GB2399684A - Layout for integrated motherboard - Google Patents

Layout for integrated motherboard Download PDF

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Publication number
GB2399684A
GB2399684A GB0306126A GB0306126A GB2399684A GB 2399684 A GB2399684 A GB 2399684A GB 0306126 A GB0306126 A GB 0306126A GB 0306126 A GB0306126 A GB 0306126A GB 2399684 A GB2399684 A GB 2399684A
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United Kingdom
Prior art keywords
motherboard
cpu
integrated
module
north bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0306126A
Other versions
GB2399684B (en
GB0306126D0 (en
Inventor
Yi-Lung Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shuttle Inc
Original Assignee
Shuttle Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shuttle Inc filed Critical Shuttle Inc
Priority to GB0306126A priority Critical patent/GB2399684B/en
Publication of GB0306126D0 publication Critical patent/GB0306126D0/en
Publication of GB2399684A publication Critical patent/GB2399684A/en
Application granted granted Critical
Publication of GB2399684B publication Critical patent/GB2399684B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

The layout for an integrated motherboard comprises placing a CPU 13 at the approximate centre of the motherboard 1, an input/output module 11 above the CPU, at least one PCI slot 12 on the left of the CPU, a power module 14 on the right of the CPU, a south bridge/north bridge chipset 15 below the CPU and a memory module 16 below the south bridge/north bridge chipset. The size of the motherboard is ideally 25.4 centimetres by 18.5 centimetres. Alternatively, the layout of the components can be reversed around the central vertical axis of the motherboard.

Description

PLACEMENT STRUCTURE OF AN INTEGRATED MOTHERBOARD
FIELD OF THE INVENTION
The present invention relates generally to a placement structure of an integrated motherboard. More particularly, the present invention relates to an integrated motherboard, wherein, a CPU is placed at the approximate center of the motherboard, and other peripheral components are placed around the CPU, so as to achieve an objective to optimum placement of the integrated motherboard.
BACKGROUND OF THE INVENTION
Recently, the process technology of Integrated Circuit (IC) has progressed to rapidly. The function of the IC is more powerful but the size of the IC is smaller, thus makes increasing the peripheral components, such as LAN chip, MODEM chip, Graphic chip and surrounding audio chip being integrated into the motherboard.
However, it is difficult that the motherboard designer could place the peripheral components and their respective connectors into the motherboard and could not increase the size of the motherboard. INTEL Corp. has designed a rule for designing P4 CPU and chipset on a motherboard, only if the motherboard designer following the designing rule, he (or she) could design a P4 motherboard correctly. However, the size of the integrated motherboard designed following the INTEL's rule couldn't meet the requirement of the market.
so Therefore, it needs an integrated motherboard that the peripheral components and their respective connectors could place into the motherboard and would not increase the size of the motherboard.
SUMMARY OF THE INVENTION
To solve the above problems, it is an object of the present invention to provide - 2 a placement structure of an integrated motherboard, which integrates the peripheral components and their respective connectors into the motherboard and could not increase the size of the motherboard.
To accomplish the above object of the present invention, there is provided s placement structure of an integrated motherboard, wherein a CPU is placed at the approximate center of the motherboard, a input/output module is placed above the CPU, at least one PCI slot is placed left the CPU, a power module is placed right the CPU, a south kridge/north bridge chipset is placed below the CPU, and a memory module is placed below the south bridge/north bridge chipset, so as to achieve an to objective to optimum placement of the integrated motherboard.
The present invention also provides a placement structure of an integrated motherboard, wherein a CPU is placed at the approximate center of the motherboard, at least one PCI slot is placed right the CPU, a inpuVoutput module is placed above the CPU, a power module is placed left the CPU, a south bridge/north bridge chipset iS placed below the CPU, and a memory module is placed below the south bridge/north bridge chipset, so as to achieve an objective to optimum placement of the integrated motherboard.
The novel features of the invention are set forth with particularity in the appended claims. The invention will be best understood from the following description no when read in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 shows a block diagram of a placement structure of an integrated motherboard in accordance with one embodiment of the present invention. 3
Fig. 2 shows a block diagram of a placement structure of an integrated motherboard in accordance with another embodiment of the present invention.
Fig. 3 shows a diagram of the main components of an integrated motherboard in accordance with one embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to Fig. 1 shows a block diagram of a placement structure of an integrated motherboard in accordance with one embodiment of the present invention.
As shown in Fig. 1, the placement structure of the integrated motherboard 1, is characterized in: a CPU 13 is placed at the approximate center of the motherboard 1, to a inpuVoutput module 11 is placed above the CPU 13; at least one PCI slot 12 is placed left the CPU 13, a power module 14 is placed right the CPU 13, a south bridge/north bridge chipset 15 is placed below the CPU 13, and a memory module 16 is placed below the south bridge/north bridge chipset 15, so as to achieve an objective to optimum placement of the integrated motherboard 1. Wherein, the size of the motherboard 1 is 25.4 cm X 18.5 cm.
Wherein, the inpuVoutput module 11 further comprises such as a COM1, COM2, VGA, AV and S terminal, LAN, USB, or PS/2 connector or combination of them.
Referring to Fig. 2 shows a block diagram of a placement structure of an no integrated motherboard in accordance with another embodiment of the present invention. As shown in Fig. 2, the placement structure of the integrated motherboard 1 of the present invention is characterized in: the CPU 13 is placed at the approximate center of the motherboard 1, the inpuVoutput module 11 is placed above the CPU 13; the power module 14 is placed left the CPU 13; at least one PCI slot 12 as is placed right the CPU 13, the south bridge/north bridge chipset 15 is placed below the CPU 13, and the memory module 16 is placed below the south bridge/north bridge chipset 15, so as to achieve an objective to optimum placement of the integrated motherboard 1. Wherein, the size of the motherboard 1 is also 25.4 cm X 18.5 cm.
Wherein, the inpuVoutput module 11 also further comprises such as a COM1, COM2, VGA, AV and S terminal, LAN, USB, or PS/2 connector or combination of them.
Referring to Fig. 3 shows a diagram of the main components of an integrated motherboard in accordance with one embodiment of the present invention. As shown in Fig. 3, the integrated motherboard 1 of the present invention comprises: the CPU To 13 is placed at the approximate center of the motherboard 1, the inpuVoutput module 11 is placed above the CPU 13; at least one PCI slot 12 is placed left the CPU 13, the power module 14 is placed right the CPU 13, the south bridge/north bridge chipset 15 is placed below the CPU 13, and the memory module 16 is placed below the south bridge/north bridge chipset 15, so as to achieve an objective to optimum placement of the integrated motherboard 1. Beside, the size of the motherboard 1 is 25.4 cm X 1 8.5 cm.
While the invention has been described with reference to a preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the To appended claims. - 5

Claims (4)

  1. WHAT IS CLAIMED IS: 1. A placement structure of an integrated motherboard,
    wherein a CPU is placed at the approximate center of the motherboard, a inpuVoutput module is placed above said CPU, at least one PCI slot is placed left said CPU, a power module is s placed right said CPU, a south bridge/ north bridge chipset is placed below said CPU, and a memory module is placed below said south bridge/north bridge chipset, so as to achieve an objective to optimum placement of said integrated motherboard.
  2. 2. A placement structure of an integrated motherboard as claimed in claim 1, wherein the size of said motherboard is 25.4 cm X 18.5 cm.
    To
  3. 3. A placement structure of an integrated motherboard, wherein a CPU is placed at the approximate center of said motherboard' at least one PCI slot is placed right said CPU, a inpuVoutput module is placed above said CPU, a power module is placed left said CPU, a south bridge/north bridge chipset is placed below said CPU, and a memory module is placed below said south bridge/north bridge chipset, so as Is to achieve an objective to optimum placement of said integrated motherboard.
  4. 4. A placement structure of an integrated motherboard as claimed in claim 3, wherein the size of said motherboard is 25.4 cm X 18.5 cm.
GB0306126A 2003-03-18 2003-03-18 Placement structure of an integrated motherboard Expired - Fee Related GB2399684B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0306126A GB2399684B (en) 2003-03-18 2003-03-18 Placement structure of an integrated motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0306126A GB2399684B (en) 2003-03-18 2003-03-18 Placement structure of an integrated motherboard

Publications (3)

Publication Number Publication Date
GB0306126D0 GB0306126D0 (en) 2003-04-23
GB2399684A true GB2399684A (en) 2004-09-22
GB2399684B GB2399684B (en) 2006-06-28

Family

ID=9954963

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0306126A Expired - Fee Related GB2399684B (en) 2003-03-18 2003-03-18 Placement structure of an integrated motherboard

Country Status (1)

Country Link
GB (1) GB2399684B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006039642A1 (en) * 2004-09-30 2006-04-13 Intel Corporation Cpu power delivery system
US7568115B2 (en) 2005-09-28 2009-07-28 Intel Corporation Power delivery and power management of many-core processors
CN103037621A (en) * 2012-10-10 2013-04-10 共青城赛龙通信技术有限责任公司 Printed circuit board (PCB) chip layout structure and electronic terminal using the same
TWI563374B (en) * 2014-09-02 2016-12-21 Delta Electronics Inc Power device
US10447166B2 (en) 2015-08-31 2019-10-15 Delta Electronics, Inc. Power module
US10511176B2 (en) 2015-07-06 2019-12-17 Delta Electronics, Inc. Power converter
US11036269B2 (en) 2014-09-02 2021-06-15 Delta Electronics (Shanghai) Co., Ltd. Power module and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104699199A (en) * 2014-08-27 2015-06-10 南宁市指搜信息技术有限公司 Novel integrated wireless server

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126013A (en) * 1982-08-18 1984-03-14 Bowthorpe Holdings Plc Microprocessor system
US4942550A (en) * 1987-06-23 1990-07-17 Burr-Brown Ltd. Printed circuit board topography for high speed intelligent industrial controller with multiple boards located within a single slot

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM240594U (en) * 2002-12-06 2004-08-11 Shuttle Inc Improved arrangement of integrated motherboard slot

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126013A (en) * 1982-08-18 1984-03-14 Bowthorpe Holdings Plc Microprocessor system
US4942550A (en) * 1987-06-23 1990-07-17 Burr-Brown Ltd. Printed circuit board topography for high speed intelligent industrial controller with multiple boards located within a single slot

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006039642A1 (en) * 2004-09-30 2006-04-13 Intel Corporation Cpu power delivery system
GB2432023A (en) * 2004-09-30 2007-05-09 Intel Corp CPU power delivery system
GB2432023B (en) * 2004-09-30 2007-12-12 Intel Corp CPU power delivery system
JP2008515242A (en) * 2004-09-30 2008-05-08 インテル コーポレイション CPU power distribution system
US7698576B2 (en) 2004-09-30 2010-04-13 Intel Corporation CPU power delivery system
CN101577273B (en) * 2004-09-30 2012-09-05 英特尔公司 CPU power delivery system
US7568115B2 (en) 2005-09-28 2009-07-28 Intel Corporation Power delivery and power management of many-core processors
CN103037621A (en) * 2012-10-10 2013-04-10 共青城赛龙通信技术有限责任公司 Printed circuit board (PCB) chip layout structure and electronic terminal using the same
TWI563374B (en) * 2014-09-02 2016-12-21 Delta Electronics Inc Power device
US9977476B2 (en) 2014-09-02 2018-05-22 Delta Electronics, Inc. Power supply apparatus
US10877534B2 (en) 2014-09-02 2020-12-29 Delta Electronics, Inc. Power supply apparatus
US11036269B2 (en) 2014-09-02 2021-06-15 Delta Electronics (Shanghai) Co., Ltd. Power module and manufacturing method thereof
US11437910B2 (en) 2014-09-02 2022-09-06 Delta Electronics, Inc. Power module
US11435797B2 (en) 2014-09-02 2022-09-06 Delta Electronics (Shanghai) Co., Ltd. Manufacturing method of power module
US10511176B2 (en) 2015-07-06 2019-12-17 Delta Electronics, Inc. Power converter
US10447166B2 (en) 2015-08-31 2019-10-15 Delta Electronics, Inc. Power module

Also Published As

Publication number Publication date
GB2399684B (en) 2006-06-28
GB0306126D0 (en) 2003-04-23

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 20170318