CN103037621A - Printed circuit board (PCB) chip layout structure and electronic terminal using the same - Google Patents
Printed circuit board (PCB) chip layout structure and electronic terminal using the same Download PDFInfo
- Publication number
- CN103037621A CN103037621A CN2012103823143A CN201210382314A CN103037621A CN 103037621 A CN103037621 A CN 103037621A CN 2012103823143 A CN2012103823143 A CN 2012103823143A CN 201210382314 A CN201210382314 A CN 201210382314A CN 103037621 A CN103037621 A CN 103037621A
- Authority
- CN
- China
- Prior art keywords
- pcb
- pmu
- cpu
- hole
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board (PCB) chip layout structure and an electronic terminal using the PCB chip layout structure. The PCB chip layout structure comprises a PCB, a central processing unit (CPU) and a power management unit (PMU). The CPU and the PMU are respectively arranged at two faces of the PCB. The PMU and projection of the CPU on the PCB are partially or completely overlapped. The electronic terminal using the PCB chip layout structure comprises the PCB chip layout structure consisting of the PCB, the CPU and the PMU. The CPU and the PMU are respectively arranged at two faces of the PCB. The PMU and projection of the CPU on the PCB are partially or completely overlapped.
Description
Technical field
The invention belongs to electronic device field, relate in particular to the electric terminal equipment designing technique.
Background technology
All include the CPU(CPU on the general electric terminal equipment) and the PMU(Power Management Unit) module, CPU is arithmetic core and the control core device of terminal, the order of the overwhelming majority and data all must through the CPU analyzing and processing, have the functions such as data of explaining in terminal instruction and the processing terminal software in the terminal; PMU then is the power supply device of terminal, and terminal is each module required voltage value by PMU with voltage transitions from the power supply that the externally fed equipment such as battery obtain, for CPU in the terminal and other modules provide power supply; Because accuracy and its core status in terminal of CPU, the core power supply of CPU except require magnitude of voltage accurately, the constant steady and Electro Magnetic Compatibility of power supply is also had very high requirement; Accurately, the power supply of stable core and higher Electro Magnetic Compatibility make CPU bring into play its optimum performance, prolong useful life of CPU, can improve largely the stability of each module of terminal and terminal.
Usually in the PCB chip layout CPU and PMU are placed on the same face of PCB, PMU is by at the PCB(printed circuit board) inside walks conductor wire and comes to provide power supply for CPU.Because this kind layout structure CPU and PMU are distant, so PMU must come the power supply for CPU by long electric conduction routing, and the increase of electric conduction routing length must cause the exchanging of supply line, dc impedance between PMU and the CPU to increase, thereby must cause PMU is the unpredictable pressure drop of core power supply generation of CPU, and the supply power voltage accuracy is caused great impact; Owing to also be furnished with simultaneously the chip of other modules such as radio frequency, storage, demonstration on the pcb board, the increase of power supply electric conduction routing length also is subject to other modules such as the unpredictable risk of interferences such as radiation, electromagnetic induction will inevitably increasing supply line between PMU and the CPU, and the stability of power supply is caused great impact.Simultaneously other modules are subject to PMU also can increase greatly to the risk of core cpu supply line electromagnetic interference, the performance of other modules is caused seriously influence; In addition since CPU and PMU put at the PCB the same face, be connected by long power supply electric conduction routing between CPU and the PMU, thereby cause upper the putting with the electric conduction routing space of other module chips of PCB to be subject to larger restriction, be unfavorable for that the engineer carries out rational layout and electric conduction routing.
Summary of the invention
Problem to be solved by this invention provides a kind of layout and the more rational PCB chip layout structure of electric conduction routing and uses the electric terminal of this structure.
The present invention is by the following technical solutions: a kind of PCB chip layout structure comprises PCB, CPU, PMU; Described CPU and described PMU lay respectively on two faces of described PCB, projection section on PCB of described PMU and described CPU or all overlapping.
In such scheme, the power input of described PMU, output series, parallel have electric capacity, inductance, resistance.
In such scheme, the number of plies of described PCB is at least more than 1 layer.
In such scheme, conducting is come by electric conduction routing in two zones between the same layer of described PCB, and electric conduction routing is arranged on any one deck of described PCB.
In such scheme, connect conducting by conductive hole between the different layers of described PCB.
In such scheme, described conductive hole is for conducting electricity buried via hole and/or conductive blind hole, conductive through hole, and the conducting between described PMU and the described CPU is finished by described conduction buried via hole, conductive blind hole, conductive through hole, electric conduction routing combination.
Based on same inventive concept, the present invention also provides a kind of application as the described electric terminal of above-mentioned scheme, and described electric terminal comprises the PCB chip layout structure, and described PCB allocation wiring structure comprises PCB, CPU, PMU; Described CPU and described PMU lay respectively on two faces of described PCB, projection section on PCB of described PMU and described CPU or all overlapping.
In such scheme, the power input of described PMU, output series, parallel have electric capacity, inductance, resistance.
In such scheme, conducting is come by electric conduction routing in two zones between the same layer of described PCB, and electric conduction routing is arranged on any one deck of described PCB.
In such scheme, connect conducting by conductive hole between the different layers of described PCB, described conductive hole is for conducting electricity buried via hole and/or conductive blind hole, conductive through hole, and the conducting between described PMU and the described CPU is finished by described conduction buried via hole, conductive blind hole, conductive through hole, electric conduction routing combination.
The invention has the beneficial effects as follows: adopt PCB chip layout structure of the present invention, so that the supply lines between CPU and the PMU is shorter, space layout is compacter; This chip layout has realized that namely PMU is the basic function of CPU power supply, its shorter supply line reduced DC internal resistance, AC internal Resistance between circuit, strengthened Electro Magnetic Compatibility has reduced risk with other module phase mutual interference, make PMU more accurate, stable for the voltage that CPU provides, compact layout also provides better layout and cabling space to the engineer simultaneously.
Description of drawings
Fig. 1 is vertical view and the end view of traditional C PU and PMU chip layout structure;
Fig. 2 is vertical view and the end view of the electric conduction routing mode of traditional C PU and PMU chip layout structure;
Fig. 3 is the CPU that proposes of the present invention and vertical view and the end view of PMU chip layout structure;
Fig. 4 is vertical view and the end view of the electric conduction routing mode of the CPU that proposes of the present invention and PMU chip layout structure;
Fig. 5 is PCB conductive hole schematic diagram;
Fig. 6 is CPU and PMU electric conduction routing mode schematic diagram.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is further detailed.
In Fig. 1, CPU 2 and PMU 3 are arranged on the same face of PCB 1, and electric capacity, inductance, resistance 4 around the PMU 3 have occupied large quantity space, so that the distance of CPU 2 and PMU 3 increases, electromagnetic interference imports easily.
In Fig. 2, electric conduction routing 5 connects CPU2 and PMU3, makes PMU3 pass through 5 pairs of CPU2 power supplies of electric conduction routing, can find out that electric conduction routing 5 is longer, and its interchange, D.C. resistance are larger, and power supply is unstable easily, imports easily and disturbs.
In Fig. 3, it is overlapping that CPU2 is arranged on the back side and the two the projection major part on PCB of PMU3, so that the Distance Shortened between CPU2 and the PMU3, takes full advantage of simultaneously the space of PCB1, so that device is put compactness, for the electric terminal equipment miniaturization provides advantage.
In Fig. 4, PMU 3 be that CPU 2 powers by electric conduction routing 5, can find out that electric conduction routing 5 compares Fig. 2 and greatly shortened, and its interchange, D.C. resistance are less, and power supply is more stable; Simultaneously so that the introducing probability that disturbs greatly reduced, favourable to electromagnetic compatibility.
In Fig. 5, PCB 1 number of plies is set to more than 1 layer, and conductive hole 6 can be conductive through hole, conduction buried via hole, conductive blind hole; Among the PCB of N layer through hole can the 1st layer of conducting and the N layer on two zones; Blind hole can conducting the 1st layer to except two zones on any one deck of N layer, also can conducting N layer two zone to any one deck except the 1st layer and N layer; Buried via hole can conducting two zones between any two-layer except the 1st layer and N layer.
In Fig. 6, electric conduction routing 5 is with conductive hole 6 conductings, so that the connected mode between CPU 2 and the PMU 3 is flexible, has made things convenient for wires design.
The above embodiment has only expressed embodiments of the present invention, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (10)
1. a PCB chip layout structure is characterized in that: comprise PCB, CPU, PMU; Described CPU and described PMU lay respectively on two faces of described PCB, projection section on PCB of described PMU and described CPU or all overlapping.
2. PCB chip layout structure according to claim 1, it is characterized in that: the power input of described PMU, output series, parallel have electric capacity, inductance, resistance.
3. PCB chip layout structure according to claim 1 and 2, it is characterized in that: the number of plies of described PCB is at least more than 1 layer.
4. PCB chip layout structure according to claim 1, it is characterized in that: conducting is come by electric conduction routing in two zones between the same layer of described PCB, and electric conduction routing is arranged on any one deck of described PCB.
5. PCB chip layout structure according to claim 1 is characterized in that: connect conducting by conductive hole between the different layers of described PCB.
6. PCB chip layout structure according to claim 5, it is characterized in that: described conductive hole is for conducting electricity buried via hole and/or conductive blind hole, conductive through hole, and the conducting between described PMU and the described CPU is finished by described conduction buried via hole, conductive blind hole, conductive through hole, electric conduction routing combination.
7. use electric terminal as claimed in claim 1 for one kind, described electric terminal comprises the PCB chip layout structure, it is characterized in that: described PCB allocation wiring structure comprises PCB, CPU, PMU; Described CPU and described PMU lay respectively on two faces of described PCB, projection section on PCB of described PMU and described CPU or all overlapping.
8. electric terminal according to claim 7, it is characterized in that: the power input of described PMU, output series, parallel have electric capacity, inductance, resistance.
9. electric terminal according to claim 7, it is characterized in that: conducting is come by electric conduction routing in two zones between the same layer of described PCB, and electric conduction routing is arranged on any one deck of described PCB.
10. electric terminal according to claim 7, it is characterized in that: connect conducting by conductive hole between the different layers of described PCB, described conductive hole is for conducting electricity buried via hole and/or conductive blind hole, conductive through hole, and the conducting between described PMU and the described CPU is finished by described conduction buried via hole, conductive blind hole, conductive through hole, electric conduction routing combination.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012103823143A CN103037621A (en) | 2012-10-10 | 2012-10-10 | Printed circuit board (PCB) chip layout structure and electronic terminal using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012103823143A CN103037621A (en) | 2012-10-10 | 2012-10-10 | Printed circuit board (PCB) chip layout structure and electronic terminal using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103037621A true CN103037621A (en) | 2013-04-10 |
Family
ID=48023951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012103823143A Pending CN103037621A (en) | 2012-10-10 | 2012-10-10 | Printed circuit board (PCB) chip layout structure and electronic terminal using the same |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103037621A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105823489A (en) * | 2016-01-29 | 2016-08-03 | 维沃移动通信有限公司 | Manufacturing method for circuit board of electronic compass and device |
CN106168992A (en) * | 2016-06-28 | 2016-11-30 | 广东欧珀移动通信有限公司 | Mobile terminal and the printing board PCB of mobile terminal and method for designing thereof |
CN108317697A (en) * | 2018-04-28 | 2018-07-24 | 广东美的制冷设备有限公司 | Transducer air conditioning circuit board, transducer air conditioning |
CN114423156A (en) * | 2021-11-19 | 2022-04-29 | 研祥智能科技股份有限公司 | Wiring algorithm between IC pin and resistor pin on PCB |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137400A (en) * | 1988-11-18 | 1990-05-25 | Fujitsu Ltd | Shielding by means of multilayer printed-circuit board |
GB2399684A (en) * | 2003-03-18 | 2004-09-22 | Shuttle Inc | Layout for integrated motherboard |
CN1901777A (en) * | 2005-07-22 | 2007-01-24 | 鸿富锦精密工业(深圳)有限公司 | Printing circuit board with modified power zone block |
KR101173606B1 (en) * | 2012-02-17 | 2012-08-13 | 주식회사 세미콘테스트 | Semiconductor Package |
CN202385383U (en) * | 2011-11-16 | 2012-08-15 | 华为终端有限公司 | Printed circuit board |
CN202818767U (en) * | 2012-10-10 | 2013-03-20 | 共青城赛龙通信技术有限责任公司 | PCB (Printed Circuit Board) chip layout structure and electronic terminal applying the structure |
-
2012
- 2012-10-10 CN CN2012103823143A patent/CN103037621A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137400A (en) * | 1988-11-18 | 1990-05-25 | Fujitsu Ltd | Shielding by means of multilayer printed-circuit board |
GB2399684A (en) * | 2003-03-18 | 2004-09-22 | Shuttle Inc | Layout for integrated motherboard |
CN1901777A (en) * | 2005-07-22 | 2007-01-24 | 鸿富锦精密工业(深圳)有限公司 | Printing circuit board with modified power zone block |
CN202385383U (en) * | 2011-11-16 | 2012-08-15 | 华为终端有限公司 | Printed circuit board |
KR101173606B1 (en) * | 2012-02-17 | 2012-08-13 | 주식회사 세미콘테스트 | Semiconductor Package |
CN202818767U (en) * | 2012-10-10 | 2013-03-20 | 共青城赛龙通信技术有限责任公司 | PCB (Printed Circuit Board) chip layout structure and electronic terminal applying the structure |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105823489A (en) * | 2016-01-29 | 2016-08-03 | 维沃移动通信有限公司 | Manufacturing method for circuit board of electronic compass and device |
CN105823489B (en) * | 2016-01-29 | 2019-04-12 | 维沃移动通信有限公司 | The method for platemaking and device of electronic compass |
CN106168992A (en) * | 2016-06-28 | 2016-11-30 | 广东欧珀移动通信有限公司 | Mobile terminal and the printing board PCB of mobile terminal and method for designing thereof |
CN106168992B (en) * | 2016-06-28 | 2018-04-10 | 广东欧珀移动通信有限公司 | The printing board PCB and its design method of mobile terminal and mobile terminal |
CN108317697A (en) * | 2018-04-28 | 2018-07-24 | 广东美的制冷设备有限公司 | Transducer air conditioning circuit board, transducer air conditioning |
CN108317697B (en) * | 2018-04-28 | 2020-10-09 | 广东美的制冷设备有限公司 | Variable frequency air conditioner circuit board and variable frequency air conditioner |
CN114423156A (en) * | 2021-11-19 | 2022-04-29 | 研祥智能科技股份有限公司 | Wiring algorithm between IC pin and resistor pin on PCB |
CN114423156B (en) * | 2021-11-19 | 2024-02-13 | 研祥智慧物联科技有限公司 | Wiring algorithm between IC pins and resistor pins on PCB |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207150424U (en) | A kind of power management chip, electric power system and electronic equipment | |
CN108233699A (en) | A kind of power management chip, electric power system and electronic equipment | |
CN103037621A (en) | Printed circuit board (PCB) chip layout structure and electronic terminal using the same | |
CN211018303U (en) | Charging device | |
US20150188354A1 (en) | Intergrally encapsulated wireless charging device | |
CN104427016A (en) | Intelligent terminal | |
CN202818767U (en) | PCB (Printed Circuit Board) chip layout structure and electronic terminal applying the structure | |
CN105653765A (en) | Four-side layout method of multi-phase VRM (Voltage Regulator Module) power circuit | |
CN102541234A (en) | Computer mainboard and power supply wiring method for same | |
CN203574934U (en) | PCB board | |
CN203482489U (en) | Multilayer printed circuit board (PCB) | |
CN206004998U (en) | Circuit board | |
CN108811314B (en) | High-frequency high-speed electronic circuit board based on high-thickness-diameter ratio deep hole electroplating technology | |
CN102105018B (en) | Multilayer circuit board | |
CN210518987U (en) | PCB structure for optimizing nuclear power distribution network impedance of BGA packaged chip | |
Muralikrishna et al. | An overview of digital circuit design and PCB design guidelines-An EMC perspective | |
CN108111016A (en) | Power module | |
CN206283001U (en) | A kind of attachment structure of accurate modularization wire harness | |
CN201928514U (en) | Embedded strong-current and large-power PCB (printed circuit board) | |
CN105163480A (en) | Circuit board and intelligent terminal | |
CN205213145U (en) | Strong and weak electric components of a whole that can function independently master control base plate | |
CN218217358U (en) | 5G communication module of M.2 interface with optimized power distribution network impedance | |
CN215264804U (en) | Core board | |
CN103499997A (en) | Backboard for NIM case and manufacturing method thereof | |
CN201282416Y (en) | High-power switch power supply A type core body |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |