Description of drawings
The schematic diagram that Fig. 1 connects by the metal derby conductor for the current output terminal of existing heavy current great-power electronic product and instrument input.
Fig. 2 is the schematic diagram that current output terminal and the instrument input of the utility model heavy current great-power electronic product connects by the high-power pcb board of embedded heavy current.
Fig. 3 is the syndeton schematic diagram of the high-power pcb board of the embedded heavy current of the utility model.
Fig. 4 is the schematic diagram of closed holddown groove for the utility model central layer hollow slots.
Fig. 5 is the schematic diagram of one of open holddown groove for the utility model central layer hollow slots.
Fig. 6 is two schematic diagram of open holddown groove for the utility model central layer hollow slots.
Identifier declaration among the figure: central layer 1, hollow slots 101, first prepreg 2, first through hole 201, second prepreg 3, second through hole 301, first copper foil layer 4, first perforation, 401, second copper foil layer 5, second perforation 501, conductor structure spare 6, wire guide 601.
Embodiment
Core concept of the present utility model is: the utility model is embedded in conductor structure spare at the central layer of pcb board, realize interconnected between big current output terminal and the instrument input by this conductor structure spare, simultaneously the line design of this conductor structure spare and pcb board self is connected, to realize circuit and power control to instrument.
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 2ly, Fig. 2 is the schematic diagram that current output terminal and the instrument input of the utility model heavy current great-power electronic product connects by the high-power pcb board of embedded heavy current.Wherein the current output terminal at present heavy current great-power electronic product connects existing assembling procedure complexity with the instrument input by the metal derby conductor, link is loosening easily, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit in disorder, it is big to take up room, cost is than problems such as height, the utility model utilizes the embedded PCB plate to replace original metal derby conductor and connects electric wire, being implemented in big current output terminal by an Embedded pcb board connects with the input of instrument, and the line design of utilizing pcb board itself simultaneously realizes the control to circuit and power, replace original metal derby conductor by the conductor structure spare that is embedded in the pcb board central layer, replace electric wire to connect by the line design that is arranged on the pcb board copper foil layer.
As shown in Figure 3, Fig. 3 is the syndeton schematic diagram of the high-power pcb board of the embedded heavy current of the utility model.The wherein said pcb board that is embedded in mainly includes central layer 1 and first copper foil layer 4 that is arranged at central layer 1 upper surface, second copper foil layer 5 of central layer lower surface, described first copper foil layer 4 is pressed together on the upper surface of central layer 1 by first prepreg 2, described second copper foil layer 5 is pressed together on the lower surface of central layer 1 by second prepreg 3, also be provided with at least one hollow slots 101 on the described central layer 1, to be embedded with a shape identical with above-mentioned hollow slots for fixed card in this hollow slots 101, and thickness is not more than the conductor structure spare 6 of central layer, described conductor structure spare 6 is provided with at least two wire guides that run through 601, described first copper foil layer 4 is provided with first perforation 401 corresponding with above-mentioned wire guide 601, second copper foil layer 5 is provided with second perforation 501 corresponding with above-mentioned wire guide 601, described wire guide 601, first perforation 401, second perforation 501 threes are run through connection.
Wherein said first prepreg 2, second prepreg 3 are the colloid that flows, and constitute by a plurality of prepregs, these prepregs are laid on the upper and lower surface of central layer 1, can satisfy the glue amount filling in slit between conductor structure spare cross section and hollow out central layer and the thickness of insulating layer between conductor structure spare and surface conductor.
The first corresponding prepreg 2, second prepreg 3 is provided with and first through hole 201 and second through hole 301 of above-mentioned wire guide 601, first perforation, 401, second perforation, 501 corresponding connections.
After said process is finished, install bolt additional in the hole of on pcb board, offering, realize the interconnected of the big current output terminal in pcb board and outside, instrument input by bolt locking.
Embedded PCB plate in the utility model can be designed to the syndeton with outside a plurality of big current output terminals, a plurality of instrument inputs according to user's different needs, when if current output terminal, instrument input respectively are one, in fact the conductor structure spare 6 that is adopted is exactly a metal copper plate or copper bar, realizes being connected of big current input terminal and instrument output by this metal copper plate or copper bar; If big current output terminal is one, when the instrument input is a plurality of, can connects by a plurality of wire guides on the conductor structure spare 6 601 as required this moment and export; When Shu Ru electric current is divided into high-low pressure power electric current if desired, then need to adopt the conductor structure spare 6 of layering, here the conductor structure spare of layering 6 is to be formed by a plurality of metallic conductor plate mutual superposition, and isolate by insulating barrier between the adjacent two metallic conductor plates, different metallic conductor plates is connected to outside power supply difference, and the corresponding yet corresponding difference of electric current that is input to instrument owing to isolate by insulating barrier between these metallic conductor plates, therefore short circuit phenomenon can not occur yet.
In addition, need to prove that hollow slots described in the utility model 101 can be closed holddown groove (see figure 4), also can be open holddown groove (seeing Fig. 5, Fig. 6), if hollow slots 101 is closed holddown groove, four limits of this closed holddown groove are positioned at central layer 1 so, and conductor structure spare 6 fixed card are embedded in this closed holddown groove, and promptly this conductor structure spare 6 all is embedded in the central layer, do not have the part (Fig. 4) of exposing in central layer 1 outside.
If hollow slots 101 is open holddown groove (seeing Fig. 5, Fig. 6), this open holddown groove then is divided into full open model (Fig. 5) and semi open model (Fig. 6).If be the full open model holddown groove, then this holddown groove is positioned on the central layer 1, and the both sides of running through central layer 1, conductor structure spare 6 fixed card are embedded in this full open model holddown groove, and the two ends of conductor structure spare 6 are positioned at outside, central layer 1 both sides, the mid portion that is conductor structure spare 6 is in central layer 1, and two ends then expose in outside, central layer 1 both sides, being partly embedded in the central layer 1 in the middle of having only; If be the semi open model holddown groove; then this holddown groove has only a side to pass central layer 1 one sides (shown in Figure 6); conductor structure spare 6 these lateral sections are positioned at the outside of central layer 1 this side accordingly; and exposed metallic conductor plate surface does not externally need insulating barrier protection; exposed part metallic conductor plate externally can random length carry out the arbitrary shape making, and the solid space that also can form multidimensional connects arbitrarily.
In sum, the utility model is embedded into conductor structure spare in the internal layer of pcb board, utilize the wire guide on the conductor structure spare to form the interconnected of big current output terminal and instrument input, simultaneously by the control of the realization of the circuit on the pcb board copper foil layer to circuit, replaced the electric wire connection, existing assembling procedure complexity, link become flexible easily in power and control part integration process, the strong and weak electric current of high-low pressure can not carry out simultaneously and circuit is in disorder, take up room big, the cost problem of higher to have solved heavy current great-power electronic product.
More than the high-power pcb board of a kind of embedded heavy current provided by the utility model is described in detail, used specific case herein principle of the present utility model and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (7)
1. high-power pcb board of embedded heavy current, it is characterized in that first copper foil layer (4) that comprises central layer (1) and be arranged at central layer (1) upper surface, second copper foil layer (5) of central layer (1) lower surface, described first copper foil layer (4) is pressed together on the upper surface of central layer (1) by first prepreg (2), described second copper foil layer (5) is pressed together on the lower surface of central layer (1) by second prepreg (3), also be provided with at least one hollow slots (101) on the described central layer (1), to be embedded with a shape identical with hollow slots (101) for fixed card in this hollow slots (101), and thickness is not more than the conductor structure spare (6) of central layer (1), described conductor structure spare (6) is provided with at least two wire guides that run through (601), described first copper foil layer (4) is provided with first perforation (401) corresponding with above-mentioned wire guide (601), second copper foil layer (5) is provided with second perforation (501) corresponding with above-mentioned wire guide (601), described wire guide (601), first perforation (401), second perforation (501) runs through connection; Described first prepreg (2) is provided with first through hole (201) corresponding with wire guide (601), and second prepreg (3) is provided with and wire guide (601) corresponding second through hole (301).
2. the high-power pcb board of embedded heavy current according to claim 1, it is characterized in that described hollow slots (101) is closed holddown groove, these closed holddown groove four limits are positioned at central layer (1), and conductor structure spare (6) fixed card is embedded in this closed holddown groove.
3. the high-power pcb board of embedded heavy current according to claim 1, it is characterized in that described hollow slots (101) is open holddown groove, this open holddown groove is positioned on the central layer (1), and run through central layer (1) both sides or a side, conductor structure spare (6) fixed card is embedded in this open holddown groove, and the one or both ends of conductor structure spare (6) are positioned at the both sides or a side of central layer (1) outside, both sides.
4. according to claim 1 or the high-power pcb board of 2 or 3 described embedded heavy currents, it is characterized in that described conductor structure spare (6) is a metallic conductor plate.
5. according to claim 1 or the high-power pcb board of 2 or 3 described embedded heavy currents, it is characterized in that described conductor structure spare (6) is formed by a plurality of metallic conductor plate mutual superposition, and isolate by insulating barrier between the adjacent two metallic conductor plates.
6. the high-power pcb board of embedded heavy current according to claim 1 is characterized in that described first prepreg (2) is made of the multilayer prepreg.
7. the high-power pcb board of embedded heavy current according to claim 1 is characterized in that described second prepreg (3) is made of the multilayer prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200518671U CN201928514U (en) | 2011-03-01 | 2011-03-01 | Embedded strong-current and large-power PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200518671U CN201928514U (en) | 2011-03-01 | 2011-03-01 | Embedded strong-current and large-power PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201928514U true CN201928514U (en) | 2011-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200518671U Expired - Lifetime CN201928514U (en) | 2011-03-01 | 2011-03-01 | Embedded strong-current and large-power PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201928514U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
-
2011
- 2011-03-01 CN CN2011200518671U patent/CN201928514U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN102123560B (en) * | 2011-03-01 | 2012-10-03 | 博敏电子股份有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN108650804A (en) * | 2018-05-14 | 2018-10-12 | 深圳市深联电路有限公司 | A kind of new-energy automobile PDU high-voltage control circuit board manufacturing methods |
| CN108650804B (en) * | 2018-05-14 | 2022-07-19 | 深圳市深联电路有限公司 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: BOMIN ELECTRONIC CO., LTD. Free format text: FORMER NAME: MEIZHOU BOMIN ELECTRONICS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 514768 Guangdong city of Meizhou Province Dongsheng Industrial Park B District Co-patentee after: Shenzhen Bomin Electronic Co.,Ltd. Patentee after: Bomin Electronic Co., Ltd. Address before: 514768 Guangdong city of Meizhou Province Dongsheng Industrial Park B District Co-patentee before: Shenzhen Bomin Electronic Co.,Ltd. Patentee before: Meizhou Bomin Electronic Co., Ltd. |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20110810 Effective date of abandoning: 20121003 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20110810 Effective date of abandoning: 20121003 |