CN205792191U - A kind of high-performance power supply module - Google Patents

Abstract

This utility model is applicable to field of power supplies, it is provided that a kind of high-performance power supply module, and its external feedback pin passes through drop-down feedback resistance ground connection, and inside includes: substrate, power stage circuit, power supply control chip, pull-up feedback resistance, input/output capacitance；Voltage input pin by input capacitance ground connection and is connected with the input of power stage circuit, voltage output pin is connected with the outfan of power stage circuit and passes through output capacitance ground connection, the outfan of power supply control chip is connected with the control end of power stage circuit, the feedback end of power supply control chip is connected with one end of feedback pin and pull-up feedback resistance, and the other end of resistance is connected with the outfan of power stage circuit.Pull-up feedback resistance is placed in power supply module internal by this utility model, under conditions of not increasing cost, improve output voltage precision, reduce wiring difficulty, and by substrate bottom output voltage signal, reduce the dead resistance between output pin, optimize load regulation.

Description

A kind of high-performance power supply module

Technical field

This utility model belongs to field of power supplies, particularly relates to a kind of high-performance power supply module.

Background technology

Along with the development of science and technology, the requirement to electronics miniaturization and reliability is more and more higher at present, especially It is in mobile device and military hardware.But, power supply is as electric supply installation indispensable in electronic equipment Occupy a large portion volume in the electronic device, be also to be easiest to the system unit that causing trouble occurs, Therefore miniaturization and the High Reliability Design of power supply is always heat subject.

At present, the mode of power volume is reduced generally by increasing the operating frequency of Switching Power Supply to reduce magnetic The volume of element, improve power supply efficiency thus reduce radiator volume or heat radiation PCB surface amass, and The mode of employing system encapsulation, by deviding devices such as power-supply controller of electric and power tube, magnet assembly and resistance capacitances Part is integrated in a shell, and the placement-and-routing making power supply is compacter, and power density is greatly improved, Meet the demand of miniaturization and high reliability, such as power supply module.

Power supply module is a kind of product using system encapsulation to design and produce, and it is by power supply control chip and magnetic The discrete devices such as property assembly (usually transformator and inductance), power tube, diode, electric capacity and resistance are integrated In same shell, installed by substrate P CB inside shell and interconnect, so that power supply module internal Construct a basic power-supply system, have only to easy configuration in outside and can meet user and use demand. In the design of power supply module, the wiring of shell interior layout is the most crucial, particularly feedback voltage signal cabling Designing quality, output voltage precision and the load regulation of power supply module can be had a strong impact on, particularly at mould Group output electric current compared with big and time internal base plate PCB layer number is more, the voltage (feedback voltage) of output pin of sampling With output curent change, thus have a strong impact on the performance of module.

Utility model content

The purpose of this utility model embodiment is to provide a kind of high-performance power supply module, it is intended to solve existing electricity Wire structures in the module of source module output electric current compared with big and time internal base plate PCB layer number is more output electric Pressure precision and the low problem of load regulation.

This utility model embodiment is achieved in that a kind of high-performance power supply module, draws including voltage input Foot, voltage output pin and feedback pin, the feedback pin outside described power supply module is by drop-down feedback electricity Resistance ground connection, the internal structure of described power supply module includes:

Substrate, power stage circuit, power supply control chip, pull-up feedback resistance, input and output capacitors；

Described power stage circuit, described power supply control chip, described pull-up feedback resistance, described input capacitance Being fixed on described substrate with described output capacitance, the inside exit of described voltage input pin is by described Input capacitance ground connection, the inside exit of described voltage input pin also with the input of described power stage circuit Connecting, the inside exit of described voltage output pin is connected with the outfan of described power stage circuit, described The outfan of power stage circuit also by described output capacitance ground connection, the outfan of described power supply control chip with The control end of described power stage circuit connects, and the inside exit of described feedback pin controls core with described power supply The feedback end of sheet connects, and the feedback end of described power supply control chip is also with one end of described pull-up feedback resistance even Connecing, the other end of described pull-up feedback resistance is connected with the outfan of described power stage circuit.

Further, the precision of described pull-up feedback resistance is higher than 0.1%.

Further, described substrate includes top layer and bottom；

Described power stage circuit, described power supply control chip, described pull-up feedback resistance, described input capacitance With on the top layer that described output capacitance is fixed on described substrate；

The inside exit of described voltage input pin, the inside exit of described voltage output pin and described The inside exit of feedback pin is positioned at the bottom of described substrate；

The outfan of described power stage circuit is positioned at the top layer of described substrate, by hole and described substrate bottom One or more cover copper points connect, described in cover the inside exit that copper point is described voltage output pin, described The other end of pull-up feedback resistance is connected to one or more center covering copper point by cabling.

Further, described hole is through hole, via or blind hole.

This utility model embodiment is by the pull-up feedback resistance R of power supply module_UPIt is placed in module internal, user not Improve output voltage precision under conditions of increasing cost, reduce the PCB layout difficulty of user, and lead to Cross at substrate bottom output voltage signal, use entirety to cover the mode of copper, reduce between module output pin Dead resistance, optimize the load regulation of power supply module.

Accompanying drawing explanation

The circuit diagram of the high-performance power supply module that Fig. 1 provides for this utility model embodiment；

The substrate junction composition of the high-performance power supply module that Fig. 2 provides for this utility model embodiment；

The substrate ground floor plan of the high-performance power supply module that Fig. 3 provides for this utility model embodiment；

The basic top floor plan view of the high-performance power supply module that Fig. 4 provides for this utility model embodiment；

The basic top layer of the high-performance power supply module that Fig. 5 provides for this utility model embodiment and bottom section Figure.

Detailed description of the invention

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing And embodiment, this utility model is further elaborated.Should be appreciated that described herein specifically Embodiment, only in order to explain this utility model, is not used to limit this utility model.Additionally, retouched below As long as technical characteristic involved in each embodiment of this utility model stated does not constitutes conflict each other Just can be mutually combined.

This utility model embodiment is by the pull-up feedback resistance R of power supply module_UPIt is placed in module internal, user not Improve output voltage precision under conditions of increasing cost, reduce the PCB layout difficulty of user, and lead to Cross at substrate bottom output voltage signal, use entirety to cover the mode of copper, reduce between module output pin Dead resistance, optimize the load regulation of power supply module.

Fig. 1 shows the circuit diagram of the high-performance power supply module that this utility model embodiment provides, this electricity Source module, including voltage input pin Vin, voltage output pin Vout and feedback pin FB, power supply module Outside feedback pin FB is by drop-down feedback resistance R_DOWNGround connection, the internal structure of power supply module includes:

Substrate P CB, power stage circuit 10, power supply control chip 20, pull-up feedback resistance R_UP, input electricity Hold Cin and output capacitance Cout；

Power stage circuit 10, power supply control chip 20, pull-up feedback resistance R_UP, input capacitance Cin and output Electric capacity Cout is fixed in substrate P CB, and the inside exit of voltage input pin Vin passes through input capacitance Cin Ground connection, the inside exit of voltage input pin Vin also input with power stage circuit 10 is connected, voltage The inside exit of output pin Vout and the outfan V of power stage circuit 10_{OUT_SENSE}Connect, power stage The outfan V of circuit 10_{OUT_SENSE}Also by output capacitance Cout ground connection, the output of power supply control chip 20 End is connected with the control end of power stage circuit 10, the inside exit of feedback pin FB and power supply control chip The feedback end V of 20_FBConnect, the feedback end V of power supply control chip 20_FBAlso with pull-up feedback resistance R_UPOne End connects, and pulls up feedback resistance R_UPThe outfan V of the other end and power stage circuit 10_{OUT_SENSE}Connect.

In this utility model embodiment, power supply module is by by pull-up feedback resistance R_UPWith drop-down feedback resistance R_DOWNThe feedback network sampling and outputting voltage Vout of composition, obtains feedback voltage V_FB, at the bar of steady operation Under part, feedback voltage V_FBWith power supply control chip 20 internal reference voltage approximately equal, theoretical output voltage For:

But it practice, there is deviation with theoretical output voltage in the actual output voltage of power supply module, deviation big Little it is output voltage precision.

The theoretical output voltage of such as power supply module is Vout, and actual output voltage is Vout1, then export electricity Pressure precision is:

As this utility model one embodiment, pull up feedback resistance R_UPPreferably select precision and be higher than ± 0.1%.

Assume that the reference voltage precise constant within power supply control chip 20 and system loop are stable, then export electricity The precision of pressure is mainly affected by feedback resistance precision.

Assume reference voltage V_REFFor 0.5V, need to set output voltage as 1V, set R_UPFor 10K Ω, R_DOWNFor 10K Ω, it is assumed that user chooses the resistance of 1% accuracy class, owing to this utility model embodiment will The pull-up feedback resistance R of power supply module_UPIt is placed in module internal, the most now pull-up feedback resistance R_UPPrecision Within ± 0.1%.

So, under extreme case, R_UPFor 10.01K Ω, R_DOWNFor 9.9K Ω, then actual output electricity Pressure is:Its output voltage precision is 0.5%；

And use traditional approach, using the resistance of 1% accuracy class to can only achieve output voltage precision is 1%.

It will be seen that this utility model embodiment (resistance essence chosen under conditions of user does not increases cost Degree grade is identical), output voltage precision is improved.Further, anti-to power supply control chip of output voltage The sensitive signal cabling of feedback end is integrated in module internal, and user has only in the feedback pin outside power supply module FB configures a drop-down feedback resistance R_DOWNTo ground, reduce the PCB layout difficulty of user.

It addition, in traditional method, between the power output stage of power supply module internal to the output pin of module There is bigger dead resistance, it is assumed that total dead resistance of the sampled point of output voltage to module output pin is R_PCB。

So when power supply module steady operation, output voltage setting value Vout=V_{OUT_SENSE}, when module is defeated When going out electric current, it is assumed that V_{OUT_SENSE}Outfan V to module_{OUT_USER}Flowing through electric current is Io, then V_{OUT_USER}=V_{OUT_SENSE}-R_PCB*Io, it is assumed that the inside PCB design of a certain module, R_PCB are 20m Ω, V_{OUT_SENSE}Voltage be 1.5V, output electric current is when being 20A, V_{OUT_SENSE}Outfan to module V_{OUT_USER}Flowing through electric current is that (output electric current also has other paths to Io=10A, power output stage flow to module Outfan), then the output voltage V that user actually obtains_{OUT_USER}=1.5V-20m Ω * 10A=1.3V, then The load regulation caused due to PCB dead resistance is changed to:

$\mathrm{\Δ}Vout\left(LOAD\right)=\frac{1.3-1.5}{1.5}=-13.3\%$

Fig. 2 shows the substrate junction composition of the high-performance power supply module that this utility model embodiment provides.

As this utility model one embodiment, substrate P CB includes top layer 301 and bottom 302；

Power stage circuit 10, power supply control chip 20, pull-up feedback resistance R_UP, input capacitance Cin and output Electric capacity Cout is fixed on the top layer 301 of substrate；

The inside exit of voltage input pin Vin, the inside exit of voltage output pin Vout and feedback The inside exit of pin FB is positioned at the bottom 302 of substrate, and the inside exit of voltage input pin Vin Via and power stage circuit 10, power supply control chip 20 is passed through respectively with the inside exit of feedback pin FB Connect；

The outfan V of power stage circuit 10_{OUT_SENSE}It is positioned at the top layer 301 of substrate, logical arrays of vias 401 Being connected with one or more copper points 50 that cover of substrate bottom, this hole array 401 is made up of multiple holes 40, knot Closing Fig. 3, Fig. 4, Fig. 5, this hole 40 can be through hole, via or blind hole, covers copper point 50 and exports for voltage The inside exit of pin, pulls up feedback resistance R_UPThe other end (i.e. the sampling end of output voltage) by anti- The signal lead 701 of feedthrough voltage is connected to one or more center covering copper point 50.

The plane figure of substrate bottom 302 sees Fig. 3, wherein covers the inside that copper point 50 is voltage output pin The large area copper sheet of exit, has on copper point 50 by exporting what PAD 60 formed outside multiple modules covering Module output pin array, the outside o pads of each module (PAD) 60 all with cover copper point 50 and be connected, The center of this array has output voltage V_{OUT_USER}The via 70 of module outfan, in conjunction with Fig. 2, Fig. 4, Fig. 5, this via 70 connects the signal lead 701 of feedback voltage, through the signal lead of feedback voltage Via 70 is connected to pull up feedback resistance R by 701_UPThe other end (i.e. the sampling end of output voltage), feedback Substrate top layer 301 is connected with substrate bottom 302 by the signal lead 701 of voltage by via 70, output electricity The via 40 of pressure penetrates into the bottom 302 of substrate from the top layer 301 of substrate, is connected with covering copper point 50.

The plane figure of the top layer 301 of substrate sees Fig. 4, and wherein 80 is that chip feedback pin FB is corresponding PAD, 801 is cabling, and 802 is the power output signal PAD of power supply control chip, and 803 is substrate P CB Bonding welding pad (bonding PAD), 804 be components and parts install pad.

The top layer 301 of substrate and the cross-section structure of substrate bottom 302 participate in Fig. 5, wherein via 70 substrate The cabling of top layer 301 is connected to pull up feedback resistance R_UPThe other end (i.e. the sampling end of output voltage), hole 40 arrays connect the outfan V of power stage circuit 10 by cabling 801_{OUT_SENSE}, module outside output PAD 60 are connected to voltage output pin Vout by covering copper point 50.In this utility model embodiment, in module The top layer 301 of portion's substrate is for power supply control chip and the installation of other discrete components, and bottom 302 is used for Connection mode assembly welding dish pin, the inside exit of such as voltage input pin Vin, voltage output pin Vout Inside exit and the inside exit of feedback pin FB.

R1 and R2 is pull-up feedback resistance R_UPThe feedback input end that installation pad, FB are controller, equal position In substrate top layer.

The power stage of substrate top layer is exported pad (L), and usually the output of power inductance or transformator is drawn Foot, is responsible for the output output voltage through power supply control chip modulation；

By outfan V_{OUT_SENSE}It is arranged on the bottom of module internal substrate P CB, and defeated close to or at module Go out the center of voltage pin.

The power output stage of PCB top layer, by via (or blind hole etc.) with cover copper, with the output of module Pin array is connected；

The signal lead of feedback voltage, in the center of module output pin array (or near centre bit Put) it is connected with the copper single-point that covers of output voltage.

This utility model embodiment, by substrate bottom output voltage signal, uses entirety to cover the mode of copper, subtracts Dead resistance between little module output pin, make module all of output pin voltage close to equal, all It is nearly equal to the voltage V of output pin array center pin_{OUT_USER}；And the sampling optimization of output voltage in The center of module output voltage pin array, the output voltage V that controller samples_{OUT_SENSE}With module Actual output voltage V_{OUT_USER}Equal (because the dead resistance between them has been negligible). Output electric current can cause the output voltage V sampled the most again_{OUT_SENSE}With module actual output voltage V_{OUT_USER}There is deviation.Optimize the load regulation of power supply module.

These are only preferred embodiment of the present utility model, not in order to limit this utility model, all Any amendment, equivalent and the improvement etc. made within spirit of the present utility model and principle, all should comprise Within protection domain of the present utility model.

Claims (4)

1. a high-performance power supply module, including voltage input pin, voltage output pin and feedback pin, It is characterized in that, the feedback pin outside described power supply module passes through drop-down feedback resistance ground connection, described power supply The internal structure of module includes:

Substrate, power stage circuit, power supply control chip, pull-up feedback resistance, input and output capacitors；

Described power stage circuit, described power supply control chip, described pull-up feedback resistance, described input capacitance Being fixed on described substrate with described output capacitance, the inside exit of described voltage input pin is by described Input capacitance ground connection, the inside exit of described voltage input pin also with the input of described power stage circuit Connecting, the inside exit of described voltage output pin is connected with the outfan of described power stage circuit, described The outfan of power stage circuit also by described output capacitance ground connection, the outfan of described power supply control chip with The control end of described power stage circuit connects, and the inside exit of described feedback pin controls core with described power supply The feedback end of sheet connects, and the feedback end of described power supply control chip is also with one end of described pull-up feedback resistance even Connecing, the other end of described pull-up feedback resistance is connected with the outfan of described power stage circuit.

2. power supply module as claimed in claim 1, it is characterised in that the precision of described pull-up feedback resistance Higher than 0.1%.

3. power supply module as claimed in claim 1, it is characterised in that described substrate includes top layer and bottom；

Described power stage circuit, described power supply control chip, described pull-up feedback resistance, described input capacitance With on the top layer that described output capacitance is fixed on described substrate；

The inside exit of described voltage input pin, the inside exit of described voltage output pin and described The inside exit of feedback pin is positioned at the bottom of described substrate；

The outfan of described power stage circuit is positioned at the top layer of described substrate, by hole and described substrate bottom One or more cover copper points connect, described in cover the inside exit that copper point is described voltage output pin, described The other end of pull-up feedback resistance is connected to one or more center covering copper point by cabling.

4. power supply module as claimed in claim 1, it is characterised in that described hole is through hole, via or blind Hole.